CN202649985U - Electromagnetic shielding structure for transparent capacitive touch tablet - Google Patents
Electromagnetic shielding structure for transparent capacitive touch tablet Download PDFInfo
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- CN202649985U CN202649985U CN 201220049644 CN201220049644U CN202649985U CN 202649985 U CN202649985 U CN 202649985U CN 201220049644 CN201220049644 CN 201220049644 CN 201220049644 U CN201220049644 U CN 201220049644U CN 202649985 U CN202649985 U CN 202649985U
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Abstract
An electromagnetic shielding structure for a transparent capacitive touch tablet comprises a capacitive touch sensor, a plurality of insulation laminates and at least a conductive material thin layer, wherein the capacitive touch sensor is disposed between two insulation laminates, and especially, the conductive material thin layer is disposed at one side of the capacitive touch sensor with the side facing an electromagnetic interference source, is disposed in a ground connection, and can shield a whole area of the capacitive touch sensor. A surface resistance of the conductive material thin layer is between 10 to 10,000 omega*cm<-2>, and the conductive material thin layer may be a conductive optical cement containing PEDOT:PSS or antistatic agents, a nano-silver grain evaporation coating film, or a transparent conductive thin film disposed on a protective layer through surface-hardening treatment, and also may be a conductive optical cement disposed between the transparent capacitive touch tablet and a liquid crystal display module.
Description
Technical field
The utility model relates to a kind of electromagnetic armouring structure of transparent capacitance contact board, especially refers to a kind of capacitance touch plate structure of utilizing transparent conductive material thin layer to form electromagnetic screen.
Background technology
Capacitive type touch pad is to produce a capacity effect by the moment that user's finger or conductor touch on panel, then can be determined by the variation of capacitance the position of finger or conductor, reaches accordingly the purpose of signal input; Capacitive type touch pad has been widely used in the aspects such as communication, computing machine and consumer electronics product at present, usually all be to use transparent touch-control panel, it is configured on the display screen of electrical equipment uses, allow the user can carry out interactive input operation, improve the purpose of linking up the goodwill of interface between the human and computer and promoting input operation efficient to reach; The structure of general capacitance type sensor all has the transparent conductive film that two layers of insulation arrange, it for example is tin indium oxide (ITO) material, and at each layer conductive film required electrode pattern is set, for example be a plurality of X-axis induction stitchings (X-Trace) and Y-axis induction stitching (Y-Trace), utilize etch process to remove the part of not wanting on the conductive film, forming required X, Y-axis induction stitching, and make the gap that keeps each other proper width between each induction stitching; As known, capacitive type touch pad easily is subjected to extraneous Electromagnetic Interference (EMI) or electric wire wave interference (RFI) when using, produce the mistake signal, even serious interference can cause whole capacitance touching control sensor all can't use, and become the important topic of capacitive type touch pad on using so how to get rid of the interference of EMI, RFI.
The at present known capacitive type touch pad structural design that has a kind of EMI of getting rid of to disturb is disclosed use, its capacitance touching control sensor is arranged on the substrate, this substrate has row and the row trace that is formed on its arbitrary side, particularly, its utilization is widened setting as best one can with each row trace, so that between the adjacent columns trace even only deposit about 30 microns spacing, therefore jointly rearrange a planar ELECTROMAGNETIC OBSCURANT screen by each row trace, with the interference of counterchecking electromagnetic wave noise; Yet the fine pitch between the adjacent columns trace can cause product in the difficulty that produces aspect the processing, reduces product yield, multiplication cost.
Summary of the invention
The utility model mainly provides a kind of electromagnetic armouring structure of transparent capacitance contact board, mainly be to reach in increase touch pad production process that need not be extra not increase in the situation of cost, make the side in the face of the electromagnetic interference (EMI) source of capacitance contact board can form an electro-magnetic screen layer, to get rid of the interference of EMI, RFI; The utility model is compared to known capacitive type touch pad structural design, possesses at least following advantage: a, electro-magnetic screen layer of the present utility model and be comprehensively, do not have apertured, so the ELECTROMAGNETIC OBSCURANT effect is better; It is irrelevant that the row, column trace of b, ELECTROMAGNETIC OBSCURANT effect of the present utility model and capacitance touching control sensor arranges shape or width, so the pattern that arranges of its row, column trace has arbitrariness, and the limitation of design is little, and capacitive sensing usefulness is good; Gap between c, each row of the present utility model can be strengthened, and avoids producing and disturbs, and can simplify process technology, improves product yield, reduces production costs.
In order to reach above-mentioned utility model purpose, the electromagnetic armouring structure of transparent capacitance contact board provided by the utility model, it comprises a capacitance touching control sensor, a plurality of insulating laminate and at least one conductive material thin layer, this capacitance touching control sensor is arranged between two insulating laminates, particularly, this conductive material thin layer is arranged on the side in the face of the electromagnetic interference (EMI) source of this capacitance touching control sensor, it is the entire area scope that ground connection arranges and can cover this capacitance touching control sensor, this conductive material thin layer is that surface resistance is at 12,000 Ω .cm
-2Below best, surface resistance is at 10 to 10,000 Ω .cm
-2Between; This conductive material thin layer can be electric conductivity optical cement (OCA), this electric conductivity optical cement material can be to be the sheet film layer that can paste on using, or being the solution shape can utilize coating or printing means to be routed on the touch pad, and aforementioned electric conductivity optical cement can be selected and contains PEDOT:PSS[Poly (3,4-ethylenedioxythiophene)-and poly (styrenesulfonate)] the electric conductivity optical cement of material, or employing contains antistatic agent (antistatic agent) material, for example: the electric conductivity optical cement of ionic interfacial agent (Ionic surfactant) or non-ionic surfactant (Nonionic Surfactant), but the material ranges of implementing is not limited with aforementioned; In addition, this conductive material thin layer can be the transparent conductive film that uses one of tin indium oxide, indium zinc oxide, zinc oxide aluminum or poly-ethylenedioxy thiophene material to make; This conductive material thin layer also can select metallic netted structural film, nanometer silver granuel vapor-deposited film or one to be arranged on the transparent property led film on this protective seam with surperficial cure process means.
In one embodiment, the electromagnetic armouring structure of transparent capacitance contact board provided by the utility model, it is configured in a transparent capacitance contact board on one LCD MODULE and uses, utilizing an electric conductivity optics glue-line to be arranged between this transparent capacitance contact board and the LCD MODULE is integral the two bonding, particularly, this electric conductivity optics glue-line is the entire area scope that ground connection arranges and can cover this transparent capacitance contact board, this electric conductivity optics glue-line contains PEDOT:PSS or antistatic agent material, and its surface resistance is between 10 to 10,000 Ω .cm-2.
This will further illustrate other functions of the present utility model and technical characterictic below, has the knack of and can realize according to this utility model after present technique person pores over explanation in the literary composition.
Description of drawings
Fig. 1 is that the member of the utility model the first embodiment separates schematic perspective view;
Fig. 2 is the side cut-away view of the utility model the first embodiment;
Fig. 3 is the side cut-away view of the utility model the second embodiment;
Fig. 4 is the side cut-away view of the utility model the 3rd embodiment;
Fig. 5 is the side cut-away view of the utility model the 4th embodiment;
Fig. 6 is the side cut-away view of the utility model the 5th embodiment;
Fig. 7 is the side cut-away view of the utility model the 6th embodiment; And
Fig. 8 is the side cut-away view of the utility model the 7th embodiment.
Among the figure:
1, the top protective seam; 2, the X-axis inductive layer;
22, X-axis induction stitching; 3, substrate;
4, the Y-axis inductive layer; 42, Y-axis induction stitching;
5, insulation course; 51, the insulation mucigel;
6, electric conductivity optics glue-line 61, electric conductor;
7, the below protective seam; 8, the conductive material thin layer;
9, the induction electrode layer; 100, touch pad;
200, LCD MODULE;
Embodiment:
The first embodiment of the present utility model as shown in Figure 1 and Figure 2, it mainly comprises a top protective seam 1, an X-axis inductive layer 2, a substrate 3, a Y-axis inductive layer 4, an insulation course 5, an electric conductivity optics glue-line 6 and a below protective seam 7, and above-mentioned each layer sequentially spliced is combined into a capacitance contact board; In this embodiment, this top protective seam 1 is superficial layer or the loam cake of capacitance contact board, usually it and below protective seam 7 all are the heat insulating laminas of selecting high transmission rate, its material is to be selected from glass, polyester (PET) or polycarbonate (PC) etc., but the material ranges of implementing is not limited with previous materials; This substrate 3 is the transparent insulating thin plate of a hard rigid material, its material is to be selected from glass or polycarbonate (PC), polyester (PET), polymethylmethacrylate (PMMA) or cycloolefin co-polymer (COC) etc., but the material ranges of implementing is not limited with previous materials; This insulation course 5 is the insulation film of a high transmission rate, and its material is to be selected from polyester, printing ink, light-hardening resin (UV glue) or insulativity optical cement (OCA) etc., but the material ranges of implementing is not limited with previous materials; This electric conductivity optics glue-line 6 is the diaphanous thin layer that becomes, particularly a kind of based on conducting polymer PEDOT:PSS (poly-3,4-ethylenedioxy thiophene: high grade of transparency electric conductivity optical cement poly styrene sulfonate), but the material ranges of implementing is not limited with previous materials, for example, also can adopt the electric conductivity optical cement of the antistatic agent material that contains ionic interfacial agent or non-ionic surfactant etc.; And this optical cement material can be thin layer in the form of sheets on using, or being the solution shape can utilize coating or printing means to be routed on this touch pad; In particular, these electric conductivity optics glue-line 6 surface resistances are between 10 to 10000 Ω .cm-2, and between layer thickness 0.01 to the 300 μ m; Aforementioned X-axis inductive layer 2 is to use tin indium oxide (ITO) nesa coating with good conductive characteristic with Y-axis inductive layer 4, wherein, nesa coating at X-axis inductive layer 2 has the X-axis induction stitching 22 that several is arranged in parallel with each other, and has the Y-axis induction stitching 42 that several is arranged in parallel with each other at the nesa coating of Y-axis inductive layer 4.Aforementioned each layer sequentially spliced be combined into a transparent plate body, wherein, X-axis inductive layer 2 is arranged on the basal surface of superficial layer 1, and Y-axis inductive layer 4 is integral across substrate 3 and the 2 stacked bondings of X-axis inductive layer, and makes orthogonal thereto setting between Y-axis induction stitching 42 and the X-axis stitching 22; Even die attach sticks together and this electric conductivity optics glue-line 6 makes between this insulation course 5 and this below protective seam 7 all sidedly; and with an electric conductor 61 ground connection, and this electric conductor 61 can be selected copper foil or flexible circuit board (FPT) at a lateral edges of this electric conductivity optics glue-line 6.
Touch pad such as aforementioned structure, form a capacitance touching control loop inductance at X-axis inductive layer 2 and Y-axis inductive layer 4, therefore when pointing or conductor touches or can trigger the electric capacity signal when gently slipping over superficial layer 1, follow the trail of by the detecting that the electric capacity signal is changed, can judge the touch location of conductor or finger; And in the utility model embodiment, the electric conductivity optics glue-line 6 of this ground connection can avoid the running of aforementioned condenser type touch-control sensing loop to be affected the interference shieldings such as EMI, RFI in the external world, produces the mistake signal.
See also again shown in Figure 3, this capacitance contact board is sequentially spliced by following each layer to be combined into a transparent plate body in the second embodiment of the present utility model, and it comprises a top protective seam 1, an X-axis inductive layer 2, a substrate 3, a Y-axis inductive layer 4, a below protective seam 7 and a conductive material thin layer 8; Each combination stack 1,2,3 of aforementioned touch pad, 4 and 7 feature are identical with aforementioned the first embodiment's, therefore repeated description no longer; And this conductive material thin layer 8 is the diaphanous thin layer that becomes, and makes that its surface resistance is at 10 to 10000 Ω .cm
-2Between, and at a lateral edges of this conductive material thin layer 8 with an electric conductor ground connection; This electric conductivity thin layer select a kind of metallic netted structural film, the metallic netted structural film of for example being produced by company of Japanese trader Fuji, Japanese trader Dong Li company or Japanese trader prefecture scholar company, also can adopt a kind of nanometer silver granuel vapor-deposited film, the nanometer silver granuel vapor-deposited film of for example being produced by US business Cima NanoTech or Japanese trader Dong Li company; In addition, some are common and to have a transparent conductive film of good conductive characteristic also applicable, for example be tin indium oxide (Indium Tin Oxide, ITO), indium zinc oxide (Indium Zinc Oxide, IZO), zinc oxide aluminum (Aluminum Zinc Oxide, but the scope of implementing is not limited with previous materials AZO) or the film of the material such as poly-ethylenedioxy thiophene (PEDOT); Understandable; have the knack of the personage of this skill; also can be below aforementioned the outer surface of protective seam 7; utilize surperficial cure process (Hard Coating) means with a conductive material that meets aforementioned surface resistance characteristic; for example be the material that contains PEDOT:PSS or antistatic agent, be set directly on 7 of this below protective seams.The utility model embodiment can effectively shield extraneous EMI, RFI by the setting of the conductive material thin layer 8 of this ground connection, to guarantee the normal operation of capacitance contact board.
The utility model the 3rd embodiment of Fig. 4 shows a touch pad is configured in the upper unitized construction of using of a LCD MODULE (LCM, Liquid Crystal Display Module) for another example; This touch pad 100 comprises a top protective seam 1, an X-axis inductive layer 2, a substrate 3, a Y-axis inductive layer 4 and a below protective seam 7, above-mentioned each layer sequentially spliced is combined into a capacitance contact board, re-use an electric conductivity optics glue-line 6 this touch pad 100 be fitted on this LCD MODULE 200 all sidedly, and at a lateral edges of this electric conductivity optics glue-line 6 with an electric conductor ground connection (not being shown in drawing); Each layer 1,2,3,4 of above-mentioned touch pad 100,7 and the feature of this electric conductivity optics glue-line 6 identical with aforementioned the first embodiment, therefore repeated description no longer; And in the present embodiment, the interference such as EMI, RFI of this LCD MODULE 200 of electric conductivity optics glue-line 6 maskables of this ground connection, avoid aforementioned touch pad 100 runnings to be affected, produce the mistake signal, therefore in the situation that do not increase manufacturing process and cost, can make again touch pad have the usefulness of electromagnetic screen concurrently.
The touch pad 100 that has shown again in addition four kinds of different structures in Fig. 5 to Fig. 8 is configured in the aspect of using on the LCD MODULE 200; This touch pad 100 of Fig. 5 comprises a top protective seam 1, an X-axis inductive layer 2, insulation mucigel 51, a Y-axis inductive layer 4 and a substrate 3, and above-mentioned each layer sequentially spliced is combined into a capacitance contact board; The capacitance contact board of Fig. 6 is sequentially spliced by laminations such as a top protective seam 1, an X-axis inductive layer 2, an insulation mucigel 51, a substrate 3, a Y-axis inductive layer 4 and insulation courses 5 to be combined into; The touch pad 100 of Fig. 7 is made of jointly a substrate 3, an induction electrode layer 9 and a below protective seam 7; The touch pad 100 of Fig. 8 is made of jointly a top protective seam 1, an induction electrode layer 9 and a substrate 3; Particularly, aforementioned induction electrode layer 9 is a kind of induction electrode structures that X-axis induction electrode and Y-axis induction electrode can be arranged on same layer; These touch pads 100 are fitted on this LCD MODULE 200 this touch pad basal surface by an electric conductivity optics glue-line 6 all sidedly, and at a lateral edges of this electric conductivity optics glue-line 6 with an electric conductor ground connection (not being shown in drawing); Identical with aforementioned the 3rd embodiment, the electric conductivity optics glue-line 6 of this ground connection has the usefulness of shielding EMI, RFI.
Although with reference to the accompanying drawings and in conjunction with specific embodiments complete description the present invention, should note haveing the knack of the technique personage and can understand various variations and modification.This type of variation and modification are understood to include in the defined category of the present invention by appended claims.
Claims (7)
1. the electromagnetic armouring structure of a transparent capacitance contact board, it comprises a capacitance touching control sensor, a plurality of insulating laminate and at least one conductive material thin layer, this capacitance touching control sensor is arranged between two insulating laminates, it is characterized by: this conductive material thin layer is arranged on the side in the face of the electromagnetic interference (EMI) source of this capacitance touching control sensor, it is the entire area scope that ground connection arranges and can cover this capacitance touching control sensor, the surface resistance of this conductive material thin layer is at 10 to 10,000 Ω .cm
-2Between.
2. the electromagnetic armouring structure of transparent capacitance contact board as claimed in claim 1 is characterized in that, wherein said conductive material thin layer is the electric conductivity optical cement.
3. the electromagnetic armouring structure of transparent capacitance contact board as claimed in claim 1 is characterized in that, wherein said conductive material thin layer is the metallic netted structural film.
4. the electromagnetic armouring structure of transparent capacitance contact board as claimed in claim 1 is characterized in that, wherein said conductive material thin layer is nanometer silver granuel vapor-deposited film.
5. the electromagnetic armouring structure of transparent capacitance contact board as claimed in claim 1 is characterized in that, wherein said conductive material thin layer is the transparent conductive film that one of tin indium oxide, indium zinc oxide, zinc oxide aluminum or poly-ethylenedioxy thiophene material is made.
6. the electromagnetic armouring structure of transparent capacitance contact board as claimed in claim 1 is characterized in that, wherein said conductive material thin layer is one to be arranged on nesa coating on the protective seam with surperficial cure process means.
7. the electromagnetic armouring structure of a transparent capacitance contact board, it is configured in a transparent capacitance contact board on one LCD MODULE and uses, utilizing an electric conductivity optics glue-line to be arranged between this transparent capacitance contact board and the LCD MODULE is integral the two bonding, it is characterized by: this electric conductivity optics glue-line is the entire area scope that ground connection arranges and can cover this transparent capacitance contact board, this electric conductivity optical cement aspect resistance is at 10 to 10,000 Ω .cm
-2Between.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220049644 CN202649985U (en) | 2012-02-16 | 2012-02-16 | Electromagnetic shielding structure for transparent capacitive touch tablet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220049644 CN202649985U (en) | 2012-02-16 | 2012-02-16 | Electromagnetic shielding structure for transparent capacitive touch tablet |
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| Publication Number | Publication Date |
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| CN202649985U true CN202649985U (en) | 2013-01-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201220049644 Expired - Fee Related CN202649985U (en) | 2012-02-16 | 2012-02-16 | Electromagnetic shielding structure for transparent capacitive touch tablet |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107634749A (en) * | 2017-10-27 | 2018-01-26 | 大明电子有限公司 | A kind of conductive film and preparation method, device |
| US9983740B2 (en) | 2014-01-02 | 2018-05-29 | Nokia Technologies Oy | Electromagnetic shielding |
| CN108493351A (en) * | 2018-01-31 | 2018-09-04 | 云谷（固安）科技有限公司 | The preparation method of thin-film packing structure, display device and display device |
-
2012
- 2012-02-16 CN CN 201220049644 patent/CN202649985U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9983740B2 (en) | 2014-01-02 | 2018-05-29 | Nokia Technologies Oy | Electromagnetic shielding |
| CN107634749A (en) * | 2017-10-27 | 2018-01-26 | 大明电子有限公司 | A kind of conductive film and preparation method, device |
| CN108493351A (en) * | 2018-01-31 | 2018-09-04 | 云谷（固安）科技有限公司 | The preparation method of thin-film packing structure, display device and display device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130102 Termination date: 20150216 |
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| EXPY | Termination of patent right or utility model |