CN107275759B - Antenna assembly and electronic equipment - Google Patents
Antenna assembly and electronic equipment Download PDFInfo
- Publication number
- CN107275759B CN107275759B CN201710400919.3A CN201710400919A CN107275759B CN 107275759 B CN107275759 B CN 107275759B CN 201710400919 A CN201710400919 A CN 201710400919A CN 107275759 B CN107275759 B CN 107275759B
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- layer
- antenna structure
- electronic equipment
- feed point
- antenna
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
- H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
- H01Q1/244—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas extendable from a housing along a given path
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q17/00—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
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- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Support Of Aerials (AREA)
Abstract
The embodiment of the invention provides a kind of antenna assembly and electronic equipments.The antenna assembly includes: antenna structure layer, is used to receive and emit radiofrequency signal；The first metal layer is used to shield the electronic equipment internal to the electromagnetic interference of the antenna structure layer；Insulating layer, for the antenna structure layer and the first metal layer to insulate, the antenna structure layer is set to the side far from the electronic equipment of the insulating layer, and the first metal layer is set to the side towards the electronic equipment of the insulating layer.The present invention has reduction electronic equipment internal to the beneficial effect of the electromagnetic interference of antenna structure layer.
Description
Technical field
The present invention relates to the communications fields, more particularly to a kind of antenna assembly and electronic equipment.
Background technique
Electronic equipment carries out radio communication by antenna structure and base station or external electronic device.
Each electronic component of electronic equipment internal is likely to generate to the antenna structure during the work time
Electromagnetic interference, to influence the intensity and accuracy of the received radiofrequency signal of antenna structure.For example, the horse of electronic equipment internal
Reach, sensor, touch screen and power supply can all generate interference signal, to influence the receiving end signal of antenna structure layer.
Summary of the invention
The embodiment of the present invention provides a kind of antenna assembly and electronic equipment, and having reduces electronic equipment internal to antenna assembly
Radio frequency interference beneficial effect.
The embodiment of the present invention provides a kind of antenna assembly, is applied in electronic equipment, comprising:
Antenna structure layer is used to receive and emit radiofrequency signal；
The first metal layer is used to shield the electronic equipment internal to the electromagnetic interference of the antenna structure layer；
Insulating layer, for the antenna structure layer and the first metal layer to insulate, the antenna structure layer is set to
The side far from the electronic equipment of the insulating layer, the first metal layer be set to the insulating layer towards the electricity
The side of sub- equipment.
The embodiment of the present invention provides a kind of electronic equipment, including antenna assembly described in any of the above embodiments.
From the foregoing, it will be observed that antenna structure provided in an embodiment of the present invention and electronic equipment are by being arranged the first gold medal for antenna assembly
Belong to layer to come inside shielded electronic equipment to have to the electromagnetic interference of antenna structure layer and improve the signal strength that antenna structure receives
And the beneficial effect of accuracy.
Detailed description of the invention
Fig. 1 is the first structural schematic diagram of the electronic equipment in the embodiment of the present invention.
Fig. 2 is second of structural schematic diagram of the electronic equipment in the embodiment of the present invention.
Fig. 3 is the first structural schematic diagram of the antenna assembly in the embodiment of the present invention.
Fig. 4 is second of structural schematic diagram of the antenna assembly in the embodiment of the present invention.
Fig. 5 is the third structural schematic diagram of the antenna assembly in the embodiment of the present invention.
Fig. 6 is the 4th kind of structural schematic diagram of the antenna assembly in the embodiment of the present invention.
Specific embodiment
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and for explaining only the invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of
The description present invention and simplified description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with spy
Fixed orientation construction and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for
Purpose is described, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic.
" first " is defined as a result, the feature of " second " can explicitly or implicitly include one or more feature.?
In description of the invention, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected or can mutually communicate；It can be directly connected, it can also be by between intermediary
It connects connected, can be the connection inside two elements or the interaction relationship of two elements.For the ordinary skill of this field
For personnel, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
In the present invention unless specifically defined or limited otherwise, fisrt feature second feature "upper" or "lower"
It may include that the first and second features directly contact, also may include that the first and second features are not direct contacts but pass through it
Between other characterisation contact.Moreover, fisrt feature includes the first spy above the second feature " above ", " above " and " above "
Sign is right above second feature and oblique upper, or is merely representative of first feature horizontal height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " include that fisrt feature is directly below and diagonally below the second feature, or is merely representative of
First feature horizontal height is less than second feature.
Following disclosure provides many different embodiments or example is used to realize different structure of the invention.In order to
Simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and
And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting
Relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
The embodiment of the present invention provides a kind of electronic equipment.The electronic equipment can be the equipment such as smart phone, tablet computer.
With reference to Fig. 1 and Fig. 2, electronic equipment 1 includes cover board 101, display screen 102, circuit board 103, power supply mould group 104, shell 105, touching
Control mould group 106 and antenna assembly 107.
The touch module 106 is covered on the display screen 102.Wherein, cover board 101 is installed in touch module 106, to cover
Lid touch module 106.Cover board 101 can be transparent glass cover plate.In some embodiments, it is such as blue to can be use for cover board 101
Glass cover-plate made of the materials such as jewel.
Display screen 102 is mounted on shell 105, to form the display surface of electronic equipment 100.Display screen 102 may include
Display area 102A and non-display area 102B.Display area 102A is for showing the information such as image, text.Non-display area
102B does not show information.The functional units such as fingerprint mould group, touch-control circuit can be set in the bottom of non-display area 102B.
Circuit board 103 is mounted on inside shell 105.Circuit board 103 can be the mainboard of electronic equipment 100.Circuit board 103
On can integrate the functional units such as camera, proximity sensor and processor.Meanwhile display screen 102 can be electrically connected to
Circuit board 103.
In some embodiments, radio frequency (RF, Radio Frequency) circuit is provided on circuit board 103.Radio circuit
Wireless network and the network equipment (for example, server, base station etc.) or other electronic equipments (for example, smart phone etc.) can be passed through
Communication, with the information transmit-receive completed and between the network equipment or other electronic equipments.
The antenna assembly 107 is socketed in the outside wall surface of shell 105 as frame, is used to receive and emit radio frequency letter
Number.
Referring to Fig. 3, which includes antenna structure layer 1071, the first metal layer 1072, insulating layer
1073, the first ground connection feed point 1074, the second ground connection feed point 1075 and input/output feed point 1076.
Wherein, antenna structure layer 1071 its be used to receive and emit radiofrequency signal；The first metal layer 1072 is for shielding electricity
To the electromagnetic interference of antenna structure layer 1071 inside sub- equipment；Insulating layer 1073 be used for by the antenna structure layer 1071 with it is described
The first metal layer 1072 insulate, and the antenna structure layer 1071 is set to the one of the separate electronic equipment of the insulating layer 1073
Side, the first metal layer 1072 are set to the side towards electronic equipment of insulating layer 1073.
First ground connection feed point 1074 and the second ground connection feed point 1075 be all set in insulating layer 1073 towards electronic equipment
Side on.First ground connection feed point 1074 is electrically connected with the first metal layer 1072, the second ground connection feed point 1075 and antenna structure layer
1071 electrical connections.First ground connection feed point 1074 is for the first metal layer 1072 to be grounded.Second ground connection feed point 1075 is used
It is grounded in by the antenna structure layer 1071.Also, due to the first ground connection feed point 1074 and the second ground connection feed point 1075 mutually electricity
Isolation, the electromagnetic interference signal that can prevent the first metal layer 1072 from absorbing are coupled to the antenna structure layer 1071 by ground connection,
To be interfered to reception signal.Accordingly, in circuit board 103, there are two the first grounding leads being electrically isolated from each other for setting
Foot and the second grounding pin, first grounding pin are electrically connected with first ground connection feed point 1074, second grounding pin with
Second ground connection feed point 1075 electrical connection.
In some embodiments, which offers plated through-hole, which passes through the metal
Change hole to be electrically connected with second ground connection feed point 1075 realization.
The input/output feed point 1076 is electrically connected by plated through-hole with antenna structure layer 1071, and logical with circuit board 103
Electrical connector is crossed to be electrically connected.Input/output feed point 1076 is used to feed the antenna structure layer or by received signal
It is transferred to the circuit board 103 of electronic equipment internal.Input/output feed point 1076 can also pass through plated through-hole and the antenna structure
Layer 1071 is electrically connected.The quantity of input/output feed point 1076 without limitation, depending on antenna structure layer 1071.
In practical applications, the first metal layer 1072 includes that the first metallic sub-layer 1072a, the first metallic sub-layer 1072a is in
Hollow columnar, in practical applications, the shape of first metallic sub-layer 1072a and the exterior contour of electronic equipment are mutually adapted,
To be coated on the lateral wall of electronic equipment.For example, in the present embodiment, outside the cross section of first metallic sub-layer 1072a
Profile is round rectangle shape.In practical applications, first metallic sub-layer 1072a can be set in the gold on the insulating layer 1073
Belong to cabling or microstrip line etc..
It is to be appreciated that referring to figure 4., in a preferred embodiment, can be set in first antenna structure 1071a in this
On the hollows of first metallic sub-layer 1072a, it that is to say at four fillets of electronic equipment.It is corresponding, the second ground connection
Feed point 1075 is also disposed on the hollows.
Insulating layer 1073 includes that the first insulator layer 1073a, the first insulator layer 1073a is set to first metal sublayer
In the outside wall surface of layer 1072；Antenna structure layer 1071 includes first antenna structure 1071a, and first antenna structure 1071a is set to
On the first insulator layer 1073a.The insulating layer 1073 can be also used to give the antenna assembly 107 using being integrally formed
Whole support is provided.
In this embodiment, the quantity of first antenna structure 1071a can be multiple, be respectively arranged at first metal sublayer
On each face of layer 1072a.Multiple first antenna structure 1071a is respectively used to receive and emit the radio frequency letter of different frequency range
Number.Such as receive and emit Bluetooth signal, WIFI signal and 4G signal etc..
In some embodiments, which is that the metal being set on the inner wall of the insulating layer 1073 applies
Layer.
To sum up, in embodiments of the present invention, by the way that the first metal layer is arranged come inside shielded electronic equipment in antenna assembly
To the electromagnetic interference of antenna structure layer, there is the beneficial effect for improving signal strength and accuracy that antenna structure receives.
In further embodiments, which can also be other forms.Referring to figure 5. and Fig. 6, the day
Line apparatus 107 connects including antenna structure layer 1071, the first metal layer 1072, insulating layer 1073, the first ground connection feed point 1074, second
Ground feed point 1075 and input/output feed point 1076.
Wherein, antenna structure layer 1071 its be used to receive and emit radiofrequency signal；The first metal layer 1072 is for shielding electricity
To the electromagnetic interference of antenna structure layer 1071 inside sub- equipment；Insulating layer 1073 be used for by the antenna structure layer 1071 with it is described
The first metal layer 1072 insulate, and the antenna structure layer 1071 is set to the one of the separate electronic equipment of the insulating layer 1073
Side, the first metal layer 1072 are set to the side towards electronic equipment of insulating layer 1073.
First ground connection feed point 1074 and the second ground connection feed point 1075 be all set in insulating layer 1073 towards electronic equipment
Side on.First ground connection feed point 1074 is electrically connected with the first metal layer 1072, the second ground connection feed point 1075 and antenna structure layer
1071 electrical connections.First ground connection feed point 1074 is for the first metal layer 1072 to be grounded.Second ground connection feed point 1075 is used
It is grounded in by the antenna structure layer 1071.Also, due to the first ground connection feed point 1074 and the second ground connection feed point 1075 mutually electricity
Isolation, the electromagnetic interference signal that can prevent the first metal layer 1072 from absorbing are coupled to the antenna structure layer 1071 by ground connection,
To be interfered to reception signal.Accordingly, in circuit board 103, there are two the first grounding leads being electrically isolated from each other for setting
Foot and the second grounding pin, first grounding pin are electrically connected with first ground connection feed point 1074, second grounding pin with
Second ground connection feed point 1075 electrical connection.
In some embodiments, which offers plated through-hole, which passes through the metal
Change hole to be electrically connected with second ground connection feed point 1075 realization.
The input/output feed point 1076 is electrically connected by plated through-hole with antenna structure layer 1071, and logical with circuit board 103
Electrical connector is crossed to be electrically connected.Input/output feed point 1076 is used to feed the antenna structure layer or by received signal
It is transferred to the circuit board 103 of electronic equipment internal.Input/output feed point 1076 can also pass through plated through-hole and the antenna structure
Layer 1071 is electrically connected.The quantity of input/output feed point 1076 without limitation, depending on antenna structure layer 1071.
The first metal layer 1072 includes the first metallic sub-layer 1072a and the second metallic sub-layer 1072b, the first metallic sub-layer
1072a is in hollow columnar；Second metallic sub-layer 1072b is annular in shape.The outer peripheral profile of second metallic sub-layer 1072b and interior
The profile at edge is round rectangle.
Wherein, the second metallic sub-layer 1072b and the first metallic sub-layer 1072a coaxial arrangement, the second metallic sub-layer
The outer edge of 1072b is connect with one end of the first metallic sub-layer 1072a.In the application, first metallic sub-layer 1072a
In the side of the electronic equipment, which is located at the back side of electronic equipment.
Insulating layer 1073 includes the first insulator layer 1073a and the second insulator layer 1073b.First insulator layer
1073a is set in the outside wall surface of the first metallic sub-layer 1072a；The second insulator layer 1073b is set to described
In the one side far from the first metallic sub-layer 1072a of two metallic sub-layer 1072b.
Antenna structure layer 1071 includes first antenna structure 1071a and the second antenna structure 1071b.First antenna structure
1071a is set on the first insulator layer 1073a.Second antenna structure is set on second insulator layer.First
The quantity of antenna structure 1071a and the second antenna structure 1071b all can be multiple, are respectively used to receive and emit different frequencies
The radiofrequency signal of section.Such as receive and emit Bluetooth signal, WIFI signal and 4G signal etc..
Corresponding, the second ground connection feed point 1075 and input/output feed point 1076 are also multiple.
To sum up, in embodiments of the present invention, by the way that the first metal layer is arranged come inside shielded electronic equipment in antenna assembly
To the electromagnetic interference of antenna structure layer, there is the beneficial effect for improving signal strength and accuracy that antenna structure receives.
Further, which is also provided with the second antenna structure at the back side of electronic equipment, increases rf signal reception
Range.
In the description of this specification, reference term " embodiment ", " certain embodiments ", " schematically implementation
What the description of mode ", " example ", " specific example " or " some examples " etc. meant to describe in conjunction with the embodiment or example
Particular features, structures, materials, or characteristics are contained at least one embodiment or example of the invention.In this specification
In, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the specific spy of description
Sign, structure, material or feature can be combined in any suitable manner in any one or more embodiments or example.
In conclusion although the present invention has been disclosed above in the preferred embodiment, but above preferred embodiment is not to limit
The system present invention, those skilled in the art can make various changes and profit without departing from the spirit and scope of the present invention
Decorations, therefore protection scope of the present invention subjects to the scope of the claims.
In conclusion although the present invention has been disclosed above in the preferred embodiment, but above preferred embodiment is not to limit
The system present invention, those skilled in the art can make various changes and profit without departing from the spirit and scope of the present invention
Decorations, therefore protection scope of the present invention subjects to the scope of the claims.
Claims (9)
1. a kind of antenna assembly is applied in electronic equipment characterized by comprising
Antenna structure layer is used to receive and emit radiofrequency signal；
The first metal layer is used to shield the electronic equipment internal to the electromagnetic interference of the antenna structure layer；
Insulating layer, for the antenna structure layer and the first metal layer to insulate, the antenna structure layer is set to described
The side far from the electronic equipment of insulating layer, the first metal layer are set to setting towards the electronics for the insulating layer
Standby side；
Wherein, the first metal layer includes the first metallic sub-layer, and first metallic sub-layer is in hollow columnar；The insulating layer
Including the first insulator layer, first insulator layer is set in the outside wall surface of first metallic sub-layer；The day knot
Structure layer includes first antenna structure, and the first antenna structure setting is on first insulator layer.
2. antenna assembly according to claim 1, which is characterized in that further include the first ground connection feed point for being electrically isolated from each other with
And second ground connection feed point；
First ground connection feed point and second ground connection feed point be all set in the insulating layer towards the electronic equipment
Side on, first ground connection feed point is electrically connected with the first metal layer, second ground connection feed point and the day knot
The electrical connection of structure layer.
3. antenna assembly according to claim 2, which is characterized in that plated through-hole is provided on the insulating layer, it is described
Second ground connection feed point is electrically connected by the plated through-hole with the antenna structure layer.
4. antenna assembly according to claim 3, which is characterized in that in the one side towards electronic equipment of the insulating layer
It is additionally provided with input/output feed point, the input/output feed point is electrically connected by the plated through-hole and the antenna structure layer
It connects.
5. antenna assembly according to claim 1, which is characterized in that the cross-sectional profiles of first metallic sub-layer are in circle
Angular moment shape；
The first antenna structure setting is on four hollows of first metallic sub-layer.
6. antenna assembly according to claim 1 or 5, which is characterized in that the first metal layer further includes the second metal
Sublayer, second metallic sub-layer are annular in shape；
Second metallic sub-layer and first metallic sub-layer coaxial arrangement, the outer edge of second metallic sub-layer and institute
State one end connection of the first metallic sub-layer；
The insulating layer further includes the second insulator layer, and second insulator layer is set to the separate of second metallic sub-layer
In the one side of first metallic sub-layer；
The antenna structure layer further includes the second antenna structure, and second antenna structure is set to second insulator layer
On.
7. antenna assembly according to claim 6, which is characterized in that the first antenna structure and the second antenna structure
Quantity be it is multiple, multiple first antenna structures are respectively used to receive and emit the radiofrequency signal of multiple and different frequency ranges, multiple
Second antenna structure is respectively used to receive and emit the radiofrequency signal of multiple and different frequency ranges.
8. antenna assembly according to claim 1, which is characterized in that the first metal layer is to be set to the insulating layer
The metal coating towards the electronic equipment side.
9. a kind of electronic equipment, which is characterized in that including the described in any item antenna assemblies of claim 1-8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710400919.3A CN107275759B (en) | 2017-05-31 | 2017-05-31 | Antenna assembly and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710400919.3A CN107275759B (en) | 2017-05-31 | 2017-05-31 | Antenna assembly and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107275759A CN107275759A (en) | 2017-10-20 |
| CN107275759B true CN107275759B (en) | 2019-08-06 |
Family
ID=60064843
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710400919.3A Active CN107275759B (en) | 2017-05-31 | 2017-05-31 | Antenna assembly and electronic equipment |
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| Country | Link |
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| CN (1) | CN107275759B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108040417B (en) * | 2017-11-23 | 2020-07-03 | Oppo广东移动通信有限公司 | Circuit board assembly and mobile terminal |
| CN108023160B (en) * | 2017-11-23 | 2020-04-24 | Oppo广东移动通信有限公司 | Circuit board assembly and mobile terminal |
| CN107889346B (en) * | 2017-11-23 | 2020-04-14 | Oppo广东移动通信有限公司 | Circuit board assembly and mobile terminal |
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| CN102055058A (en) * | 2009-10-27 | 2011-05-11 | 柏腾科技股份有限公司 | Shell with electromagnetic interference prevention and antenna functions and manufacturing method thereof |
| CN203521610U (en) * | 2013-09-27 | 2014-04-02 | 深圳市金立通信设备有限公司 | Terminal |
| CN104350815A (en) * | 2012-06-04 | 2015-02-11 | 阿莫绿色技术有限公司 | Electromagnetic wave shielding sheet, method for manufacturing same, and embedded antenna comprising same |
| CN104540359A (en) * | 2014-12-17 | 2015-04-22 | 宇龙计算机通信科技(深圳)有限公司 | Shell of electronic device like mobile phone and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI605748B (en) * | 2014-09-05 | 2017-11-11 | 啟碁科技股份有限公司 | Electromagnetic absorber material structure having metal pattern |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102055058A (en) * | 2009-10-27 | 2011-05-11 | 柏腾科技股份有限公司 | Shell with electromagnetic interference prevention and antenna functions and manufacturing method thereof |
| CN104350815A (en) * | 2012-06-04 | 2015-02-11 | 阿莫绿色技术有限公司 | Electromagnetic wave shielding sheet, method for manufacturing same, and embedded antenna comprising same |
| CN203521610U (en) * | 2013-09-27 | 2014-04-02 | 深圳市金立通信设备有限公司 | Terminal |
| CN104540359A (en) * | 2014-12-17 | 2015-04-22 | 宇龙计算机通信科技(深圳)有限公司 | Shell of electronic device like mobile phone and manufacturing method thereof |
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| CN107275759A (en) | 2017-10-20 |
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Address after: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant after: OPPO Guangdong Mobile Communications Co., Ltd. Address before: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant before: Guangdong OPPO Mobile Communications Co., Ltd. |
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