CN107272345A - The illumination optics unit of EUV projection lithography - Google Patents
The illumination optics unit of EUV projection lithography Download PDFInfo
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- CN107272345A CN107272345A CN201710195298.XA CN201710195298A CN107272345A CN 107272345 A CN107272345 A CN 107272345A CN 201710195298 A CN201710195298 A CN 201710195298A CN 107272345 A CN107272345 A CN 107272345A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
- G03F7/70116—Off-axis setting using a programmable means, e.g. liquid crystal display [LCD], digital micromirror device [DMD] or pupil facets
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/7015—Details of optical elements
- G03F7/70175—Lamphouse reflector arrangements or collector mirrors, i.e. collecting light from solid angle upstream of the light source
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/08—Mirrors
- G02B5/0891—Ultraviolet [UV] mirrors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70075—Homogenization of illumination intensity in the mask plane by using an integrator, e.g. fly's eye lens, facet mirror or glass rod, by using a diffusing optical element or by beam deflection
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/08—Mirrors
- G02B5/09—Multifaceted or polygonal mirrors, e.g. polygonal scanning mirrors; Fresnel mirrors
Abstract
A kind of illumination optics unit of EUV projection lithography, object field is directed to by illumination light from light source along illuminating beam path.First facet speculum includes multiple first monolithic facets.Second facet speculum includes multiple second facets.At least some and distribution predetermined object field illumination passages of the second facet in the first facet.Via illumination passage, whole object field can use illumination optical illumination.First facet is embodied as light source thing being imaged onto in the light source picture of the certain amount set in the second facet, and the number corresponds to the number that object field illuminates passage.Passage is illuminated at least some object fields, the light source picture for being assigned to respective object field illumination passage is subdivided into the first light source part picture and at least one secondary light source part picture, and it is produced by the facet part not overlapped each other for being assigned to the first facet that respective object field illuminates passage respectively.At least two light source part pictures have the distance more than its average diameter to each other.
Description
Technical field
The present invention relates to a kind of illumination optics unit of EUV projection lithography, for illumination light to be guided to object field, wherein light
Carving mask can arrange.In addition, including the illuminator of such illumination optics unit the present invention relates to a kind of, it is related to one kind
Include the projection exposure apparatus of such illuminator, be related to a kind of by means of such projection exposure apparatus manufacture micro-structural
Or the method for nano-structured part (especially semiconductor chip), and be related to a kind of micro-structural of thus method manufacture and receive
Rice structured component.
Background technology
The illumination optics unit of the type proposed at the beginning is from the A1 of WO 2010/037453 and the A1 of US 2010/0231880
It is known.The A1 of WO 2013/139635 have been disclosed for a kind of illumination optics unit, wherein the first facet is implemented without monolithic
Example, and it is implemented as the group of single speculum being separated.
The content of the invention
The target of illumination be make via the illumination lights of the different illumination passages guiding of illumination optics unit in illuminated field with
Loss as few as possible is overlapping (superpose).It is an object of the present invention to provide a kind of illumination optics unit, it provides illumination
Optimize, and especially via different illumination passages guiding optimization of the illumination lights in illuminated field it is overlapping.
According to the present invention, this target is realized by the illumination optics unit of EUV projection lithography.The illumination optics unit is used
In by illumination light from light source along beam of illumination light Route guiding to object field, it is described wherein the object to be imaged can be arranged
Illumination optics unit is included：First facet speculum, the first facet speculum includes multiple first monolithic facets, described many
Individual first monolithic facet is used for the reflection guiding of the segment beam of the light beam of the illumination light；Second facet speculum, described
Two facet speculums are arranged on the downstream of the first facet speculum described in the beam of illumination light path, and including multiple second
Facet, the reflection that the multiple second facet is used for the segment beam reflected by first facet is guided so that passed through
In first facet and second facet of the reflected beams guiding distribution it is at least some come predetermined object field illumination passage, lead to
The object field illumination passage is crossed, the whole object field can be illuminated by the illumination light in every case, wherein in each situation
It is lower that what a proper the first facet and what a proper the second facet are distributed into the object field illumination passage；Wherein described first facet
It is embodied as the light source thing for the light source or downstream intermediate focus being imaged to the certain amount being arranged in second facet
Light source picture, the number correspond to object field illuminate passage number, wherein at least some object fields illuminate passage be applicable
It is that the light source picture for distributing to respective object field illumination passage contains：First light source part picture, the first light source part picture is by dividing
The first facet part of first facet of respective object field illumination passage is produced described in dispensing, and at least one second light
Source part picture, at least one described secondary light source part picture is by distributing to described first point that the respective object field illuminates passage
The second facet part in face is produced, wherein the first facet part and the second facet part do not overlap each other, wherein institute
State average 1/e of the distance more than described two light source parts picture between the center of at least two light source part pictures2Diameter.
It holds according to the invention that it is thin that object field is illuminated to the light source picture set in respective second facet of one in passage
It is divided into not overlapping and provides compensation optical aberration by the multiple light sources part picture that the non-overlapped part of the first related facet is produced
Option.Because object field illuminates the different geometrical arrangements of passage, especially because the different spaces arrangement of object field illumination passage, may
Cause such optical aberration.Respective object field illumination passage is dispersed in the second facet on light source imaging, thus this object field
Illuminate passage different zones may by the reflection at the different piece of the second facet Different Effects.
The arrangement and distance condition of light source part picture can apply in whole object fields illumination passages at least 10%.This
At least 20%, at least 30%, at least 40%, at least 50% or even more big ratio that part can apply in object field illumination passage
Example.
It can be performed by appropriately designed in terms of the forms of the different facet parts of the first facet by the second facet
Respective light source picture is subdivided into multiple light sources part picture, whereby, and different light source parts picture is produced in the second facet.It is respective whole
The form of individual first facet may deviate conic section (conic section), and for example can be by distorted elliptical
(twisted ellipsoid) is approx described.It may also be approximately twisted torus.
For the first selected facet part, the distance between the picture of resulting light source part may be two light
Twice of the average diameter of source part picture.The intensity of a diameter of illumination light of respective light source part picture is down in light source part picture
Center maximum intensity ratio 1/e2Twice of the radius at place.The facet of first facet speculum is not subdivided into discretely
The facet part being separated.The part of first facet is continuously incorporated into remaining for the boundary in its region of the first facet
The region of first facet.This distance/diameter ratio can be more than two, can be more than three, can be more than four, and even can be bigger.
Because object field illuminates the different geometry guiding of passage, by the non-overlapped facet part of one in first facet
Produce and distance each other increases the freedom of correct for optical aberrations more than the more than two light source part picture of its average diameter
Degree.
Corresponding statement is applied to the more than two light source part picture along the crooked route arrangement in second facet
Arrangement.
When design is embodied as the first facet of related object field illumination passage being imaged to the second facet of object field, illumination
The advantage of optical unit especially plays good action.Especially, the light source part by means of being subdivided into light source picture in pupil facet
Picture, can correct or compensate the first facet to the undesirable distortion of the imaging of object field.
It is at least some applicable following in second facet：The curvature of second facet is in the scope of second facet
Change at least 10%, above-mentioned Curvature varying is easy to the even relatively large imaging deviation of correction or light source picture is purposefully divided into that
This light source part picture separated.Here, curvature is the spherical surface portion for the corresponding reflective surface portions for matching the second facet
Radius of curvature inverse.This curvature condition go for the second facet of the second facet speculum at least 10%, at least
20%th, at least 30%, at least 40%, at least 50% or even more big ratio.The curvature of second facet can be in the second facet
Scope on change at least 15%, at least 20% or at least 25%.
Corresponding statement is applied to following curvature condition：It is at least some applicable following in second facet：In order to by correlation
The midpoint of the first facet of object field illumination passage be imaged to the midpoint of object field or to be imaged into the object field original image of object field
Point, the average curvature of the second facet is from nominal ρ0Deviate at least 10%.
Curvature deviation can be at least 12.5%, at least 15%, at least 17.5% or at least 20%.
If this imaging is directly performed by respective second facet, i.e. in the case of other no downstream image-forming blocks,
Then realize variant " being imaged onto in the midpoint of object field ".The midpoint of the first facet is imaged to thing when by the second related facet
Original image and when object field original image is used as real image or virtual image forming into object field midpoint by follow-up image-forming block, is realized
Variant " is imaged onto in object field original image ".
Proved as the field facet mirror of the first facet speculum in the illumination optics unit of EUV projection lithography
It is worth.
It is thin due to light source part picture in the case of making a reservation for various object fields illumination passages in the first facet tiltable
The optical aberration correction promoted is divided particularly well to carry out.
Demonstrate,proved as the pupil facet speculum of the second facet speculum in the illumination optics unit of EUV projection lithography
Its bright value.
A kind of illuminator, including any of the above-described described illumination optics unit and object field is imaged to the projection light of image field
Learn unit.A kind of projection exposure apparatus, including：Said lighting system；EUV light source；The object of object is kept to keep in object field
Device, the object holder is movable along direction of displacement by ohject displacement driver；And keep brilliant in image field
The wafer holders of piece, the wafer holders are movable along direction of displacement by crystal shift driver.One kind is thrown
The method for penetrating exposure, comprises the following steps：Above-mentioned projection exposure apparatus is provided；Chip is provided；Mask is provided；By means of institute
The projection optical unit of projection exposure apparatus is stated, at least a portion of the mask is projected to the photosensitive layer of the chip
Region on.A kind of micro-structural manufactured by the above method or nano-structured part.Said lighting system, above-mentioned projection exposes
The advantage of light device, above-mentioned manufacture method and above-mentioned micro-structural or nano-structured part corresponds to above by reference to root
Those explained according to the illumination optics unit of the present invention.Above-mentioned micro-structural or nanostructured can be manufactured with high structural resolution
Change part.
In this way, it is possible to such as semiconductor chip of the manufacture with high integration or storage density.
Brief description of the drawings
Explain the exemplary embodiment of the present invention in further detail below based on accompanying drawing.In the accompanying drawings：
Fig. 1 schematically shows the meridional section through the projection exposure apparatus of EUV projection lithography；
Fig. 2 very schematically illustrates the alternative photograph of the projection exposure apparatus between intermediate focal plane and object plane
The beam path of bright optical unit；
Fig. 3 very schematically illustrates first point of the illumination optics unit of the projection exposure apparatus according to Fig. 1 or Fig. 2
First facet of face speculum, three the second facets of this illumination optics unit and the object field illuminated by illumination optics unit,
Wherein for three different obliquities of the first facet, and therefore for the distribution respectively between the first facet and object field
The second facet three corresponding selections object field illumination passage, it is illustrated that from the first facet three selected locations advance
Beam path.
Embodiment
Fig. 1 schematically shows the projection exposure apparatus 1 of micro-lithography in meridional section.Projection exposure apparatus 1 includes
Light source or irradiation bomb 2.The illuminator 3 of projection exposure apparatus 1, which has, to be used to expose the photograph overlapped with the object field 5 in object plane 6
The illumination optics unit 4 of light field.Illuminated field can also be more than object field 5.In the case, exposure is arranged on the mask in object field 5
The object of the form of mother matrix 7, the reticle is fixed by object or reticle retainer 8.Reticle 7 is also referred to as photoetching
Mask.By ohject displacement driver 9, object holder 8 is movable along direction of displacement.Projection optical unit 10 is used for
Object field 5 is imaged in the image field 11 into image plane 12.Structure imaging on reticle 7 is to the picture being arranged in image plane 12
On the photosensitive layer of chip 13 in the region of field 11.Pass through wafer holders 14 (same not shown) fixed wafer 13.Pass through crystalline substance
Piece displacement driver 15 is in the mode synchronous with object holder 8, and wafer holders 14 are movable equally along direction of displacement
's.
The EUV irradiation bombs that irradiation bomb 2 radiates for the use with the transmitting in 5nm into the scope between 30nm.This can
Think plasma source, such as GDPP (plasma that gas discharge is produced) sources or LPP (laser-produced plasma) source.
Radiation source based on synchrotron or free electron laser (FEL) can be used for radiation source 2.Those skilled in the art's energy
The enough information found from such as B2 of US 6,859,515 on such radiation source.The EUV-radiation 16 sent from radiation source 2 leads to
Cross the focusing of optical collector (collector) 17.Known to corresponding optical collector from the A of EP 1225481.In the downstream of optical collector 17, EUV
Radiation 16 propagates across intermediate focal plane 18 before being incident in field facet mirror 19.Field facet mirror 19 is illumination light
Learn the first facet speculum of unit 4.Field facet mirror 19 includes multiple facets 20 (see Fig. 2), and it does not show in Fig. 1
Go out.Field facet 20 is embodied as monolithic facet.So as to, the reflecting surface of each in field facet 20 be it is complete, it is especially thinless
It is divided into multiple single small reflectors.
Field facet mirror 19 is arranged in the plane on the optical conjugate of object plane 6 of illumination optics unit 4.
EUV-radiation 16 is hereinafter also referred to as illumination light or imaging.
In the downstream of field facet mirror 19, EUV-radiation 16 is reflected by pupil facet speculum 21.Pupil facet reflects
Mirror 21 is the second facet speculum of illumination optics unit 4.Pupil facet speculum 21 be arranged on illumination optics unit 4 on
Intermediate focal plane 18 and pupil plane optical conjugate on projection optical unit 10 or the pupil overlapped with the pupil plane
In plane.Pupil facet speculum 21 includes multiple pupil facets 22 (see Fig. 2), and its is not shown in FIG. 1.By means of pupil point
The pupil facet of face speculum 21 and imaging optics downstream, thing is imaged onto by the field facet 20 of field facet mirror 19
In field 5, the form of imaging optics is the transmission with the order by beam path by 24,25 and 26 speculums referred to
Optical unit 23.The last speculum 26 for transmitting optical unit 23 is grazing incidence mirror (grazing incidence
mirror).Part 24 to 26 is used for the original virtual image forming of object field that will be produced by respective pupil facet 22 into object field.
In order to simplify the description of position relationship, accompanying drawing depicts Cartesian xyz coordinate system system as object plane 6 and picture
The world coordinates system of the description of the position relationship of each part of projection exposure apparatus 1 between plane 12.In Fig. 1, x-axis is hung down
The straight plane in accompanying drawing is advanced and entered wherein.In Fig. 1, y-axis is towards the right side and parallel to object holder 8 and wafer holders 14
Direction of displacement advance.In Fig. 1, z-axis is advanced down, i.e., perpendicular to object plane 6 and perpendicular to image plane 12.
X sizes on object field 5 or image field 11 are also appointed as field height.
Fig. 2 shown when using illumination optics unit 27, illumination light 16 between intermediate focal plane 18 and image plane 5
Alternative guiding, illumination optics unit 27 is the replacement of illumination optics unit 4, and can be used in projection exposure apparatus 1.It is non-
What is be often schematically illustrated is the beam path of the illumination light 3 between intermediate image plane 18 and object plane 6.Corresponding to light optics
The part of the illumination optics unit 27 of those parts of unit 4 is referred to same reference numerals, and is no longer discussed in detail.With illumination
Different in optical unit 4, pupil facet speculum 21 is the only part for transmitting optical unit 23 in illumination optics unit 27.
That is, the pupil facet 22 of the pupil facet speculum 21 of illumination optics unit 27 is by field facet mirror 19
Field facet directly (that is, in the case of the object field original image not plugged) be imaged in the way of overlapping each other into object field 5.
In the case of illumination optics unit 27, pupil facet speculum 21 is set directly at the pupil of projection optical unit 10 below
In plane.
In the case of the reflection at field facet mirror 19, due to the reflection at multiple facets 20, illumination light 16
Total light beam is divided into corresponding multiple illumination light segment beams.The light distributed respectively is guided by field facet 20 and by the reflected beams
The predetermined object field of pupil facet 22 illumination passage 28 (see Fig. 3).Passage 28 is illuminated via described, whole object field 5 is in each case
It can be illuminated by illumination light 16.Proper what a facet 20 and what a proper pupil facet 22 are distributed in object field illumination passage 28
Each.
By means of the tilt drive 29 schematically indicated in Fig. 3, in field facet 20 each each obliquity it
Between relocatable.These obliquities are different, depending on the embodiment of illumination optics unit 4,27.This can be related to two, three
Individual, four, the obliquity of five or even greater number of field facet 20.The field facet 20 of field facet mirror 19 can also
It is reoriented to different number of obliquity.Finally, at least some in field facet 20 are probably not tiltable.Field facet is anti-
Penetrate mirror 19 have can not the region of inclined field facet 20 can generally have one piece embodiment.
Fig. 3 very schematically illustrates the illumination light for the total of three obliquity of one in field facet 20
The independent light 16 of selectioniGuiding, its Fig. 3 left side illustrate.Just what a object field illuminates passage 281、282、283With it is proper
The pupil facet 22 of what a distribution1、222、223Belong to each in these three obliquities.
Field facet 20 can have the embodiment of rectangle or bending.Pupil facet 22 can have circular, square, rectangle
Or hexagonal embodiment.Both field facet 20 and pupil facet 22 is shown in Fig. 3 plan, and a facet 20 is not considered
Different obliquities.
Object field 5 is shown in Fig. 3 right side.Three pupil facets 221To 223Illustrate between facet 20 on the scene and object field 5.Three
Individual pupil facet 221To 223It is not actual proportions and significantly in figure 3 with the distance between field facet 20 and next object field 5 first
Reduce.
In addition, Fig. 3 is illustrated illuminates passage 28 for each object field1To 283Pupil facet 221To 223Between object field 5
Each independent light 16iBeam path continuity.
Independent light 16 between field facet 20 and object field 5iGuiding schematic illustration in assume illumination optics unit
The illumination optics unit of 27 types, wherein pupil facet 22 image directly to respective field facet 20 in object field 5.Alternative
Illumination optics unit 4 in, still there will be light beam guiding, light beam is guided via each pupil facet 22iIt is independent between object field 5
Light 16iBeam path in transmission optical unit 23 other speculums.
Field facet 20 is used for imaging source object, in the illustrated embodiment, in intermediate focal plane 18 (see Fig. 1)
Between focus 30 be imaged as being separately positioned on pupil facet 22iOn certain amount light source as 31i, the number pair of the light source picture
Passage 28 should be illuminated in object fieldiNumber.As can be seen from Figure 3, respective object field illumination passage 28 is distributed toiLight source
As 31iIt is subdivided into different light source parts pictureEach pupil facet 22 is indicated by dotted line image outline in figure 3iOn it is respective
Total light source is as 31i, wherein inscribed (inscribe) light source part picture
Elaborate light source as 31 by the independent light 16 of the selection of illumination light in figure 3iTo light source part pictureShould
Subdivision, the light rises in three field that is different, being spaced facet part A of a facet 201、A2And A3.Below
Use facet part A1、A2And A3To explain light source as 31iSubdivision.From field facet part A1、A2And A3Illumination
Light beam path, the beam of illumination light path meets specific image-forming condition respectively, and it will be explained below.It is random in the example shown
Select respective field facet part AiSegment boundary, and be continuously merged into remaining facet 20.
On x coordinate, first facet part A1In the left-hand side 1/3rd that facet 20 on the scene is set.On x coordinate,
Second facet part A2In the centre 1/3rd that facet 20 on the scene is set.On x coordinate, the 3rd facet part A3Set
In the right-hand side 1/3rd of facet 20 on the scene.Three fields facet part A1、A2And A3Do not overlap each other.
Depending on the obliquity of field facet 20, from first facet part A1Independent light 16 by light source part
As B1 iIt is incident upon respective pupil facet 22iOn.Corresponding statement is applied to from second facet part A2With the 3rd
Facet part A3And projection source part is as B2 iAnd B3 iIndependent light 16.In each case, light source part pictureRespective
Pupil facet 22iOn do not overlap each other.So as to adjacent light source part pictureThe distance between be more than light source part picture's
Average diameter.
As shown in figure 3, the various pupil facets 22 for distributing to proper what a facet 20 by obliquityi, light source
Part pictureIn pupil facet 22iOn arrangement can be different.
Upper pupil facet 22 in figure 31On, by three fields facet part A in the first obliquity of field facet 201、
A2And A3Shock produce light source part as B1 1、B1 2And B1 3Under each other, i.e. the phase with sufficient approximation
Same x coordinate.In central pupil facet 222On, the corresponding three light source portions produced in the second obliquity of facet 20 on the scene
Divide as B2 1、B2 2And B2 3It is distributed along oblique string-like.In relatively low pupil facet 223On, the 3rd of facet 20 on the scene tilts position
Three light source parts of middle generation are put as B3 1、B3 2、B3 3It is distributed along approximate C-shaped path string-like.
Field facet part A in object field 5iPicture part CiThe field facet part corresponded in object field 5 in field facet 20
AiArrangement position at.Especially, for its size and position, as part CiWith inclining for the selection of field facet mirror 20
Loxosis is put unrelated.Here, in each case on x coordinate (that is, field height), as part C1Positioned at the left-hand side three of object field 5
In/mono-, as part C2In the center 1/3rd of object field 5, and as part C3Positioned at object field 5 right-hand side three/
In one.
Generally it is applicable that, respective pupil facet 22iOn light source part pictureCan be along crooked route cloth
Put.
To cause pupil facet 22iEnsure via light source part pictureRespective impingement region by facet part AjImaging
To as part CjOn, pupil facet 22iWith curvature, curvature is in respective pupil facet 22iReflecting surface x scopes on and/
Or change at least 10% in y scopes.
To cause from each field facet part AjIndependent light 16 is directed to each light source part pictureOn, field facet 20 it is anti-
Reflective surface have can approximate description be distorted elliptical shape, it is correspondingly offset from conic section, especially deviates oval surface.
In the alternative embodiment of the reflecting surface of field facet 20, these can be using approximate description as twisted torus.Herein, distort
(distorted elliptical/twisted torus) is interpreted as bird caging of the respective 3D shape on axle, and the amplitude of this bird caging depends on
In the position along twisted spindle, especially in the way of approximately linear.
In order to which related object field is illuminated into passage 28iField facet 20 midpoint (that is, central facet part A2) be imaged to thing
(that is, center is as part C at the midpoint of field2) (in the case of illumination optics unit 4, imaging will extremely be imaged onto the object field in object field 5
The midpoint of original image), for pupil facet 22iIt is applicable, pupil facet 22iAverage curvature and nominal ρ0Deviation is extremely
Few 10%.
It is applied to this nominal ρ below0：
ρ0=1/2 [1/a+1/b]
Here, a is central facet part A2The distance between with pupil facet 22, and b is pupil facet 22 and object field 5
Middle body C2The distance between.
Whole field facets 20 are not necessarily suitable above in conjunction with Fig. 3 image-forming conditions explained, and are also not necessarily suitable
Whole pupil facets 22.
Due to by light source as 31iIt is subdivided into light source part pictureThe option of optical aberration correction is produced, the option is produced
It is the object field illumination passage 28 because in illumination optics unit 4 or 27iThe three-dimensional scopes of difference.Field facet is produced in object field 5
The precise overlay of 20 picture, is applicable above in conjunction with the image-forming condition that Fig. 3 is explained for it.
During being exposed by means of the projection of projection exposure apparatus 1, initially set by means of establishing method explained above
Illumination geometry.Then, at least a portion in the reticle 7 in object field 5 is imaged onto on the chip 13 in image field 11
On region on photosensitive layer, the photoetching process for micro-structural or nano-structured part is manufactured, especially semiconductor device, example
Photoetching process such as microchip is manufactured.In the case, in operation of scanner, in y-direction continuously with time upper synchronization
Mode moves reticle 7 and chip 13.
Claims (13)
1. a kind of illumination optics unit (4 of EUV projection lithography；27), for by illumination light (16) from light source (2) along illumination light
Beam path is directed to object field (5), wherein the object to be imaged (7) can arrange that the illumination optics unit is included：
- the first facet speculum (19), the first facet speculum (19) includes multiple first monolithic facets (20), described many
Individual first monolithic facet (20) is used for the reflection guiding of the segment beam of the light beam of the illumination light (16),
- the second facet speculum (21), the second facet speculum (21) is arranged on described in the beam of illumination light path
The downstream of first facet speculum (19), and including multiple second facets (22), the multiple second facet (22) is used for by institute
State the reflection guiding of the segment beam of the first facet (20) reflection so that guide described the first of distribution by the reflected beams
In facet (20) and second facet (22) it is at least some come predetermined object field illumination passage (28), illuminated by the object field
Passage, the whole object field (5) can be illuminated by the illumination light (16) in every case, wherein in every case will be lucky
One the first facet (20) and just what a the second facet (22) distribute to the object field illumination passage (28),
- wherein described first facet (20) is embodied as the light source thing (2 of the light source (2) or downstream intermediate focus (30)；
30) imaging is to the light source picture (31) for the certain amount being arranged on second facet (22), and the number is corresponding to object field photograph
The number of bright passage (28),
- be wherein applicable at least some object fields illumination passage (28), distribute to respective object field illumination passage (28i)
Light source picture (31i) contain：
-- the first light source part picture (Bi 1), the first light source part picture (Bi 1) illuminate passage by distributing to the respective object field
(28i) first facet (20) the first facet part (A1) produce,
-- at least one secondary light source part picture (Bi 2；Bi 3), at least one secondary light source part picture (Bi 2；Bi 3) by distributing
To the respective object field illumination passage (28i) first facet (20) the second facet part (A2；A3) produce, wherein
The first facet part (A1) and the second facet part (A2；A3) do not overlap each other,
- wherein described at least two light sources part picture (Bi 1, Bi 2；Bi 1, Bi 3) center between distance be more than it is described two
Light source part picture (Bi 1, Bi 2；Bi 1, Bi 3) average 1/e2Diameter.
2. illumination optics unit according to claim 1, it is characterised in that by one 's in first facet (20)
Non-overlapped facet part (A1, A2, A3) produce more than two light source part picture (Bi 1, Bi 2, Bi 3), wherein light source part picture
(Bi 1, Bi 2, Bi 3) between distance be more than the light source part picture (Bi 1, Bi 2, Bi 3) average diameter.
3. illumination optics unit according to claim 2, it is characterised in that along second facet (223) on bending
More than two light source part picture (B described in paths arrangementi 1, Bi 2, Bi 3)。
4. illumination optics unit according to any one of claim 1 to 3, it is characterised in that second facet (22)
It is embodied as first facet (20) imaging of the related object field illumination passage (28) to the object field (5).
5. illumination optics unit according to any one of claim 1 to 3, it is characterised in that second facet (22)
In it is at least some be applicable it is following：The curvature of second facet (22) changes at least in the scope of second facet (22)
10%.
6. illumination optics unit according to any one of claim 1 to 3, it is characterised in that second facet (22)
In it is at least some be applicable it is following：For the midpoint of first facet (20) that the related object field is illuminated to passage (28)
(A2) be imaged to the object field (C2) midpoint or the object field original image that be imaged to the object field (5) midpoint, described second point
The average curvature in face (22) is from nominal ρ0Deviate at least 10%.
7. illumination optics unit according to any one of claim 1 to 3, it is characterised in that field facet mirror conduct
The first facet speculum (19).
8. illumination optics unit according to any one of claim 1 to 3, it is characterised in that first facet (20)
Tiltable, for making a reservation for various object field illumination passages (28).
9. illumination optics unit according to any one of claim 1 to 3, it is characterised in that pupil facet speculum is made
For the second facet speculum (21).
10. a kind of illuminator (3)
- include the illumination optics unit (4) according to any one of claim 1 to 9,
- include the object field (5) being imaged to the projection optical unit (10) of image field (11).
11. a kind of projection exposure apparatus (1)
- include illuminator according to claim 10 (3),
- include EUV light source (2),
- it is included in the object holder (8) that object (7) is kept in the object field (5), the object holder is by object position
Move driver (9) movable along direction of displacement (y),
- it is included in the wafer holders (14) that chip (13) is kept in the image field (11), the wafer holders are to pass through crystalline substance
Piece displacement driver (15) is movable along the direction of displacement (y).
12. a kind of method for projecting exposure, comprises the following steps：
- projection exposure apparatus (1) according to claim 11 is provided,
- chip (13) is provided,
- mask (7) is provided,
- by means of the projection optical unit (10) of the projection exposure apparatus (1), by least one of the mask (7)
On the region for dividing the photosensitive layer for projecting the chip (13).
13. a kind of micro-structural or nano-structured part, are manufactured by method according to claim 12.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102016205624.7 | 2016-04-05 | ||
| DE102016205624.7A DE102016205624B4 (en) | 2016-04-05 | 2016-04-05 | Illumination optics for EUV projection lithography, illumination system, projection exposure apparatus and method for projection exposure |
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| Publication Number | Publication Date |
|---|---|
| CN107272345A true CN107272345A (en) | 2017-10-20 |
| CN107272345B CN107272345B (en) | 2019-04-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710195298.XA Active CN107272345B (en) | 2016-04-05 | 2017-03-28 | The illumination optics unit of EUV projection lithography |
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| Country | Link |
|---|---|
| CN (1) | CN107272345B (en) |
| DE (1) | DE102016205624B4 (en) |
| TW (1) | TWI625606B (en) |
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| CN102193334A (en) * | 2010-03-17 | 2011-09-21 | 卡尔蔡司Smt有限责任公司 | Illumination optical system for projection lithography |
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| CN103140782A (en) * | 2010-07-28 | 2013-06-05 | 卡尔蔡司Smt有限责任公司 | Facet mirror device |
| CN104335096A (en) * | 2012-05-23 | 2015-02-04 | 卡尔蔡司Smt有限责任公司 | Facet mirror |
| CN102695988B (en) * | 2009-12-23 | 2015-09-02 | Asml荷兰有限公司 | Lithographic equipment and device making method |
| CN107567598A (en) * | 2015-05-20 | 2018-01-09 | 卡尔蔡司Smt有限责任公司 | Pupil facet speculum |
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| US6859515B2 (en) | 1998-05-05 | 2005-02-22 | Carl-Zeiss-Stiftung Trading | Illumination system, particularly for EUV lithography |
| DE10138313A1 (en) | 2001-01-23 | 2002-07-25 | Zeiss Carl | Collector for lighting systems with a wavelength <193 nm |
| DE102007008448A1 (en) * | 2007-02-19 | 2008-08-21 | Carl Zeiss Smt Ag | Method of producing mirror facets for a facet mirror |
| DE102008049586A1 (en) | 2008-09-30 | 2010-04-08 | Carl Zeiss Smt Ag | Field facet mirror for use in illumination optics of a projection exposure apparatus for EUV microlithography |
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| DE102010062779A1 (en) * | 2010-12-10 | 2012-06-14 | Carl Zeiss Smt Gmbh | Illumination optics for projection lithography |
| DE102011003928B4 (en) * | 2011-02-10 | 2012-10-31 | Carl Zeiss Smt Gmbh | Illumination optics for projection lithography |
| DE102012204273B4 (en) | 2012-03-19 | 2015-08-13 | Carl Zeiss Smt Gmbh | Illumination optics for EUV projection lithography |
| DE102014203187A1 (en) * | 2014-02-21 | 2015-08-27 | Carl Zeiss Smt Gmbh | Illumination optics for projection lithography |
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2016
- 2016-04-05 DE DE102016205624.7A patent/DE102016205624B4/en active Active
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- 2017-03-28 CN CN201710195298.XA patent/CN107272345B/en active Active
- 2017-03-31 TW TW106111074A patent/TWI625606B/en active
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|---|---|---|---|---|
| CN102549461A (en) * | 2009-09-30 | 2012-07-04 | 卡尔蔡司Smt有限责任公司 | Illumination optical unit for microlithography |
| CN102695988B (en) * | 2009-12-23 | 2015-09-02 | Asml荷兰有限公司 | Lithographic equipment and device making method |
| CN102193334A (en) * | 2010-03-17 | 2011-09-21 | 卡尔蔡司Smt有限责任公司 | Illumination optical system for projection lithography |
| CN103140782A (en) * | 2010-07-28 | 2013-06-05 | 卡尔蔡司Smt有限责任公司 | Facet mirror device |
| CN104335096A (en) * | 2012-05-23 | 2015-02-04 | 卡尔蔡司Smt有限责任公司 | Facet mirror |
| CN107567598A (en) * | 2015-05-20 | 2018-01-09 | 卡尔蔡司Smt有限责任公司 | Pupil facet speculum |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107272345B (en) | 2019-04-23 |
| TW201802612A (en) | 2018-01-16 |
| DE102016205624A1 (en) | 2017-10-05 |
| DE102016205624B4 (en) | 2017-12-28 |
| TWI625606B (en) | 2018-06-01 |
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