CN107310271B - Ink gun and ink-jet recording apparatus - Google Patents
Ink gun and ink-jet recording apparatus Download PDFInfo
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- CN107310271B CN107310271B CN201610270820.1A CN201610270820A CN107310271B CN 107310271 B CN107310271 B CN 107310271B CN 201610270820 A CN201610270820 A CN 201610270820A CN 107310271 B CN107310271 B CN 107310271B
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- ink
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- ink gun
- single electrode
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
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- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
The present invention provides a kind of longest distance that can be shortened between the connection terminal of public electrode and driving element, and the ink gun and ink-jet recording apparatus of stability are improved and being stably driven with each driving element.Ink gun includes nozzle plate, public electrode and single electrode.Nozzle plate is formed with multiple nozzles.Public electrode is connect with multiple actuators, and applies voltage to actuator.Single electrode applies voltage to each actuator.Multiple actuators are divided into multiple groups, and are separately equipped with single electrode and public electrode to each group.The end of nozzle plate is provided with portion arranged side by side, the connection terminal for the multiple single electrodes connecting with single electrode is arranged side by side in portion arranged side by side.The connection terminal of public electrode is arranged respectively between the connection terminal of single electrode and the exterior portion in the portion arranged side by side of the connection terminal of single electrode.
Description
Technical field
The present invention relates to ink gun and ink-jet recording apparatus.
Background technique
Drop on demand ink jet recording mode is according to picture signal to be formed in recording sheet from nozzle discharge ink droplet, and by ink droplet
The mode of image.Drop on demand ink jet recording mode includes heater element type and piezoelectric element type.
In heater element type, the heater in the flow path of ink makes to generate bubble in ink.The ink droplet pressed by bubble
It spues from nozzle.On the other hand, in piezoelectric element type, pass through the piezoelectric element (Piezoelectric as actuator
Element it) deforms, makes to be housed in the indoor ink generation pressure change of ink.Pressurized drops out from nozzles spues as a result,.
The ink gun of an example as piezoelectric element type has multiple nozzles and respective multiple actuatings corresponding to nozzle
Device.Actuator has piezoelectric element and applies alive public electrode and single electrode to piezoelectric element.Public electrode and individually
Electrode is electrically connected via each conductive pattern with driving circuit.If right via public electrode and single electrode from driving circuit
Piezoelectric element applies driving voltage, then piezoelectric element deforms.The ink for being supplied to ink pressure room as a result, is pressurized.It is pressurized
Ink a part become ink droplet and from nozzle spue.
Summary of the invention
Technical problems to be solved by the inivention
In the ink gun with multiple driving elements, when being the construction with public electrode, the public electrode
It only configures with the connection terminal for applying alive outer member in the end of ink gun main body.According to this composition, with
Ink gun main body becomes large-sized, and keeps the longest distance between the connection terminal of public electrode and driving element elongated.Therefore, may be used
Variation in voltage can be generated because of routing resistance, and the driving to each driving element is caused to impact.
In addition, due to longest distance and the shortest distance between the connection terminal and driving element of public electrode difference compared with
Greatly, the difference of the variation in voltage between each driving element may be made to increase, the stability of the driving of each driving element reduces.In addition,
It only configures in the case where the end of ink gun main body in the connection terminal of public electrode, since current convergence occurs, and worries
A problem that causing short circuit, wiring breakage.
Present embodiment provides a kind of longest distance that can shorten between the connection terminal of public electrode and driving element,
And the ink gun and ink-jet recording apparatus of stability can be improved by being stably driven with each driving element.
For solving the technical solution of technical problem
The ink gun that one embodiment is related to, comprising: nozzle plate is formed with multiple nozzles；And multiple actuators, with institute
It states nozzle respectively to correspond to, the nozzle plate, which has, to be connect with multiple actuators and apply to the actuator alive public
Electrode and for applying alive single electrode to each actuator, multiple actuators are divided into multiple groups, to each
A described group is separately equipped with the single electrode and the public electrode, is provided in the end of the nozzle plate arranged side by side
Portion, the connection terminal for the multiple single electrodes connecting with the single electrode are arranged side by side in the portion arranged side by side, institute
The connection terminal for stating public electrode is arranged respectively between the connection terminal of the single electrode and the connection of the single electrode
The exterior portion in the portion arranged side by side of terminal.
A kind of ink-jet recording apparatus that one embodiment is related to has the ink gun.
Detailed description of the invention
Fig. 1 is the longitudinal section for showing the whole Sketch for the ink-jet printer that first embodiment is related to.
Fig. 2 is the top view for showing the major part for the ink gun that first embodiment is related to and constituting.
Fig. 3 is the connection for showing the connection terminal of single electrode and single electrode for the ink gun that first embodiment is related to
The longitudinal section of the major part of state.
Fig. 4 is the connection for showing the connection terminal of public electrode and public electrode for the ink gun that first embodiment is related to
The longitudinal section of the major part of state.
Specific embodiment
(composition)
Hereinafter, being illustrated referring to figs. 1 to Fig. 4 to first embodiment.In addition, being able to carry out each of a variety of descriptions
More than one other description examples are added on a ingredient sometimes.But this not negate to do not add other descriptions at
Divide and use different descriptions, also not limits the other descriptions not illustrated.In addition, each attached drawing schematically illustrates embodiment,
The size of each ingredient shown in attached drawing illustrates difference with embodiment sometimes.
Fig. 1 is the longitudinal section for showing the whole Sketch for the ink-jet printer 1 that first embodiment is related to.Ink-jet
Printer 1 is an example of ink-jet recording apparatus.In addition, ink-jet recording apparatus is not limited to this, be also possible to duplicator this
Other devices of sample.
As shown in Figure 1, ink-jet printer 1 is such as carrying out image when conveying the recording sheet P as recording medium and formed
Various processing.Ink-jet printer 1 has shell 10, paper feeding cassette 11, discharge tray 12, maintaining roller (drum) 13, conveying device 14, protects
Hold device 15, image forming apparatus 16, except electric stripping off device 17, turnover device 18 and cleaning device 19.
Paper feeding cassette 11 configures in shell 10, accommodates multiple recording sheets P.Discharge tray 12 is located at the top of shell 10.It is logical
The recording sheet P for crossing ink-jet printer 1 and being formed image is discharged to discharge tray 12.
The multiple guiding devices and multiple conveying rollers that conveying device 14 is configured with the path along feeding recordable paper P.It should
Conveying roller is motor driven and rotates, and recording sheet P is transported to discharge tray 12 from paper feeding cassette 11.
Maintaining roller 13 has the thin insulation of the cylindric frame formed by conductor and the surface for being formed in the frame
Layer.Said frame is grounded (ground line).Maintaining roller 13 rotates and with the state for the paper P that holds the record on the surface thereof, conveying
Recording sheet P.
Holding meanss 15 make the recording sheet P transferred out by conveying device 14 from paper feeding cassette 11 be adsorbed in the table of maintaining roller 13
Face (outer peripheral surface) and keep.After holding meanss 15 press recording sheet P to maintaining roller 13, recording sheet is made by the electrostatic force of electrification
P is adsorbed on maintaining roller 13.
The formation figure on the recording sheet P for being kept the outer surface that device 15 is maintained at maintaining roller 13 of image forming apparatus 16
Picture.Image forming apparatus 16 has multiple ink guns 21 on the surface towards maintaining roller 13.Multiple ink guns 21 are for example, by dividing
Image is not formed to recording sheet P discharge cyan, magenta, yellow, this four color ink of black.
Except electric stripping off device 17 is by except electricity, removing it from maintaining roller 13 the recording sheet P for being formed with image.Except electricity is shelled
Charge is supplied from device 17 and electricity is removed to recording sheet P, and is inserted into pawl between recording sheet P and maintaining roller 13.Recording sheet P as a result,
It is removed from maintaining roller 13.The recording sheet P removed from maintaining roller 13 is transported to discharge tray 12 or overturning by conveying device 14
Device 18.
Cleaning device 19 cleans maintaining roller 13.Cleaning device 19 is located on the direction of rotation of maintaining roller 13 than except electricity removing
Device 17 is farther downstream.Cleaning device 19 make cleaning member 19a be connected to rotation maintaining roller 13 surface, thus by rotation
It cleans on the surface of maintaining roller 13.
Turnover device 18 overturns the front and back sides of the recording sheet P removed from maintaining roller 13, and recording sheet P is supplied again
On the surface of maintaining roller 13.Turnover device 18 is for example, by the defined overturning path that goes back to recording sheet P inversely along front and back
Carry out feeding recordable paper P, so that recording sheet P be made to overturn.
Fig. 2 is the top view for showing the major part of ink gun 21 and constituting.Fig. 3 is the single electrode for showing ink gun 21
The longitudinal section of the major part of the connection status of the connection terminal of (lower electrode portion 106c) and single electrode.Fig. 4 is to show
The major part of the connection status of the connection terminal of the public electrode (upper electrode portion 107c) and public electrode of ink gun 21
Longitudinal section.In addition, Fig. 2, Fig. 3 and Fig. 4 for convenience of explanation, are shown in solid originally hiding various composition.
Ink-jet printer 1 has the multiple ink tanks (not shown) connecting with multiple ink guns 21 and multiple control units.Spray
Black head 21 is connect with the ink tank for the ink that receiving corresponds to color.
Ink gun 21 is by forming writings and image to the recording sheet P discharge ink droplet that roller 13 is kept is kept.As Fig. 3,
Shown in Fig. 4, ink gun 21 has nozzle plate 100, chamber arrangement body 200, ink flow path tectosome 400.Chamber arrangement body
200 be an example of matrix.
The plate of the formation rectangle of nozzle plate 100.Nozzle plate 100 is on chamber arrangement body 200 in a manner of Construction integration
And it is formed.Nozzle plate 100 has multiple nozzles (spray orifice, ink discharge hole) 101, multiple driving elements (piezoelectric element, actuating
Device) 102.
Multiple nozzles 101 are circular holes.The diameter of nozzle 101 is such as 20 μm.As shown in Fig. 2, multiple nozzles 101 divide
Multiple row is not lined up along the length direction of nozzle plate 100 (being up and down direction in Fig. 2) and width direction (being left and right directions in Fig. 2).
One column nozzle 101 and another column nozzle 101 on the length direction of nozzle plate 100 in a manner of with certain interval and
Configuration.Thereby, it is possible to configure multiple driving elements 102 more to high-density.
On the length direction of nozzle plate 100, the centre distance of adjacent nozzle 101 is such as 340 μm.In nozzle plate
In 100 width direction (being left and right directions in Fig. 2), the distance between two column of nozzle 101 are such as 240 μm.
Multiple driving elements 102 correspond to multiple nozzles 101 and configure.In other words, driving element 102 and corresponding nozzle
101 are located on the same axis.Driving element 102 forms annular in shape, surrounds corresponding nozzle 101.Driving element 102 is simultaneously unlimited
In this, for example, it can be the open annular shapes (C-shaped) of a part.
Chamber arrangement body 200 forms the plate of rectangle using silicon wafer.In addition, chamber arrangement body 200 and unlimited
In this, for example, it can be others semiconductors as silicon carbide (SiC), germanium substrate.In addition, matrix is not limited to this,
It can use that ceramics, glass, quartz, other materials are formed as resin or metal.The ceramics utilized are such as aluminium oxide potteries
Nitride as porcelain, zirconium oxide, silicon carbide, silicon nitride or barium titanate, carbide or oxide.The resin utilized is for example
Plastic material as ABS (acrylonitrile-butadiene-styrene (ABS)), polyacetals, polyamide, polycarbonate or polyether sulfone.It utilizes
Metal be such as aluminium or titanium.The thickness of chamber arrangement body 200 is such as 725 μm.The thickness of chamber arrangement body 200 is in example
In the range of 100 μm~775 μm.
As shown in Figure 3 and Figure 4, chamber arrangement body 200 has the first face 200a, the second face 200b and multiple pressure chambers
(ink chamber) 201.First face 200a and the second face 200b are flattened.Second face 200b is located at the opposite side of the first face 200a.
Nozzle plate 100 adheres on the first face 200a.
Multiple pressure chambers 201 have circular hole.The diameter of pressure chamber 201 is such as 190 μm.In addition, pressure chamber 201
Shape is not restricted thereto.Pressure chamber 201 penetrates through chamber arrangement body 200 on the thickness direction of chamber arrangement body 200, and respectively
It is open to the first face 200a and the second face 200b.The multiple pressure chambers 201 being open to the first face 200a are closed by nozzle plate 100.
Multiple pressure chambers 201 correspond to multiple nozzles 101 and configure.In other words, pressure chamber 201 and corresponding nozzle 101
On the same axis.Therefore, pressure chamber 201 is connected to corresponding nozzle 101.Pressure chamber 201 via nozzle 101 and and ink-jet
First 21 external connection.
Ink flow path tectosome 400 is for example made using stainless steel and forms the plate in rectangle.Ink flow path tectosome 400
Thickness be such as 4mm.In addition, the material of ink flow path tectosome 400 is not limited to stainless steel.For example, it is also possible to utilize ceramics
Or other materials as resin are formed.The ceramics used be such as aluminium oxide ceramics, zirconium oxide, silicon carbide, silicon nitride in this way
Nitride, carbide or oxide.The resin used is such as ABS, polyacetals, polyamide, polycarbonate or polyether sulfone
Such plastic material.The material of ink flow path tectosome 400 allow for the difference of the coefficient of expansion between nozzle plate 100 and
Selection, so that will not be influenced on the generation of the pressure for the ink that spues.
Ink flow path tectosome 400 is adhered for example, by epoxy sticker with chamber arrangement body 200.Ink flow path
Tectosome 400 has ink flow path 401, ink supply port (not shown) and ink discharge port.
Ink flow path 401 is the slot formed on the surface of ink flow path tectosome 400.The depth of ink flow path 401 is example
Such as 2mm.One of ink supply port to ink flow path is open-ended.Ink supply port is for example connect via pipe with ink tank.Oil
Ink tank is connect via ink flow path 401 with multiple pressure chambers 201.
The ink of ink tank flows into ink flow path 401 by ink supply port.The ink for being supplied to ink flow path 401 is supplied
To multiple pressure chambers 201.The ink for being filled in pressure chamber 201 is also flowed into the nozzle 101 that pressure chamber 201 is open.Ink-jet is beaten
Print machine 1 stays in ink in nozzle 101 and the pressure of ink is maintained at negative pressure appropriate.Ink makes in nozzle 101
While generating meniscus, it is held in order to avoid being leaked out from nozzle 101.
Ink discharge port to ink flow path 401 another is open-ended.Ink discharge port for example passes through pipe and ink tank
Connection.The ink of the ink flow path 401 of non-feed pressure room 201 is discharged to ink tank by ink discharge port.In this way, ink
It is recycled between ink tank and ink flow path 401.By the circulation of ink, the temperature of ink gun 21 and ink is kept constant, can
With inhibit for example due to caused by heat ink it is rotten.
Next, nozzle plate 100 is described in detail.As shown in Figure 3 and Figure 4, nozzle plate 100 has said nozzle
101 and driving element 102, oscillating plate 104, insulating film 105, lower electrode 106, upper electrode 107, protective film 108, repel oil
Ink film 109.Insulating film 105 and protective film 108 are an examples of insulation division.
Oscillating plate 104 is for example, by the SiO that forms a film on the first face 200a of chamber arrangement body 2002(silica)
And the plate in rectangle formed.In other words, oscillating plate 104 is the oxidation film of the chamber arrangement body 200 as silicon wafer.Vibration
Movable plate 104 can also be by single crystals Si (silicon), Al2O3(aluminium oxide), HfO2(hafnium oxide), ZrO2(zirconium oxide) or DLC
Other materials as (Diamond Like Carbon) are formed.The thickness of oscillating plate 104 is such as 4 μm.Oscillating plate 104
Thickness is about in the range of 1 μm~50 μm.
Oscillating plate 104 has the first face 104a and the second face 104b.First face 104a adheres to chamber arrangement body 200
On, close multiple pressure chambers 201.Second face 104b is located at the opposite side of the first face 104a.
Lower electrode 106 is formed on the second face 104b of oscillating plate 104.As shown in Figures 2 and 3, lower electrode 106 divides
It Ju You not wiring portion 106a, independent connecting end sub-portion 106b, the lower electrode portion (single electrode) being connect with piezoelectric film 111
106c.The portion of terminal 106b of lower electrode 106 is located at an end of the width direction of oscillating plate 104, has along oscillating plate 104
Length direction arrangement portion 106f arranged side by side.
As shown in Figure 2 and Figure 4, upper electrode 107 has wiring portion 107a, common connection end sub-portion 107b and piezoelectric film
Upper electrode (public electrode) 107c of 111 connections.Portion of terminal 107b is located at an end of the width direction of oscillating plate 104,
And be located at along oscillating plate 104 length direction configure portion of terminal 106b portion 106f arranged side by side between and two ends.
Lower electrode 106 is the film of such as Pt (platinum) and Al (aluminium).The wiring portion 107a and portion of terminal of upper electrode 107
107b is the film of such as Ti (titanium) and Al (aluminium).In addition, lower electrode 106 and upper electrode 107 can also be by Ni (nickel), Cu
(copper), Al (aluminium), Ag (silver), Ti (titanium), W (tungsten), Mo (molybdenum), other materials are formed as Au (copper).
The thickness of lower electrode 106 and upper electrode 107 is, for example, 0.5 μm.Lower electrode 106 and upper electrode 107
Film thickness is in the range of about 0.01 μm~1 μm.The wiring portion 106a of lower electrode 106 and the wiring portion of upper electrode 107
The width of 107a is, for example, 10 μm.
As shown in Figure 3 and Figure 4, driving element 102 is by the lower electrode portion 106c, the piezoelectric film that connect with piezoelectric film 111
111, the upper electrode 107c connecting with piezoelectric film 111 is constituted, positioned at the second face 104b of oscillating plate 104.Driving element 102 makes
Ink in corresponding pressure chamber 201 occurs for the pressure for dripping from corresponding 101 discharge ink of nozzle.
The electrode portion 106c connecting with the piezoelectric film 111 of lower electrode 106 is located at the second face 104b of oscillating plate 104.Electricity
Pole portion 106c forms the annular shape for surrounding nozzle 101.Electrode portion 106c and nozzle 101 are located on same axis.Electrode portion 106c's
Outer diameter is, for example, 133 μm.The internal diameter of electrode portion 106c is, for example, 30 μm.Therefore, separated from nozzle 101 in electrode portion 106c
A part in electrode portion 106c have with the unconnected part 106d of piezoelectric film 111, it is true by the connection with wiring portion 106a
Protect conducting.
The wiring portion 106a of lower electrode 106 connects with the electrode portion 106c of corresponding driving element 102 and portion of terminal 106b
It connects.Wiring portion 106a passes through adjacent driving element 102 on the length direction of the width direction of nozzle plate 100, nozzle plate 100
Between and extend.
As shown in Figure 3 and Figure 4, piezoelectric film 111 is while surrounding nozzle 101, and forms the electrode with lower electrode 106
The roughly the same annular shape of portion's 106c size.Piezoelectric film 111 is formed as more smaller than the electrode portion 106c of lower electrode 106, but
It can be bigger than electrode portion 106c.Piezoelectric film 111 and nozzle 101 are located on the same axis.Piezoelectric film 111 covers lower electrode 106
Electrode portion 106c.
Piezoelectric film 111 is the film of the metatitanic acid zircon lead plumbate (PZT) as piezo-electric material.In addition, piezoelectric film 111 and unlimited
In this, for example, it is also possible to utilize PTO (PbTiO3: lead titanates), PMNT (Pb (Mg1/3Nb2/3)O3-PbTiO3)、PZNT(Pb
(Zn1/3Nb2/3)O3-PbTiO3), various piezo-electric material as ZnO and AlN and formed.
The thickness of piezoelectric film 111 is, for example, 2 μm.The thickness of piezoelectric film is for example determined by piezoelectric property and insulation breakdown voltage
It is fixed.The thickness of piezoelectric film is in the range of about 0.1 μm to 5 μm.
Piezoelectric film 111 generates polarization in the thickness direction thereof.When the electric field with the polarized direction same direction is applied to
When piezoelectric film 111, piezoelectric film 111 stretches on the direction vertical with the direction of the electric field.In other words, piezoelectric film 111 is opposite
In contraction on the vertical direction of film thickness (direction in face) or extend.
In addition, as piezoelectric film 111, in the case where strong dielectric this using PZT, by applying and polarization direction phase
Anti- electric field and generate polarization overturning.Therefore, it substantially only can apply electric field on direction identical with polarization direction, pass through
Apply electric field, so that piezoelectric film 111 extends on film thickness direction, and is shunk on perpendicular to film thickness direction (direction in face).
The electrode portion 107c of upper electrode 107 forms the electrode with lower electrode 106 while surrounding nozzle 101
Portion 106c and the roughly the same annular shape of 111 size of piezoelectric film.The electrode portion 107c of upper electrode 107 is formed as comparing piezoelectric film
111 is smaller, but can also be bigger than piezoelectric film 111.Electrode portion 107c and nozzle 101 are located on the same axis.Electrode portion 107c covers
Lid piezoelectric film 111.In other words, the discharge side of piezoelectric film 111 is arranged in (towards the one of the outside of ink gun 21 in electrode portion 107c
Side).
Piezoelectric film 111 is between the electrode portion 106c of lower electrode 106, the electrode portion 107c of upper electrode 107.Change speech
It, the electrode portion 106c of lower electrode 106 and the electrode portion 107c of upper electrode 107 are overlapped on piezoelectric film 111.Piezoelectric film
111 insulate between two electrode portions 106c, 107c.The electrode portion 107c of upper electrode 107 is via piezoelectric film 111 and lower part electricity
The electrode portion 106c of pole 106 is opposite.
The electrode portion 107c of upper electrode 107 forms the outer surface 102a of driving electrodes 102.Outer surface 102a is directed towards vibration
One face of the driving element 102 of the opposite side of movable plate 104.In other words, discharge of the outer surface 102a towards driving element 102
Side.Outer surface 102a is a face substantially parallel with the second face 104b of oscillating plate 104.
The second face 104b, the surface of driving element 102 and the cloth of lower electrode 106 of the covering oscillating plate 104 of insulating film 105
Line portion 106a.Insulating film 105 has the multiple hole 105b for exposing the portion of terminal 106b of lower electrode 106.
Insulating film 105 is for example formed by SiO2.Insulating film 105 can also other materials as such as SiN (silicon nitride)
Material is formed.Insulating film 105 is electric in the lower part of the second face 104b of oscillating plate 104, the surface of driving element 102, lower electrode 106
The upper surface of pole portion 106c has substantially uniform thickness.The thickness of insulating film 105 is 1 μm.The thickness of insulating film 105 is preferably big
It causes in the range of 0.1 μm to 5 μm.In addition, the thickness of insulating film 105 can part difference.
Insulating film 105 has multiple contact portions 113.Contact portion 113 is be arranged in corresponding driving element 102 outer
Hole 105c in a part of insulating film 105 on the 102a of surface.Contact portion 113 forms such as 20 μm of diameter of circle.Contact
The hole 105b in portion 113 exposes a part for the part 107d not contacted with piezoelectric film 111.In addition, the hole 105c of contact portion 113
Expose a part of the electrode portion 107c of upper electrode 107.The hole 105c of contact portion 113 is configured to than circular electrode portion
Center between the inner periphery and the outer periphery of 107c is closer to the periphery of electrode portion 107c.
As shown in figure 4, the table of the common connection end sub-portion 107b and wiring portion 107a of upper electrode 107 in insulating film 105
Face 105a.In other words, the portion of terminal 107b and wiring portion 107a of upper electrode 107 are on insulating film 105.The table of insulating film 105
Opposite direction of the face 105a towards oscillating plate 104.
As shown in Figure 3 and Figure 4, the wiring portion 107a of upper electrode 107 is by the electrode portion 107c of corresponding driving element 102
It is connected with common connecting end sub-portion 107b.Wiring portion 107a extends in the width direction of nozzle plate 100.
As shown in Fig. 2, wiring portion 107a is integrated in the immediate vicinity of the width direction of nozzle plate 100, along nozzle plate
100 length direction forms extension.Therefore, common connection end sub-portion 107b and 8 electrode portion 107c pass through wiring portion
107a and connect.On the other hand, it will be connect with the driving element 102 in width direction end, and periodically by from nozzle plate
The wiring portion 107a that 100 end side pulls out is configured to be connected with common connecting end sub-portion 107b so that each driving element 102 and
The distance of common connection end sub-portion 107b shortens.
As shown in figure 4, surface of the wiring portion 107a of upper electrode 107 by the insulating film 105 of covering driving element 102
105a.An end of wiring portion 107a is connect by contact portion 113 with the electrode portion 107c of upper electrode 107.In other words, by
It is connect in wiring portion 107a with electrode portion 107c, therefore, contact portion 113 is the part that insulating film 105 is partially removed.
Insulating film 105 is spaced apart by the electrode portion 106c of the wiring portion 107a of upper electrode 107 and lower electrode 106.
Insulating film 105 prevents lower electrode 106 to be electrically connected with upper electrode 107.
Protective film 108 is on the second face 104b of oscillating plate 104.Protective film 108 is for example by Dongli Ltd.
Photosensitive polyimide as Photoneece (registered trademark) is formed.That is, protective film 108 is different from insulating film 105, and by
Material with insulating properties is formed.Protective film 108 is not limited to this, other insulating properties materials as resin or ceramics
Material is formed.The resin utilized be, for example, the polyimides of other types, ABS, polyacetals, polyamide, polycarbonate, polyether sulfone this
The plastic material of sample.The ceramics utilized are, for example, the nitride such as zirconium oxide, silicon carbide, silicon nitride, barium titanate or oxide.And
And it can also be formed by metal material if protective film 108 has with driving element 102 and the insulating properties of upper electrode 107.It should
Metal material is, for example, aluminium, SUS or titanium.
The material of protective film 108 need to consider heat resistance, insulating properties, thermal expansion coefficient, flatness, come to the wetability of ink
Selection.In the case where ink-jet printer 1 is using the high ink of conductivity, the insulating properties of the material can influence driving element
The degree of metamorphism of ink when 102 driving.
Protective film 108 covers the surface 105a and upper electrode 107 of the second face 104b of oscillating plate 104, insulating film 105
Wiring portion 107a.In other words, protective film 108 covers driving element 102 and lower electrode 106 from the top of insulating film 105
Wiring portion 106a.Protective film 108 protects driving element 102, lower electrode 106 and upper electrode 107 from contact ink and sky
Moisture in gas.Protective film 108, which has, reveals multiple portion of terminal 106b, 107b of lower electrode 106 and upper electrode 107 respectively
Multiple holes out.
The material of protective film 108 is different from the young modulus of material of oscillating plate 104.Form the SiO of oscillating plate 1042Poplar
Family name's modulus is 80.6GPa.On the other hand, the Young's modulus for forming the polyimides of protective film 108 is 4GPa.That is, protective film 108
Young's modulus it is smaller than the Young's modulus of oscillating plate 104.
Protective film 108 forms substantially smooth surface 108a, but has small bumps.For example, being provided with driving member
The surface 108a of the part of part 102, protective film 108 is swelled than other parts.The surface 108a of protective film 108, which is located at, is adhered to vibration
The opposite side in the face of movable plate 104.
Protective film 108 other than the part with driving element 102, lower electrode 106 and upper electrode 107,
Thickness is about 4 μm.The film thickness of protective film 108 is in the range of about 1 μm to 50 μm.The thickness of the protective film 108 is from vibration
Distance until second face 104b to the surface 108a of protective film 108 of movable plate 104.The protective film formed in driving element 102
108 thickness is about 2.5 μm.The thickness of the protective film 108 is from the surface of the insulating film 105 in driving element 102
Distance until 105a to the surface 108a of protective film 108.
Repel a part of ink film 109 covering protection film 108 and insulating film 105.Repel ink film 109 by such as rising sun
The cytop (registered trademark) of Xiao Zi Co., Ltd. is such to have fluid drainage silicon class drainage material or fluorinated organic material shape
At.In addition, repelling ink film 109 can also be formed by other materials.
On the periphery of the portion of terminal 107b of the portion of terminal 106b and upper electrode 107 of lower electrode 106, repel ink film
109 not covering protection film 108 and make its exposing.The surface 109a for repelling ink film 109 forms the surface of nozzle plate 100.Repel
The surface 109a of ink film 109 is located at the opposite side in the face adhered with protective film 108.
The thickness of repulsion ink film 109 other than part with driving element 102, upper electrode 107 and lower electrode 106
Degree is, for example, 1 μm.The thickness for repelling ink film 109 is preferably for example in the range of 0.01 μm to 10 μm.It is provided with driving member
The thickness of the repulsion ink film 109 of the part of part 102 is thinner than other parts.In addition, the thickness for repelling ink film 109 is also possible to
Certain.
When the ink drop that nozzle 101 spues is attached near nozzle 101, it is possible to reduce the stabilization of ink discharge
Property.Repel the surface that ink film 109 inhibits ink drop to be attached to nozzle plate 100.
Nozzle 101 is through oscillating plate 104, protective film 108 and repels ink film 109.In other words, nozzle 101 is by oscillating plate
104, protective film 108 and the repulsion formation of ink film 109.Oscillating plate 104 and protective film 108 have ink-receptive (lyophily), because
This, the meniscus for the ink being housed in pressure chamber 201 is maintained in nozzle 101.A part of protective film 108 is between nozzle
Between 101 and the inner peripheral surface of driving element 102.
Control unit (not shown) is connect for example, by flexible cable with the portion of terminal 106c of lower electrode 106.Control unit is
Such as it controls the IC of ink gun 21, control the microcomputer of ink-jet printer 1.On the other hand, the portion of terminal of upper electrode 107
107b is for example connect with GND (ground connection=0V).
Control unit transmits the signal for driving corresponding driving element 102 to lower electrode 106.Lower electrode 106 is made
Single electrode to act multiple driving elements 102 independently uses.
Above-mentioned ink gun 21 for example carries out printing as follows (image is formed).By the operation of user, print instruction
Signal is entered control unit.Control unit is based on the print instruction, applies signal to multiple driving elements 102.In other words, control unit
Driving voltage is applied to the electrode portion 106c of lower electrode 106.
After signal is applied to the electrode portion 106c of lower electrode 106, in the electrode portion 106c of lower electrode 106, top
Potential difference is generated between the electrode portion 107c of electrode 107.As a result, piezoelectric film 111 be applied with the equidirectional electric field of polarization direction,
Driving element 102 is stretched on the direction vertical with direction of an electric field.
On this nozzle plate 100, when driving element 102 is in the case where the direction vertical with direction of an electric field extends, vibration
Movable plate 104 is bent in a manner of making the smaller volume of pressure chamber 201.On the contrary, when driving element 102 is vertical with direction of an electric field
In the case that direction is shunk, oscillating plate 104 is bent in a manner of making the volume enlargement of pressure chamber 201.At this moment, insulating film 105 and
Protective film 108 hinders the bending.
Specifically, as shown in Figure 3 and Figure 4, driving element 102 is sandwiched in oscillating plate 104 and insulating film 105 and protective film
Between 108.Therefore, when driving element 102 is in the case where the direction vertical with direction of an electric field extends, oscillating plate 104 is by right
201 side of pressure chamber makes its deformation into the power of concave shape.In other words, oscillating plate 104 can increase in the volume for making pressure chamber 201
Side be bent upwards.On the contrary, insulating film 105 and protective film 108 are made its deformation into convex by 201 side of a kind of pair of pressure chamber
The power of shape.In other words, insulating film 105 and protective film 108 can be bent upwards in the side for the volume reducing for making pressure chamber 201.
On the other hand, when driving element 102 is when the direction vertical with direction of an electric field is shunk, oscillating plate 104 is by one kind
Make its deformation into the power of convex form 201 side of pressure chamber.In other words, oscillating plate 104 can be such that the volume of pressure chamber 201 subtracts
Small side is bent upwards.Moreover, insulating film 105 and protective film 108 deform it into recessed by 201 side of a kind of pair of pressure chamber
The power of shape.In other words, insulating film 105 and protective film 108 can be bent upwards in the side that the volume for making pressure chamber 201 increases.
As described above, oscillating plate 104 can be bent in directions opposite each other with insulating film 105 and protective film 108.That is,
It can make the power of the deformation of the generation obstruction oscillating plate 104 of driving element 102 by the insulation division that insulating film 105 and protective film 108 are formed
(membrane stress).
The deflection of component will affect Young's modulus and the thickness of the component.Form the poplar of the polyimides of protective film 108
The SiO of family name's modular ratio formation oscillating plate 1042It is small.Therefore, oscillating plate 104 is compared, protective film 108 is relative to identical power
Deflection is bigger.Moreover, insulating film 105 is thinner than oscillating plate 104.Therefore, oscillating plate 104 is compared, insulating film 105 is relative to phase
The deflection of same power is bigger.
As described above, driving element 102 is acted by beam mode (bending vibration).Driving element 102 is applied electricity
When pressure, by deforming oscillating plate 104, and change the volume of pressure chamber 201.
Firstly, driving element 102 increases the volume of pressure chamber 201 and deforming oscillating plate 104.As a result, to receipts
The ink held in pressure chamber 201 generates negative pressure, and ink is from 401 feed pressure room 201 of ink flow path.
Next, driving element 102 reduces the volume of pressure chamber 201 and deforming oscillating plate 104.It presses as a result,
The ink of power room 201 is pressurized.The positive pressure being applied on the ink will not be discharged into ink flow path 401, and be closed in
In pressure chamber 201.Spue from nozzle 101 pressurized ink as a result,.
Oscillating plate 104 and the difference of the Young's modulus of protective film 108 are bigger, and the voltage for making it possible that ink spues is got over
It is low, the ink so that ink gun 21 can more effectively spue.Moreover, being formed by insulation division by insulating film 105 and protective film 108
Bigger with the difference of the thickness of oscillating plate 104, the voltage that ink can be made to spue is lower, so that ink gun 21 can more effectively be spat
Ink out.
Next, being illustrated to an example of the manufacturing method of ink gun 21.Firstly, before being formed to pressure chamber 201
Chamber arrangement body 200 (silicon wafer) the first face 200a whole region formed SiO2Film is as oscillating plate 104.The SiO2
Film forms film for example, by thermal oxide embrane method.In addition, SiO2Film can also be formed a film by other methods as CVD method.
The silicon wafer for forming chamber arrangement body 200 is one block of big plectane.Later, it can be cut from the silicon wafer multiple
Chamber arrangement body 200.In addition, being not limited to this, a chamber arrangement body can also be formed by the silicon wafer of one piece of rectangle
200。
In the manufacturing process of ink gun 21, above-mentioned silicon wafer is heated repeatedly and the film forming of film.Therefore, above-mentioned
Silicon wafer has heat resistance, meets SEMI (Semiconductor Equipmentand Materials International)
Standard, and pass through being smoothed of mirror ultrafinish.
Next, forming a film in the second face 104b of oscillating plate 104 to the metal film for forming lower electrode 106.It is first
First, it using sputtering method, forms a film in order to the film of the film of Ti and Pt.The film thickness of Pt is, for example, 0.45 μm, the film thickness example of Ti
0.05 μm in this way.In addition, the metal film can also be formed by vapor deposition and gold-plated such other methods.
Next, forming piezoelectric film 111 on the metal film for forming lower electrode 106.Piezoelectric film 111 is for example, by RF magnetic
Keyholed back plate sputtering method forms a film.At this moment, the temperature of above-mentioned silicon wafer is heated to such as 350 DEG C.After piezoelectric film 111 forms a film, in order to
Its piezoelectricity is assigned, carries out heat treatment in 3 hours to piezoelectric film 111 at 650 DEG C.Piezoelectric film 111 can be obtained good as a result,
Crystallinity, simultaneously, moreover it is possible to obtain good piezoelectric property.Piezoelectric film 111 can also be for example, by CVD (chemical vapor deposition
Method), sol-gal process, AD method (aerosol deposition method), other preparation methods as hydrothermal synthesis method are formed.
Next, on piezoelectric film 111, to the metal film of the Pt for the electrode portion 107c for forming upper electrode 107 carry out at
Film.The metal film is for example, by sputtering film-forming.The metal film can also pass through vacuum evaporation and gold-plated such other preparation methods
To be formed.
Next, by etching above-mentioned metal film and piezoelectric film 111, to the electrode portion 107c and piezoelectricity of upper electrode 107
Film 111 is patterned.Patterning is that the etching is covered by making etching mask on above-mentioned metal film, and by etching removing
Above-mentioned metal film and piezoelectric film 111 other than film carry out.Above-mentioned metal film and piezoelectric film 111 are temporarily patterned.In addition, above-mentioned
Metal film and piezoelectric film 111 can also be patterned individually.Etching mask passes through coating, preliminary drying, the use of photonasty resist
It forms exposure, development and the rear baking of the exposure mask of required pattern and is formed.
Next, forming lower electrode 106 by patterning.Patterning is by piezoelectric film 111 and upper electrode 107
Electrode portion 107c and piezoelectric film 111 under above-mentioned metal film (Pt/Ti) on make etching mask, and being removed by etching should
Above-mentioned metal film other than etching mask carries out.Etching mask by the coating of photonasty resist, preliminary drying, using foring
It needs exposure, development and the rear baking of the exposure mask of pattern and is formed.
Spray is centrally formed in electrode portion 106c, 107c and piezoelectric film 111 of lower electrode 106 and upper electrode 107
Mouth 101.Therefore, the metal film and piezoelectricity not having with electrode portion 106c, 107c and the center concentric circles of piezoelectric film 111 be will form
The part of film 111.As described above, being formed with driving element 102 on the face 104b in the second face of oscillating plate 104.Pass through pattern
Change, oscillating plate 104 is from the wiring portion 106a, lower electrode portion 106c and driving element 102 of lower electrode 106 to expose outside.
Next, forming insulating film 105 on the face 104b in the second face of oscillating plate 104 and driving element 102.Insulation
Film 105 in a manner of film formation at low temp that can realize that the CVD method of good insulating properties is formed.Insulating film 105 is not limited to this,
It can use sputtering method or such other methods be deposited and formed.
Insulating film 105 is patterned after film forming.In order to form nozzle 101, and is formed and do not had and driving element 102
Center is the part of the insulating film 105 of concentric circles.Meanwhile forming contact portion 113.Part without the insulating film 105, it is straight
Diameter is, for example, 10 μm.Patterning is carried out by removing the insulating film 105 other than etching mask using etching.Etching mask is logical
Cross the coating of photonasty resist, preliminary drying, using the exposure for the exposure mask for foring desired pattern, development, fixing and rear baking
It bakes and is formed.
Next, on insulating film 105, to the wiring portion 106a and portion of terminal 106b, upper electrode for forming lower electrode
The metal film of 107 wiring portion 107a and portion of terminal 107b form a film.The metal film is the Ti for example by sputtering film-forming
(titanium)/Al (aluminium) film.The film thickness of Ti is, for example, 0.1 μm, and the film thickness of Al is, for example, 0.4 μm.The metal film can also be by true
Sky vapor deposition and gold-plated such other preparation methods are formed.The metal film passes through the electrode portion of contact portion 113 and lower electrode 106
Any of 106c, electrode portion 107c of upper electrode 107 are connected.
By patterning to above-mentioned metal film, the wiring portion 106a and portion of terminal 106b, top of lower electrode are formed
The wiring portion 107a and portion of terminal 107b of electrode 107.Patterning and is passed through by making etching mask on above-mentioned metal film
Etching removes the above-mentioned metal film other than the etching mask and carries out.Etching mask by the coating of photonasty resist, preliminary drying,
It is formed using the exposure for the exposure mask for foring required pattern, development and rear baking.
Next, to the SiO for forming oscillating plate 1042Film is patterned, to form a part of nozzle 101.Pattern
Change is by SiO2Etching mask is made on film, and the SiO other than etching mask is removed by etching2Film carries out.Etching mask
By to carried out on oscillating plate 104 coating of photonasty resist, preliminary drying, using the exposure mask for foring required pattern exposure,
Develop and toasts and formed afterwards.
Next, passing through spin coating method (spin coated) in the wiring portion of oscillating plate 104, insulating film 105, lower electrode
106a and portion of terminal 106b, upper electrode 107 wiring portion 107a and portion of terminal 107b on form protective film 108.It is covered that is, being formed
The protective film 108 of lid insulating film 105.Firstly, using the second face of the solution covering oscillating plate 104 containing polyimide precursor
104b and insulating film 105.Next, above-mentioned silicon wafer is rotated, so that solution surface is smoothened.Hot polymerization is carried out by baking
It closes and solvent removes, form protective film 108.
The forming method of protective film 108 is not limited only to spin coating method.Protective film 108 can also be steamed by CVD, vacuum
Plating or gold-plated this other methods are formed.
By patterning to protective film 108, form nozzle 101, and make lower electrode 106 portion of terminal 106b, on
The portion of terminal 107b of portion's electrode 107 exposes.Patterning carries out in order according to the material of protective film 108.
The shape to this non-photosensitive polyimides of Semicofine (registered trademark) for example, by Dongli Ltd.
It is illustrated at the case where protective film 108.Firstly, by spin coating method by the solution film forming containing polyimides, and pass through
Baking carries out thermal polymerization and solvent removal, and is burnt into forming.Then, etching mask is made on non-photosensitive polyimide film,
The polyimide film other than etching mask is removed by etching, is patterned.Etching mask passes through sub- to non-photosensitive polyamides
The coating of carry out photonasty resist on amine film, preliminary drying, using the exposure for the exposure mask for foring required pattern, development and
After toast and formed.
This photosensitive polyimide of Photoneece (registered trademark) for example, by Dongli Ltd. is formed and is protected
The case where cuticula 108, is illustrated.Firstly, carrying out preliminary drying for after solution film forming by spin coating method.Then, by using
After the exposure of exposure mask, developing procedure, patterned.Pair in the case where positive type photosensitive polyimide, in above-mentioned exposure mask
It should be in the part of the portion of terminal 107b of nozzle 101, opening portion 115, the portion of terminal 106b of lower electrode 106 and upper electrode 107
It is open (light transmission).In the case where negative-type photosensitive polyimides, correspond to nozzle 101, opening portion (not in above-mentioned exposure mask
Diagram), the part of the portion of terminal 107b of the portion of terminal 106b of lower electrode 106 and upper electrode 107 is by shading.Then, it carries out
After toast, protective film 108 i.e. be burnt into forming.
Next, pasting covering band on protective film 108.Covering band is the chemical mechanical grinding of such as silicon wafer
The back-protective adhesive tape of (Chemical Mecanical Polishing:CMP).Make the chamber arrangement for being pasted with covering band
Body 200 is spun upside down, and forms multiple pressure chambers 201 in chamber arrangement body 200.Pressure chamber 201 is formed by patterning.
Fig. 3 and Fig. 4 is to show the sectional view of the ink gun of protective film for the insulating properties to form first embodiment.It carries out
Silicon substrate is dedicated to be referred to as the vertical deep pick dry ecthing (for example, referring to International Publication No. 2003/030239) of Deep-RIE,
Chamber arrangement body 200 is etched, pressure chamber 201 is formed.At this moment, it is made on the chamber arrangement body 200 of silicon wafer
It is formed with the resist exposure mask of required pattern, in this way, above-mentioned pressure chamber 201 is formed required pattern.Resist
Exposure mask is by the coating of photonasty resist, preliminary drying, using the exposure, development, Yi Jihou for the exposure mask for foring required pattern
It toasts and is formed.
SF6 gas for above-mentioned etching is to the SiO of oscillating plate 1042And the polyimides of protective film 108 does not have etching
Effect.Therefore, the dry ecthing for forming the above-mentioned silicon wafer of pressure chamber 201 stops carrying out in oscillating plate 104.In other words, oscillating plate
104 as above-mentioned etching stop-layer and work.
In addition, above-mentioned etching can also be using as the wet etch method using medical fluid, the dry ecthing method using plasma
Various methods.Moreover, also can change engraving method and etching condition according to material difference.
As described above, from the process for forming driving element 102 and nozzle 101 on oscillating plate 104, in chamber arrangement
The process that body 200 forms pressure chamber 201 is carried out by film technique, photoetching and etching technique and spin coating method.Cause
This, can form accurate and easy nozzle 101, driving element 102 and pressure chamber 201 on a silicon wafer.
Next, to the second face 200b adhesion ink flow path tectosome 400 of chamber arrangement body 200.That is, using epoxy
Class sticker adheres ink flow path tectosome 400 and chamber arrangement body 200.
Next, covering band is pasted onto a part of protective film 108, so that the portion of terminal of covering lower electrode 106
The portion of terminal 107b of 106b and upper electrode 107.The covering band is formed by resin, and can be easily detached from from protective film 108.On
Stating covering band prevents dirt and repulsion ink film 109 to be attached to the portion of terminal 106b of lower electrode 106 and the end of upper electrode 107
On sub-portion 107b.
Repel ink film 109 next, being formed on protective film 108.Repel ink film 109 protecting by spin coating method
Make the repulsion ink membrane material of liquid into film on cuticula 108.At this point, injecting positive-pressure type air by ink supply port.As a result,
Positive-pressure type air is discharged from the nozzle 101 being connected to ink flow path 401.In this case, the repulsion ink membrane material of liquid is applied
After material, repulsion ink membrane material can be inhibited to be attached on the inner peripheral surface of nozzle 101.It is formed after repelling ink film 109, will be protected
Film 108 is removed from above-mentioned covering band.
Next, dividing above-mentioned silicon wafer, multiple ink guns 21 are formed.Ink gun 21 is loaded in the interior of ink-jet printer 1
Portion.Control unit is connect via such as flexible cable with the portion of terminal 106b of lower electrode 106.In addition, ink flow path tectosome 400
Ink supply port and ink discharge port for example connect by pipe with ink tank.
As described above, present embodiment, is the production nozzle plate 100 on chamber arrangement body 200.However, it is also possible to not
Nozzle plate 100 is made on chamber arrangement body 200, but using a part of chamber arrangement body 200 as oscillating plate 104.
For example, forming driving element 102 in a face of chamber arrangement body 200, is formed from other face sides and be equivalent to pressure chamber 201
Hole.The hole is not through chamber arrangement body 200.The thin layer under the side residual in a face of chamber arrangement body 200, the portion
It is allocated as acting for oscillating plate 104.
(effect/effect)
Next, being illustrated referring to Fig. 2 to the function and effect of the first embodiment of above-mentioned composition.It is real according to first
The ink gun 21 for applying the ink-jet printer 1 of mode has the nozzle plate 100 for being formed with multiple nozzles 101 and corresponds to each spray
Multiple driving elements 102 of mouth 101.Nozzle plate 100 is included to be connect with multiple driving elements 102, and is applied to driving element 102
Alive public electrode, that is, upper electrode portion 107c and for applying alive single electrode i.e. to each driving element 102
Lower electrode 106c.Moreover, being provided with portion 106f arranged side by side in the end of nozzle plate 100, being arranged side by side has and individually electricity
Connection terminal, that is, portion of terminal 106b of multiple single electrodes of the lower electrode portion 106c connection of pole.As upper electrode portion 107c
The connection terminal of this public electrode, portion of terminal 107b are located at the portion of terminal 106b's configured along the length direction of oscillating plate 104
It is arranged side by side between portion 106f and on two ends.In this way, can frequent by the connection of upper electrode 107
Portion of terminal 107b is pulled out to the end of nozzle plate 100.Therefore, compared to only in the end of ink gun main body configuration upper electrode portion
107c and as the connection terminal for applying alive outer member portion of terminal 107b the case where, each driving member can be shortened
The upper electrode portion 107c of part 102 is at a distance from connecting end sub-portion 107b.Therefore, each driving element 102 and top can be shortened
The distance of the connecting end sub-portion 107b of electrode portion 107c, so as to reduce variation in voltage caused by routing resistance.Moreover, can subtract
The difference of longest distance and the shortest distance between the upper electrode portion 107c and connecting end sub-portion 107b of small each driving element 102.
The variation in voltage difference between each driving element 102 becomes smaller as a result, and the stability of driving is kept to be possibly realized.Further, since connection
Portion of terminal 107b is arranged to frequent, thus is avoided that current convergence, so as to inhibit because of short circuit and wiring breakage etc.
Yield rate reduces caused by generation.
Moreover, in the present embodiment, multiple driving elements 102 being divided into multiple groups, have been separately equipped with work to each group
Lower electrode portion 106c for the single electrode and upper electrode portion 107c as public electrode.Herein, as shown in Fig. 2, by 8
A driving element 102 is used as a group, is configured with upper electrode 107 between the approximate centre position of each driving element 102
Wiring portion 107a.The wiring portion 106a of lower electrode 106 is extended upward in the side vertical with the configuration direction of wiring portion 107a.
Herein, the wiring portion 106a of lower electrode 106 is directed to the portion 106f arranged side by side of the portion of terminal 106b of lower electrode 106 side by side
Setting direction and the two sides configured in each lower electrode 106.Moreover, the wiring portion 106a of lower electrode 106 by with nozzle plate
Between the adjacent another column driving element 102 of 100 length direction, it is led to portion of terminal 106b.It in this way, can be with
Same shape is regularly formed each group driving element 102, so as to simplify the manufacture of ink gun 21.
In addition, in the above-described embodiment, showing and regarding 8 driving elements 102 as a group, making all groups includes
The same number of example of driving element 102, but the number of each group driving element 102 that includes needs not be identical number, it can
To change the number of the driving element for including in each group 102.Such case can also reduce the upper electrode of each driving element 102
The difference of longest distance and the shortest distance between portion 107c and connecting end sub-portion 107b.Therefore, top by frequent is formed
The connecting end sub-portion 107b of electrode portion 107c, can be in the connecting end sub-portion 107b and driving element for shortening upper electrode portion 107c
While longest distance between 102, reduce the difference of longest distance and the shortest distance, so as to mitigate the shadow caused by driving
It rings.
According to these embodiments, a kind of can be shortened between the connection terminal of public electrode and driving element can be provided
Longest distance improves the ink gun and ink-jet recording apparatus of stability and being stably driven with each driving element.Although explanation
Several embodiments, but these embodiments are proposed only as example, it is not intended that limit the range of invention.These
Embodiment can be implemented with various other ways, can carry out various provinces without departing from the spirit and scope of the invention
Slightly, replacement, change.These embodiments and modifications thereof are included in the scope and spirit of invention, are similarly included in power
In the range of invention and its equalization documented by sharp claim.
Symbol description
1 ... ink-jet printer, 21 ... ink guns, 100 ... nozzle plates, 101 ... nozzles, 102 ... driving elements (actuator),
104 ... oscillating plates, 105 ... insulating films, 106 ... lower electrodes (single electrode), 106a ... wiring portion, the independent connecting pin 106b ...
Sub-portion, 106c ... lower electrode portion, 106f ... be arranged side by side portion, 107 ... upper electrodes (public electrode), 107a ... wiring portion,
Ink film, 111 ... piezoelectricity are repelled in 107b ... common connection end sub-portion, 107c ... upper electrode portion, 108 ... protective films, 109 ...
Film, 200 ... chamber arrangement bodies, 201 ... pressure chambers.
Claims (10)
1. a kind of ink gun, comprising:
Nozzle plate is formed with multiple nozzles；And
Multiple actuators, it is respectively corresponding with the nozzle,
The nozzle plate, which has, to be connect with multiple actuators and applies alive public electrode to the actuator and be used for
Alive single electrode is applied to each actuator,
Multiple actuators are divided into multiple groups, are separately equipped with the single electrode and the common electrical to each described group
Pole,
The end of the nozzle plate is provided with portion arranged side by side, the multiple single electrodes being connect with the single electrode
Connection terminal is arranged side by side in the portion arranged side by side,
The connection terminal of the public electrode is arranged respectively between the connection terminal of the single electrode and the single electrode
Connection terminal portion arranged side by side exterior portion.
2. ink gun according to claim 1, wherein
The wiring portion of the single electrode passes through between the actuator, and is led to the connection terminal.
3. ink gun according to claim 1, wherein
The number difference of the single electrode in each described group of the nozzle plate is identical.
4. ink gun according to claim 1, wherein
The number of the single electrode in each described group of the nozzle plate is not identical respectively.
5. ink gun according to claim 2, wherein
The wiring portion of the single electrode configures on the direction arranged side by side of the connection terminal of the single electrode in the list
The two sides of only electrode.
6. ink gun according to claim 1, wherein
The wiring portion of the public electrode is configured between the center of each actuator.
7. ink gun according to claim 6, wherein
The wiring portion of the single electrode is extended on the direction orthogonal with the configuration direction of the wiring portion of the public electrode.
8. ink gun according to claim 1, wherein
The single electrode is aluminium film.
9. ink gun according to claim 1, wherein
The public electrode is aluminium film.
10. a kind of ink-jet recording apparatus has ink gun according to any one of claim 1 to 9.
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| CN201610270820.1A CN107310271B (en) | 2016-04-27 | 2016-04-27 | Ink gun and ink-jet recording apparatus |
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| CN201610270820.1A CN107310271B (en) | 2016-04-27 | 2016-04-27 | Ink gun and ink-jet recording apparatus |
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| CN107310271B true CN107310271B (en) | 2019-04-26 |
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| CN1754701A (en) * | 2004-09-30 | 2006-04-05 | 兄弟工业株式会社 | Inkjet head |
| EP1749661A2 (en) * | 2005-08-01 | 2007-02-07 | Seiko Epson Corporation | Electrostatic actuator, droplet discharge head, method for driving droplet discharge head, and method for manufacturing electrostatic actuator |
| US8002389B2 (en) * | 2007-06-08 | 2011-08-23 | Brother Kogyo Kabushiki Kaisha | Liquid jetting apparatus |
| CN104589800A (en) * | 2010-03-02 | 2015-05-06 | 精工爱普生株式会社 | liquid ejecting head, liquid ejecting apparatus, and piezoelectric element |
| CN104943381A (en) * | 2014-03-26 | 2015-09-30 | 兄弟工业株式会社 | Liquid ejection apparatus and method for producing liquid ejection apparatus |
| JP2016055513A (en) * | 2014-09-09 | 2016-04-21 | 株式会社東芝 | Correction amount determination method, ink jet head, and printing device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5432064B2 (en) * | 2010-05-31 | 2014-03-05 | エスアイアイ・プリンテック株式会社 | Liquid ejecting head and liquid ejecting apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1754701A (en) * | 2004-09-30 | 2006-04-05 | 兄弟工业株式会社 | Inkjet head |
| EP1749661A2 (en) * | 2005-08-01 | 2007-02-07 | Seiko Epson Corporation | Electrostatic actuator, droplet discharge head, method for driving droplet discharge head, and method for manufacturing electrostatic actuator |
| US8002389B2 (en) * | 2007-06-08 | 2011-08-23 | Brother Kogyo Kabushiki Kaisha | Liquid jetting apparatus |
| CN104589800A (en) * | 2010-03-02 | 2015-05-06 | 精工爱普生株式会社 | liquid ejecting head, liquid ejecting apparatus, and piezoelectric element |
| CN104943381A (en) * | 2014-03-26 | 2015-09-30 | 兄弟工业株式会社 | Liquid ejection apparatus and method for producing liquid ejection apparatus |
| JP2016055513A (en) * | 2014-09-09 | 2016-04-21 | 株式会社東芝 | Correction amount determination method, ink jet head, and printing device |
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