CN107282603B - Method for treating and recycling PCB waste film residues - Google Patents
Method for treating and recycling PCB waste film residues Download PDFInfo
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- CN107282603B CN107282603B CN201710602567.XA CN201710602567A CN107282603B CN 107282603 B CN107282603 B CN 107282603B CN 201710602567 A CN201710602567 A CN 201710602567A CN 107282603 B CN107282603 B CN 107282603B
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- 239000002699 waste material Substances 0.000 title claims abstract description 133
- 238000000034 method Methods 0.000 title claims abstract description 39
- 238000004064 recycling Methods 0.000 title claims abstract description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 46
- 238000001035 drying Methods 0.000 claims abstract description 32
- 239000003607 modifier Substances 0.000 claims abstract description 22
- 238000003756 stirring Methods 0.000 claims abstract description 22
- 238000001914 filtration Methods 0.000 claims abstract description 17
- 238000001291 vacuum drying Methods 0.000 claims abstract description 15
- 239000000446 fuel Substances 0.000 claims abstract description 9
- 238000002156 mixing Methods 0.000 claims abstract description 5
- 238000007599 discharging Methods 0.000 claims abstract description 3
- 239000007789 gas Substances 0.000 claims description 16
- 239000000126 substance Substances 0.000 claims description 12
- 239000000843 powder Substances 0.000 claims description 11
- 238000001704 evaporation Methods 0.000 claims description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 9
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 9
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 claims description 9
- 229910052901 montmorillonite Inorganic materials 0.000 claims description 9
- 229910052760 oxygen Inorganic materials 0.000 claims description 9
- 239000001301 oxygen Substances 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- XKMRRTOUMJRJIA-UHFFFAOYSA-N ammonia nh3 Chemical compound N.N XKMRRTOUMJRJIA-UHFFFAOYSA-N 0.000 claims description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 6
- 230000008020 evaporation Effects 0.000 claims description 6
- 229910052698 phosphorus Inorganic materials 0.000 claims description 6
- 239000011574 phosphorus Substances 0.000 claims description 6
- 235000019738 Limestone Nutrition 0.000 claims description 5
- 238000009835 boiling Methods 0.000 claims description 5
- 239000010881 fly ash Substances 0.000 claims description 5
- 239000006028 limestone Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 238000005516 engineering process Methods 0.000 claims description 2
- 238000009834 vaporization Methods 0.000 claims description 2
- 230000008016 vaporization Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000000460 chlorine Substances 0.000 description 13
- 229910052801 chlorine Inorganic materials 0.000 description 11
- 239000002893 slag Substances 0.000 description 11
- 229910052717 sulfur Inorganic materials 0.000 description 9
- 239000002351 wastewater Substances 0.000 description 9
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 8
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 8
- 239000011593 sulfur Substances 0.000 description 8
- 229910000069 nitrogen hydride Inorganic materials 0.000 description 5
- 239000012528 membrane Substances 0.000 description 4
- 238000007738 vacuum evaporation Methods 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000002485 combustion reaction Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000011812 mixed powder Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 238000007605 air drying Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 244000005700 microbiome Species 0.000 description 2
- 239000002574 poison Substances 0.000 description 2
- 231100000614 poison Toxicity 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000002352 surface water Substances 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 241000192710 Microcystis aeruginosa Species 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000012851 eutrophication Methods 0.000 description 1
- 238000004108 freeze drying Methods 0.000 description 1
- 239000000295 fuel oil Substances 0.000 description 1
- 239000002920 hazardous waste Substances 0.000 description 1
- 239000008235 industrial water Substances 0.000 description 1
- 239000003077 lignite Substances 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000010865 sewage Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004065 wastewater treatment Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
- B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
- B09B3/40—Destroying solid waste or transforming solid waste into something useful or harmless involving thermal treatment, e.g. evaporation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F23—COMBUSTION APPARATUS; COMBUSTION PROCESSES
- F23G—CREMATION FURNACES; CONSUMING WASTE PRODUCTS BY COMBUSTION
- F23G7/00—Incinerators or other apparatus for consuming industrial waste, e.g. chemicals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F23—COMBUSTION APPARATUS; COMBUSTION PROCESSES
- F23G—CREMATION FURNACES; CONSUMING WASTE PRODUCTS BY COMBUSTION
- F23G7/00—Incinerators or other apparatus for consuming industrial waste, e.g. chemicals
- F23G7/06—Incinerators or other apparatus for consuming industrial waste, e.g. chemicals of waste gases or noxious gases, e.g. exhaust gases
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B5/00—Drying solid materials or objects by processes not involving the application of heat
- F26B5/04—Drying solid materials or objects by processes not involving the application of heat by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum
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- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Molecular Biology (AREA)
- Processing Of Solid Wastes (AREA)
- Fire-Extinguishing Compositions (AREA)
Abstract
The invention provides a method for treating and recycling PCB waste film residues, which comprises the following steps: A. filtering the PCB waste film residues to reduce the water content of the PCB waste film residues; B. placing the filtered PCB waste film residues into a mixer, adding a surface modifier, stirring and mixing to attach the surface modifier to the surface of the PCB waste film residues; C. vacuum drying the PCB waste film residues attached with the surface modifier, and collecting condensate and non-condensable gas generated in the drying process; D. burning the dried PCB waste film residues as fuel of a burning furnace; discharging the condensate after biochemical treatment; and introducing the non-condensable gas into an incinerator to fully combust the PCB waste film residues. The production process is simple, the cost is low, secondary pollution is avoided, and safe disposal and recycling of PCB waste film residues can be effectively realized.
Description
Technical Field
The invention relates to a waste film residue treatment process, in particular to a PCB waste film residue treatment and recycling method.
Background
In recent years, information, communication, automobile and consumer electronics manufacturing have become one of the fastest growing industries worldwide, and the production value of Printed Circuit Boards (PCBs) is increasing year by year.
In the production process of the PCB, a large number of dry film or wet film processes are used, the dry film or wet film processes are classified into developing ink residues, film removing ink residues, developing dry film residues, film removing dry film residues and the like, the film residues obtained by solid-liquid separation after the dry film is removed are strong alkaline and have high Chemical Oxygen Demand (COD), and the film residues contain a large number of organic matters such as polyethylene films, photosensitive resins, polyesters and the like, and belong to the division of dyes and coating waste (HW12) in the national hazardous waste list. The membrane slag in the PCB industry is in a viscose state, the water content is up to more than 65%, the water content of the membrane slag can be reduced by traditional airing and natural air drying, but because the membrane slag is high in viscosity and poor in water permeability, the surface of the membrane slag becomes crusted after airing and natural air drying, the internal water content cannot volatilize, and the reduction amount of the water content is limited.
Because the film slag belongs to dangerous waste and has no economic value, the common treatment mode of PCB enterprises is the treatment of environment-friendly enterprises directly entrusted with HW12 treatment quality, and the mainstream treatment process is high-temperature incineration. However, the film slag has the characteristics of strong corrosivity, high water content, low heat value, difficult combustion and the like, a large amount of fuel oil needs to be added in the incineration treatment process, so that the treatment cost is increased sharply, in addition, the normal operation of incineration equipment is seriously influenced due to the high water content, and dry materials need to be matched to reduce the water content of materials fed into a furnace, so that the treatment capacity is greatly reduced.
Disclosure of Invention
In view of the above, there is a need for a method for treating waste film slag, which can rapidly reduce the water content of the waste film slag, increase the calorific value, reduce the incineration energy consumption and the treatment cost, and is more environment-friendly.
The invention provides a method for treating and recycling PCB waste film residues, which comprises the following steps:
A. filtering the PCB waste film residues to reduce the water content of the PCB waste film residues;
B. placing the filtered PCB waste film residues into a mixer, adding a surface modifier, stirring and mixing to attach the surface modifier to the surface of the PCB waste film residues;
C. vacuum drying the PCB waste film residues attached with the surface modifier, and collecting condensate and non-condensable gas generated in the drying process;
D. burning the dried PCB waste film residues as fuel of a burning furnace; discharging the condensate after biochemical treatment; and introducing the non-condensable gas into an incinerator to fully combust the PCB waste film residues.
Preferably, in the step A, the PCB waste film residues with the water content of more than 65% are filtered, and the water content is reduced to 40% -65%; the filtering mode is filter pressing or centrifugal filtration.
Preferably, in the step B, the surface modifier is one or a combination of more of activated carbon, incinerator inert fly ash, limestone powder, silica powder and montmorillonite powder.
Preferably, in the step B, the mesh size of the surfactant is in the range of 100 mesh to 500 mesh.
Preferably, in the step B, the surface modifier accounts for 5-10% of the weight of the PCB waste film residues.
Preferably, in the step C, the PCB waste film residue is stirred and vacuum-dried in a vacuum drier with a stirring function.
Preferably, in the step C, the vacuum drying conditions of the PCB waste film residues are as follows: the vacuum degree is more than or equal to 0.06MPa, the temperature is more than or equal to 60 ℃, and the drying time is less than or equal to 3 h.
Preferably, in the step C, the steam generated in the vacuum drying process passes through a heat exchanger to generate the condensate and the non-condensable gas.
Preferably, in the step C, the drying standard of the PCB waste film residues is that the water content of the dried PCB waste film residues is less than or equal to 5%, or the lower calorific value is more than or equal to 2000 kcal/kg.
Preferably, in the step D, the condensate after biochemical treatment is standardized to chemical oxygen demand less than or equal to 30mg/L, ammonia nitrogen content less than or equal to 1.5mg/L and total phosphorus content less than or equal to 0.3 mg/L.
Compared with the prior art, the dry PCB waste film residues treated by the method can be used as fuel of an incinerator for incineration treatment, condensate liquid is biochemically treated and then discharged after reaching standards, non-condensable gas is directly led into the incinerator for full combustion, and the incinerator can be used as heating or incineration equipment to provide energy for required application or scenes, so that the PCB waste film residues can be safely treated and recycled. The invention has simple production process, low cost and no secondary pollution.
Detailed Description
The technical solution of the present invention will be clearly and completely described below with reference to specific embodiments. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention. In the present invention, "recycling" means directly utilizing waste as a raw material or recycling waste, and "recycling PCB waste film residue" means recycling the processed PCB waste film residue as a fuel, wherein the fuel can be burned in an incinerator, and the incinerator can be used as a heating or incineration device to provide energy to a desired application or scene. The biochemical treatment is a sewage treatment method which mixes and contacts microorganisms, decomposes organic matters and certain inorganic poisons in the waste water by utilizing the biochemical action in the microorganisms and converts unstable organic matters and inorganic poisons into nontoxic substances. The chemical oxygen demand COD is the quantity of reducing substances needing to be oxidized in the wastewater measured by a chemical method and is an important organic matter pollution parameter in the wastewater. "Ammonia Nitrogen NH3the-N' is an index of the content of ammonia nitrogen in the wastewater, and is an important standard for measuring water quality, and the eutrophication of a water body can be caused by the high content of ammonia nitrogen. The total phosphorus P is the total content of phosphorus elements in the water body, is one of indexes of the water body rich in organic matters, and excessive phosphorus can cause water bloom or red tide to disturb the balance of the water body. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The names of technical means used in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.
The specific implementation mode comprises the following steps:
A. filtering the PCB waste film residues to reduce the water content of the PCB waste film residues;
B. placing the filtered PCB waste film residues into a mixer, adding a surface modifier, stirring and mixing to attach the surface modifier to the surface of the PCB waste film residues;
C. vacuum drying the PCB waste film residues attached with the surface modifier, and collecting condensate and non-condensable gas generated in the drying process;
D. burning the dried PCB waste film residues as fuel of a burning furnace; the condensate is biochemically treated and then discharged after reaching the standard; and the non-condensable gas is directly introduced into the incinerator to fully combust the PCB waste film residues.
Filtering the PCB waste film residues with the water content of more than 65% in the step A, and reducing the water content of the PCB waste film residues to 40% -65%; the filtration method is filter pressing or centrifugal filtration, specifically, filter pressing by using a filter press or centrifugal filtration by using a centrifugal filter.
And B, placing the PCB waste film residues with the water content of 40-65% in a mixer, adding a surface modifier, stirring and mixing to attach the surface modifier to the surfaces of the PCB waste film residues. The surface modifier is one or a combination of more of activated carbon, incinerator inert fly ash, limestone powder, silicon dioxide powder and montmorillonite powder. The mesh size range of the surfactant is 100 meshes-500 meshes. Where the unit of measure is the number of open pores per square inch of screen used to indicate the particle size of particles that can pass through the screen, the higher the number of mesh, the smaller the particle size. The proportion of the added surface modifier in the PCB waste film residue is 5-10%.
And C, performing vacuum drying on the PCB waste film residues attached with the surface modifier, and collecting condensate and non-condensable gas generated in the drying process. Specifically, the PCB waste film residues are placed in a vacuum drier with a stirring function for stirring and vacuum drying. The vacuum drying conditions of the PCB waste film residues are as follows: the vacuum degree is more than or equal to 0.06MPa, the temperature is more than or equal to 60 ℃, and the drying time is less than or equal to 3 h. The drying standard of the PCB waste film residues is that the water content of the dried PCB waste film residues is less than or equal to 5 percent, or the low calorific value is more than or equal to 2000 kcal/kg. The vacuum drying technique is a method of drying by evacuating air from a closed container and reducing the pressure. Vacuum drying can be divided into boiling point drying and freeze drying. The invention adopts boiling point drying technology, namely, sufficient heat is supplied to the moisture in the PCB waste film residues in a heating mode, so that evaporation and boiling are carried out simultaneously, and the vaporization speed is accelerated. Meanwhile, vaporized steam is quickly pumped out through vacuumizing, and finally the purpose of quickly drying the PCB waste film residues is achieved. And the steam generated in the vacuum drying process passes through a heat exchanger to generate condensate and non-condensable gas, and the condensate and the non-condensable gas are collected. The main component of the condensate may be water. The non-condensable gas may be air, or other exhaust gas.
D, burning the dried PCB waste film residues as fuel of a burning furnace; the condensate is biochemically treated and then discharged after reaching the standard; and the non-condensable gas is directly introduced into the incinerator to fully combust the PCB waste film residues. Specifically, the condensate is discharged after meeting the IV-class standard specified in the environmental quality Standard of surface Water (GB3838-2002) after biochemical treatment. The IV-class standard of the surface water environment quality standard (GB3838-2002) is suitable for the wastewater discharge of general industrial water areas and recreational water areas which are not directly contacted with human bodies, and the standard specifies that the Chemical Oxygen Demand (COD) is less than or equal to 30mg/L and the ammonia Nitrogen (NH)3N is less than or equal to 1.5mg/L, and total phosphorus (P) is less than or equal to 0.3 mg/L.
The invention discloses a method for treating and recycling PCB waste film residues. In the method, the dry waste film slag can be used as fuel of an incinerator for incineration treatment, condensate liquid is subjected to advanced wastewater treatment and then discharged up to the standard, and non-condensable gas is directly introduced into the incinerator for full combustion. The process does not produce secondary pollution, has simple production process and low cost, and can effectively realize the safe disposal and the resource utilization of the PCB waste film residues.
The first embodiment is as follows:
taking a batch of PCB waste film residues, measuring that the water content of the batch of PCB waste film residues is 81%, and if the prior art is adopted, drying the batch of PCB waste film residues under the conditions of 105 ℃ and 100Kpa of normal pressure takes about 12 hours.
Firstly, the PCB waste film residues are subjected to centrifugal filtration by a centrifugal filter, and the PCB waste film residues are subjected to centrifugal filtration for 5min under the condition that the rotating speed is 2000rpm, so that the PCB waste film residues with part of water removed are obtained, and the water content of the PCB waste film residues is about 55%.
Secondly, placing the PCB waste film residues with the water content of about 55% into a mixer with a stirrer, adding active carbon accounting for about 10% of the mass of the PCB waste film residues, wherein the mesh size range of the active carbon is 200-300 meshes, starting the stirrer, and stirring at a low speed for 60min to uniformly mix the PCB waste film residues and the active carbon, so as to carry out surface modification on the PCB waste film residues.
And then, placing the PCB waste film residues with the modified surfaces in a vacuum drier with a stirring function for stirring, vacuum evaporating and drying, wherein the vacuum degree is 0.08MPa, the temperature is 60 ℃, and after evaporation for 3 hours, the water content of the PCB waste film residues is reduced to below 5%, and compared with the prior art, the drying time is reduced by 9 hours.
The low-level heat value of the PCB waste film residues treated by the steps is determined to reach more than 5000kcal/kg, the heat value of the PCB waste film residues is equivalent to that of lignite, the contents of sulfur (S) and chlorine (Cl) of the PCB waste film residues are far lower than a kiln entering standard, and the kiln entering standards of the sulfur content and the chlorine content are respectively that S% is less than or equal to 1% and Cl% is less than or equal to 0.1%. COD (chemical oxygen demand) of condensate collected in the vacuum evaporation drying process after biochemical treatment is less than or equal to 30mg/L, and NH3N is less than or equal to 1.5mg/L, P is less than or equal to 0.3mg/L, and the wastewater reaches the standard and is discharged.
Example two:
taking a batch of PCB waste film residues, measuring that the water content of the batch of PCB waste film residues is about 81%, and if the prior art is adopted, drying the batch of PCB waste film residues at the temperature of 105 ℃ and the normal pressure of 100Kpa takes about 12 hours.
Firstly, the PCB waste film residues are subjected to centrifugal filtration by a centrifugal filter, and the PCB waste film residues are subjected to centrifugal filtration for 5min under the condition that the rotating speed is 2000rpm, so that the PCB waste film residues with part of water removed are obtained, and the water content of the PCB waste film residues is about 55%.
Secondly, placing the PCB waste film residues with the water content of about 55% into a mixer with a stirrer, adding montmorillonite powder accounting for about 5% of the mass of the PCB waste film residues, wherein the mesh size of the montmorillonite powder is larger than 300 meshes, starting the stirrer, and stirring at a low speed for 60min to uniformly mix the PCB waste film residues and the montmorillonite powder, so as to carry out surface modification on the PCB waste film residues.
And then, placing the PCB waste film residues with the modified surfaces in a vacuum drier with a stirring function for stirring, vacuum evaporating and drying, wherein the vacuum degree is 0.08MPa, the temperature is 105 ℃, and after evaporation for 2 hours, the water content of the PCB waste film residues is reduced to below 5%, and compared with the prior art, the drying time is reduced by 10 hours.
The low calorific value of the PCB waste film slag treated by the steps is up to 4500kcal/kg, the contents of sulfur and chlorine are far lower than the standard of entering a kiln, and the standards of the sulfur content and the chlorine content of entering the kiln are respectively that S% is less than or equal to 1% and Cl% is less than or equal to 0.1%. COD (chemical oxygen demand) of condensate collected in the vacuum evaporation drying process after biochemical treatment is less than or equal to 30mg/L, and NH3N is less than or equal to 1.5mg/L, P is less than or equal to 0.3mg/L, and the wastewater reaches the standard and is discharged.
Example three:
taking a batch of PCB waste film residues, measuring that the water content of the batch of PCB waste film residues is about 41%, and if the prior art is adopted, drying the batch of PCB waste film residues at the temperature of 105 ℃ and the normal pressure of 100Kpa takes about 8 hours.
Firstly, placing the PCB waste film residues with the water content of 41% in a mixer with a stirrer, adding silicon dioxide accounting for 5% of the mass of the PCB waste film residues, wherein the mesh size of the silicon dioxide is larger than 200 meshes, starting the stirrer, and stirring at a low speed for 60min to uniformly mix the PCB waste film residues and montmorillonite powder, so as to modify the surface of the PCB waste film residues.
And then, placing the PCB waste film residues with the modified surface into a vacuum drier with a stirring function for stirring, vacuum evaporating and drying, wherein the vacuum degree is 0.08MPa, the temperature is 95 ℃, and the water content is reduced to below 5% after evaporation for 3 hours, compared with the prior art, the drying time is reduced by 5 hours.
Determining the low calorific value of the PCB waste film residues treated by the stepsThe sulfur and chlorine contents of the product reach more than 4800kcal/kg, and are far lower than the kiln entry standard, wherein the kiln entry standards of the sulfur content and the chlorine content are respectively that S% is less than or equal to 1% and that Cl% is less than or equal to 0.1%. COD (chemical oxygen demand) of condensate collected in the vacuum evaporation drying process after biochemical treatment is less than or equal to 30mg/L, and NH3N is less than or equal to 1.5mg/L, P is less than or equal to 0.3mg/L, and the wastewater reaches the standard and is discharged.
Example four:
taking a batch of PCB waste film residues, measuring that the water content of the batch of PCB waste film residues is 41%, and if the prior art is adopted, drying the batch of PCB waste film residues at the temperature of 105 ℃ and the normal pressure of 100Kpa takes about 8 hours.
Firstly, placing the PCB waste film residues with the water content of about 41 percent into a blender with a stirrer, adding mixed powder accounting for about 10 percent of the mass of the PCB waste film residues, wherein the mixed powder consists of montmorillonite, limestone and incinerator inert fly ash, and the proportion of the montmorillonite, the limestone and the incinerator inert fly ash is 1: 1: 1, the granularity of the three is larger than 200 meshes, stirring is started, and stirring is carried out at a low speed for 60min, so that the PCB waste film residues and the mixed powder are uniformly mixed, and the aim of carrying out surface modification on the PCB waste film residues is fulfilled.
And then, placing the PCB waste film residues with the modified surface into a vacuum drier with a stirring function for stirring, vacuum evaporating and drying, wherein the vacuum degree is 0.08MPa, the temperature is 85 ℃, and the water content is reduced to below 5% after evaporation for 2.5h, compared with the prior art, the drying time is reduced by 5.5 h.
The low calorific value of the PCB waste film slag treated by the steps is determined to reach more than 4600kcal/kg, the contents of sulfur and chlorine are far lower than the standard of entering the kiln, and the standard of entering the kiln of the sulfur content and the chlorine content are respectively less than or equal to 1 percent of S percent and less than or equal to 0.1 percent of Cl percent. COD (chemical oxygen demand) of condensate collected in the vacuum evaporation drying process after biochemical treatment is less than or equal to 30mg/L, and NH3N is less than or equal to 1.5mg/L, P is less than or equal to 0.3mg/L, and the wastewater reaches the standard and is discharged.
The above embodiments are preferred embodiments of the present invention, but the present invention is not limited to the above embodiments, and the above embodiments are only used for explaining the claims. The scope of the invention is not limited by the description. Any changes or substitutions that can be easily made by those skilled in the art within the technical scope of the present disclosure are included in the scope of the present invention.
Claims (9)
1. A method for treating and recycling PCB waste film residues comprises the following steps:
step A, filtering the PCB waste film residues to reduce the water content of the PCB waste film residues;
b, placing the filtered PCB waste film residues into a mixer, adding a surface modifier, stirring and mixing to attach the surface modifier to the surfaces of the PCB waste film residues;
c, performing vacuum drying on the PCB waste film residues attached with the surface modifier, and performing vacuum drying by adopting a boiling point drying technology, namely supplying enough heat to the PCB waste film residues through a heating mode, so that evaporation and boiling are performed simultaneously, and the vaporization speed is increased; meanwhile, vaporized steam is quickly pumped out through vacuumizing, and finally the purpose of quickly drying the PCB waste film residues is achieved; the steam generated in the vacuum drying process passes through a heat exchanger to generate condensate and non-condensable gas, and the condensate and the non-condensable gas are collected;
d, burning the dried PCB waste film residues as fuel of a burning furnace; discharging the condensate after biochemical treatment; and introducing the non-condensable gas into an incinerator to fully combust the PCB waste film residues.
2. The method for treating and recycling the PCB waste film residues as claimed in claim 1, wherein the method comprises the following steps: in the step A, filtering the PCB waste film residues with the water content of more than 65 percent to reduce the water content to 40 to 65 percent; the filtering mode is filter pressing or centrifugal filtration.
3. The method for treating and recycling the PCB waste film residues as claimed in claim 1, wherein the method comprises the following steps: in the step B, the surface modifier is one or a combination of more of activated carbon, incinerator inert fly ash, limestone powder, silicon dioxide powder and montmorillonite powder.
4. The method for treating and recycling the PCB waste film residues as claimed in claim 1, wherein the method comprises the following steps: in the step B, the mesh particle size range of the surface modifier is 100 meshes-500 meshes.
5. The method for treating and recycling the PCB waste film residues as claimed in claim 1, wherein the method comprises the following steps: in the step B, the surface modifier accounts for 5-10% of the weight of the waste PCB film residues.
6. The method for treating and recycling the PCB waste film residues as claimed in claim 1, wherein the method comprises the following steps: and in the step C, the PCB waste film residues are placed in a vacuum drier with a stirring function to be stirred and vacuum-dried.
7. The method for treating and recycling the PCB waste film residues as claimed in claim 1, wherein the method comprises the following steps: in the step C, the vacuum drying conditions of the PCB waste film residues are as follows: the vacuum degree is more than or equal to 0.06MPa, the temperature is more than or equal to 60 ℃, and the drying time is less than or equal to 3 h.
8. The method for treating and recycling the PCB waste film residues as claimed in claim 1, wherein the method comprises the following steps: in the step C, the drying standard of the PCB waste film residues is that the water content of the dried PCB waste film residues is less than or equal to 5 percent, or the low calorific value is more than or equal to 2000 kcal/kg.
9. The method for treating and recycling the PCB waste film residues as claimed in claim 1, wherein the method comprises the following steps: in the step D, the condensate after biochemical treatment is standardized to chemical oxygen demand less than or equal to 30mg/L, ammonia nitrogen content less than or equal to 1.5mg/L and total phosphorus content less than or equal to 0.3 mg/L.
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| CN108998058A (en) * | 2018-07-19 | 2018-12-14 | 广州福之源环保科技有限公司 | A kind of PCB takes off membrane process film Slag treatment method |
| CN109679037B (en) * | 2019-01-09 | 2021-03-26 | 深圳市星河环境技术有限公司 | Method suitable for PCB waste film residue reduction and resource utilization |
| CN109621886B (en) * | 2019-01-23 | 2022-08-19 | 珠海恒格微电子装备有限公司 | Composite drying agent based on PCB dry film waste residues and preparation method thereof |
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| CN101786786A (en) * | 2010-02-09 | 2010-07-28 | 董萍萍 | Sewage treatment and utilization method of municipal sewage treatment plant |
| CN105642657B (en) * | 2016-03-18 | 2018-05-18 | 东莞东元环境科技股份有限公司 | A kind of film slag decrement integrated processing system and film slag decrement treatment method |
| CN205784384U (en) * | 2016-06-28 | 2016-12-07 | 苏州卓融新能源科技有限公司 | One is applicable to PCB and gives up film slag laundry drying processor |
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