CN107282603A - The method of the useless film Slag treatments of PCB and recycling - Google Patents
The method of the useless film Slag treatments of PCB and recycling Download PDFInfo
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- CN107282603A CN107282603A CN201710602567.XA CN201710602567A CN107282603A CN 107282603 A CN107282603 A CN 107282603A CN 201710602567 A CN201710602567 A CN 201710602567A CN 107282603 A CN107282603 A CN 107282603A
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- Prior art keywords
- pcb
- film
- film slag
- recycling
- slags
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- Granted
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- 239000002893 slag Substances 0.000 title claims abstract description 126
- 238000011282 treatment Methods 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000004064 recycling Methods 0.000 title claims abstract description 22
- 238000001035 drying Methods 0.000 claims abstract description 28
- 239000007788 liquid Substances 0.000 claims abstract description 25
- 238000001914 filtration Methods 0.000 claims abstract description 22
- 239000003607 modifier Substances 0.000 claims abstract description 16
- 239000000446 fuel Substances 0.000 claims abstract description 9
- 238000003756 stirring Methods 0.000 claims abstract description 9
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 6
- 238000002156 mixing Methods 0.000 claims abstract description 6
- 239000007789 gas Substances 0.000 claims description 15
- 239000000843 powder Substances 0.000 claims description 14
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 12
- 238000001291 vacuum drying Methods 0.000 claims description 9
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 claims description 8
- 229910052901 montmorillonite Inorganic materials 0.000 claims description 8
- 238000012545 processing Methods 0.000 claims description 8
- 239000002245 particle Substances 0.000 claims description 7
- XKMRRTOUMJRJIA-UHFFFAOYSA-N ammonia nh3 Chemical compound N.N XKMRRTOUMJRJIA-UHFFFAOYSA-N 0.000 claims description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 5
- 229910052698 phosphorus Inorganic materials 0.000 claims description 5
- 239000011574 phosphorus Substances 0.000 claims description 5
- 230000008569 process Effects 0.000 claims description 5
- 235000019738 Limestone Nutrition 0.000 claims description 4
- 239000000428 dust Substances 0.000 claims description 4
- 239000006028 limestone Substances 0.000 claims description 4
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 3
- 238000009833 condensation Methods 0.000 claims description 2
- 230000005494 condensation Effects 0.000 claims description 2
- 239000004094 surface-active agent Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- 239000002351 wastewater Substances 0.000 description 9
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 8
- 239000000460 chlorine Substances 0.000 description 6
- 229910052801 chlorine Inorganic materials 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 238000001704 evaporation Methods 0.000 description 5
- 230000008020 evaporation Effects 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000005864 Sulphur Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 229910052717 sulfur Inorganic materials 0.000 description 4
- 239000011593 sulfur Substances 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000005416 organic matter Substances 0.000 description 3
- 238000007605 air drying Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011812 mixed powder Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 239000010865 sewage Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 231100000331 toxic Toxicity 0.000 description 2
- 230000002588 toxic effect Effects 0.000 description 2
- 238000009834 vaporization Methods 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000012851 eutrophication Methods 0.000 description 1
- 239000000295 fuel oil Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000000813 microbial effect Effects 0.000 description 1
- 244000005700 microbiome Species 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002912 waste gas Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
- B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
- B09B3/40—Destroying solid waste or transforming solid waste into something useful or harmless involving thermal treatment, e.g. evaporation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F23—COMBUSTION APPARATUS; COMBUSTION PROCESSES
- F23G—CREMATION FURNACES; CONSUMING WASTE PRODUCTS BY COMBUSTION
- F23G7/00—Incinerators or other apparatus for consuming industrial waste, e.g. chemicals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F23—COMBUSTION APPARATUS; COMBUSTION PROCESSES
- F23G—CREMATION FURNACES; CONSUMING WASTE PRODUCTS BY COMBUSTION
- F23G7/00—Incinerators or other apparatus for consuming industrial waste, e.g. chemicals
- F23G7/06—Incinerators or other apparatus for consuming industrial waste, e.g. chemicals of waste gases or noxious gases, e.g. exhaust gases
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B5/00—Drying solid materials or objects by processes not involving the application of heat
- F26B5/04—Drying solid materials or objects by processes not involving the application of heat by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum
Landscapes
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Molecular Biology (AREA)
- Processing Of Solid Wastes (AREA)
- Fire-Extinguishing Compositions (AREA)
Abstract
The present invention provides a kind of method that PCB gives up film Slag treatment and recycling, and it comprises the following steps：A. the film slag that given up to PCB carries out filtration treatment, to reduce its moisture content；B. the useless film slags of PCB after the filtering are placed in blender, add surface modifier and simultaneously stir mixing, make surface modifier described in the useless film slag surface attachments of the PCB；C. the useless film slags of the PCB of the attaching surface modifying agent are dried in vacuo, and collect the condensate liquid and incoagulable gas produced in drying process；D. the film slag that the dried PCB given up is used as the fuel progress burning disposal of incinerator；The condensate liquid discharged after biochemical treatment；The incoagulable gas, which is imported into incinerator, makes the useless film slags of the PCB fully burn.Production process of the present invention is simple, and cost is low, does not produce secondary pollution, can effectively realize safe disposal and the recycling of the useless film slags of PCB.
Description
Technical field
The present invention relates to the method for useless film residues processing technique, more particularly to a kind of useless film Slag treatments of PCB and recycling.
Background technology
In recent years, information, communication, automobile and consumption electronic products manufacture had turned into whole world growth most quickly production already
One of industry, promotes global printed substrate (Printed Circuit Board, abbreviation PCB) output value to increase year by year.
Dry film or wet film technique can be largely used in PCB production process, there is invisible ink slag, striping ink
Slag, the development different classifications such as dry film slag and striping dry film slag, the film slag obtained after dry film stripping through separation of solid and liquid in strong basicity and
The characteristics of high chemical oxygen demand (Chemical Oxygen Demand, abbreviation COD), wherein containing polyethylene film, photosensitive resin
With the large amount of organic such as polyester, dyestuff, coating waste (HW12) subitem are belonged in National Hazard discarded object register.PCB industry films
Slag is in viscose glue shape, and moisture content is up to more than 65%, and traditional drying and natural air drying can reduce film slag moisture content, but due to film
Slag viscosity is larger, water penetration is poor, and the surface crust after drying and natural air drying, internal moisture can not still volatilize, and moisture content subtracts
It is a small amount of limited.
Because film slag belongs to dangerous waste and without economic value, the general processing mode of PCB enterprises has HW12 classes for directly commission
Enviromental protection enterprise's processing of qualification is handled, and the handling process of main flow is high temperature incineration.But film slag has stronger corrosivity, aqueous
Rate is high, calorific value is low, and the characteristic such as nonflammable needs to add substantial amounts of fuel oil during burning disposal, causes processing cost
Steeply rise, additionally due to water content is high, have a strong impact on the normal operation of burning facility, it is necessary to arrange in pairs or groups siccative to reduce into stove
The moisture content of material, causes treating capacity to substantially reduce.
The content of the invention
In view of the foregoing, it is necessary to which useless film slag moisture content can quickly be reduced, improve calorific value, reduction burning by providing one kind
Energy consumption and processing cost, more environmentally-friendly useless film Slag treatment method.
The present invention provides a kind of method that PCB gives up film Slag treatment and recycling, comprises the following steps：
A. the film slag that given up to PCB carries out filtration treatment, to reduce its moisture content；
B. the useless film slags of PCB after the filtering are placed in blender, add surface modifier and simultaneously stir mixing, make described
Surface modifier described in the useless film slag surface attachments of PCB；
C. the useless film slags of the PCB of the attaching surface modifying agent are dried in vacuo, and collect what is produced in drying process
Condensate liquid and incoagulable gas；
D. the film slag that the dried PCB given up is used as the fuel progress burning disposal of incinerator；The condensate liquid is carried out
Discharged after biochemical treatment；The incoagulable gas, which is imported into incinerator, makes the useless film slags of the PCB fully burn.
Preferably, in the step A, the useless film slags of PCB that 65% is more than to moisture content are filtered, and reduce its moisture content extremely
40%~65%；The mode of the filtering is press filtration or centrifugal filtration.
Preferably, in the step B, the surface modifier be activated carbon, incinerator inertia flying dust, limestone powder,
One or several kinds of combinations in SiO 2 powder, montmorillonite powder.
Preferably, in the step B, the mesh particle size range of the surfactant is the mesh of 100 mesh~500.
Preferably, in the step B, the surface modifier account for the PCB give up film slag weight proportion for 5%~
10%.
Preferably, in the step C, the useless film slags of the PCB, which are placed in the vacuum desiccator with agitating function, to be stirred
Vacuum drying.
Preferably, in the step C, the PCB is useless, and the vacuum drying condition of film slag is：Vacuum >=0.06MPa, temperature
>=60 DEG C, drying time≤3h.
Preferably, in the step C, the steam produced in the process of vacuum drying produces described after over-heat-exchanger
Condensate liquid and the incoagulable gas.
Preferably, in the step C, the drying standard of the useless film slags of the PCB is the moisture content of the useless film slags of dried PCB
≤ 5%, or Lower heat value >=2000kcal/kg.
Preferably, in the step D, the standard of the condensate liquid after biochemical treatment is COD≤30mg/
L, ammonia-nitrogen content≤1.5mg/L, total phosphorus content≤0.3mg/L.
Compared with prior art, incinerator can be used as using the useless film slags of PCB of the drying after the method processing of the present invention
Fuel carries out burning disposal, and condensate liquid carries out qualified discharge after biochemical treatment, and incoagulable gas, which is importing directly into incinerator, to be made
It fully burns, and incinerator can be supplied to energy application or the scene of needs, such one as heating or the equipment burned
Come, both can safe disposal PCB give up film slag, its recycling can be used again.Production process of the present invention is simple, cost
It is low, do not produce secondary pollution.
Embodiment
Technical scheme is clearly and completely described below in conjunction with specific embodiment.Obviously, it is described
Embodiment be only a part of embodiment of the invention, rather than whole embodiment.Based on the embodiment party in the present invention
Formula, the every other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made, all belongs to
In the scope of protection of the invention.It should be noted that " recycling " refers to waste carrying out profit directly as raw material herein
Regeneration is carried out with or to waste, and " the useless film slag recyclings of PCB " refers to enter the useless film slags of the PCB after processing as fuel
Row recycling, fuel can burn in incinerator, and incinerator can provide energy as heating or the equipment burned
Application or scene to needs." biochemical treatment " is to make microorganism mixing contact, utilizes the biological chemistry action in microbial body
Organic matter and some inorganic toxic materials in Decomposition Wastewater, make unstable organic matter and inorganic toxic material be converted into the one of innocuous substance
Plant sewage water treatment method." COD COD " is chemically to measure in waste water to need oxidized reducing substances
Amount, it is the Organic Pollution parameter in an important waste water." ammonia nitrogen NH3- N " is ammonia-nitrogen content index in waste water, is weighing apparatus
A major criterion of water quality is measured, ammonia-nitrogen content height can cause body eutrophication." total phosphorus P " is that P elements always contain in water body
Amount, is one of the index of water body rich in organic matter, phosphorus content can excessively cause wawter bloom or red tide, upset the balance of water body.Unless
Defined otherwise, all of technologies and scientific terms used here by the article and the those skilled in the art for belonging to the present invention are usual
The implication of understanding is identical.The title of used technological means is intended merely to describe specific implementation in the description of the invention
The purpose of example, it is not intended that in the limitation present invention.
Specific embodiment comprises the following steps：
A. the film slag that given up to PCB carries out filtration treatment, to reduce its moisture content；
B. the useless film slags of PCB after the filtering are placed in blender, add surface modifier and simultaneously stir mixing, make described
Surface modifier described in the useless film slag surface attachments of PCB；
C. the useless film slags of the PCB of the attaching surface modifying agent are dried in vacuo, and collect what is produced in drying process
Condensate liquid and incoagulable gas；
D. the film slag that the dried PCB given up is used as the fuel progress burning disposal of incinerator；The condensate liquid is carried out
Qualified discharge after biochemical treatment；The incoagulable gas, which is importing directly into incinerator, makes the useless film slags of the PCB fully burn.
The useless film slags of PCB for being more than 65% in step A to moisture content are filtered, and reduce its moisture content to 40%~65%；
The filter type is press filtration or centrifugal filtration, specifically, carries out press filtration by using filter press or is entered using centrifugal filter
Row centrifugal filtration.
The moisture content is placed in blender for 40%~65% useless film slags of PCB in step B, surface modifier is added
And mixing is stirred, make surface modifier described in the useless film slag surface attachments of the PCB.The surface modifier is activated carbon, burned
One or several kinds of combinations in stove inertia flying dust, limestone powder, SiO 2 powder, montmorillonite powder.Live on the surface
Property agent mesh particle size range be the mesh of 100 mesh~500.Wherein measurement unit mesh refers to the empty eye number on screen cloth per square inch,
For represent can be by the particle diameter of the particle of screen cloth, mesh number is higher, and particle diameter is smaller.The surface modifier of the addition accounts for described
The proportion of the useless film slag weight of PCB is 5%~10%.
The useless film slags of the PCB of the attaching surface modifying agent are dried in vacuo in step C, and collect production in drying process
Raw condensate liquid and incoagulable gas.Specifically, the useless film slags of the PCB are placed in the vacuum desiccator with agitating function and carried out
Stirring vacuum is dried.The PCB is useless, and the vacuum drying condition of film slag is：Vacuum >=0.06MPa, temperature >=60 DEG C, during drying
Between≤3h.The give up drying standards of film slag of the PCB are given up moisture content≤5% of film slag for dried PCB, or Lower heat value >=
2000kcal/kg.Vacuum drying technique is the vacuumizing in closed container, a kind of method for depressurizing and being dried.Very
Empty drying can be divided into boiling point and be dried and frozen dry two ways.The present invention uses boiling point dry technology, that is, passes through the side of heating
The enough heats of moisture that formula supply PCB gives up in film slag, make evaporation and seethe with excitement to carry out simultaneously, quickening vaporization rate.Meanwhile, pass through
The quick steam for extracting vaporization out is vacuumized, the purpose of the useless film slags of rapid draing PCB is finally reached.Produced in the process of vacuum drying
Raw steam produces condensate liquid and incoagulable gas after over-heat-exchanger, collects condensate liquid and incoagulable gas.The condensation
The main component of liquid can be water.The composition of the incoagulable gas can be air, or other waste gas.
It is used as the fuel of incinerator to carry out burning disposal the useless film slags of the dried PCB in step D；The condensate liquid
Carry out qualified discharge after biochemical treatment；The incoagulable gas, which is importing directly into incinerator, makes the useless film slags of the PCB fully fire
Burn.Specifically, the condensate liquid must reach after carrying out biochemical treatment《Water environment quality standard》(GB3838-2002) advised in
Discharged after IV fixed class standard.《Water environment quality standard》(GB3838-2002) IV class standard is applied to general
Industrial pool and the discharge of wastewater in the recreational water area of human body non-direct contact, standard regulation COD (COD)≤
30mg/L, ammonia nitrogen (NH3- N)≤1.5mg/L, total phosphorus (P)≤0.3mg/L.
A kind of method for film Slag treatment and the recycling of being given up the present invention discloses PCB.In the method, drying useless film slag can make
Burning disposal is carried out for the fuel of incinerator, condensate liquid carries out qualified discharge after Sewage advanced treatment, and incoagulable gas is directly led
Enter makes it fully burn into incinerator.The process does not produce secondary pollution, and production process is simple, and cost is low, can
Effectively realize safe disposal and the recycling of the useless film slags of PCB.
Embodiment one：
The useless film slags of a collection of PCB are taken, the moisture content for measuring the useless film slags of this crowd of PCB is 81%, prior art is such as used, in temperature
Time-consuming about 12h is needed to dry the useless film slags of this crowd of PCB under conditions of 105 DEG C and normal pressure 100Kpa.
First, centrifugal filtration is carried out to the useless film slags of this crowd of PCB using centrifugal filter, in the condition that rotating speed is 2000rpm
Under, centrifugal filtration 5min, the PCB after the part water that is removed gives up film slag, and its moisture content is about 55%.
Secondly, the useless film slags of PCB that the moisture content is about 55% are placed in the blender with agitator, addition is accounted for
The PCB gives up the activated carbon of film slag amount 10%, and the mesh particle size range of the activated carbon is 200~300 mesh, turn on agitator,
Stirring at low speed 60min, makes the useless film slags of the PCB and the activated carbon well mixed, it is therefore intended that the film slag that given up to the PCB is carried out
Surface is modified.
Then, the useless film slags of the modified PCB in the surface are placed in the vacuum desiccator with agitating function and be stirred
Drying is evaporated in vacuo, vacuum is 0.08MPa, and temperature is 60 DEG C, after evaporation 3h, and the moisture content of the useless film slags of the PCB is down to
Less than 5%, compared to prior art, drying time reduces 9h.
The PCB after being handled after measured through above-mentioned steps film slag Lower heat value of giving up reaches more than 5000kcal/kg, and brown
Quite, while its sulphur (S), chlorine (Cl) content are far below into kiln standard, sulfur content and chlorinity enter kiln standard scores for the calorific value of coal
Wei not S%≤1% and Cl%≤0.1%.Be evaporated in vacuo the condensate liquid collected in drying process carry out the COD after biochemical treatment≤
30mg/L, NH3- N≤1.5mg/L, P≤0.3mg/L, discharged wastewater met the national standard.
Embodiment two：
The useless film slags of a collection of PCB are taken, the moisture content for measuring the useless film slags of this crowd of PCB is about 81%, prior art is such as used, in temperature
Spend needs time-consuming about 12h to dry the useless film slags of this crowd of PCB under conditions of 105 DEG C and normal pressure 100Kpa.
First, centrifugal filtration is carried out to the useless film slags of this crowd of PCB using centrifugal filter, in the condition that rotating speed is 2000rpm
Under, centrifugal filtration 5min, the PCB after the part water that is removed gives up film slag, and its moisture content is about 55%.
Secondly, the useless film slags of PCB that the moisture content is about 55% are placed in the blender with agitator, addition is accounted for
The PCB gives up the montmorillonite powder of film slag amount 5%, and the mesh granularity of the montmorillonite powder is more than 300 mesh, turn on agitator,
Stirring at low speed 60min, makes the useless film slags of the PCB and montmorillonite powder well mixed, it is therefore intended that the film slag that given up to the PCB is carried out
Surface is modified.
Then, the useless film slags of the modified PCB in the surface are placed in the vacuum desiccator with agitating function and be stirred
Drying is evaporated in vacuo, vacuum is 0.08MPa, and temperature is 105 DEG C, after evaporation 2h, and the moisture content of the useless film slags of the PCB will drop
To less than 5%, compared to prior art, drying time reduces 10h.
The useless film slag Lower heat value of the PCB after being handled after measured through above-mentioned steps reaches more than 4500kcal/kg, simultaneously
Its sulphur, chlorinity are far below into kiln standard, sulfur content and chlorinity enter kiln standard be respectively S%≤1% and Cl%≤
0.1%.It is evaporated in vacuo the condensate liquid collected in drying process and carries out COD≤30mg/L, NH after biochemical treatment3-N≤1.5mg/
L, P≤0.3mg/L, discharged wastewater met the national standard.
Embodiment three：
The useless film slags of a collection of PCB are taken, the moisture content for measuring the useless film slags of this crowd of PCB is about 41%, prior art is such as used, in temperature
Spend needs time-consuming about 8h to dry the useless film slags of this crowd of PCB under conditions of 105 DEG C and normal pressure 100Kpa.
First, the useless film slags of PCB that the moisture content is about 41% are placed in the blender with agitator, addition is accounted for
The silica of the useless film slag amounts 5% of the PCB, the mesh granularity of the silica is more than 200 mesh, turn on agitator, low speed
60min is stirred, makes the useless film slags of the PCB and montmorillonite powder well mixed, it is therefore intended that the film slag that given up to the PCB carries out surface
It is modified.
Then, the useless film slags of the modified PCB in the surface are placed in the vacuum desiccator with agitating function and be stirred
Drying is evaporated in vacuo, vacuum is 0.08MPa, 95 DEG C of temperature, after evaporation 3h, moisture content near less than 5%, compared to existing
Technology, drying time reduces 5h.
The useless film slag Lower heat value of the PCB after being handled after measured through above-mentioned steps reaches more than 4800kcal/kg, simultaneously
Its sulphur, chlorinity are far below into kiln standard, sulfur content and chlorinity enter kiln standard be respectively S%≤1% and Cl%≤
0.1%.It is evaporated in vacuo the condensate liquid collected in drying process and carries out COD≤30mg/L, NH after biochemical treatment3-N≤1.5mg/
L, P≤0.3mg/L, discharged wastewater met the national standard.
Example IV：
The useless film slags of a collection of PCB are taken, it is 41% to measure the useless film slag moisture content of this crowd of PCB, such as uses prior art, is in temperature
The useless film slags of this crowd of PCB are dried under conditions of 105 DEG C and normal pressure 100Kpa needs time-consuming about 8h.
First, the useless film slags of PCB that the moisture content is about 41% are placed in the blender with agitator, addition is accounted for
The mixed-powder of the useless film slag amounts 10% of the PCB, mixed-powder is made up of montmorillonite, lime stone and incinerator inertia flying dust,
Proportions are 1：1：1, three's mesh granularity is all higher than 200 mesh, opens stirring, and stirring at low speed 60min makes the useless film slags of PCB and mixed
Close powder to be well mixed, it is therefore intended that the film slag that gives up to the PCB carries out surface modification.
Then, the useless film slags of the modified PCB in the surface are placed in the vacuum desiccator with agitating function and be stirred
Drying is evaporated in vacuo, vacuum is 0.08MPa, 85 DEG C of temperature, after evaporation 2.5h, moisture content near less than 5%, compared to existing
There is technology, drying time reduces 5.5h.
The useless film slag Lower heat value of the PCB after being handled after measured through above-mentioned steps reaches more than 4600kcal/kg, simultaneously
Its sulphur, chlorinity are far below into kiln standard, sulfur content and chlorinity enter kiln standard be respectively S%≤1% and Cl%≤
0.1%.It is evaporated in vacuo the condensate liquid collected in drying process and carries out COD≤30mg/L, NH after biochemical treatment3-N≤1.5mg/
L, P≤0.3mg/L, discharged wastewater met the national standard.
Above-described embodiment is preferably embodiment, but embodiments of the present invention are not by above-described embodiment of the invention
Limitation, embodiment of above is only for explaining claims.Right protection scope of the present invention is not limited to specification.Appoint
What those familiar with the art is in the technical scope of present disclosure, the change or replacement that can be readily occurred in,
It is included within protection scope of the present invention.
Claims (10)
- A kind of method of film Slag treatment and recycling 1. PCB gives up, comprises the following steps：A. the film slag that given up to PCB carries out filtration treatment, to reduce its moisture content；B. the useless film slags of PCB after the filtering are placed in blender, add surface modifier and simultaneously stir mixing, make the PCB Surface modifier described in useless film slag surface attachment；C. the useless film slags of the PCB of the attaching surface modifying agent are dried in vacuo, and collect the condensation produced in drying process Liquid and incoagulable gas；D. the film slag that the dried PCB given up is used as the fuel progress burning disposal of incinerator；The condensate liquid carries out biochemical Discharged after processing；The incoagulable gas, which is imported into incinerator, makes the useless film slags of the PCB fully burn.
- The method of film Slag treatment and recycling 2. PCB according to claim 1 gives up, it is characterised in that：In the step A, The useless film slags of PCB for being more than 65% to moisture content are filtered, and reduce its moisture content to 40%~65%；The mode of the filtering is Press filtration or centrifugal filtration.
- The method of film Slag treatment and recycling 3. PCB according to claim 1 gives up, it is characterised in that：In the step B, The surface modifier is one in activated carbon, incinerator inertia flying dust, limestone powder, SiO 2 powder, montmorillonite powder Plant or several combinations.
- The method of film Slag treatment and recycling 4. PCB according to claim 1 gives up, it is characterised in that：In the step B, The mesh particle size range of the surfactant is the mesh of 100 mesh~500.
- The method of film Slag treatment and recycling 5. PCB according to claim 1 gives up, it is characterised in that：In the step B, The proportion that the surface modifier accounts for the useless film slag weight of the PCB is 5%~10%.
- The method of film Slag treatment and recycling 6. PCB according to claim 1 gives up, it is characterised in that：In the step C, The useless film slags of the PCB, which are placed in the vacuum desiccator with agitating function, is stirred vacuum drying.
- The method of film Slag treatment and recycling 7. PCB according to claim 1 gives up, it is characterised in that：In the step C, The PCB is useless, and the vacuum drying condition of film slag is：Vacuum >=0.06MPa, temperature >=60 DEG C, drying time≤3h.
- The method of film Slag treatment and recycling 8. PCB according to claim 1 gives up, it is characterised in that：In the step C, The steam produced in the process of vacuum drying produces the condensate liquid and the incoagulable gas after over-heat-exchanger.
- The method of film Slag treatment and recycling 9. PCB according to claim 1 gives up, it is characterised in that：In the step C, The give up drying standards of film slag of the PCB are given up moisture content≤5% of film slag for dried PCB, or Lower heat value >= 2000kcal/kg。
- The method of film Slag treatment and recycling 10. PCB according to claim 1 gives up, it is characterised in that：In the step D, The standard of the condensate liquid after biochemical treatment is COD≤30mg/L, ammonia-nitrogen content≤1.5mg/L, total phosphorus content ≤0.3mg/L。
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| CN201710602567.XA CN107282603B (en) | 2017-07-21 | 2017-07-21 | Method for treating and recycling PCB waste film residues |
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| CN201710602567.XA CN107282603B (en) | 2017-07-21 | 2017-07-21 | Method for treating and recycling PCB waste film residues |
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| CN107282603A true CN107282603A (en) | 2017-10-24 |
| CN107282603B CN107282603B (en) | 2020-12-01 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108998058A (en) * | 2018-07-19 | 2018-12-14 | 广州福之源环保科技有限公司 | A kind of PCB takes off membrane process film Slag treatment method |
| CN109621886A (en) * | 2019-01-23 | 2019-04-16 | 珠海恒格电子科技有限公司 | A kind of composite drying agent and preparation method thereof based on PCB dry film waste residue |
| CN109679037A (en) * | 2019-01-09 | 2019-04-26 | 深圳市星河环境技术有限公司 | A method of it gives up the minimizing of film slag and resource utilization suitable for PCB |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101786786A (en) * | 2010-02-09 | 2010-07-28 | 董萍萍 | Sewage treatment and utilization method of municipal sewage treatment plant |
| CN105642657A (en) * | 2016-03-18 | 2016-06-08 | 东莞东元环境科技有限公司 | Film residue reduction integrated treatment system and film residue reduction treatment method |
| CN205784384U (en) * | 2016-06-28 | 2016-12-07 | 苏州卓融新能源科技有限公司 | One is applicable to PCB and gives up film slag laundry drying processor |
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2017
- 2017-07-21 CN CN201710602567.XA patent/CN107282603B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101786786A (en) * | 2010-02-09 | 2010-07-28 | 董萍萍 | Sewage treatment and utilization method of municipal sewage treatment plant |
| CN105642657A (en) * | 2016-03-18 | 2016-06-08 | 东莞东元环境科技有限公司 | Film residue reduction integrated treatment system and film residue reduction treatment method |
| CN205784384U (en) * | 2016-06-28 | 2016-12-07 | 苏州卓融新能源科技有限公司 | One is applicable to PCB and gives up film slag laundry drying processor |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108998058A (en) * | 2018-07-19 | 2018-12-14 | 广州福之源环保科技有限公司 | A kind of PCB takes off membrane process film Slag treatment method |
| CN109679037A (en) * | 2019-01-09 | 2019-04-26 | 深圳市星河环境技术有限公司 | A method of it gives up the minimizing of film slag and resource utilization suitable for PCB |
| CN109679037B (en) * | 2019-01-09 | 2021-03-26 | 深圳市星河环境技术有限公司 | Method suitable for PCB waste film residue reduction and resource utilization |
| CN109621886A (en) * | 2019-01-23 | 2019-04-16 | 珠海恒格电子科技有限公司 | A kind of composite drying agent and preparation method thereof based on PCB dry film waste residue |
| CN109621886B (en) * | 2019-01-23 | 2022-08-19 | 珠海恒格微电子装备有限公司 | Composite drying agent based on PCB dry film waste residues and preparation method thereof |
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|---|---|
| CN107282603B (en) | 2020-12-01 |
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