CN107254679A - It is a kind of to improve the process of low-temperature co-fired ceramic substrate solderability - Google Patents
It is a kind of to improve the process of low-temperature co-fired ceramic substrate solderability Download PDFInfo
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- CN107254679A CN107254679A CN201710451467.1A CN201710451467A CN107254679A CN 107254679 A CN107254679 A CN 107254679A CN 201710451467 A CN201710451467 A CN 201710451467A CN 107254679 A CN107254679 A CN 107254679A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
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Abstract
Improve the process of low-temperature co-fired ceramic substrate solderability the invention discloses a kind of, this method is cleaned using chromic acid solution, removes the grease and dirt of ltcc substrate metal film layer surface；After water thoroughly cleaning, soaked in alkaline solution, reduce the glass phase coverage rate of metal film layer surface, then with water thoroughly cleaning and drying.The wettability of metallic diaphragm and solder can be significantly improved using this method, it is obviously improved solderability, obtain good welding pulling force, the process will not deteriorate other indexs such as the weld strength of low-temperature co-fired ceramic substrate, gold wire bonding intensity simultaneously, the formula of LTCC material systems need not be adjusted, also the crystalline phase composition and substrate overall performance of ltcc substrate will not be changed, and it is simple to operate, can be well compatible with Conventional cryogenic common burning porcelain technique and welding procedure.
Description
Technical field
The invention belongs to low-temperature co-burning ceramic material technical field of surface, and in particular to one kind improves low temperature co-fired pottery
The process of porcelain substrate solderability, the wettability of metallic diaphragm and solder can be significantly improved using this method, hence it is evident that change
Kind solderability, obtains good welding pulling force, while the process will not deteriorate the other indexs of low-temperature co-fired ceramic substrate, and
It is simple to operate, it is well compatible with Conventional cryogenic common burning porcelain technique and welding procedure.
Background technology
LTCC (low temperature co-fired ceramics, hereinafter abbreviated as LTCC) is 1982
The new material technology of year Hughes Electronics's exploitation, is that low temperature co-fired structural ceramics powder is made into the accurate and fine and close green of thickness
Band, required circuit diagram is made on green band using techniques such as laser boring, micropore slip casting, accurate conductor paste printings
Shape, and multiple passive blocks (such as low capacitance electric capacity, resistance, wave filter, impedance transducer, coupler) are embedded to multi-layer ceramics
In substrate, then overlap together, internal and external electrode can sinter respectively using metals such as silver, copper, gold, three-dimensional is made at 900 DEG C
The non-interfering high-density circuit in space, may be made as the three-dimensional circuit substrate of built-in passive element, can be mounted on its surface
IC and active device, are made passive/active integrated functional module, can be further by circuit miniaturization and densification, especially
It is suitable for high frequency communications component.
With multi-functional, high density of integration, high-power growing, the functional unit based on LTCC to radiating efficiency,
Consistency of performance, global reliability also show higher and higher requirement, therefore increasing Service Environment is proposed to LTCC
The requirement of highly reliable welding.
Determining the principal element of ltcc substrate welding effect has two, and one is the film layer attachment of metallic diaphragm and ltcc substrate
Power, two be the wettability of metallic diaphragm and solder.The former is adjusted by each LTCC raw material production firm by the formula of system
Match somebody with somebody, can stablize, well realize.Composition composition of the latter due to LTCC metallic diaphragms, glass in itself is deposited in a large amount of of surface
Make it that the solder wettability of metallic diaphragm and solder is not good enough, influenceing welding effect, be recognized problem in the industry.
Bright dragon of Liu et al. (the solderable Journal of Sex Research of LTCC surface metalations,《Electronics and encapsulation》, 2013,13 (3)：13-23)
LTCC surface metal film layers are modified by electric plating method, are respectively increased by electroplating Cu/Ni/Au and Cu/Ni/Sn
To the solderability of Pb-Sn, Au-Sn, In-Sn solder.But this method needs complicated electroplating technology, technological process is long and right
The wiring of ltcc substrate produces limitation.King from perfume (or spice) et al. (silver paste LTCC plate gold base engineering Application Research,《Electric mechanical work
Journey》, 2015,1 (3)：Electroless Plating Ni/Pd/Au research 45-49) has been carried out to ltcc substrate, has improved solderability, but this method
Still need longer technological process.Yan Rong et al. (LTCC freeze altogether disk weldability research,《Solid State Electronics is ground
Study carefully and be in progress》,2015(4)：398-402) method that reduction sintering temperature suppression glass is separated out improves metallic diaphragm solderability,
But this method is possible to change the crystalline phase tissue of ltcc substrate, causes substrate overall performance to change, or cause other types of gold
Category film layer occurs sintering or matches sex chromosome mosaicism with substrate, there is greater risk.Jiang Chengjun et al. (starch silver conductor by paste composition
Expect the influence of performance,《Special Processes of Metal Castings and non-ferrous alloy》,2008,28(10):It 804-806) have studied Ag particles in conductor film layer
Influence to solderability, but still in single factor test conceptual phase, have relatively large distance from engineering application, and this method may cause
Whole LTCC material systems formula adjustment, cost is higher, and for substrate, process unit is relatively difficult to achieve.
The content of the invention
For above-mentioned technical problem, it is an object of the invention to provide one kind is simple to operate, and with conventional LTCC techniques and
The process of the compatible improvement metallic diaphragm solderability of welding procedure, to solve the problem of ltcc substrate solderability is poor.
The above-mentioned purpose of the present invention is achieved through the following technical solutions：
It is a kind of to improve the process of low-temperature co-fired ceramic substrate solderability, including ltcc substrate metallic diaphragm is carried out rotten
Erosion is modified.By reducing the glass phase coverage rate of film surface, film layer and the solder wettability of solder are improved.
The process of above-mentioned improvement low-temperature co-fired ceramic substrate solderability, the progress corrosion modification includes：
1) cleaned using chromic acid solution, remove the grease and dirt of ltcc substrate metal film layer surface；
2) soaked in alkaline solution, reduce the glass phase coverage rate of metal film layer surface.
According to the preferred embodiment of the invention, step 1) solvent of the chromic acid solution is deionized water or pure water, water with
The ratio for the concentrated sulfuric acid that concentration is 95~98% is 1:1~1:4, the mass concentration of potassium bichromate is 1%~4%.
The step 1) using chromic acid solution cleaning, the grease and dirt for removing ltcc substrate metal film layer surface are by table
Ltcc substrate of the face with welding metal film layer is immersed in 2~5min in chromic acid solution, and solution temperature is 35 DEG C~60 DEG C, preferably
For 40~50 DEG C.
Step 2) alkaline solution be mass concentration 1%~10% NaOH solution, solvent be deionized water or pure water.
The step 2) soaked in alkaline solution, reduction metal film layer surface glass phase coverage rate refer to by
Ltcc substrate is immersed in 6~15min in NaOH solution, and solution temperature is 40 DEG C~60 DEG C.
Further, the process of above-mentioned improvement low-temperature co-fired ceramic substrate solderability, is additionally included in step 1) use afterwards
Water thoroughly cleaning ltcc substrate is used further to step 2).
Further, the process of above-mentioned improvement low-temperature co-fired ceramic substrate solderability, is additionally included in step 2) use afterwards
Water thoroughly cleaning ltcc substrate is dried again.
Further, above-mentioned drying refers to blow away ltcc substrate surface moisture film with air gun, is then put into ltcc substrate
60~80 DEG C of baking ovens are dried.
The present inventor has found by lot of experiments, passes through the technique side that above-mentioned steps are simple, operation is succinct
Method, which just can reach, improves the purpose of low-temperature co-fired ceramic substrate solderability, omits the cumbersome and complicated journeys such as plating, chemical plating
Sequence；More importantly method and existing LTCC techniques and welding procedure compatibility of the invention are good, it is not necessary to adjust LTCC materials
The formula of material system, will not also change the crystalline phase composition and substrate overall performance of ltcc substrate, be obtained significantly improving solderability
While good welds pulling force, the process will not deteriorate the other indexs of low-temperature co-fired ceramic substrate, in ltcc substrate manufacture
Field has general applicability.
Brief description of the drawings
Fig. 1 corrodes modified technique flow chart for the ltcc substrate metallic diaphragm of embodiment 1；
Fig. 2 is the solderability experiment test comparison diagram of embodiment 2；
Fig. 3 is the weld strength test experiments result figure of embodiment 3；
Fig. 4 is the gold wire bonding strength test experimental result picture of embodiment 4.
Embodiment
For the content of the invention of the clearer explanation present invention, reconciliation is illustrated to the present invention by the following examples
Release, it is to be understood that, this is the present invention preferably embodiment, and the scope of above-mentioned theme of the invention is not limited in following
Example, all technologies realized based on the above of the present invention belong to the scope of protection of the invention.To being not known in embodiment
The condition or method of explanation, are carried out in the way of this area is conventional.
Embodiment 1 improves the experiment of ltcc substrate solderability
1) the A6M systems using Ferro companies make ltcc substrate with conventional LTCC techniques, mode are burnt after as raw material
Tin-lead welding metallic diaphragm is made, film layer main component is Au/Pt/Pd and glass, and material trademark is FX31-014 and FX31-
017, film layer gross thickness is 28 μm~32 μm after sintering.
2) substrate that welding metal film layer is made in 1) is immersed in chromic acid solution and cleaned, as shown in P1, chromium
Acid proportioning is goes from water (or pure water) 250ml, 98% concentrated sulfuric acid 750ml, potassium bichromate 20g, and soaking temperature is 45 ± 5 DEG C, leaching
The bubble time is 4min.
3) ltcc substrate for finishing chrome pickle in 2) is spent fully rinses from water (or pure water), as shown in P2, cleaning
Time is not less than 1min.
4) ltcc substrate rinsed well in 3) is immersed in the NaOH solution that mass concentration is 4%, while passing through magnetic
The mode of power stirring is stirred to solution, and soaking temperature is 50 ± 2 DEG C, and soak time is 10min, to remove film surface
Glass phase, as shown in P3.
5) ltcc substrate that 4) middle corrosion is finished fully is rinsed with deionized water (or pure water), scavenging period is not less than
1min, as shown in P4.
6) the ltcc substrate compressed air or compressed nitrogen that clean up in 5) are purged clean, and it is abundant to be put into baking oven
Dry, drying temperature is 70 DEG C, and drying time is not less than 30min, as shown in P5.
7) the dry ltcc substrate finished is packed, be put in storage.
The solderability test experiments of embodiment 2
Solderability test is carried out to technique exemplar in embodiment 1, method of testing is with reference to GB-T 17473.7-2008, solder
For Sn63-Pb37,235 ± 5 DEG C of tin pot temperature, 5 ± 1S of weld interval, more than 2mm under liquid level, come in and go out 25 ± 5mm/S of speed, knot
Fruit is as shown in Figure 2.
Left figure is the ltcc substrate exemplar without the processing of present invention process method in Fig. 2, it can be seen that metallic diaphragm and Sn-
Pb solder wettabilities are poor, and solder can not be paved with pad.Right figure is the ltcc substrate by the processing of present invention process method in Fig. 2
Exemplar, it can be seen that metallic diaphragm is good with Sn-Pb solder wettabilities, and Solder Spread is uniform.
The weld strength test experiments of embodiment 3
Weld strength test experiments are carried out to technique exemplar in embodiment 1, method of testing is with reference to national standard GB-T 17473.4-
2008, solder is Sn63-Pb37, and technique exemplar is as shown in figure 3, test result is as shown in table 1.
The welding tensile test result of table 1 (Kg)
The gold wire bonding strength test of embodiment 4 is tested
Test corroding influence of the modified technique to the gold wire bonding intensity of layer gold in embodiment 1, test material board
Number be 30-080M, bonding gold wire be 25 μm, method of testing is as shown in figure 4, spun gold two ends are welded in the way of ultrasonic thermocompression is bonded
Layer gold surface is connected on, spun gold is formed certain sagitta, then vertical lifting upwards in the middle of spun gold is hooked using tension tester, it is right
Gold wire bonding intensity carries out destructive testing, as a result as shown in table 2, and wherein R is the reference group without the processing of embodiment 1, and T is
The test group handled by embodiment 1.Test result contrast is not as can be seen that the technical process deteriorates the spun gold key of golden membranous layer
Intensity is closed, is slightly improved on the contrary, preferable bonding effect is obtained.
The gold wire bonding strength test (g) of table 2
In summary, the invention provides a kind of method for being effectively improved LTCC metallic diaphragm solderabilities, and to through this
The treated LTCC of inventive method carries out test assessment in terms of solderability, weld strength, gold wire bonding intensity, it was demonstrated that the present invention
Process can be obviously improved the solderability of LTCC metallic diaphragms, and weld strength disclosure satisfy that national standard and application requirement,
This method will not deteriorate other technic indexs simultaneously, and substrate body and metallic diaphragm attachment state are good, and gold wire bonding intensity is good
It is good, it is with a wide range of applications in LTCC manufactures field.
Claims (10)
- Improve the process of low-temperature co-fired ceramic substrate solderability 1. a kind of, including ltcc substrate metallic diaphragm is corroded It is modified.
- 2. according to claim 1 improve the process of low-temperature co-fired ceramic substrate solderability, it is characterised in that described Carrying out corrosion modification includes：1) cleaned using chromic acid solution, remove the grease and dirt of ltcc substrate metal film layer surface；2) soaked in alkaline solution, reduce the glass phase coverage rate of metal film layer surface.
- 3. according to claim 2 improve the process of low-temperature co-fired ceramic substrate solderability, it is characterised in that step 1) solvent of the chromic acid solution is deionized water or pure water, and the ratio for the concentrated sulfuric acid that water and concentration are 95~98% is 1:1~ 1:4, the mass concentration of potassium bichromate is 1%~4%.
- 4. according to claim 2 improve the process of low-temperature co-fired ceramic substrate solderability, it is characterised in that described Step 1) using chromic acid solution cleaning, the grease and dirt for removing ltcc substrate metal film layer surface are with welding gold by surface The ltcc substrate of category film layer is immersed in 2~5min in chromic acid solution, and solution temperature is 35 DEG C~60 DEG C
- 5. according to claim 4 improve the process of low-temperature co-fired ceramic substrate solderability, it is characterised in that described Solution temperature is 40~50 DEG C.
- 6. according to claim 2 improve the process of low-temperature co-fired ceramic substrate solderability, it is characterised in that step 2) alkaline solution is the NaOH solution of mass concentration 1%~10%, and solvent is deionized water or pure water.
- 7. according to claim 2 improve the process of low-temperature co-fired ceramic substrate solderability, it is characterised in that described Step 2) to be soaked in alkaline solution, the glass phase coverage rate of reduction metal film layer surface refers to ltcc substrate being immersed in 6~15min in NaOH solution, solution temperature is 40 DEG C~60 DEG C.
- 8. according to claim 2 improve the process of low-temperature co-fired ceramic substrate solderability, it is characterised in that also wraps Include in step 1) after be used further to step 2 with water thoroughly cleaning ltcc substrate).
- 9. according to claim 2 improve the process of low-temperature co-fired ceramic substrate solderability, it is characterised in that also wraps Include in step 2) after be dried again with water thoroughly cleaning ltcc substrate.
- 10. according to claim 9 improve the process of low-temperature co-fired ceramic substrate solderability, it is characterised in that institute State drying to refer to blow away ltcc substrate surface moisture film with air gun, ltcc substrate then is put into 60~80 DEG C of baking ovens is dried.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113260146A (en) * | 2021-04-26 | 2021-08-13 | 中国电子科技集团公司第四十三研究所 | LTCC substrate and manufacturing method thereof |
| CN115611652A (en) * | 2022-11-10 | 2023-01-17 | 华东光电集成器件研究所 | Process method for improving welding performance of LTCC conductor |
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| CN104195556A (en) * | 2014-09-17 | 2014-12-10 | 中国电子科技集团公司第五十四研究所 | Wet-method nickel etching solution |
| CN104442057A (en) * | 2013-09-23 | 2015-03-25 | 张益诚 | Method of forming metallization patterns by inkjet printing and molded interconnect assembly therefor |
| CN105200400A (en) * | 2015-09-18 | 2015-12-30 | 中国电子科技集团公司第三十八研究所 | Method for secondary metalized nickel plating on surface of high-temperature co-fired ceramics |
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2017
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Patent Citations (4)
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| CN101451240A (en) * | 2007-11-28 | 2009-06-10 | 中国科学院金属研究所 | Method for improving ferro-nickel alloy plating weldability |
| CN104442057A (en) * | 2013-09-23 | 2015-03-25 | 张益诚 | Method of forming metallization patterns by inkjet printing and molded interconnect assembly therefor |
| CN104195556A (en) * | 2014-09-17 | 2014-12-10 | 中国电子科技集团公司第五十四研究所 | Wet-method nickel etching solution |
| CN105200400A (en) * | 2015-09-18 | 2015-12-30 | 中国电子科技集团公司第三十八研究所 | Method for secondary metalized nickel plating on surface of high-temperature co-fired ceramics |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113260146A (en) * | 2021-04-26 | 2021-08-13 | 中国电子科技集团公司第四十三研究所 | LTCC substrate and manufacturing method thereof |
| CN115611652A (en) * | 2022-11-10 | 2023-01-17 | 华东光电集成器件研究所 | Process method for improving welding performance of LTCC conductor |
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