CN107275759A - Antenna assembly and electronic equipment - Google Patents
Antenna assembly and electronic equipment Download PDFInfo
- Publication number
- CN107275759A CN107275759A CN201710400919.3A CN201710400919A CN107275759A CN 107275759 A CN107275759 A CN 107275759A CN 201710400919 A CN201710400919 A CN 201710400919A CN 107275759 A CN107275759 A CN 107275759A
- Authority
- CN
- China
- Prior art keywords
- layer
- antenna structure
- electronic equipment
- feed point
- insulating barrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
- H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
- H01Q1/244—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas extendable from a housing along a given path
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q17/00—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
Abstract
The embodiments of the invention provide a kind of antenna assembly and electronic equipment.The antenna assembly includes：Antenna structure layer, it is used to receiving and launching radiofrequency signal；The first metal layer, it is used to shield electromagnetic interference of the electronic equipment internal to antenna structure layer；Insulating barrier, for antenna structure layer and the first metal layer to be insulated, the antenna structure layer is arranged at the side of the remote electronic equipment of the insulating barrier, and the first metal layer is arranged at the side of the direction electronic equipment of the insulating barrier.The present invention has beneficial effect of the reduction electronic equipment internal to the electromagnetic interference of antenna structure layer.
Description
Technical field
The present invention relates to the communications field, more particularly to a kind of antenna assembly and electronic equipment.
Background technology
Electronic equipment carries out radio communication by antenna structure and base station or external electronic device.
Each electronic component of electronic equipment internal is likely to produce to the antenna structure in the course of the work
Electromagnetic interference, so as to influence the intensity and accuracy of the radiofrequency signal of antenna structure reception.For example, the horse of electronic equipment internal
Reach, sensor, touch screen and power supply can all produce interference signal, so as to influence the receiving end signal of antenna structure layer.
The content of the invention
The embodiment of the present invention provides a kind of antenna assembly and electronic equipment, with reduction electronic equipment internal to antenna assembly
Radio frequency interference beneficial effect.
The embodiment of the present invention provides a kind of antenna assembly, applied in electronic equipment, including：
Antenna structure layer, it is used to receiving and launching radiofrequency signal；
The first metal layer, it is used to shield electromagnetic interference of the electronic equipment internal to antenna structure layer；
Insulating barrier, for antenna structure layer and the first metal layer to be insulated, the antenna structure layer is arranged at
The side of the remote electronic equipment of the insulating barrier, the first metal layer is arranged at the direction electricity of the insulating barrier
The side of sub- equipment.
The embodiment of the present invention provides a kind of electronic equipment, including the antenna assembly described in any of the above-described.
From the foregoing, it will be observed that antenna structure provided in an embodiment of the present invention and electronic equipment by antenna assembly by setting the first gold medal
Category layer carrys out the electromagnetic interference inside shielded electronic equipment to antenna structure layer, the signal intensity received with raising antenna structure
And the beneficial effect of the degree of accuracy.
Brief description of the drawings
Fig. 1 is the first structural representation of the electronic equipment in the embodiment of the present invention.
Fig. 2 is second of structural representation of the electronic equipment in the embodiment of the present invention.
Fig. 3 is the first structural representation of the antenna assembly in the embodiment of the present invention.
Fig. 4 is second of structural representation of the antenna assembly in the embodiment of the present invention.
Fig. 5 is the third structural representation of the antenna assembly in the embodiment of the present invention.
Fig. 6 is the 4th kind of structural representation of the antenna assembly in the embodiment of the present invention.
Embodiment
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning
Same or similar element or element with same or like function are represented to same or similar label eventually.Below by ginseng
The embodiment for examining accompanying drawing description is exemplary, is only used for explaining the present invention, and is not considered as limiting the invention.
In the description of the invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer ", " up time
The orientation or position relationship of the instruction such as pin ", " counterclockwise " are, based on orientation shown in the drawings or position relationship, to be for only for ease of
The description present invention and simplified description, rather than indicate or imply that the device or element of meaning must have specific orientation, Yi Te
Fixed azimuth configuration and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for
Purpose is described, and it is not intended that indicating or implying relative importance or the implicit quantity for indicating indicated technical characteristic.
Thus, " first " is defined, one or more feature can be expressed or be implicitly included to the feature of " second ".
In description of the invention, " multiple " are meant that two or more, unless otherwise specifically defined.
In the description of the invention, it is necessary to illustrate, unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or be integrally connected；Can
To be mechanical connection or electrical connection or can mutually communicate；Can be joined directly together, can also be by between intermediary
Connect connected, can be connection or the interaction relationship of two elements of two element internals.For the ordinary skill of this area
For personnel, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or it " under "
Can directly it be contacted including the first and second features, it is not direct contact but by it that can also include the first and second features
Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " to include first special
Levy directly over second feature and oblique upper, or be merely representative of fisrt feature level height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " fisrt feature that includes are immediately below second feature and obliquely downward, or be merely representative of
Fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the present invention.In order to
Simplify disclosure of the invention, hereinafter the part and setting of specific examples are described.Certainly, they are only merely illustrative, and
And purpose does not lie in the limitation present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, between discussed various embodiments itself are not indicated and/or are set
Relation.In addition, the invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
The embodiment of the present invention provides a kind of electronic equipment.The electronic equipment can be the equipment such as smart mobile phone, tablet personal computer.
With reference to Fig. 1 and Fig. 2, electronic equipment 1 includes cover plate 101, display screen 102, circuit board 103, power supply module 104, housing 105, touched
Control module 106 and antenna assembly 107.
The touch module 106 is covered on the display screen 102.Wherein, cover plate 101 is installed in touch module 106, to cover
Lid touch module 106.Cover plate 101 can be transparent glass cover plate.In certain embodiments, cover plate 101 can be with such as blue
The glass cover-plate that the materials such as jewel are made.
Display screen 102 is arranged on housing 105, to form the display surface of electronic equipment 100.Display screen 102 can include
Viewing area 102A and non-display area 102B.Viewing area 102A is used for the information such as display image, text.Non-display area
102B not display informations.Non-display area 102B bottom can set the functional units such as fingerprint module, touch-control circuit.
Circuit board 103 is arranged on inside housing 105.Circuit board 103 can be the mainboard of electronic equipment 100.Circuit board 103
On can be integrated with the functional units such as camera, proximity transducer and processor.Meanwhile, display screen 102 can be electrically connected to
Circuit board 103.
In certain embodiments, radio frequency (RF, Radio Frequency) circuit is provided with circuit board 103.Radio circuit
Wireless network and the network equipment (for example, server, base station etc.) or other electronic equipments (for example, smart mobile phone etc.) can be passed through
Communication, with the information transmit-receive completed and between the network equipment or other electronic equipments.
The antenna assembly 107 is socketed in as frame in the outside wall surface of housing 105, and it is used to receive and launches radio frequency letter
Number.
Referring to Fig. 3, the antenna assembly 107 includes antenna structure layer 1071, the first metal layer 1072, insulating barrier
1073rd, the first ground connection feed point 1074, the second ground connection feed point 1075 and input/output feed point 1076.
Wherein, antenna structure layer 1071 its be used to receiving and launching radiofrequency signal；The first metal layer 1072 is used to shield electricity
Electromagnetic interference of the sub- device interior to antenna structure layer 1071；Insulating barrier 1073 be used for by the antenna structure layer 1071 with it is described
The first metal layer 1072 insulate, and the antenna structure layer 1071 is arranged at the one of the remote electronic equipment of the insulating barrier 1073
Side, the first metal layer 1072 is arranged at the side towards electronic equipment of insulating barrier 1073.
First ground connection feed point 1074 and the second ground connection feed point 1075 may be contained within insulating barrier 1073 towards electronic equipment
Side on.First ground connection feed point 1074 is electrically connected with the first metal layer 1072, the second ground connection feed point 1075 and antenna structure layer
1071 electrical connections.First ground connection feed point 1074 is used to the first metal layer 1072 being grounded.Second ground connection feed point 1075 is used
It is grounded in by antenna structure layer 1071.Also, due to the first ground connection feed point 1074 and the second ground connection feed point 1075 mutually electricity
Isolation, can prevent the electromagnetic interference signal that the first metal layer 1072 absorbs to be coupled to antenna structure layer 1071 by ground connection,
Interfered so as to dock the collection of letters number.Accordingly, in circuit board 103, two the first grounding leads being electrically isolated from each other are provided with
Pin and the second grounding pin, first grounding pin are electrically connected with first ground connection feed point 1074, second grounding pin with
Second ground connection feed point 1075 is electrically connected.
In certain embodiments, the insulating barrier 1073 offers plated through-hole, and antenna structure layer 1071 passes through the metal
Change hole to electrically connect with second ground connection feed point 1075 realization.
The input/output feed point 1076 is electrically connected by plated through-hole with antenna structure layer 1071, and logical with circuit board 103
Electrical connector is crossed to be electrically connected.Input/output feed point 1076 is used for antenna structure layer feed or by the signal of reception
It is transferred to the circuit board 103 of electronic equipment internal.Input/output feed point 1076 can also pass through plated through-hole and the antenna structure
Layer 1071 is electrically connected.The quantity of input/output feed point 1076 is not limited, depending on it is according to antenna structure layer 1071.
In actual applications, the first metal layer 1072 is in including the first metallic sub-layer 1072a, the first metallic sub-layer 1072a
Hollow columnar, in actual applications, first metallic sub-layer 1072a shape and the exterior contour of electronic equipment are mutually adapted,
To be coated on the lateral wall of electronic equipment.For example, in the present embodiment, outside first metallic sub-layer 1072a cross section
Profile is round rectangle shape.In actual applications, first metallic sub-layer 1072a can be arranged at the gold on the insulating barrier 1073
Belong to cabling or microstrip line etc..
It is to be appreciated that refer to Fig. 4, in a preferred embodiment, this can be arranged in first antenna structure 1071a
On first metallic sub-layer 1072a hollows, it that is to say at four fillets of electronic equipment.It is corresponding, its second ground connection
Feed point 1075 is also disposed on the hollows.
Insulating barrier 1073 is arranged at first metal sublayer including the first insulator layer 1073a, the first insulator layer 1073a
In the outside wall surface of layer 1072；Antenna structure layer 1071 includes first antenna structure 1071a, and first antenna structure 1071a is arranged at
On the first insulator layer 1073a.The insulating barrier 1073 can be using being integrally formed, and it is additionally operable to give the antenna assembly 107
Overall support is provided.
In this embodiment, first antenna structure 1071a quantity can be multiple, be respectively arranged at first metal sublayer
On layer 1072a each face.The plurality of first antenna structure 1071a is respectively used to receive and launches the radio frequency letter of different frequency range
Number.Such as receiving and launch Bluetooth signal, WIFI signal and 4G signals.
In certain embodiments, the first metal layer 1072 is that the metal being arranged on the inwall of the insulating barrier 1073 is applied
Layer.
To sum up, in embodiments of the present invention, by the way that antenna assembly is set into the first metal layer come inside shielded electronic equipment
To the electromagnetic interference of antenna structure layer, the signal intensity and the beneficial effect of the degree of accuracy received with raising antenna structure.
In further embodiments, the antenna assembly 107 can also be other forms.Fig. 5 and Fig. 6 is refer to, the day
Line apparatus 107 connects including antenna structure layer 1071, the first metal layer 1072, insulating barrier 1073, the first ground connection feed point 1074, second
Ground feed point 1075 and input/output feed point 1076.
Wherein, antenna structure layer 1071 its be used to receiving and launching radiofrequency signal；The first metal layer 1072 is used to shield electricity
Electromagnetic interference of the sub- device interior to antenna structure layer 1071；Insulating barrier 1073 be used for by the antenna structure layer 1071 with it is described
The first metal layer 1072 insulate, and the antenna structure layer 1071 is arranged at the one of the remote electronic equipment of the insulating barrier 1073
Side, the first metal layer 1072 is arranged at the side towards electronic equipment of insulating barrier 1073.
First ground connection feed point 1074 and the second ground connection feed point 1075 may be contained within insulating barrier 1073 towards electronic equipment
Side on.First ground connection feed point 1074 is electrically connected with the first metal layer 1072, the second ground connection feed point 1075 and antenna structure layer
1071 electrical connections.First ground connection feed point 1074 is used to the first metal layer 1072 being grounded.Second ground connection feed point 1075 is used
It is grounded in by antenna structure layer 1071.Also, due to the first ground connection feed point 1074 and the second ground connection feed point 1075 mutually electricity
Isolation, can prevent the electromagnetic interference signal that the first metal layer 1072 absorbs to be coupled to antenna structure layer 1071 by ground connection,
Interfered so as to dock the collection of letters number.Accordingly, in circuit board 103, two the first grounding leads being electrically isolated from each other are provided with
Pin and the second grounding pin, first grounding pin are electrically connected with first ground connection feed point 1074, second grounding pin with
Second ground connection feed point 1075 is electrically connected.
In certain embodiments, the insulating barrier 1073 offers plated through-hole, and antenna structure layer 1071 passes through the metal
Change hole to electrically connect with second ground connection feed point 1075 realization.
The input/output feed point 1076 is electrically connected by plated through-hole with antenna structure layer 1071, and logical with circuit board 103
Electrical connector is crossed to be electrically connected.Input/output feed point 1076 is used for antenna structure layer feed or by the signal of reception
It is transferred to the circuit board 103 of electronic equipment internal.Input/output feed point 1076 can also pass through plated through-hole and the antenna structure
Layer 1071 is electrically connected.The quantity of input/output feed point 1076 is not limited, depending on it is according to antenna structure layer 1071.
The first metal layer 1072 includes the first metallic sub-layer 1072a and the second metallic sub-layer 1072b, the first metallic sub-layer
1072a is in hollow columnar；Second metallic sub-layer 1072b is annular in shape.Second metallic sub-layer 1072b outer peripheral profile and interior
The profile at edge is round rectangle.
Wherein, the second metallic sub-layer 1072b and the first metallic sub-layer 1072a are coaxially disposed, the second metallic sub-layer
1072b outward flange is connected with one end of the first metallic sub-layer 1072a.In the application, first metallic sub-layer 1072a
In the side of the electronic equipment, second metallic sub-layer 1072b is located at the back side of electronic equipment.
Insulating barrier 1073 includes the first insulator layer 1073a and the second insulator layer 1073b.First insulator layer
1073a is arranged in the outside wall surface of the first metallic sub-layer 1072a；The second insulator layer 1073b is arranged at described
In two metallic sub-layer 1072b remote first metallic sub-layer 1072a one side.
Antenna structure layer 1071 includes first antenna structure 1071a and the second antenna structure 1071b.First antenna structure
1071a is arranged on the first insulator layer 1073a.Second antenna structure is arranged on second insulator layer.First
Antenna structure 1071a and the second antenna structure 1071b quantity can be multiple, are respectively used to receive and launch different frequencies
The radiofrequency signal of section.Such as receiving and launch Bluetooth signal, WIFI signal and 4G signals.
Corresponding, the second ground connection feed point 1075 and input/output feed point 1076 are also to be multiple.
To sum up, in embodiments of the present invention, by the way that antenna assembly is set into the first metal layer come inside shielded electronic equipment
To the electromagnetic interference of antenna structure layer, the signal intensity and the beneficial effect of the degree of accuracy received with raising antenna structure.
Further, the antenna assembly is also provided with the second antenna structure at the back side of electronic equipment, increases rf signal reception
Scope.
In the description of this specification, reference term " embodiment ", " some embodiments ", " schematically implementation
The description of mode ", " example ", " specific example " or " some examples " etc. means with reference to the embodiment or example description
Specific features, structure, material or feature are contained at least one embodiment of the present invention or example.In this specification
In, identical embodiment or example are not necessarily referring to the schematic representation of above-mentioned term.Moreover, the specific spy of description
Levy, structure, material or feature can in an appropriate manner be combined in any one or more embodiments or example.
In summary, although the present invention it is disclosed above with preferred embodiment, but above preferred embodiment and be not used to limit
The system present invention, one of ordinary skill in the art without departing from the spirit and scope of the present invention, can make various changes and profit
Adorn, therefore protection scope of the present invention is defined by the scope that claim is defined.
In summary, although the present invention it is disclosed above with preferred embodiment, but above preferred embodiment and be not used to limit
The system present invention, one of ordinary skill in the art without departing from the spirit and scope of the present invention, can make various changes and profit
Adorn, therefore protection scope of the present invention is defined by the scope that claim is defined.
Claims (10)
1. a kind of antenna assembly, applied in electronic equipment, it is characterised in that including：
Antenna structure layer, it is used to receiving and launching radiofrequency signal；
The first metal layer, it is used to shield electromagnetic interference of the electronic equipment internal to antenna structure layer；
Insulating barrier, for antenna structure layer and the first metal layer to be insulated, the antenna structure layer is arranged at described
The side of the remote electronic equipment of insulating barrier, the direction electronics that the first metal layer is arranged at the insulating barrier is set
Standby side.
2. antenna assembly according to claim 1, it is characterised in that also including the first ground connection feed point for being electrically isolated from each other with
And second ground connection feed point；
The direction electronic equipment that first ground connection feed point and second ground connection feed point may be contained within the insulating barrier
Side on, first ground connection feed point is electrically connected with the first metal layer, second ground connection feed point and the day knot
Structure layer electrical connection.
3. antenna assembly according to claim 2, it is characterised in that plated through-hole is provided with the insulating barrier, described
Second ground connection feed point is electrically connected by the plated through-hole with antenna structure layer.
4. antenna assembly according to claim 3, it is characterised in that in the one side towards electronic equipment of the insulating barrier
Input/output feed point is additionally provided with, the input/output feed point is electrically connected with the plated through-hole with antenna structure layer.
5. antenna assembly according to claim 1, it is characterised in that the first metal layer includes the first metallic sub-layer,
First metallic sub-layer is in hollow columnar；
The insulating barrier includes the first insulator layer, and first insulator layer is arranged at the outside wall surface of first metallic sub-layer
On；
The antenna structure layer includes first antenna structure, and the first antenna structure setting is on first insulator layer.
6. antenna assembly according to claim 5, it is characterised in that the cross-sectional profiles of first metallic sub-layer are in circle
Angular moment shape；
The first antenna structure setting is on four hollows of first metallic sub-layer.
7. the antenna assembly according to claim 5 or 6, it is characterised in that the first metal layer also includes the second metal
Sublayer, second metallic sub-layer is annular in shape；
Second metallic sub-layer and first metallic sub-layer are coaxially disposed, the outward flange of second metallic sub-layer and institute
State one end connection of the first metallic sub-layer；
The insulating barrier also includes the second insulator layer, and second insulator layer is arranged at the remote of second metallic sub-layer
In the one side of first metallic sub-layer；
The antenna structure layer also includes the second antenna structure, and second antenna structure is arranged at second insulator layer
On.
8. antenna assembly according to claim 7, it is characterised in that the first antenna structure and the second antenna structure
Quantity be multiple, to be respectively used to receive and launch the radiofrequency signal of multiple frequency ranges.
9. antenna assembly according to claim 1, it is characterised in that the first metal layer is to be arranged at the insulating barrier
The direction electronic equipment side metal coating.
10. a kind of electronic equipment, it is characterised in that including the antenna assembly described in claim any one of 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710400919.3A CN107275759B (en) | 2017-05-31 | 2017-05-31 | Antenna assembly and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710400919.3A CN107275759B (en) | 2017-05-31 | 2017-05-31 | Antenna assembly and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107275759A true CN107275759A (en) | 2017-10-20 |
| CN107275759B CN107275759B (en) | 2019-08-06 |
Family
ID=60064843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710400919.3A Active CN107275759B (en) | 2017-05-31 | 2017-05-31 | Antenna assembly and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107275759B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107889346A (en) * | 2017-11-23 | 2018-04-06 | 广东欧珀移动通信有限公司 | Circuit board assemblies and mobile terminal |
| CN108023160A (en) * | 2017-11-23 | 2018-05-11 | 广东欧珀移动通信有限公司 | Circuit board assemblies and mobile terminal |
| CN108040417A (en) * | 2017-11-23 | 2018-05-15 | 广东欧珀移动通信有限公司 | Circuit board assemblies and mobile terminal |
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| CN104350815A (en) * | 2012-06-04 | 2015-02-11 | 阿莫绿色技术有限公司 | Electromagnetic wave shielding sheet, method for manufacturing same, and embedded antenna comprising same |
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| US20160072192A1 (en) * | 2014-09-05 | 2016-03-10 | Wistron Neweb Corp. | Metal pattern on electromagnetic absorber structure |
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| CN102055058A (en) * | 2009-10-27 | 2011-05-11 | 柏腾科技股份有限公司 | Shell with electromagnetic interference prevention and antenna functions and manufacturing method thereof |
| CN104350815A (en) * | 2012-06-04 | 2015-02-11 | 阿莫绿色技术有限公司 | Electromagnetic wave shielding sheet, method for manufacturing same, and embedded antenna comprising same |
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| CN108023160A (en) * | 2017-11-23 | 2018-05-11 | 广东欧珀移动通信有限公司 | Circuit board assemblies and mobile terminal |
| CN108040417A (en) * | 2017-11-23 | 2018-05-15 | 广东欧珀移动通信有限公司 | Circuit board assemblies and mobile terminal |
| CN108023160B (en) * | 2017-11-23 | 2020-04-24 | Oppo广东移动通信有限公司 | Circuit board assembly and mobile terminal |
| CN108040417B (en) * | 2017-11-23 | 2020-07-03 | Oppo广东移动通信有限公司 | Circuit board assembly and mobile terminal |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107275759B (en) | 2019-08-06 |
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| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant after: OPPO Guangdong Mobile Communications Co., Ltd. Address before: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant before: Guangdong OPPO Mobile Communications Co., Ltd. |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |