CN107329327B

CN107329327B - Optical alignment device

Info

Publication number: CN107329327B
Application number: CN201710659995.6A
Authority: CN
Inventors: 肖印; 万能; 刘伟; 张波; 邹志杰
Original assignee: Chengdu Tianma Micro Electronics Co Ltd
Current assignee: Chengdu Tianma Micro Electronics Co Ltd
Priority date: 2017-08-04
Filing date: 2017-08-04
Publication date: 2022-05-10
Anticipated expiration: 2037-08-04
Also published as: CN107329327A

Abstract

The present invention provides a photo-alignment device, comprising: the alignment light source is used for providing a light source used in an alignment process; the linearly polarized light grid is used for forming polarized light required by the alignment process by the light source provided by the alignment light source; the bearing base station is used for placing a substrate to be aligned; and the heat dissipation interlayer is positioned in the bearing base station and used for cooling the bearing base station and the substrate to be matched. In the alignment process of the optical alignment device provided by the invention, the heat of the substrate to be aligned and the bearing base station is replaced and taken away through the heat dissipation interlayer, so that the cooling effect is realized, the chain-broken small molecules are effectively prevented from volatilizing onto an optical device of the optical alignment device to generate oxidation reaction or chemical adsorption, and the service life and the stability of the optical alignment device are further improved.

Description

Optical alignment device

Technical Field

The present invention relates to the field of optical alignment technology, and in particular, to an optical alignment apparatus.

Background

With the development of display technology, the optical alignment technology has been gradually popularized in the current liquid crystal display manufacturing industry (especially for liquid crystal displays of in-plane switching technologies such as IPS & FFS), and the liquid crystal displays obtained by the optical alignment technology have the characteristics of high contrast, good image quality, high yield and convenient operation, so that the optical alignment technology is regarded as important, developed and applied by many liquid crystal display enterprises. Specifically, the photo-alignment technology is a non-contact liquid crystal alignment technology, which utilizes linearly polarized ultraviolet light to irradiate a high molecular polymer alignment film with a photosensitizer, so that the high molecular polymer has alignment capability.

At present, there are three main reaction mechanisms for realizing photo-alignment by using a high molecular polymer alignment film: firstly, the photo-induced synthesis is carried out, and the common photoresist is a photo-resist, namely, the photo-dimerization reaction is carried out by utilizing unsaturated bonds; second, photocleavage, which is commonly a polyimide-type structure; thirdly, photo-isomerization, which is common in the structure containing azo groups, namely, the transformation of cis-trans structure of unsaturated bonds, finally generates surface anisotropy of the high molecular polymer. Among them, the photo-induced cracking type, i.e., decomposition type photo-alignment technology is widely used at present because of stable material properties, simple process and environmental requirements, and easy equipment correspondence.

The problems in the decomposition type optical alignment technology in the prior art are mainly as follows: in the alignment process, in order to maintain uniformity of the light source and utilization rate of light, the distance between the substrate to be aligned and the light source is usually set within a small range, and the high-power light source generates extremely high heat, so that surrounding devices have extremely high temperature through radiation and light conduction. After the high molecular polymer forming the alignment film is decomposed, the surrounding high temperature environment volatilizes and gathers partial decomposed small molecules onto the optical device of the optical alignment device, and the small molecules are subjected to oxidation reaction and chemical adsorption on the optical device through long-term production accumulation, so that the optical device of the optical alignment device, such as a filter plate, generates stains and a microstructure film layer of a linearly polarized light grating is cracked, and finally the performance of the optical device of the optical alignment device is reduced (such as the reduction of light transmittance and the reduction of extinction ratio).

Disclosure of Invention

The invention aims to provide a photo-alignment device to solve the problem that the performance of an optical device of the photo-alignment device is reduced due to high temperature in the existing photo-alignment process.

The present invention provides a photo-alignment device, comprising: the alignment light source is used for providing a light source used in an alignment process; the linearly polarized light grid is used for forming polarized light required by the alignment process by the light source provided by the alignment light source; the bearing base station is used for placing a substrate to be aligned; and the heat dissipation interlayer is positioned in the bearing base station and used for cooling the bearing base station and the substrate to be matched.

In one embodiment of the present invention, the heat dissipation interlayer comprises a cooling fluid in a flowing state, wherein the cooling fluid flows from an inlet end of the heat dissipation interlayer to an outlet end of the heat dissipation interlayer.

In one embodiment of the present invention, the temperature of the cooling fluid inside the heat dissipation interlayer is in a range of 15 to 45 ℃.

In one embodiment of the present invention, the cooling fluid comprises deionized water, process cooling water, organic cooling fluid, or high pressure compressed gas.

In one embodiment of the present invention, the high-pressure compressed gas includes dry ice or liquid nitrogen.

In an embodiment of the invention, the bearing base platform includes a carrier layer, and the heat dissipation interlayer is located on a side of the carrier layer away from the linearly polarized light grid.

In one embodiment of the invention, the carrier sheet layer is in direct contact with the cooling fluid; and one side of the carrier layer, which faces the cooling fluid, is provided with an upper radiating fin, and the upper radiating fin is positioned in the cooling fluid.

In an embodiment of the present invention, the upper heat sink is a wedge-shaped heat sink blade type heat sink.

In one embodiment of the present invention, the cooling fluid is sealed within the heat dissipation interlayer; the upper radiating fins are arranged on the carrier layer, the lower radiating fins are arranged on one side, facing the carrier layer, of the radiating interlayer, and the lower radiating fins are in contact with the upper radiating fins.

In an embodiment of the present invention, the upper heat sink and the lower heat sink are both wedge-shaped heat sinks, and the upper heat sink is in fit contact with the wedge-shaped cross section of the lower heat sink.

In an embodiment of the invention, the material of the upper heat sink and the lower heat sink includes a metal or a metal alloy.

In an embodiment of the present invention, the material of the upper heat sink and the lower heat sink includes aluminum, copper or stainless steel.

In an embodiment of the invention, the bearing base further includes a bearing layer, and the heat dissipation interlayer is located between the carrier layer and the bearing layer.

In an embodiment of the invention, the bearing base further includes a heat conducting sheet, and the heat conducting sheet is located between the carrier layer and the heat dissipation interlayer.

In an embodiment of the invention, the bearing base station further includes an anti-static coating layer, and the anti-static coating layer is formed on a side of the carrier layer, which faces away from the heat dissipation interlayer.

In an embodiment of the invention, a material of the anti-static coating includes teflon.

In an embodiment of the invention, a material of the carrier layer includes a metal or a metal alloy.

In an embodiment of the present invention, the heat dissipation interlayer is a serpentine structure, or the heat dissipation interlayer is a flat interlayer structure.

Compared with the prior art, the technical scheme provided by the invention has the following advantages: the present invention provides a photo-alignment device, comprising: the alignment light source is used for providing a light source used in an alignment process; the linearly polarized light grid is used for forming polarized light required by the alignment process by the light source provided by the alignment light source; the bearing base station is used for placing a substrate to be aligned; and the heat dissipation interlayer is positioned in the bearing base station and used for cooling the bearing base station and the substrate to be matched. In the alignment process of the optical alignment device provided by the invention, the heat of the substrate to be aligned and the bearing base station is replaced and taken away through the heat dissipation interlayer, so that the cooling effect is realized, the chain scission small molecules are effectively prevented from volatilizing onto the optical device of the optical alignment device to cause the oxidation reaction or chemical adsorption of the optical device, and the service life and the stability of the optical alignment device are further improved.

Drawings

Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments made with reference to the following drawings:

FIG. 1 is a schematic structural diagram of an optical alignment apparatus according to an embodiment of the present invention;

FIG. 2 is a top view of a supporting base of the photo-alignment apparatus shown in FIG. 1;

FIG. 3 is a cross-sectional view of the supporting base of the photo-alignment device of FIG. 1;

FIG. 4 is a cross-sectional view of the supporting base of the photo-alignment device of FIG. 1;

FIG. 5 is a schematic view of a supporting base according to another embodiment of the present invention;

fig. 6 is a schematic view of a supporting base according to another embodiment of the present invention;

FIG. 7 is a schematic view of a carrier base station of an optical alignment device according to another embodiment of the present invention;

FIG. 8 is a schematic view of a heat-dissipating interlayer of a photoalignment device according to a further embodiment of the invention;

FIG. 9 is a schematic view of a heat sink layer of a photo-alignment device according to yet another embodiment of the invention.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.

In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.

First, the present invention provides a photo-alignment device, fig. 1 is a schematic structural diagram of a photo-alignment device according to an embodiment of the present invention, fig. 2 is a top view of a supporting base of the photo-alignment device shown in fig. 1, fig. 3 is a cross-sectional view of the supporting base of the photo-alignment device shown in fig. 1, and fig. 4 is a cross-sectional view of the supporting base of the photo-alignment device shown in fig. 1, wherein the photo-alignment device shown in fig. 1 is placed with a substrate to be aligned and in an exposure state.

Specifically, as shown in fig. 1, 2, 3, and 4, the optical alignment apparatus provided in this embodiment includes: the alignment device comprises an alignment light source 03 and a bearing base 01, wherein the alignment light source 03 is used for providing a light source used in an alignment process, the linearly polarized light grid 02 is used, the light source provided by the alignment light source 03 forms polarized light required by the alignment process after passing through the linearly polarized light grid 02, an alignment liquid is coated on the surface of a substrate 04 to be aligned, the alignment liquid can be polyimide or polyamic acid, for example, after being irradiated by ultraviolet light with a specific wavelength, a polymer with the same polarization direction is subjected to chain scission decomposition, and an alignment film with a preset angle is formed. Further, bear the inside heat dissipation intermediate layer 2 that is provided with of base station 01, bear base station 01 and place and to treat the heat of joining in marriage substrate 04 above bearing base station 01 and can conduct away through heat dissipation intermediate layer 2 fast, reach the cooling effect.

Specifically, the alignment light source 03 provided by this embodiment includes a lamp source 31 for emitting ultraviolet light, and in addition, in order to enable light generated by the lamp source 31 to be concentrated and to be irradiated onto the substrate 04 to be aligned to the maximum extent, the alignment light source 03 further includes a reflective cover 33, and the reflective cover 33 is, for example, semicircular, so that when reaching the semicircular reflective cover 33, light generated by the lamp source 31 is emitted toward the opening direction of the semicircular reflective cover 33 and is irradiated onto the substrate 04 to be aligned, thereby improving the utilization rate of the light. In the light emitting direction, a filter 32 is further disposed in the alignment light source 03 for filtering out ultraviolet light in other bands that do not act on alignment.

In order to improve the utilization rate of the light source and maintain the uniformity of the light source during the exposure process of the alignment liquid, the photo-alignment apparatus provided in the embodiment of the present invention generally sets the distance d between the supporting base 01 and the optical device (e.g., the linearly polarized light grating 02 and the filter 32) within a small range, for example, within a range of 10cm to 20 cm. However, since the high power light source generates extremely high heat, the surrounding devices, such as the carrier substrate and the substrate to be aligned, also have very high temperature by radiation and light conduction. After the macromolecules in the alignment liquid are decomposed in the exposure process, the continuous influence of a light source and the surrounding high-temperature environment volatilize a part of decomposed micromolecules, and the micromolecules are gathered on optical devices such as a linearly polarized light grating, a filter plate and the like of the optical alignment device, and after long-term production accumulation, the micromolecules gathered on the optical devices such as the linearly polarized light grating, the filter plate and the like of the optical alignment device can generate oxidation reaction and chemical adsorption, so that the film layer of the filter plate generates stains, the microstructure film layer of the linearly polarized light grating is cracked, and finally the performance of the optical device is reduced, such as the reduction of light transmittance and the reduction of extinction ratio. In order to overcome the defects, in the embodiment of the invention, the heat dissipation interlayer is arranged in the bearing base platform, the heat of the bearing base platform and the substrate to be aligned placed on the bearing base platform can be quickly conducted out through the heat dissipation interlayer, so that the cooling effect is achieved, the volatilization amount of organic small molecules in the optical alignment process is reduced or eliminated, further, the pollution and damage of the organic small molecules to optical devices such as linear polarization gratings and filters are reduced or eliminated, the service life of the optical devices such as the linear polarization gratings and the filters is prolonged, and the stability of the optical devices of the optical alignment device is improved.

In one embodiment of the present invention, for example, the cooling fluid 21 is filled in the heat dissipation interlayer 2 in a flowing state, the cooling fluid 21 flows from the inlet end 201 of the heat dissipation interlayer 2 to the outlet end 202 of the heat dissipation interlayer 2, the cooling fluid 21 flows in the heat dissipation interlayer 2 in a unidirectional manner at a certain speed, and the temperature of the heat dissipation interlayer 2 can be controlled to be in a constant temperature state by controlling the flow speed and the volume of the cooling fluid 21 in the heat dissipation interlayer 2. For example, the specific flow rate of the cooling fluid 21 can be adjusted according to the temperature of the bearing base, and the temperature of the cooling fluid can be controlled to ensure the cooling effect.

Generally, when a substrate to be aligned is exposed, the temperature right below a lamp source is between 80 ℃ and 130 ℃, and the temperature is high, so that trace chain-breaking small molecules are easy to volatilize. Preferably, the temperature of the cooling fluid is controlled to be in the range of 15 ℃ to 45 ℃ by setting the temperature of the cooling fluid entering the inlet port and the flow rate of the cooling fluid in the heat dissipation interlayer, so that the temperature of the surface of the substrate to be aligned can be controlled to be between 20 ℃ to 30 ℃, and the volatilization of the organic small molecules is reduced or eliminated.

In one embodiment of the invention, the cooling fluid may be, for example, any one of deionized water, process cooling water, an organic cooling fluid, or a high pressure compressed gas, which may be, for example, dry ice or liquid nitrogen.

With regard to the specific structure of the supporting base platform, please refer to fig. 1, 2, 3, and 4, the supporting base platform 01 includes a carrier layer 1 for placing the substrate 04 to be aligned, and the heat dissipation interlayer 2 is located on a side of the carrier layer 1 away from the linearly polarized light grid 02 and directly contacts with the carrier layer 1. Further, the supporting base 01 further includes a supporting column 11 and a vacuum groove 12, further, the supporting column 11 includes a solid supporting column 110 and a vacuum supporting column 120, the supporting base 01 is further provided with a receiving groove for receiving the solid supporting column 110 and the vacuum supporting column 120, and the solid supporting column 110 and the vacuum supporting column 120 can freely rise or fall in the receiving groove. The supporting function of the solid supporting column 110 is to perform a supporting function when the substrate 04 to be aligned is subjected to sheet exchange, that is, when the substrate 04 to be aligned that is well aligned is changed to the next substrate 04 to be aligned that is not yet aligned, only the solid supporting column 110 is used for supporting, and at this time, the solid supporting column 110 is in a supporting state, and the vacuum supporting column 120 is retracted into the accommodating groove of the bearing base station 01, so as to facilitate the taking and placing of the manipulator. The vacuum support columns 120 function to prevent the substrate 04 to be aligned from being shifted when the substrate 04 to be aligned ascends or descends. The vacuum groove 12 is used for preventing the substrate 04 to be aligned from shifting during the movement of the supporting base 01 after the supporting columns 11 are retracted into the receiving grooves and the substrate 04 to be aligned is attached to the carrier layer 1.

In the specific alignment process, according to the material of the alignment liquid, selecting proper illumination of a required light source, a filter plate and a linearly polarized light grid so as to obtain an alignment film with a preset angle, then placing the substrate to be aligned coated with the alignment liquid on a carrying sheet layer of a carrying base table, and conveying the substrate to be aligned to an exposure area through the movement of the carrying base table and a support column.

Fig. 5 is a schematic view of a carrying base station according to another embodiment of the present invention, in the optical alignment device according to this embodiment, a specific structure of a heat dissipation interlayer in the carrying base station is as shown in fig. 5, the carrying base station includes a carrier layer 1 and a heat dissipation interlayer 2, a cooling fluid 21 in a flowing state is filled in the heat dissipation interlayer 2, the cooling fluid 21 flows from an inlet end 201 of the heat dissipation interlayer 2 to an outlet end 202 of the heat dissipation interlayer 2, and flows unidirectionally in the heat dissipation interlayer 2 at a certain rate, and the temperature of the heat dissipation interlayer 2 can be controlled to be in a constant temperature state by controlling the flow rate and the volume of the cooling fluid 21 in the heat dissipation interlayer 2. In this case, the underside of the carrier sheet layer 1 is in direct contact with the cooling fluid 21, or the heat sink 2 is, for example, a container with an upper opening, and the carrier sheet layer 1 covers the opening of the heat sink directly and is in direct contact with the cooling fluid. Further, the upper radiating fins 13 are arranged on the side, facing the cooling fluid, of the chip carrier layer 1, the upper radiating fins 13 can be integrally formed with the chip carrier layer 1, when the chip carrier layer 1 and the radiating interlayer 2 are fixed together, the upper radiating fins 13 are located in the cooling fluid 21, the contact area between the chip carrier layer 1 and the cooling fluid 21 is enlarged, the speed of transferring heat on the chip carrier layer 1 to the cooling fluid 21 is increased, and the heat is replaced to the outside of the radiating interlayer through the cooling fluid 21 in a flowing state, so that the effect of quickly reducing the temperature is achieved.

Further, the upper fin 13 may be, for example, a wedge-shaped fin or a blade-shaped fin, and the contact area of the upper fin 13 with the cooling fluid is increased. The cooling fluid flows from the inlet end of the heat dissipation interlayer to the outlet end of the heat dissipation interlayer and is in a flowing state all the time, the relative constant temperature can be kept, the temperature difference exists between the upper radiating fin and the cooling fluid, the heat conduction direction is transmitted from the upper radiating fin to the cooling fluid, and the cooling fluid is replaced to the outside of the bearing base station to achieve the purpose of cooling.

In this embodiment, the material of the carrier layer may include any solid material that is easy to transfer heat, and preferably, the material may be a metal material or a metal alloy with aluminum, copper, stainless steel, cast iron, or the like as a main matrix to accelerate heat transfer. Meanwhile, the material of the upper heat sink may include any solid object that is easy to transfer heat, and preferably, the material may be a metal material or a metal alloy that mainly includes aluminum, copper, stainless steel, or the like.

Furthermore, the surface of the slide glass layer can be coated with an anti-static coating such as teflon or other related coatings, the anti-static coating is formed on one side of the slide glass layer, which is far away from the heat dissipation interlayer, and static electricity on the bearing base platform is prevented from causing static electricity damage to metal wiring on a substrate to be aligned and the like.

In this embodiment, there is no space between the cooling fluid of the carrier layer and the heat dissipation interlayer, heat can be directly conducted into the cooling fluid, and the cooling fluid is replaced to the outside of the bearing base station, thereby realizing the cooling effect on the bearing base station and the substrate to be aligned on the bearing base station, avoiding the problem that the temperature of the bearing base station, the substrate to be aligned and the surrounding environment is too high, and causing a large amount of volatilization of organic small molecules, and reducing or eliminating the volatilization amount of organic small molecules of the alignment liquid in the optical alignment process, thereby reducing or eliminating the pollution and damage of the organic small molecules to optical devices such as linear polarization gratings and filters, prolonging the service life of the optical devices such as linear polarization gratings and filters, and improving the stability of the optical devices of the optical alignment device.

Fig. 6 is a schematic view of a supporting base station according to another embodiment of the present invention, and the optical alignment device provided in this embodiment has a structure similar to that of the optical alignment device provided in fig. 5, except that the supporting base station further includes a supporting layer 3, and a heat dissipation interlayer is located between the supporting layer and the supporting layer 3. Be provided with base station fixing device in the bearing layer 3, can increase the stability of bearing the base station.

Fig. 7 is a schematic view of a carrying base station of an optical alignment device according to still another embodiment of the present invention, in the optical alignment device according to this embodiment, a specific structure of a heat dissipation interlayer in the carrying base station is as shown in fig. 7, the carrying base station includes a carrier layer 1, a heat dissipation interlayer 2 and a bearing layer 3, the heat dissipation interlayer 2 is located between the carrier layer 1 and the heat dissipation interlayer 2, wherein the heat dissipation interlayer 2 is a sealed structure, and a cooling fluid 21 in a flowing state is filled in the sealed structure, the cooling fluid 21 flows from an inlet end 201 of the heat dissipation interlayer 2 to an outlet end 202 of the heat dissipation interlayer 2, and flows in a unidirectional direction in the heat dissipation interlayer 2 at a certain speed, and the temperature of the heat dissipation interlayer 2 can be controlled to be in a constant temperature state by controlling the flow speed and the volume of the cooling fluid 21 in the heat dissipation interlayer 2.

Furthermore, an upper heat sink 13 is disposed on a side of the chip carrier layer 1 facing the heat dissipation interlayer 2, the upper heat sink 13 may be formed integrally with the chip carrier layer 1, for example, and a lower heat sink 23 is disposed on a side of the heat dissipation interlayer 2 facing the chip carrier layer 1, for example, the lower heat sink 23 may be formed integrally with a housing of the heat dissipation interlayer 2. When the carrier sheet layer 1 is fixed to the heat-radiating interlayer 2, the lower heat-radiating fins 23 and the upper heat-radiating fins 13 are in contact with each other for conducting heat from the upper heat-radiating fins 13 into the heat-radiating interlayer 2.

In this embodiment, the upper heat sink 13 and the lower heat sink 23 may be both wedge-shaped heat sinks, and the wedge-shaped cross sections of the upper heat sink 13 and the lower heat sink 23 are in matching contact, so that the contact area between the upper heat sink 13 and the lower heat sink 23 is increased, the speed of transferring heat on the carrier layer 1 to the cooling fluid 21 is increased, and the heat is replaced to the outside of the heat dissipation interlayer by the flowing cooling fluid 21, so as to achieve the effect of rapid cooling.

In this embodiment, the material of the carrier layer may include any solid material that is easy to transfer heat, and preferably, the material may be a metal material or a metal alloy with aluminum, copper, stainless steel, cast iron, or the like as a main matrix to accelerate heat transfer. Meanwhile, the material of the upper heat sink and the lower heat sink may include any solid object that is easy to transfer heat, and preferably, the material may be a metal material or a metal alloy that uses aluminum, copper, stainless steel, or the like as a main matrix.

Further, a heat conducting sheet (not shown) may be disposed on the supporting base, and the heat conducting sheet is located between the supporting layer and the heat dissipation layer, for example, to accelerate the conduction of the heat in the exposure high temperature region to the heat dissipation layer.

In this embodiment, the slide glass layer can conduct heat into the cooling fluid through the upper and lower heat dissipation sheets which are in mutual matching contact, and the heat is replaced to the outside of the bearing base platform through the cooling fluid, so as to realize the cooling effect on the bearing base platform and the substrate to be aligned positioned on the bearing base platform, thereby avoiding the phenomenon that a large amount of organic small molecules volatilize due to overhigh temperature of the bearing base platform, the substrate to be aligned and the surrounding environment thereof, reducing or eliminating the volatilization amount of organic small molecules of the alignment liquid in the optical alignment process, further reducing or eliminating the pollution and damage of the organic small molecules to optical devices such as a linear polarization grating and a filter plate, prolonging the service life of the optical devices such as the linear polarization grating and the filter plate, and improving the stability of the optical devices of the optical alignment device.

Fig. 8 is a schematic diagram of a heat dissipation interlayer of a photoalignment device according to still another embodiment of the present invention, and fig. 9 is a schematic diagram of a heat dissipation interlayer of a photoalignment device according to still another embodiment of the present invention, as shown in fig. 8 and 9, in the photoalignment device according to the embodiment of the present invention, a structure of the heat dissipation interlayer 2 may be designed as a serpentine tube or a flat plate interlayer, and a cooling fluid in a flowing state is filled in the serpentine tube or the flat plate interlayer, and the cooling fluid flows from an inlet end of the heat dissipation interlayer to an outlet end of the heat dissipation interlayer in a unidirectional flow at a certain rate, and a temperature of the heat dissipation interlayer may be controlled to be in a constant temperature state by controlling a flow rate and a volume of the cooling fluid in the heat dissipation interlayer, or the flow rate of the cooling fluid may be adjusted according to a temperature of a carrier stage, so as to adjust the temperature of the heat dissipation interlayer.

Of course, in other embodiments, the structure of the heat dissipation interlayer may be designed in other modifications based on this, or the structure of the heat dissipation interlayer may also be a single-layer or multi-layer sandwich plate type, or a combination of multiple structures, and a person in the same industry may make simple structural adjustments, but the essence of which does not depart from the solution described in the present invention, and is also a solution protected by the present invention.

The optical alignment device provided by the invention can conduct the heat of the bearing base station into the heat dissipation interlayer and replace the heat into the outside of the bearing base station through the heat dissipation interlayer, so that the cooling effect of the bearing base station and the substrate to be aligned on the bearing base station is realized, the phenomenon that a large amount of organic micromolecules volatilize due to overhigh temperature of the bearing base station, the substrate to be aligned and the surrounding environment of the bearing base station is avoided, the volatilization amount of the organic micromolecules of the alignment liquid in the optical alignment process can be reduced or eliminated, the pollution and damage of the organic micromolecules to optical devices such as a linear polarization grating, a filter plate and the like are reduced or eliminated, the service life of the optical devices such as the linear polarization grating, the filter plate and the like is prolonged, and the stability of the optical devices of the optical alignment device is improved.

It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A photoalignment device, comprising:

the alignment light source is used for providing a light source used in an alignment process;

the linearly polarized light grid is used for forming polarized light required by the alignment process by the light source provided by the alignment light source;

the bearing base station is used for placing a substrate to be aligned; the surface of the substrate to be aligned is coated with alignment liquid, and after the alignment liquid is irradiated by the polarized light, the polymers in the same polarization direction as the polarized light are subjected to chain scission decomposition to form an alignment film with a preset angle; the bearing base platform (01) further comprises a supporting column (11) and a vacuum groove (12), the supporting column (11) comprises a solid supporting column (110) and a vacuum supporting column (120), a containing groove for containing the solid supporting column (110) and the vacuum supporting column (120) is further arranged on the bearing base platform (01), and the solid supporting column (110) and the vacuum supporting column (120) can freely ascend or descend in the containing groove;

the heat dissipation interlayer is positioned in the bearing base station and used for cooling the bearing base station and the substrate to be aligned;

the bearing base station further comprises a carrier layer, and the heat dissipation interlayer is positioned on one side, away from the linearly polarized light grid, of the carrier layer;

the heat dissipation interlayer comprises a cooling fluid in a flowing state, and the cooling fluid flows from an inlet end of the heat dissipation interlayer to an outlet end of the heat dissipation interlayer;

the carrier sheet layer is in direct contact with the cooling fluid; an upper radiating fin is arranged on one side, facing the cooling fluid, of the carrier layer, and the upper radiating fin is located in the cooling fluid;

the heat dissipation interlayer is used for controlling the temperature of the surface of the substrate to be 20-30 ℃;

the distance between the bearing base platform and the linearly polarized light grating is set within the range of 10cm-20 cm;

the cooling fluid is sealed within the heat dissipation interlayer;

one side of the radiating interlayer, which faces the carrier layer, is provided with a lower radiating fin, and the lower radiating fin is in contact with the upper radiating fin;

the upper radiating fin and the lower radiating fin are both wedge-shaped radiating fins, and the wedge-shaped sections of the upper radiating fin and the lower radiating fin are in matched contact.

2. The photoalignment device of claim 1, wherein the cooling fluid is located within the heat dissipation interlayer at a temperature ranging from 15 ℃ to 45 ℃.

3. The photoalignment device of claim 1, wherein the cooling fluid comprises deionized water, process cooling water, an organic cooling fluid, or a high pressure compressed gas.

4. The photoalignment device of claim 3, wherein the high pressure compressed gas comprises dry ice or liquid nitrogen.

5. The photoalignment device of claim 1, wherein the upper heat sink is a wedge-shaped heat sink or a blade-shaped heat sink.

6. The photoalignment device of claim 1 or 5, wherein the material of the upper and lower heat sinks comprises a metal or a metal alloy.

7. The photoalignment device of claim 6, wherein the upper and lower heat sinks are made of aluminum, copper or stainless steel.

8. The photoalignment device of claim 1, the supporting base further comprising a bearing layer, the heat dissipation interlayer being between the carrier layer and the bearing layer.

9. The photoalignment device of claim 1, the carrier stage further comprising a thermally conductive sheet between the carrier layer and the heat dissipation interlayer.

10. The photoalignment device of claim 1, the supporting base further comprising an anti-static coating formed on a side of the carrier layer facing away from the heat dissipation interlayer.

11. The photoalignment device of claim 10, wherein the antistatic coating comprises teflon.

12. The photoalignment device of claim 1, wherein the material of the carrier layer comprises a metal or a metal alloy.

13. The photoalignment device of claim 1, wherein the heat dissipation layer is a serpentine structure or a flat sandwich structure.