CN107309220A - A kind of slicken solder load track element - Google Patents
A kind of slicken solder load track element Download PDFInfo
- Publication number
- CN107309220A CN107309220A CN201710457530.2A CN201710457530A CN107309220A CN 107309220 A CN107309220 A CN 107309220A CN 201710457530 A CN201710457530 A CN 201710457530A CN 107309220 A CN107309220 A CN 107309220A
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- CN
- China
- Prior art keywords
- slicken solder
- hydrogen
- track element
- protective gas
- element according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of slicken solder load track element, including：Track body and plasma cleaner, the both sides of track body are provided with multiple hydrogen nitrogen protective gas joints, and plasma cleaner is provided with multiple pipelines, multiple pipelines respectively with multiple hydrogen nitrogen protective gas fittings.Pass through said structure design, plasma cleaner carries out pollutant cleaning to the surface of bare copper frame in the previous station of load processing procedure, and to there is the bare copper frame surface of oxidizing elemental to carry out reduction deoxidation, the cleanliness factor on bare copper frame surface is lifted in solder load, the backflow performance of solder is improved.The cleannes on bare copper frame surface are improved using plasma cleans machine simultaneously, and then are measured the need for reducing hydrogen, production cost are reduced while improving the security of production process.
Description
Technical field
The present invention relates to semiconductor fabrication techniques field, more particularly to a kind of slicken solder load track element.
Background technology
Plasma cleaner is handled by using the property of ion, electronics, atom or active group isoreactivity component
The surface of sample, so as to realize the purposes such as cleaning, coating.Need to be heated to bare copper frame during production of semiconductor products, work
Solder stick melting between chip and framework is used during skill, both are combined together after cooling, the method for this fixation is led to
Often referred to as slicken solder load.
Because bare copper frame can produce oxidative phenomena in high temperature guide rail, generally conventional method is used in heating track
Hydrogen-nitrogen mixture gas is protected, reduced, it is ensured that bare copper frame avoids oxidation at high temperature.All it is generally in the prior art in height
Hydrogen-nitrogen mixture gas is directly injected into warm guide rail, such a mode needs the hydrogen gas amount of consumption big, adds the cost of manufacture,
Simultaneously because hydrogen easily combustion explosion at normal temperatures and pressures, higher hydrogen content significantly impacts the safety of production process
Property.
Therefore, in the market needs a kind of slicken solder load track element badly, while product quality is ensured, reduces semiconductor
The gas supply of hydrogen in process of producing product, reduces production cost and improves the security of production process.
The content of the invention
It is an object of the invention to provide a kind of slicken solder load track element, to solve asking for above-mentioned prior art presence
Topic, while product quality is ensured, the gas supply of hydrogen, reduces production cost during reduction production of semiconductor products
And improve the security of production process.
To achieve the above object, the invention provides following scheme：The present invention provides a kind of slicken solder load track element,
Including：
Track body, the both sides of the track body are provided with multiple hydrogen nitrogen protective gas joints；
Plasma cleaner, the plasma cleaner is provided with multiple pipelines, multiple pipelines respectively with multiple institutes
State hydrogen nitrogen protective gas fittings.
Preferably, bringing-up section and cooling section are included on the track body.
Preferably, the length of the bringing-up section is more than the length of the cooling section.
Preferably, the air supply source of the plasma cleaner includes hydrogen and nitrogen.
Preferably, the mass ratio of the hydrogen of the air supply source and nitrogen is 0.5:10.
Preferably, the hydrogen nitrogen protective gas joint quantity of the track body both sides is different.
Preferably, the hydrogen nitrogen protective gas joint is raised type interface.
Preferably, the leading portion of the guide rail body has the monitoring alarm for preventing multi-disc or preventing from putting back.
The present invention generates following technique effect relative to prior art：
The both sides of track body of the present invention set multiple pipelines on multiple cleaning interfaces, plasma cleaner respectively with it is many
Individual hydrogen nitrogen protective gas fittings.The surface of bare copper frame is entered in the previous station of load processing procedure by plasma cleaner
Row pollutant is cleaned, and to there is the bare copper frame surface of oxidizing elemental to carry out reduction deoxidation, is lifted in solder load naked
The cleanliness factor on copper framework surface, improves the backflow performance of solder.Simultaneously bare copper frame table is improved using plasma cleans machine
The cleannes in face, and then measure the need for reducing hydrogen, production cost is reduced while improving the security of production process.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to institute in embodiment
The accompanying drawing needed to use is briefly described, it should be apparent that, drawings in the following description are only some implementations of the present invention
Example, for those of ordinary skill in the art, without having to pay creative labor, can also be according to these accompanying drawings
Obtain other accompanying drawings.
Fig. 1 is the structural representation of slicken solder load track element of the present invention；
Wherein, 1- tracks body, 2- plasma cleaners, 3- hydrogen nitrogen protective gas joint, 4- bringing-up sections, 5- cooling sections.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
It is an object of the invention to provide a kind of slicken solder load track element, to solve the problem of prior art is present,
While ensureing product quality, the gas supply of hydrogen during reduction production of semiconductor products reduces production cost and carried
The security of high production process.
In order to facilitate the understanding of the purposes, features and advantages of the present invention, it is below in conjunction with the accompanying drawings and specific real
Applying mode, the present invention is further detailed explanation.
With reference to Fig. 1, the present invention provides a kind of slicken solder load track element, including：
Track body 1 and plasma cleaner 2, the both sides of track body 1 are provided with multiple hydrogen nitrogen protective gas joints
3；Plasma cleaner 2 is provided with multiple pipelines, and multiple pipelines are connected with multiple hydrogen nitrogen protective gas joints 3 respectively.Pass through
Ion Cleaning machine 2 carries out pollutant cleaning to the surface of bare copper frame in the previous station of load processing procedure, and to there is oxidation member
The bare copper frame surface of element carries out reduction deoxidation, and the cleanliness factor on bare copper frame surface is lifted in solder load, weldering is improved
The backflow performance of material.The cleannes on bare copper frame surface are improved using plasma cleans machine simultaneously, and then reduce hydrogen
Requirement, reduces production cost while improving the security of production process.
In order to improve production efficiency, make full use of and include bringing-up section 4 and cooling section on the device space, track body 1
5.For load preheating is provided in the bringing-up section 4 of track, after load completion, utilize cooling section 5 to complete later core to load
Piece is cooled, it is ensured that the stability of structure.
In order to ensure the quality of product, the length of bringing-up section 4 is more than the length of cooling section 5.
In the present invention, the air supply source of plasma cleaner 2 includes hydrogen and nitrogen.And then be the oxygen of bare copper frame
Change element and carry out reduction deoxidation, further improve the cleanliness factor on lifting bare copper frame surface in solder load.
While production requirement is ensured, the supply of hydrogen is reduced, in the present invention the hydrogen of air supply source and nitrogen
Mass ratio is 0.5:10.The security of production link is not only increased, the production cost of brazing product is also reduced.
In order to improve the cleannes on naked copper surface, the arrangement to hydrogen nitrogen protective gas joint 3 carries out reasonable Arrangement, the present invention
The quantity of hydrogen nitrogen protective gas joint 3 of the both sides of track body 1 is different.Realize the multistage injection of hydrogen-nitrogen mixture gas.
In order to ensure the Fast Installation of pipeline and hydrogen nitrogen protective gas joint 3 while avoiding ensureing to be connected closure, hydrogen nitrogen
Protective gas joint 3 is raised type interface.
Further, in order to ensure the stability of production process, the leading portion of guide rail body, which has, to be prevented multi-disc or prevents from putting
Anti- monitoring alarm.During if there is the bare copper frame supply different from default process conditions, monitoring alarm can be sent
Alarm, points out operating personnel to be handled in time.
Specific case is applied in the present invention to be set forth the principle and embodiment of the present invention, above example
Illustrate the method and its core concept for being only intended to help to understand the present invention；Simultaneously for those of ordinary skill in the art, according to
According to the thought of the present invention, it will change in specific embodiments and applications.In summary, this specification content
It should not be construed as limiting the invention.
Claims (8)
1. a kind of slicken solder load track element, it is characterised in that including：
Track body, the both sides of the track body are provided with multiple hydrogen nitrogen protective gas joints；
Plasma cleaner, the plasma cleaner is provided with multiple pipelines, multiple pipelines respectively with multiple hydrogen
Nitrogen protective gas fittings.
2. slicken solder load track element according to claim 1, it is characterised in that include on the track body and add
Hot arc and cooling section.
3. slicken solder load track element according to claim 2, it is characterised in that the length of the bringing-up section is more than institute
State the length of cooling section.
4. slicken solder load track element according to claim 1, it is characterised in that the supply of the plasma cleaner
Source includes hydrogen and nitrogen.
5. slicken solder load track element according to claim 4, it is characterised in that the hydrogen and nitrogen of the air supply source
Mass ratio be 0.5:10.
6. slicken solder load track element according to claim 1, it is characterised in that the track body both sides it is described
Hydrogen nitrogen protective gas joint quantity is different.
7. slicken solder load track element according to claim 1, it is characterised in that the hydrogen nitrogen protective gas joint is
Raised type interface.
8. the slicken solder load track element according to claim any one of 1-7, it is characterised in that the guide rail body
Leading portion has the monitoring alarm for preventing multi-disc or preventing from putting back.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710457530.2A CN107309220A (en) | 2017-06-16 | 2017-06-16 | A kind of slicken solder load track element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710457530.2A CN107309220A (en) | 2017-06-16 | 2017-06-16 | A kind of slicken solder load track element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107309220A true CN107309220A (en) | 2017-11-03 |
Family
ID=60183333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710457530.2A Pending CN107309220A (en) | 2017-06-16 | 2017-06-16 | A kind of slicken solder load track element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107309220A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109671613A (en) * | 2018-11-29 | 2019-04-23 | 贵州振华风光半导体有限公司 | One kind being suitable for substrate circuit nitrogen-hydrogen mixing plasma cleaning method |
| CN109686650A (en) * | 2018-11-29 | 2019-04-26 | 贵州振华风光半导体有限公司 | One kind being suitable for integrated circuit metal shell nitrogen-hydrogen mixing plasma cleaning method |
| CN113782451A (en) * | 2021-08-20 | 2021-12-10 | 江苏富乐德半导体科技有限公司 | Method for improving bonding performance of copper-clad ceramic substrate |
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| CN103839839A (en) * | 2014-03-26 | 2014-06-04 | 常州银河世纪微电子有限公司 | Method for assembling chip by coating back surface of chip with solder paste |
| US20150050812A1 (en) * | 2013-08-13 | 2015-02-19 | Globalfoundries Inc. | Wafer-less auto clean of processing chamber |
| CN104637830A (en) * | 2014-12-31 | 2015-05-20 | 吴华 | Soft solder die bonder of microelectronic chip |
| CN104646874A (en) * | 2014-12-31 | 2015-05-27 | 吴华 | Guide rail unit of soft solder loading machine |
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2017
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150050812A1 (en) * | 2013-08-13 | 2015-02-19 | Globalfoundries Inc. | Wafer-less auto clean of processing chamber |
| CN103839839A (en) * | 2014-03-26 | 2014-06-04 | 常州银河世纪微电子有限公司 | Method for assembling chip by coating back surface of chip with solder paste |
| CN104637830A (en) * | 2014-12-31 | 2015-05-20 | 吴华 | Soft solder die bonder of microelectronic chip |
| CN104646874A (en) * | 2014-12-31 | 2015-05-27 | 吴华 | Guide rail unit of soft solder loading machine |
Non-Patent Citations (2)
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| 实用技工技术教材编写组: "《实用清洗技术》", 31 December 2007, 广东科技出版社 * |
| 郭建民: "《山东信息通信技术研究院优秀学术论文集》", 30 November 2013, 科学技术文献出版社 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109671613A (en) * | 2018-11-29 | 2019-04-23 | 贵州振华风光半导体有限公司 | One kind being suitable for substrate circuit nitrogen-hydrogen mixing plasma cleaning method |
| CN109686650A (en) * | 2018-11-29 | 2019-04-26 | 贵州振华风光半导体有限公司 | One kind being suitable for integrated circuit metal shell nitrogen-hydrogen mixing plasma cleaning method |
| CN113782451A (en) * | 2021-08-20 | 2021-12-10 | 江苏富乐德半导体科技有限公司 | Method for improving bonding performance of copper-clad ceramic substrate |
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Application publication date: 20171103 |
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