CN107272345B - The illumination optics unit of EUV projection lithography - Google Patents

The illumination optics unit of EUV projection lithography Download PDF

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Publication number
CN107272345B
CN107272345B CN201710195298.XA CN201710195298A CN107272345B CN 107272345 B CN107272345 B CN 107272345B CN 201710195298 A CN201710195298 A CN 201710195298A CN 107272345 B CN107272345 B CN 107272345B
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facet
light source
illumination
object field
field
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CN107272345A (en
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M.帕特拉
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Carl Zeiss SMT GmbH
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Carl Zeiss SMT GmbH
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
    • G03F7/70116—Off-axis setting using a programmable means, e.g. liquid crystal display [LCD], digital micromirror device [DMD] or pupil facets
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/08—Mirrors
    • G02B5/0891—Ultraviolet [UV] mirrors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70075—Homogenization of illumination intensity in the mask plane by using an integrator, e.g. fly's eye lens, facet mirror or glass rod, by using a diffusing optical element or by beam deflection
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/08—Mirrors
    • G02B5/09—Multifaceted or polygonal mirrors, e.g. polygonal scanning mirrors; Fresnel mirrors

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Lenses (AREA)

Abstract

Illumination light is directed to object field along illuminating beam path from light source by a kind of illumination optics unit of EUV projection lithography.First facet reflecting mirror includes multiple first monolithic facets.Second facet reflecting mirror includes multiple second facets.Channel is illuminated by the predetermined object field of at least some in the first facet and distribution the second facet.Via illumination channel, the available illumination optical illumination of entire object field.First facet is embodied as light source object being imaged onto the light source picture for the certain amount being arranged in the second facet, and the number corresponds to the number in object field illumination channel.Channel is illuminated at least some object fields, the light source picture for being assigned to respective object field illumination channel is subdivided into first light source part picture and at least one second light source part picture, is generated respectively by the facet part not overlapped each other for being assigned to first facet in respective object field illumination channel.At least two light source part pictures have the distance greater than its average diameter to each other.

Description

The illumination optics unit of EUV projection lithography
Technical field
The present invention relates to a kind of illumination optics unit of EUV projection lithography, for guiding illumination light to object field, wherein light Carving mask can arrange.In addition, being related to one kind the present invention relates to a kind of lighting system including such illumination optics unit Projection exposure apparatus including such lighting system is related to a kind of micro-structural by means of the manufacture of such projection exposure apparatus Or the method for nano-structured component (especially semiconductor chip), and it is related to a kind of micro-structural the receiving of thus method manufacture Rice structured component.
Background technique
The illumination optics unit of the type proposed at the beginning is from 2010/0231880 A1 of WO 2010/037453 A1 and US It is known.A kind of illumination optics unit has been disclosed in 2013/139635 A1 of WO, wherein the first facet is implemented without monolithic Example, and it is implemented as the group of individual reflecting mirror being separated.
Summary of the invention
The target of illumination be make via the illumination lights of the different illumination channels guidance of illumination optics unit in illuminated field with Loss as few as possible is overlapped (superpose).It is an object of the present invention to provide a kind of illumination optics units, provide illumination It optimizes, and the overlapping of the optimization especially via the illumination light of different illumination channels guidance in illuminated field.
According to the present invention, this target is realized by the illumination optics unit of EUV projection lithography.The illumination optics unit is used In by illumination light from light source along beam of illumination light Route guiding to object field, it is described wherein the object to be imaged can be arranged Illumination optics unit includes: the first facet reflecting mirror, and the first facet reflecting mirror includes multiple first monolithic facets, described more Reflection guidance of a first monolithic facet for the segment beam of the light beam of the illumination light；Second facet reflecting mirror, described The downstream of the first facet reflecting mirror described in the beam of illumination light path is arranged in two facet reflecting mirrors, and including multiple second The reflection of facet, the segment beam that the multiple second facet is used to be reflected by first facet guides, so that passing through At least some of described first facet and second facet of the reflected beams guidance distribution come predetermined object field illumination channel, lead to Object field illumination channel is crossed, the entire object field can be illuminated by the illumination light in every case, wherein in each situation It is lower that a proper the first facet and what a proper the second facet are distributed into object field illumination channel；Wherein first facet It is embodied as to be imaged for the light source object of the light source or downstream intermediate focus to the certain amount being arranged in second facet Light source picture, the number correspond to object field illumination channel number, wherein at least some object fields illumination channel be applicable in To distribute to the light source picture in respective object field illumination channel to contain: first light source part picture, first light source part picture by point First facet part of first facet in respective object field illumination channel described in dispensing generates and at least one second light Source part picture, at least one described second light source part picture is by distributing to described first point of respective object field illumination channel The second facet part in face generates, wherein first facet part and second facet part do not overlap each other, wherein institute State the average 1/e that the distance between the center of at least two light source part pictures is greater than described two light source parts picture2Diameter.
It holds according to the invention that it is thin that object field is illuminated to the light source picture being arranged in one respective second facet in channel It is divided into and is not overlapped and provides compensation optical aberration by the multiple light sources part picture that the non-overlap part of relevant first facet generates Option.Because object field illuminates the different geometrical arrangements in channel, especially because the different spaces arrangement in object field illumination channel, it may Cause such optical aberration.Respective object field illumination channel is dispersed in the second facet about light source imaging, thus this object field The different zones for illuminating channel may be by the Different Effects of the reflection at the different piece of the second facet.
The arrangement and distance condition of light source part picture can be applied at least 10% in whole object field illuminations channel.This Part can be applied at least 20%, at least 30%, at least 40%, at least 50% or even more big ratio in object field illumination channel Example.
Can by way of the different facet parts of the first facet in terms of it is appropriately designed, execution will be in the second facet Respective light source picture is subdivided into multiple light sources part picture, whereby, different light source parts picture is generated in the second facet.It is respective whole The form of a first facet may deviate conic section (conic section), and for example can be by distorted elliptical (twisted ellipsoid) is approximatively described.It may also be approximately twisted torus.
For the first selected facet part, the distance between the picture of resulting light source part may be two light Twice of the average diameter of source part picture.The diameter of respective light source part picture is that the intensity of illumination light is down in light source part picture Center at maximum intensity ratio 1/e2Twice of the radius at place.The facet of first facet reflecting mirror is not subdivided into discretely The facet part being separated.The part of first facet is that the boundary in its region of the first facet is continuously incorporated into remaining The region of first facet.This distance/diameter ratio can be greater than two, can be greater than three, can be greater than four, and even can be bigger.
Due to the different geometry guidance in object field illumination channel, by the non-overlap facet part of one in first facet It generates and distance each other is greater than the more than two light source part picture of its average diameter and increases the freedom of correct for optical aberrations Degree.
Corresponding statement is suitable for the more than two light source part picture along the crooked route arrangement in second facet Arrangement.
When design is embodied as the first facet that relevant object field illuminates channel being imaged to the second facet of object field, illumination The advantages of optical unit, especially plays good action.Particularly, the light source part by means of being subdivided into light source picture in pupil facet Picture can correct or compensate the undesirable distortion of the imaging of the first facet to object field.
At least some of second facet is applicable in following: the curvature of second facet is in the range of second facet Light source picture is divided into convenient for the even relatively large imaging deviation of correction or purposefully that by variation at least 10%, above-mentioned Curvature varying This light source part picture separated.Here, curvature is the spherical surface portion for being matched to the correspondence reflective surface portions of the second facet Radius of curvature inverse.This curvature condition can be adapted for the second facet of the second facet reflecting mirror at least 10%, at least 20%, at least 30%, at least 40%, at least 50% or even greater ratio.The curvature of second facet can be in the second facet Range on change at least 15%, at least 20% or at least 25%.
Corresponding statement is suitable for following curvature condition: at least some of second facet is applicable in following: in order to will be related The midpoint of the first facet in object field illumination channel be imaged to the midpoint of object field or to be imaged into the object field original image of object field Point, the average curvature of the second facet is from nominal ρ0Deviate at least 10%.
Curvature deviation can be at least 12.5%, at least 15%, at least 17.5% or at least 20%.
If this imaging is directly executed by respective second facet, that is, in the case where other no downstream image-forming blocks, Then realize variant " being imaged onto the midpoint of object field ".When the midpoint of the first facet is imaged to object by relevant second facet Original image and object field original image by subsequent image-forming block as real image or virtual image forming into object field midpoint when, realize Variant " is imaged onto object field original image ".
Field facet mirror as the first facet reflecting mirror has proved in the illumination optics unit of EUV projection lithography It is worth.
It is thin due to light source part picture in the case where the first facet tiltable is for making a reservation for various object fields illumination channel The optical aberration correction promoted is divided particularly well to carry out.
Pupil facet reflecting mirror as the second facet reflecting mirror has been demonstrate,proved in the illumination optics unit of EUV projection lithography Its bright value.
A kind of lighting system is imaged including any of the above-described illumination optics unit and by object field to the projection light of image field Learn unit.A kind of projection exposure apparatus, comprising: said lighting system；EUV light source；The object of object is kept to keep in object field Device, the object holder are movable along direction of displacement by ohject displacement driver；And keep brilliant in image field The wafer holders of piece, the wafer holders are movable along direction of displacement by crystal shift driver.A kind of throwing The method for penetrating exposure, comprising the following steps: above-mentioned projection exposure apparatus is provided；Chip is provided；Mask is provided；By means of institute At least part of the mask is projected the photosensitive layer of the chip by the projection optical unit for stating projection exposure apparatus Region on.A kind of micro-structural or nano-structured component manufactured by the above method.Said lighting system, above-mentioned projection expose The advantages of light device, above-mentioned manufacturing method and above-mentioned micro-structural or nano-structured component, corresponds to above by reference to root Those of explained according to illumination optics unit of the invention.Above-mentioned micro-structural or nanostructure can be manufactured with high structural resolution Change component.
In this way, it is possible to the semiconductor chip that such as manufacture has high integration or storage density.
Detailed description of the invention
Exemplary embodiment of the present invention is explained in further detail below based on attached drawing.In the accompanying drawings:
Fig. 1 schematically shows the meridional section of the projection exposure apparatus across EUV projection lithography；
Fig. 2 very schematically illustrates the alternative photograph of the projection exposure apparatus between intermediate focal plane and object plane The beam path of bright optical unit；
Fig. 3 very schematically illustrates first point of the illumination optics unit of the projection exposure apparatus according to Fig. 1 or Fig. 2 First facet of face reflecting mirror, three the second facets of this illumination optics unit and the object field illuminated by illumination optics unit, Wherein for three different obliquities of the first facet, and therefore for having the distribution respectively between the first facet and object field The second facet three corresponding selections object field illuminate channel, illustrate from the first facet three selected locations advance Beam path.
Specific embodiment
Fig. 1 schematically shows the projection exposure apparatus 1 of micro-lithography in meridional section.Projection exposure apparatus 1 includes Light source or irradiation bomb 2.The lighting system 3 of projection exposure apparatus 1 has for exposing the photograph being overlapped with the object field 5 in object plane 6 The illumination optics unit 4 of light field.Illuminated field can also be greater than object field 5.In the case, the mask being arranged in object field 5 is exposed The object of 7 form of mother matrix passes through object or the fixed reticle of reticle retainer 8.Reticle 7 is also referred to as photoetching Mask.By ohject displacement driver 9, object holder 8 is movable along direction of displacement.Projection optical unit 10 is used for By the imaging of object field 5 to as in the image field 11 in plane 12.Structure imaging on reticle 7 is to being arranged in as the picture in plane 12 On the photosensitive layer of chip 13 in the region of field 11.Fixed wafer 13 (is equally not shown) by wafer holders 14.Pass through crystalline substance For piece displacement driver 15 in a manner of synchronous with object holder 8, wafer holders 14 are equally movable along direction of displacement 's.
Irradiation bomb 2 is the EUV irradiation bomb of the use radiation with the transmitting in 5nm into the range between 30nm.This can Think plasma source, such as (plasma that the gas discharge generates) source GDPP or LPP (laser-produced plasma) source. Radiation source based on synchrotron or free electron laser (FEL) can be used for radiation source 2.Those skilled in the art's energy It is enough to find the information about such radiation source from such as 6,859,515 B2 of US.The EUV radiation 16 issued from radiation source 2 is logical Cross the focusing of optical collector (collector) 17.Known to corresponding optical collector from 1225481 A of EP.In the downstream of optical collector 17, EUV Radiation 16 propagates across intermediate focal plane 18 before being incident in field facet mirror 19.Field facet mirror 19 is illumination light Learn the first facet reflecting mirror of unit 4.Field facet mirror 19 includes multiple facets 20 (see Fig. 2), is not shown in Fig. 1 Out.Field facet 20 is embodied as monolithic facet.To which the reflecting surface of each of field facet 20 is completely, especially not carefully It is divided into multiple individual small reflectors.
Field facet mirror 19 is arranged in the plane about 6 optical conjugate of object plane of illumination optics unit 4.
EUV radiation 16 is hereinafter also referred to as illumination light or imaging.
In the downstream of field facet mirror 19, EUV radiation 16 is reflected by pupil facet reflecting mirror 21.The reflection of pupil facet Mirror 21 is the second facet reflecting mirror of illumination optics unit 4.Pupil facet reflecting mirror 21 be arranged in illumination optics unit 4 about Intermediate focal plane 18 and the pupil plane optical conjugate about projection optical unit 10 or the pupil that is overlapped with the pupil plane In plane.Pupil facet reflecting mirror 21 includes multiple pupil facets 22 (see Fig. 2), not shown in FIG. 1.By means of pupil point The pupil facet of face reflecting mirror 21 and imaging optics downstream, are imaged onto object for the field facet 20 of field facet mirror 19 In field 5, the form of imaging optics is the transmission of the reflecting mirror referred to the sequence by beam path by 24,25 and 26 Optical unit 23.The last reflecting mirror 26 for transmitting optical unit 23 is grazing incidence mirror (grazing incidence mirror).The original virtual image forming of object field that component 24 to 26 is used to be generated by respective pupil facet 22 is into object field.
In order to simplify the description of positional relationship, attached drawing depicts Cartesian xyz coordinate system system as object plane 6 and picture The world coordinates system of the description of the positional relationship of each component of projection exposure apparatus 1 between plane 12.In Fig. 1, x-axis is hung down It directly advances and enters wherein in the plane of attached drawing.In Fig. 1, y-axis is towards the right side and is parallel to object holder 8 and wafer holders 14 Direction of displacement advance.In Fig. 1, z-axis is advanced downward, i.e., perpendicular to object plane 6 and perpendicular to as plane 12.
X size on object field 5 or image field 11 is also appointed as field height.
Fig. 2 shows when using illumination optics unit 27, intermediate focal plane 18 and as the illumination light 16 between plane 5 Alternative guidance, illumination optics unit 27 are the substitution of illumination optics unit 4, and can be used in projection exposure apparatus 1.It is non- What is be often schematically illustrated is the beam path of the illumination light 3 between intermediate image plane 18 and object plane 6.Corresponding to light optics The component of the illumination optics unit 27 of those of unit 4 component is referred to same reference numerals, and is no longer discussed in detail.With illumination Different in optical unit 4, pupil facet reflecting mirror 21 is the only component of the transmission optical unit 23 in illumination optics unit 27.
That is, the pupil facet 22 of the pupil facet reflecting mirror 21 of illumination optics unit 27 is by field facet mirror 19 Field facet directly (that is, in the case where the object field original image not plugged) be imaged in a manner of overlapping each other into object field 5. In the case where illumination optics unit 27, pupil facet reflecting mirror 21 is set up directly on the pupil of subsequent projection optical unit 10 In plane.
In the case where reflection at field facet mirror 19, due to the reflection at multiple facets 20, illumination light 16 Total light beam is divided into corresponding multiple illumination light segment beams.The light distributed respectively is guided by field facet 20 and by the reflected beams The predetermined object field of pupil facet 22 illuminates channel 28 (see Fig. 3).Via the illumination channel 28, entire object field 5 is in each case It can be illuminated by illumination light 16.Proper what a facet 20 and what a proper pupil facet 22 are distributed in object field illumination channel 28 Each.
By means of the tilt drive 29 schematically indicated in Fig. 3, each of field facet 20 each obliquity it Between relocatable.These obliquities are different, the embodiment depending on illumination optics unit 4,27.This can be related to two, three A, four, five or even larger number of facets 20 obliquity.The field facet 20 of field facet mirror 19 can also be with It is reoriented to different number of obliquity.Finally, at least some of field facet 20 may be not tiltable.Field facet is anti- Penetrate mirror 19 with can not the region of inclined field facet 20 can generally have one piece embodiment.
Fig. 3 very schematically illustrates the illumination light for one a total of three obliquity in field facet 20 The independent light 16 of selectioniGuidance, Fig. 3 left side illustrate.Just what a object field illuminates channel 281、282、283With it is proper The pupil facet 22 of what a distribution1、222、223Belong to each of these three obliquities.
Field facet 20 can have rectangle or curved embodiment.Pupil facet 22 can have round, square, rectangle Or hexagonal embodiment.Both field facet 20 and pupil facet 22 are shown in the plan view of Fig. 3, do not consider a facet 20 Different obliquities.
Object field 5 is shown in the right side of Fig. 3.Three pupil facets 221To 223It illustrates between facet 20 and object field 5 on the scene.Three A pupil facet 221To 223It is not actual proportions and significantly in Fig. 3 with the distance between field facet 20 and next object field 5 first It reduces.
In addition, Fig. 3, which is illustrated, illuminates channel 28 for each object field1To 283Pupil facet 221To 223Between object field 5 Each independent light 16iBeam path continuity.
Independent light 16 between field facet 20 and object field 5iGuidance schematic illustration in assume illumination optics unit The illumination optics unit of 27 types, wherein pupil facet 22 images directly to respective field facet 20 in object field 5.Alternative Illumination optics unit 4 in, still will be present light beam guidance, light beam guide via each pupil facet 22iIt is independent between object field 5 Light 16iBeam path in transmission optical unit 23 other reflecting mirrors.
Field facet 20 is used for imaging source object, in the illustrated embodiment, in intermediate focal plane 18 (see Fig. 1) Between focus 30 be imaged as being separately positioned on pupil facet 22iOn certain amount light source as 31i, the number pair of the light source picture Channel 28 should be illuminated in object fieldiNumber.As can be seen from Figure 3, respective object field illumination channel 28 is distributed toiLight source As 31iIt is subdivided into different light source parts pictureEach pupil facet 22 is indicated by dotted line image outline in Fig. 3iOn it is respective Total light source is as 31i, wherein inscribed (inscribe) light source part picture
The independent light 16 of selection in Fig. 3 through illumination light elaborates light source as 31iTo light source part pictureShould Subdivision, the light rise in three field that is different, being spaced each other facet part A of facet 201、A2And A3.Below Use facet part A1、A2And A3To explain light source as 31iSubdivision.From field facet part A1、A2And A3Illumination Light beam path, the beam of illumination light path meet specific image-forming condition respectively, will be explained below.It is random in the example shown Select respective field facet part AiSegment boundary, and be continuously merged into remaining facet 20.
About x coordinate, first facet part A1It is arranged in the left-hand side one third of facet 20 on the scene.About x coordinate, Second facet part A2It is arranged in the intermediate one third of facet 20 on the scene.About x coordinate, third field facet part A3Setting In the right-hand side one third of facet 20 on the scene.Three fields facet part A1、A2And A3It does not overlap each other.
Depending on the obliquity of field facet 20, first facet part A is derived from1Independent light 16 by light source part As B1 iIt is incident upon respective pupil facet 22iOn.Corresponding statement is suitable for deriving from second facet part A2With third field Facet part A3And projection source part is as B2 iAnd B3 iIndependent light 16.In each case, light source part pictureRespective Pupil facet 22iOn do not overlap each other.To adjacent light source part pictureThe distance between be greater than light source part picture's Average diameter.
As shown in figure 3, for the various pupil facets 22 for distributing to proper what a facet 20 by obliquityi, light source Part pictureIn pupil facet 22iOn arrangement can be different.
Upper pupil facet 22 in Fig. 31On, by three fields facet part A in the first obliquity of field facet 201、 A2And A3Shock generate light source part as B1 1、B1 2And B1 3Under each other, that is, the phase with sufficient approximation Same x coordinate.In central pupil facet 222On, corresponding three light source portions for being generated in the second obliquity of facet 20 on the scene Divide as B2 1、B2 2And B2 3It is distributed along oblique string-like.In lower pupil facet 223On, the third of facet 20 on the scene tilts position Three light source parts of middle generation are set as B3 1、B3 2、B3 3It is distributed along approximate C-shaped path string-like.
Field facet part A in object field 5iPicture part CiCorrespond to the field facet part in field facet 20 in object field 5 AiArrangement position at.Particularly, for its size and position, as part CiWith inclining for the selection of field facet mirror 20 Loxosis is set unrelated.Here, in each case about x coordinate (that is, field height), as part C1Positioned at the left-hand side of object field 5 three In/mono-, as part C2In the central one third of object field 5, and as part C3Positioned at object field 5 right-hand side three/ In one.
Usually it is applicable that, respective pupil facet 22iOn light source part pictureIt can be along crooked route cloth It sets.
To make pupil facet 22iEnsure via light source part pictureRespective impingement region by facet part AjImaging To as part CjOn, pupil facet 22iWith curvature, curvature is in respective pupil facet 22iReflecting surface x range on and/ Or change at least 10% in y range.
To make from each field facet part AjIndependent light 16 is directed to each light source part pictureOn, field facet 20 it is anti- Reflective surface have can approximate description be distorted elliptical shape, be correspondingly offset from conic section, especially deviation oval surface.? In the alternative embodiment of the reflecting surface of field facet 20, these can be using approximate description as twisted torus.Herein, it distorts (distorted elliptical/twisted torus) is interpreted as bird caging of the respective 3D shape about axis, and the amplitude of this bird caging depends on In the position along twisted spindle, especially in a manner of approximately linear.
In order to which relevant object field is illuminated channel 28iField facet 20 midpoint (that is, central facet part A2) be imaged to object The midpoint of field is (that is, center is as part C2) (in the case where illumination optics unit 4, the object field that be extremely imaged onto object field 5 is imaged The midpoint of original image), for pupil facet 22iIt is applicable, pupil facet 22iAverage curvature and nominal ρ0Deviation is extremely Few 10%.
It is suitable for this nominal ρ below0:
ρ0=1/2 [1/a+1/b]
Here, a is central facet part A2The distance between pupil facet 22, and b is pupil facet 22 and object field 5 Center portion C2The distance between.
Whole field facets 20 are not necessarily suitable above in conjunction with Fig. 3 image-forming condition explained, and are also not necessarily suitable Whole pupil facets 22.
Due to by light source as 31iIt is subdivided into light source part pictureThe option for generating optical aberration correction, generates the option It is the object field illumination channel 28 because in illumination optics unit 4 or 27iThe three-dimensional ranges of difference.Field facet is generated in object field 5 The precise overlay of 20 picture is applicable in it above in conjunction with the image-forming condition that Fig. 3 is explained.
By means of initially being set by means of setting method explained above during the projection of projection exposure apparatus 1 exposure Illumination geometry.Then, at least part in the reticle 7 in object field 5 is imaged on the chip 13 in image field 11 On region on photosensitive layer, the photoetching process for micro-structural or nano-structured component is manufactured, especially semiconductor component, example As the photoetching process of microchip manufactures.In the case, in operation of scanner, in y-direction continuously with synchronization on the time The mobile reticle 7 of mode and chip 13.

Claims (13)

1. a kind of illumination optics unit of EUV projection lithography is used for illumination light from light source along beam of illumination light Route guiding To object field, wherein the object to be imaged can be arranged, the illumination optics unit includes:
- the first facet reflecting mirror, the first facet reflecting mirror include multiple first facets, and first facet is monolithic, Reflection guidance of the multiple first facet for the segment beam of the light beam of the illumination light,
The first facet described in the beam of illumination light path is arranged in-the second facet reflecting mirror, the second facet reflecting mirror The downstream of reflecting mirror, and including multiple second facets, the multiple second facet is used for as described in first facet reflection The reflection of segment beam guides, so that in first facet and second facet that pass through the reflected beams guidance distribution extremely It is few it is some come predetermined object field illuminate channel, channel is illuminated by the object field, the entire object field is in every case by described Illumination light can illuminate, wherein what a proper the first facet and what a proper the second facet are distributed to the object in every case Field illumination channel,
Wherein first facet is embodied as to be imaged to setting for the light source object of the light source or downstream intermediate focus described The light source picture of certain amount in second facet, the number correspond to the number in object field illumination channel,
Wherein at least some object fields illumination channel is applicable in, the light source picture for distributing to respective object field illumination channel contains Have:
-- first light source part picture, first light source part picture is by distributing to described the of respective object field illumination channel First facet part of one facet generates,
-- at least one second light source part picture, at least one described second light source part picture is by distributing to the respective object field The the second facet part for illuminating first facet in channel generates, wherein first facet part and second facet portion Divide and do not overlap each other,
Distance between the center of wherein at least two light source part picture is greater than average the 1/ of described two light source parts picture e2Diameter.
2. illumination optics unit according to claim 1, it is characterised in that by the non-heavy of one in first facet The more than two light source part picture that folded facet part generates, wherein the distance between the picture of the light source part is greater than the light The average diameter of source part picture.
3. illumination optics unit according to claim 2, which is characterized in that along the crooked route in second facet Arrange more than two light source part picture.
4. illumination optics unit according to any one of claim 1 to 3, which is characterized in that second facet is implemented First facet for relevant object field is illuminated channel is imaged to the object field.
5. illumination optics unit according to any one of claim 1 to 3, which is characterized in that in second facet At least some to be applicable in below: the curvature of second facet changes at least 10% in the range of second facet.
6. illumination optics unit according to any one of claim 1 to 3, which is characterized in that in second facet It is at least some to be applicable in below: in order to be imaged at the midpoint of first facet in relevant object field illumination channel to the object field Midpoint will be imaged to the midpoint of the object field original image of the object field, and the average curvature of second facet is from nominal ρ0Partially From at least 10%.
7. illumination optics unit according to any one of claim 1 to 3, which is characterized in that field facet mirror conduct The first facet reflecting mirror.
8. illumination optics unit according to any one of claim 1 to 3, which is characterized in that first facet can incline Tiltedly, for making a reservation for various object field illuminations channel.
9. illumination optics unit according to any one of claim 1 to 3, which is characterized in that pupil facet reflecting mirror is made For the second facet reflecting mirror.
10. a kind of lighting system
Including according to claim 1 to any one of 9 illumination optics unit,
It include the object field being imaged to the projection optical unit of image field.
11. a kind of projection exposure apparatus
Including lighting system according to claim 10,
Including EUV light source,
It include the object holder that object is kept in the object field, the object holder is to pass through ohject displacement driver It is movable along direction of displacement,
It include the wafer holders that chip is kept in the image field, the wafer holders are to pass through crystal shift driver It is movable along the direction of displacement.
12. a kind of method of projection exposure, comprising the following steps:
Projection exposure apparatus according to claim 11 is provided,
Chip is provided,
Mask is provided,
By means of the projection optical unit of the projection exposure apparatus, at least part of the mask is projected into institute On the region for stating the photosensitive layer of chip.
13. a kind of micro-structural or nano-structured component, is manufactured by method according to claim 12.
CN201710195298.XA 2016-04-05 2017-03-28 The illumination optics unit of EUV projection lithography Active CN107272345B (en)

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