CN107325361A - 一种电容器外壳绝缘材料 - Google Patents
一种电容器外壳绝缘材料 Download PDFInfo
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- 239000003990 capacitor Substances 0.000 title claims abstract description 18
- 239000011810 insulating material Substances 0.000 title claims abstract description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000000203 mixture Substances 0.000 claims abstract description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000004927 clay Substances 0.000 claims abstract description 10
- 239000003063 flame retardant Substances 0.000 claims abstract description 10
- 239000010439 graphite Substances 0.000 claims abstract description 10
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 10
- 239000010445 mica Substances 0.000 claims abstract description 10
- 229910052618 mica group Inorganic materials 0.000 claims abstract description 10
- 239000004014 plasticizer Substances 0.000 claims abstract description 10
- 239000000843 powder Substances 0.000 claims abstract description 10
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 10
- YOEWQQVKRJEPAE-UHFFFAOYSA-L succinylcholine chloride (anhydrous) Chemical class [Cl-].[Cl-].C[N+](C)(C)CCOC(=O)CCC(=O)OCC[N+](C)(C)C YOEWQQVKRJEPAE-UHFFFAOYSA-L 0.000 claims abstract description 10
- 239000002994 raw material Substances 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims abstract description 7
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 3
- 229910021502 aluminium hydroxide Inorganic materials 0.000 claims description 3
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 3
- 239000000347 magnesium hydroxide Substances 0.000 claims description 3
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 3
- 229910000410 antimony oxide Inorganic materials 0.000 claims 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 claims 1
- 238000009413 insulation Methods 0.000 abstract description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/04—Ingredients characterised by their shape and organic or inorganic ingredients
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K3/2279—Oxides; Hydroxides of metals of antimony
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/346—Clay
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
- C08K7/24—Expanded, porous or hollow particles inorganic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/28—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances natural or synthetic rubbers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/2224—Magnesium hydroxide
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- Microelectronics & Electronic Packaging (AREA)
- Dispersion Chemistry (AREA)
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- Compositions Of Macromolecular Compounds (AREA)
Abstract
本发明公开了一种电容器外壳绝缘材料,包括以下重量份的原料组成:氯化丁基橡胶30‑55份;二氧化硅30‑50份;膨胀石墨8‑15份;阻燃剂20‑35份;增塑剂4‑10份;陶土10‑15份;云母粉5‑15份。本发明制得的绝缘材料具有优异的绝缘、阻燃特性,不容易被引燃,使用安全性能高,显著提高使用寿命,可广泛用于电容器外壳材料。
Description
技术领域
本发明涉及电子材料技术领域,尤其涉及一种绝缘材料。
背景技术
随着电子产业的迅速发展,计算机、通信产品和家电等产品市场的急剧扩大,对铝电解电容器的需求量也急剧上升,目前,铝电解电容器发展趋势是小型化、片式化、耐高温和长寿命,因此铝电解电容器的外壳材料尤为重要。
因此,为了解决上述存在的技术问题,本发明提供了一种新的技术。
发明内容
本发明的目的是提供了一种电容器外壳绝缘材料。
本发明针对上述技术缺陷所采用的技术方案是:
一种电容器外壳绝缘材料,包括以下重量份的原料组成:
氯化丁基橡胶 30-55份;
二氧化硅 30-50份;
膨胀石墨 8-15份;
阻燃剂 20-35份;
增塑剂 4-10份;
陶土 10-15份;
云母粉 5-15份。
进一步地,包括以下重量份的原料组成:
氯化丁基橡胶 30份;
二氧化硅 30份;
膨胀石墨 8份;
阻燃剂 20份;
增塑剂 4份;
陶土 10份;
云母粉 5份。
进一步地,包括以下重量份的原料组成:
氯化丁基橡胶 55份;
二氧化硅 50份;
膨胀石墨 15份;
阻燃剂 35份;
增塑剂 10份;
陶土 15份;
云母粉 15份。
进一步地,包括以下重量份的原料组成:所述阻燃剂为氢氧化铝、氢氧化镁以及三氧化二锑中的任意一种或一种以上的组合。
本发明的有益效果是:本发明制得的绝缘材料具有优异的绝缘、阻燃特性,不容易被引燃,使用安全性能高,显著提高使用寿命,可广泛用于电容器外壳材料。
具体实施方式
为了加深对本发明的理解,下面将结合实施例对本发明作进一步详述,该实施例仅用于解释本发明,并不构成对本发明的保护范围的限定。
实施例1
一种电容器外壳绝缘材料,包括以下重量份的原料组成:
氯化丁基橡胶 30份;
二氧化硅 30份;
膨胀石墨 8份;
氢氧化铝 20份;
增塑剂 4份;
陶土 10份;
云母粉 5份。
实施例2
一种电容器外壳绝缘材料,包括以下重量份的原料组成:
氯化丁基橡胶 45份;
二氧化硅 40份;
膨胀石墨 12份;
氢氧化镁 30份;
增塑剂 7份;
陶土 12份;
云母粉 10份。
实施例3
一种电容器外壳绝缘材料,包括以下重量份的原料组成:
氯化丁基橡胶 55份;
二氧化硅 50份;
膨胀石墨 15份;
阻燃剂 35份;
增塑剂 10份;
陶土 15份;
云母粉 15份。
本发明的有益效果是:本发明制得的绝缘材料具有优异的绝缘、阻燃特性,不容易被引燃,使用安全性能高,显著提高使用寿命,可广泛用于电容器外壳材料。
以上所述仅为本发明的优选实施例而已,并不用于限制本发明,对于本领域的技术人员来说,本发明可以有各种更改和变化。凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。
Claims (4)
1.一种电容器外壳绝缘材料,其特征在于:包括以下重量份的原料组成:
氯化丁基橡胶 30-55份;
二氧化硅 30-50份;
膨胀石墨 8-15份;
阻燃剂 20-35份;
增塑剂 4-10份;
陶土 10-15份;
云母粉 5-15份。
2.根据权利要求1所述的一种电容器外壳绝缘材料,其特征在于:包括以下重量份的原料组成:
氯化丁基橡胶 30份;
二氧化硅 30份;
膨胀石墨 8份;
阻燃剂 20份;
增塑剂 4份;
陶土 10份;
云母粉 5份。
3.根据权利要求1所述的一种电容器外壳绝缘材料,其特征在于:包括以下重量份的原料组成:
氯化丁基橡胶 55份;
二氧化硅 50份;
膨胀石墨 15份;
阻燃剂 35份;
增塑剂 10份;
陶土 15份;
云母粉 15份。
4.根据权利要求1所述的一种电容器外壳绝缘材料,其特征在于:包括以下重量份的原料组成:所述阻燃剂为氢氧化铝、氢氧化镁以及三氧化二锑中的任意一种或一种以上的组合。
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1280158A (zh) * | 2000-08-10 | 2001-01-17 | 王少华 | 丁基橡胶自粘防水胶带 |
CN102977482A (zh) * | 2012-12-24 | 2013-03-20 | 天津市橡胶工业研究所 | 一种粘弹性阻尼胶板及其制备方法 |
CN104086871A (zh) * | 2014-07-01 | 2014-10-08 | 安徽江威精密制造有限公司 | 一种自洁性耐老化电容器薄膜专用填料及其制备方法 |
CN105885256A (zh) * | 2016-06-23 | 2016-08-24 | 柳州市二和汽车零部件有限公司 | 耐酸胶管 |
-
2017
- 2017-06-27 CN CN201710503160.1A patent/CN107325361A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1280158A (zh) * | 2000-08-10 | 2001-01-17 | 王少华 | 丁基橡胶自粘防水胶带 |
CN102977482A (zh) * | 2012-12-24 | 2013-03-20 | 天津市橡胶工业研究所 | 一种粘弹性阻尼胶板及其制备方法 |
CN104086871A (zh) * | 2014-07-01 | 2014-10-08 | 安徽江威精密制造有限公司 | 一种自洁性耐老化电容器薄膜专用填料及其制备方法 |
CN105885256A (zh) * | 2016-06-23 | 2016-08-24 | 柳州市二和汽车零部件有限公司 | 耐酸胶管 |
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