CN107316933A - 高铁专用led远光灯 - Google Patents
高铁专用led远光灯 Download PDFInfo
- Publication number
- CN107316933A CN107316933A CN201710584213.7A CN201710584213A CN107316933A CN 107316933 A CN107316933 A CN 107316933A CN 201710584213 A CN201710584213 A CN 201710584213A CN 107316933 A CN107316933 A CN 107316933A
- Authority
- CN
- China
- Prior art keywords
- aln ceramic
- light source
- upside
- down mounting
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims abstract description 76
- 239000000758 substrate Substances 0.000 claims abstract description 48
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 42
- 229910052802 copper Inorganic materials 0.000 claims abstract description 42
- 239000010949 copper Substances 0.000 claims abstract description 42
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 29
- 239000006071 cream Substances 0.000 claims abstract description 29
- 238000000034 method Methods 0.000 claims abstract description 26
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000000741 silica gel Substances 0.000 claims abstract description 18
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 18
- 229960001866 silicon dioxide Drugs 0.000 claims abstract description 18
- 238000012546 transfer Methods 0.000 claims abstract description 18
- 239000000843 powder Substances 0.000 claims abstract description 13
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 9
- 238000005253 cladding Methods 0.000 claims abstract description 9
- 230000009977 dual effect Effects 0.000 claims abstract description 7
- 238000003466 welding Methods 0.000 claims description 17
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 238000007639 printing Methods 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 238000012545 processing Methods 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 abstract description 4
- 230000008901 benefit Effects 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 238000005538 encapsulation Methods 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 abstract description 3
- 230000000630 rising effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 7
- 238000013461 design Methods 0.000 description 6
- 238000009826 distribution Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 230000008676 import Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000000151 deposition Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910052573 porcelain Inorganic materials 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 206010068052 Mosaicism Diseases 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 230000001754 anti-pyretic effect Effects 0.000 description 1
- 239000002221 antipyretic Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 210000003765 sex chromosome Anatomy 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000005570 vertical transmission Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710584213.7A CN107316933A (zh) | 2017-07-18 | 2017-07-18 | 高铁专用led远光灯 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710584213.7A CN107316933A (zh) | 2017-07-18 | 2017-07-18 | 高铁专用led远光灯 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN107316933A true CN107316933A (zh) | 2017-11-03 |
Family
ID=60178806
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710584213.7A Pending CN107316933A (zh) | 2017-07-18 | 2017-07-18 | 高铁专用led远光灯 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN107316933A (zh) |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN202855795U (zh) * | 2012-09-04 | 2013-04-03 | 江苏尚明光电有限公司 | 大功率led封装结构 |
CN103325915A (zh) * | 2012-03-23 | 2013-09-25 | 东芝照明技术株式会社 | 配线基板装置、照明装置、以及配线基板装置的制造方法 |
CN103500787A (zh) * | 2013-10-16 | 2014-01-08 | 北京大学东莞光电研究院 | 一种底部可直接焊接于散热器的陶瓷cob封装led光源 |
CN104505454A (zh) * | 2014-12-06 | 2015-04-08 | 深圳市格天光电有限公司 | 高光效路灯覆晶cob光源及其生产工艺 |
CN105098031A (zh) * | 2015-07-09 | 2015-11-25 | 深圳市格天光电有限公司 | 一种覆晶工矿灯cob光源 |
CN105202437A (zh) * | 2014-06-30 | 2015-12-30 | 立碁电子工业股份有限公司 | 车用发光二极管头灯及发光二极管封装模块 |
CN105914289A (zh) * | 2016-06-08 | 2016-08-31 | 湖南华特光电科技有限公司 | 一种led芯片倒装cob的封装装置及其生产方法 |
CN205723613U (zh) * | 2016-06-08 | 2016-11-23 | 湖南华特光电科技有限公司 | 一种led倒装晶片封装结构 |
CN207074667U (zh) * | 2017-07-18 | 2018-03-06 | 中山市圣上光电科技有限公司 | 高铁专用led远光灯 |
-
2017
- 2017-07-18 CN CN201710584213.7A patent/CN107316933A/zh active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103325915A (zh) * | 2012-03-23 | 2013-09-25 | 东芝照明技术株式会社 | 配线基板装置、照明装置、以及配线基板装置的制造方法 |
CN202855795U (zh) * | 2012-09-04 | 2013-04-03 | 江苏尚明光电有限公司 | 大功率led封装结构 |
CN103500787A (zh) * | 2013-10-16 | 2014-01-08 | 北京大学东莞光电研究院 | 一种底部可直接焊接于散热器的陶瓷cob封装led光源 |
CN105202437A (zh) * | 2014-06-30 | 2015-12-30 | 立碁电子工业股份有限公司 | 车用发光二极管头灯及发光二极管封装模块 |
CN104505454A (zh) * | 2014-12-06 | 2015-04-08 | 深圳市格天光电有限公司 | 高光效路灯覆晶cob光源及其生产工艺 |
CN105098031A (zh) * | 2015-07-09 | 2015-11-25 | 深圳市格天光电有限公司 | 一种覆晶工矿灯cob光源 |
CN105914289A (zh) * | 2016-06-08 | 2016-08-31 | 湖南华特光电科技有限公司 | 一种led芯片倒装cob的封装装置及其生产方法 |
CN205723613U (zh) * | 2016-06-08 | 2016-11-23 | 湖南华特光电科技有限公司 | 一种led倒装晶片封装结构 |
CN207074667U (zh) * | 2017-07-18 | 2018-03-06 | 中山市圣上光电科技有限公司 | 高铁专用led远光灯 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: 528415 first, five building, 4 building, 93 Yongning Industrial Road, Xiaolan Town, Zhongshan, Guangdong. Applicant after: ZHONGSHAN SHENGSHANG PHOTOELECTRIC TECHNOLOGY Co.,Ltd. Address before: 528415 first blocks, 1, 129 west of Ju Cheng Road, Yongning County, Zhongshan, Guangdong Applicant before: ZHONGSHAN SHENGSHANG PHOTOELECTRIC TECHNOLOGY Co.,Ltd. |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20190821 Address after: 528400, No. 93, Yongning Industrial Road, Xiaolan Town, Guangdong, Zhongshan two Applicant after: ZHONGSHAN SAINTLY LIGHTING Co.,Ltd. Address before: 528415 No. 1 card, 4th building, 5th floor, 93 Yongning Industrial Avenue, Xiaolan Town, Zhongshan City, Guangdong Province Applicant before: ZHONGSHAN SHENGSHANG PHOTOELECTRIC TECHNOLOGY Co.,Ltd. |
|
WD01 | Invention patent application deemed withdrawn after publication | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20171103 |