CN107291297A - Touch sensing, its preparation method and touch control display apparatus - Google Patents
Touch sensing, its preparation method and touch control display apparatus Download PDFInfo
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- CN107291297A CN107291297A CN201710544451.5A CN201710544451A CN107291297A CN 107291297 A CN107291297 A CN 107291297A CN 201710544451 A CN201710544451 A CN 201710544451A CN 107291297 A CN107291297 A CN 107291297A
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- conductive layer
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- binding point
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- General Engineering & Computer Science (AREA)
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- General Physics & Mathematics (AREA)
- Position Input By Displaying (AREA)
- Manufacture Of Switches (AREA)
Abstract
The invention provides a kind of touch sensing, its preparation method and touch control display apparatus.The preparation method includes：First conductive material is covered on the first flexible base board and forms the first conductive layer, and the first etching process is carried out on the surface away from the first flexible base board of the first conductive layer and forms at least one first binding point, the first binding point is used to electrically connect with external circuitses；Second conductive material is covered on the second flexible base board and forms the second conductive layer, and at least one second binding point is formed on the surface away from the second flexible base board of the second conductive layer, the second binding point with external circuitses for electrically connecting；It will be fitted between first conductive layer and the second conductive layer by adhesive, obtain circuit board to be solidified, and circuit board to be solidified is subjected to hot-pressing processing, obtain touch sensing.Can flexibly it be set using the position of binding point in touch sensing made from above-mentioned preparation method, so as to greatly save process costs and time cost.
Description
Technical field
The present invention relates to touch control display apparatus field, in particular to a kind of touch sensing, its preparation method and touch
Control display device.
Background technology
Touch screen signal line is divided into two groups, i.e. TX and RX, TX and is mainly responsible for driving (transmission), and RX is mainly responsible for sensing and (connect
Receive), the division of labor of two groups of signal wires is different, and can not it is overlapping, intersect, it is such as inevitable when intersecting, can only square crossing.Two groups of letters
Number line is distributed in the X-direction and Y-direction of touch-screen respectively.The size of touch-screen is bigger, and the impedance loop of passage is corresponding bigger,
Impedance is removable to be divided into：The impedance of touch-screen Petting Area and edge cabling (Trace) impedance, and the silver paste come out with screen printing
(Ag) edge cabling (Trace) impedance, is then effectively reduced.
For touch-screen, typically all customized according to the drawing of client, so there is each guest to chi
Very little, FPC Bonding, number of active lanes etc. have different requirements.But existing conventional web plate design method is required for being directed to
Different sizes, identical size but flexible PCB welding position is different, identical size and port number does not require to make corresponding on an equal basis
Web plate, and compound polyester web plate price is very expensive.Existing technique can cause the waste of raw material, improve process costs.
The content of the invention
It is a primary object of the present invention to provide a kind of touch sensing, its preparation method and touch control display apparatus, to solve
, it is necessary to prepare printing net for the size of touch-screen, binding point and port number difference in the preparation process of certainly existing touch-screen
Plate, this causes the problem of process costs are substantially increased.
To achieve these goals, according to an aspect of the invention, there is provided a kind of preparation method of touch sensing,
Preparation method includes：First conductive material is covered on the first flexible base board and forms the first conductive layer, and in the first conductive layer
The surface away from the first flexible base board on carry out the first etching process and form at least one first binding point, the first binding point
For being electrically connected with external circuitses；Second conductive material is covered on the second flexible base board and forms the second conductive layer, and
Form at least one second binding point on the surface away from the second flexible base board of two conductive layers, the second binding point be used for it is outer
Connect circuit electrical connection；It will be fitted between first conductive layer and the second conductive layer by adhesive, obtain circuit to be solidified
Plate；And circuit board to be solidified is subjected to hot-pressing processing, obtain touch sensing.
Further, the step of forming the second binding point includes：Pass through the second etching process the second binding point of formation.
Further, before the step of forming the first binding point, preparation method also includes：In the remote of the first conductive layer
The first patterned process is carried out on the surface of first flexible base board, the first conductive layer is divided into the first lead district and first touches
Area is controlled, and the first lead district is looped around around the first Touch Zone；At least one the first leads are provided with first lead district,
And first one end of lead electrically connected with the first Touch Zone, the other end of the first lead is electrically connected with the first binding point to be formed
Connect.
Further, preparation method also includes：Before the step of forming second binding point, in the second conductive layer
The second patterned process is carried out on surface away from the second flexible base board, the second conductive layer is divided into the second lead district and the
Two Touch Zones, and the second lead district is looped around around the second Touch Zone；At least one the second are provided with second lead district to draw
Line, and one end of the second lead electrically connects with the second Touch Zone, the other end of the second lead and the second binding point electricity to be formed
Connection.
Further, the first etching process, the second etching process, the first patterned process and the second patterning process difference
Independently selected from the etching of laser-induced thermal etching, chemical etching or gold-tinted.
Further, before the first patterned process and the second patterned process is carried out, respectively in the first conductive layer and
Target is carried out on second conductive layer radium-shine.
Further, formed the material of the first flexible base board and the second flexible base board separately selected from PET, COP,
PVC, PEN or TPU.
Further, the first conductive material and the second conductive material separately selected from ITO, graphite, nano-silver thread or
One or more in the group of CNT composition.
Further, the step of forming the first conductive layer includes：By the method for sputtering by the first conductive material cover to
The first conductive layer is formed on first flexible base board；And/or the step of the second conductive layer of formation includes：Will by the method for sputtering
Second conductive material, which is covered to the second flexible base board, forms the second conductive layer.
The another aspect of the application additionally provides a kind of touch sensing, and touch sensing uses above-mentioned preparation method system
Into.
The another aspect of the application additionally provides a kind of touch control display apparatus, and touch control display apparatus is sensed including above-mentioned touch-control
Device.
Apply the technical scheme of the present invention, lead to overetched mode and form at least one first binding point, this causes binding
The position of point can flexibly be set on the first conductive layer and/or the second conductive layer as needed, so as to eliminate again
The expense of Printing screen and silver paste printing is made, and then greatlys save process costs and time cost.
Embodiment
It should be noted that in the case where not conflicting, the feature in embodiment and embodiment in the application can phase
Mutually combination.The present invention is described in detail below in conjunction with embodiment.
As described by background technology, it is necessary to size for touch-screen, tie up in the preparation process of existing touch-screen
Fixed point and port number difference prepare Printing screen, and this causes the problem of process costs are substantially increased.Asked to solve above-mentioned technology
Topic, this application provides a kind of preparation method of above-mentioned touch sensing, the preparation method includes：First conductive material is covered
Cover and the first conductive layer is formed on the first flexible base board, and it is enterprising on the surface away from the first flexible base board of the first conductive layer
The etching process of row first forms at least one first binding point, and the first binding point is used to electrically connect with external circuitses；Second is led
Electric material is covered on the second flexible base board forms the second conductive layer, and in the second conductive layer away from the second flexible base board
At least one second binding point is formed on surface, the second binding point is used to electrically connect with external circuitses.First conductive layer and second
Fitted between conductive layer by adhesive progress and obtain circuit board to be solidified；And circuit board to be solidified is subjected to hot-pressing processing,
Obtain touch sensing.
In the preparation method for the touch sensing that the application is provided, the mode for forming the first conductive layer and the second conductive layer can
To use method commonly used in the art, such as physical vaporous deposition, chemical vapour deposition technique are preferably to splash conductive material
It is incident upon on flexible parent metal and forms the first flexible base board and the second flexible base board with conducting function.Then conductive first
Carry out the first etching process on layer and form at least one first binding point, at least one is formed on the second conductive layer and second is tied up
Fixed point；Fitted between first conductive layer and the second conductive layer by adhesive；And the first flexible base board and second is flexible
Substrate is carried out after hot-pressing processing, the first flexible base board and the second flexible base board one entirety of formation, obtains touch sensing.
The adhesive used in above-mentioned preparation method can select adhesive commonly used in the art.
As background section is stated, existing binding point is fixed, and is to print to be formed by silver paste.Due to
The requirement of the size of touch-screen, binding point and port number is different, it is necessary to for preparing Printing screen again the need for different.On
State in preparation method, at least one first binding point is formed by way of etching conductive layer, this causes the position of the first binding point
Put flexibly to be set on the first conductive layer as needed, and Printing screen and silver paste are remake so as to eliminate
The expense of printing, and then greatly save process costs and time cost.
The preparation method of the touch sensing provided using the application, can flexibly set the position of binding point, also simultaneously
Process costs and time cost can be saved.In above-mentioned preparation method, the generation type of the second binding point can also use this area
Conventional mode, such as silver paste print process.In a preferred embodiment, the step of forming the second binding point includes passing through
Second etching process the second binding point of formation.The second binding point on second substrate is configured also by the mode of etching,
This is conducive to further reducing process costs and time cost.
Term " the first binding point " and " the second binding point " are identical with the effect of the binding point in this area in the application,
It is that one end is electrically connected with electrically-conductive backing plate, the other end is electrically connected with external circuit.Preferably, one end of the first binding point and the
One flexible base board is electrically connected, and the first binding point other end is electrically connected with the positive pole of external circuitses input, and the one of the second binding point
End is electrically connected with the second flexible base board, and the second binding point other end is electrically connected with the negative pole of the input of external circuitses.
In the preparation method for the touch sensing that the application is provided, the first etching process and the second etching process can be used
Engraving method commonly used in the art, including chemical etching and physical etch.In a preferred embodiment, the first etching
Process and the second etching process are separately selected from laser-induced thermal etching, chemical etching or gold-tinted etching, preferably laser-induced thermal etching.
Touch control component is additionally provided with touch sensing, and one end of binding point is electrically connected with touch control component.In order that soft
Region division on property substrate definitely, by touch control component concentrated setting in the central area of conductive layer, be designated as touch-control
Area, and binding point concentrated setting is designated as lead district in the fringe region of conductive layer, and lead district is looped around the week of Touch Zone
Enclose.
Specifically, before the step of forming the first binding point, the preparation method bag for the touch sensing that the application is provided
Include：The first patterned process is carried out on the surface away from the first flexible base board of the first conductive layer, by the first conductive layer point
For the first lead district and the first Touch Zone, the first lead district is looped around around the first Touch Zone, is provided with the first lead district
At least one the first leads, and one end of the first lead electrically connects with the first Touch Zone, the other end of the first lead to be formed with being intended to
The first binding point electrical connection.Because the first binding point is not formed also before the first lead is formed, so herein with " desire
Formed " illustrate hereby.
In a preferred embodiment, before the step of forming the second binding point, above-mentioned preparation method also includes：
The second patterned process is carried out on the surface away from the second flexible base board of the second conductive layer, the second conductive layer is divided into
Second lead district and the second Touch Zone, the second lead district are looped around around the second Touch Zone, be provided with the second lead district to
Few second lead, and one end of the second lead electrically connects with the second Touch Zone, the other end of the second lead is with to be formed
Second binding point is electrically connected.Because the second binding point is not formed also before the second lead is formed, so herein with " desire shape
Into " illustrate hereby.
In the preparation method of above-mentioned touch sensing, the first etching process, the second etching process, the first patterned process and
Second patterning process is separately selected from laser-induced thermal etching, chemical etching or gold-tinted etching.
In a preferred embodiment, before the first patterned process and the second patterned process is carried out, respectively
Target is carried out on the first conductive layer and the second conductive layer radium-shine, is formationed of target, which has, to be beneficial in follow-up patterned print, the
It is more convenient for adjusting relative position in the process such as the laminating of one conductive layer and the second conductive layer and hot pressing.
In a preferred embodiment, after the first conductive layer and the second conductive layer being fitted, as needed by first
Flexible base board and the second flexible base board it is radium-shine go out needed for profile, be then cut out along above-mentioned radium-shine frame.
In the preparation method for the touch sensing that the application is provided, the first flexible base board and the second flexible base board can be selected
Flexible material commonly used in the art.In a preferred embodiment, the first flexible base board and the second flexible base board are formed
Material is separately selected from PET (polyethylene terephthalate), COP (Cyclo-Olefin Polymer, cycloolefin
Polymer), PVC (polyvinyl chloride), PEN (PEN) or TPU (thermoplastic polyurethane elastic rubber bodies).
In the preparation method for the touch sensing that the application is provided, the first conductive material and the second conductive material can be selected
Conductive material commonly used in the art.In a preferred embodiment, the first conductive material and the second conductive material difference are only
One or more in the group on the spot constituted selected from ITO, graphite, nano-silver thread or CNT.
On the other hand the application additionally provides a kind of touch sensing, and the touch sensing is using above method preparation
Into.
Binding point on above-mentioned touch sensing is formed by way of etching conductive layer, and this make it that the position of binding point can
Flexibly to be set on the electrically conductive as needed, so as to eliminate the expense for remaking Printing screen and silver paste printing
With, and then greatly save process costs and time cost.
On the other hand the application additionally provides a kind of touch control display apparatus, and the touch control display apparatus includes touch sensing.
Binding point on above-mentioned touch sensing is led to overetched mode and formed, this allow binding point position according to
Need flexibly to be set on the electrically conductive, so that the expense for remaking Printing screen and silver paste printing is eliminated, and then
Greatly save process costs and time cost.On this basis, including the touch control display apparatus of above-mentioned touch sensing also has
There is the advantage that cost is low.
The application is described in further detail below in conjunction with specific embodiment, these embodiments are it is not intended that limit this
Apply for scope claimed.
Embodiment 1
A kind of preparation method of touch sensing, the preparation method includes：
By physical vaporous deposition (sputtering), the first conductive material (ITO) is covered on the first flexible base board (PET)
Form the first conductive layer.The first patterned process (laser-induced thermal etching) is carried out on the first conductive layer, the first conductive layer is divided into
One lead district and the first Touch Zone, the first lead district are looped around around the first Touch Zone, and the first lead district includes at least one
The lead of bar first；Then carry out the first etching process (laser-induced thermal etching) in the first lead district and form at least one first binding point,
One end of first lead is electrically connected with the first Touch Zone, and the other end of the first lead is electrically connected with the first binding point.
By physical vaporous deposition (sputtering), the second conductive material (ITO) is covered on the second flexible base board (PET)
Form the second conductive layer.The second patterning (laser-induced thermal etching) processing is carried out on the second conductive layer, the second conductive layer is divided into the
Two lead district and the second Touch Zone, the second lead district are looped around around the second Touch Zone, and the second lead district includes at least one
The lead of bar second；Then carry out the second etching process (laser-induced thermal etching) in the second lead district and form at least one second binding point,
One end of second lead is electrically connected with the second Touch Zone, and the other end of the second lead is electrically connected with the second binding point.
It will be fitted between first conductive layer and the second conductive layer by adhesive, then by the first flexible base board and
Two flexible base boards carry out hot-pressing processing, obtain touch sensing.
Embodiment 2
A kind of preparation method of touch sensing, the preparation method includes：
By physical vaporous deposition (sputtering), the first conductive material (ITO) is covered on the first flexible base board (COP)
Form the first conductive layer.The first patterning (laser-induced thermal etching) processing is carried out on the first conductive layer, the first conductive layer is divided into the
One lead district and the first Touch Zone, the first lead district are looped around around the first Touch Zone, and the first lead district includes at least one
The lead of bar first；Then carry out the first etching process (laser-induced thermal etching) in the first lead district and form at least one first binding point,
One end of first lead is electrically connected with the first Touch Zone, and the other end of the first lead is electrically connected with the first binding point.
By rubbing method, the second conductive material (nano-silver thread slurry) is covered on the second flexible base board (COP) and formed
Second conductive layer.The second pattern (laser-induced thermal etching) change processing is carried out on the second conductive layer, the second conductive layer is divided into second and drawn
Line area and the second Touch Zone, the second lead district are looped around around the second Touch Zone, and the second lead district includes at least one the
Two leads；Then carry out the second etching process (laser-induced thermal etching) in the second lead district and form at least one second binding point, second
One end of lead is electrically connected with the second Touch Zone, and the other end of the second lead is electrically connected with the second binding point.
It will be fitted between first conductive layer and the second conductive layer by adhesive, then by the first flexible base board and
Two flexible base boards carry out hot-pressing processing, obtain touch sensing.
Embodiment 3
A kind of preparation method of touch sensing, the preparation method includes：
By physical vaporous deposition (sputtering), the first conductive material (ITO) is covered on the first flexible base board (TPU)
Form the first conductive layer.The first patterning (laser-induced thermal etching) processing is carried out on the first conductive layer, the first conductive layer is divided into the
One lead district and the first Touch Zone, the first lead district are looped around around the first Touch Zone, and the first lead district includes at least one
The lead of bar first；Then carry out the first etching process (laser-induced thermal etching) in the first lead district and form at least one first binding point,
One end of first lead is electrically connected with the first Touch Zone, and the other end of the first lead is electrically connected with the first binding point.
By physical vaporous deposition (sputtering), the second conductive material (ITO) is covered on the second flexible base board (PEN)
Form the second conductive layer.The second pattern (laser-induced thermal etching) change processing is carried out on the second conductive layer, the second conductive layer is divided into the
Two lead district and the second Touch Zone, the second lead district are looped around around the second Touch Zone, and the second lead district includes at least one
The lead of bar second；Then carry out the second etching process (laser-induced thermal etching) in the second lead district and form at least one second binding point,
One end of second lead is electrically connected with the second Touch Zone, and the other end of the second lead is electrically connected with the second binding point.
It will be fitted between first conductive layer and the second conductive layer by adhesive, then by the first flexible base board and
Two flexible base boards carry out hot-pressing processing, obtain touch sensing.
Embodiment 4
A kind of preparation method of touch sensing, the preparation method includes：
By physical vaporous deposition (sputtering), the first conductive material (ITO) is covered on the first flexible base board (PET)
Form the first conductive layer.The first patterned process (chemical etching) is carried out on the first conductive layer, the first conductive layer is divided into
One lead district and the first Touch Zone, the first lead district are looped around around the first Touch Zone, and the first lead district includes at least one
The lead of bar first；Then carry out the first etching process (chemical etching) in the first lead district and form at least one first binding point,
One end of first lead is electrically connected with the first Touch Zone, and the other end of the first lead is electrically connected with the first binding point.
By physical vaporous deposition (sputtering), the second conductive material (ITO) is covered on the second flexible base board (PET)
Form the second conductive layer.The second patterning (chemical etching) processing is carried out on the second conductive layer, the second conductive layer is divided into the
Two lead district and the second Touch Zone, the second lead district are looped around around the second Touch Zone, and the second lead district includes at least one
The lead of bar second；Then carry out the second etching process (chemical etching) in the second lead district and form at least one second binding point,
One end of second lead is electrically connected with the second Touch Zone, and the other end of the second lead is electrically connected with the second binding point.
It will be fitted between first conductive layer and the second conductive layer by adhesive, then by the first flexible base board and
Two flexible base boards carry out hot-pressing processing, obtain touch sensing.
Embodiment 5
A kind of preparation method of touch sensing, the preparation method includes：
By physical vaporous deposition (sputtering), the first conductive material (ITO) is covered on the first flexible base board (PET)
Form the first conductive layer.The first patterned process (gold-tinted etching) is carried out on the first conductive layer, the first conductive layer is divided into
One lead district and the first Touch Zone, the first lead district are looped around around the first Touch Zone, and the first lead district includes at least one
The lead of bar first；Then carry out the first etching process (gold-tinted etching) in the first lead district and form at least one first binding point,
One end of first lead is electrically connected with the first Touch Zone, and the other end of the first lead is electrically connected with the first binding point.
By physical vaporous deposition (sputtering), the second conductive material (ITO) is covered on the second flexible base board (PET)
Form the second conductive layer.The second patterning (gold-tinted etching) is carried out on the second conductive layer to handle, and the second conductive layer is divided into the
Two lead district and the second Touch Zone, the second lead district are looped around around the second Touch Zone, and the second lead district includes at least one
The lead of bar second；Then carry out the second etching process (gold-tinted etching) in the second lead district and form at least one second binding point,
One end of second lead is electrically connected with the second Touch Zone, and the other end of the second lead is electrically connected with the second binding point.
It will be fitted between first conductive layer and the second conductive layer by adhesive, then by the first flexible base board and
Two flexible base boards carry out hot-pressing processing, obtain touch sensing.
The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the invention, for the skill of this area
For art personnel, the present invention can have various modifications and variations.Within the spirit and principles of the invention, that is made is any
Modification, equivalent substitution, improvement etc., should be included in the scope of the protection.
Claims (11)
1. a kind of preparation method of touch sensing, it is characterised in that the preparation method includes：
First conductive material is covered on the first flexible base board and forms the first conductive layer, and in the remote of first conductive layer
The first etching process is carried out on the surface of first flexible base board and forms at least one first binding point, first binding point
For being electrically connected with external circuitses；
Second conductive material is covered on the second flexible base board and forms the second conductive layer, and in the remote of second conductive layer
At least one second binding point is formed on the surface of second flexible base board, second binding point is used for and the external electricity
Road is electrically connected；
It will be fitted between first conductive layer and second conductive layer by adhesive, obtain circuit board to be solidified；
And
The circuit board to be solidified is subjected to hot-pressing processing, the touch sensing is obtained.
2. preparation method according to claim 1, it is characterised in that the step of forming second binding point includes：It is logical
Cross the second etching process and form second binding point.
3. preparation method according to claim 2, it is characterised in that before the step of forming first binding point,
The preparation method also includes：
The first patterned process is carried out on the surface of remote first flexible base board of first conductive layer, will be described
First conductive layer is divided into the first lead district and the first Touch Zone, and first lead district is looped around the week of first Touch Zone
Enclose；At least one the first leads, and one end of first lead and first touch-control are provided with first lead district
Area is electrically connected, and the other end of first lead is electrically connected with first binding point to be formed.
4. preparation method according to claim 3, it is characterised in that before the step of forming second binding point,
The preparation method also includes：
The second patterned process is carried out on the surface of remote second flexible base board of second conductive layer, will be described
Second conductive layer is divided into the second lead district and the second Touch Zone, and second lead district is looped around the week of second Touch Zone
Enclose；At least one the second leads, and one end of second lead and second touch-control are provided with second lead district
Area is electrically connected, and the other end of second lead is electrically connected with second binding point to be formed.
5. preparation method according to claim 4, it is characterised in that first etching process, described second etched
Journey, first patterned process and second patterning process are separately selected from laser-induced thermal etching, chemical etching or Huang
Photoetch.
6. preparation method according to claim 4, it is characterised in that carrying out first patterned process and described the
Before two patterned process, target is carried out on first conductive layer and second conductive layer respectively radium-shine.
7. preparation method according to claim 1, it is characterised in that form first flexible base board and described second soft
Property substrate material separately be selected from PET, COP, PVC, PEN or TPU.
8. preparation method according to claim 1, it is characterised in that first conductive material and second conduction material
One or more in the group that material is separately constituted selected from ITO, graphite, nano-silver thread or CNT.
9. preparation method according to claim 1, it is characterised in that
The step of forming first conductive layer includes：First conductive material is covered to described by the method for sputtering
First conductive layer is formed on one flexible base board；And/or
The step of forming second conductive layer includes：Second conductive material is covered to described by the method for sputtering
Second conductive layer is formed on two flexible base boards.
10. a kind of touch sensing, it is characterised in that the touch sensing is using any one of claim 1 to 9
Preparation method is made.
11. a kind of touch control display apparatus, it is characterised in that the touch-control that the touch control display apparatus includes described in claim 10 is passed
Sensor.
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| CN201710544451.5A CN107291297A (en) | 2017-07-05 | 2017-07-05 | Touch sensing, its preparation method and touch control display apparatus |
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| CN109860431A (en) * | 2018-12-12 | 2019-06-07 | 武汉华星光电半导体显示技术有限公司 | Organic Light Emitting Diode (OLED) panel and production method |
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| CN103677400A (en) * | 2012-09-25 | 2014-03-26 | 郡是株式会社 | Display device having touch panel |
| CN102929471A (en) * | 2012-11-21 | 2013-02-13 | 深圳爱商精密电子有限公司 | Manufacturing method for capacitive touch screen |
| CN106155434A (en) * | 2015-04-03 | 2016-11-23 | 昆山工研院新型平板显示技术中心有限公司 | A kind of flexible touch screen and preparation method thereof |
| CN106293168A (en) * | 2015-05-14 | 2017-01-04 | 深圳欧菲光科技股份有限公司 | Contactor control device and contact conductor method to set up based on contactor control device |
| CN106775055A (en) * | 2016-11-23 | 2017-05-31 | 苏州欧菲光科技有限公司 | Flexible touch screen and flexible touch display screen |
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| CN109860431A (en) * | 2018-12-12 | 2019-06-07 | 武汉华星光电半导体显示技术有限公司 | Organic Light Emitting Diode (OLED) panel and production method |
| WO2020118846A1 (en) * | 2018-12-12 | 2020-06-18 | 武汉华星光电半导体显示技术有限公司 | Organic light-emitting diode (oled) panel and manufacturing method therefor |
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