CN107247225A - A kind of calibration method tested based on ATE radio frequencies CP - Google Patents
A kind of calibration method tested based on ATE radio frequencies CP Download PDFInfo
- Publication number
- CN107247225A CN107247225A CN201710444970.4A CN201710444970A CN107247225A CN 107247225 A CN107247225 A CN 107247225A CN 201710444970 A CN201710444970 A CN 201710444970A CN 107247225 A CN107247225 A CN 107247225A
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- Prior art keywords
- test
- ate
- tested based
- radio frequencies
- radio frequency
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
- G01R31/2834—Automated test systems [ATE]; using microprocessors or computers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
- G01R35/005—Calibrating; Standards or reference devices, e.g. voltage or resistance standards, "golden" references
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The invention discloses a kind of calibration method tested based on ATE radio frequencies CP, in radio frequency chip flow, making auxiliary goes embedding structure as standard component on disk.Auxiliary goes embedding structure to include three kinds of structures：Open a way (open), short-circuit (short), transmission line (thru).Embedding structural requirement is gone to correspond to the position of the radio frequency pin of measured device；The collimation technique tested based on ATE radio frequencies CP that the present invention is provided, embedding structure is gone by auxiliary so that the test error that test system impedance mismatch is brought is eliminated in the CP test process of radio frequency products.It is final to improve test yield so as to obtain more accurately test result, save testing cost.
Description
Technical field
This technology invention is that one kind is directed to radio frequency class product when carrying out CP tests using ATE (ATE), right
A kind of its method calibrated.
Background technology
It is well known that needed during radio signal transmission transmission line can fully impedance matching, could so reduce signal
Reflection.But ATE is when testing CP radio frequency productses, the radiofrequency signal sent by test machine can by test adaptor plate,
Probe card is transferred to chip input, in the process, the signal source inside test machine to signal output port, pinboard and
Cabling impedance matching in probe card is undesirable, connection, pinboard and the probe card of pinboard and test machine signal output port
Connection, there is parasitic capacitor and inductor in probe contact with chip pin (pad), these necessarily cause radiofrequency signal can not
Intact impedance matching, signal reflects in transmitting procedure, and the signal for eventually arriving at chip pin has damage on power
Consume, and the delay in sequential etc..Equally, the signal of radio frequency chip output also needs just be sent to by probe card and pinboard
Test machine is analyzed, and the impedance mismatch of transmission line will also result in us and cannot get real output result.This impedance
Mismatch and carry out error to our calibration tape, but once product test hardware configuration, fixed, this error can exactly indicate and can
Repeat, can be in test process by calibrating elimination so as to quantitative description.
The present invention proposes a kind of occurrence first tested standard component, record measurement system error, Ran Houtong
Cross the method for calculating and processing being modified to chip under test test result.The method can eliminate the mistake in radio frequency products CP tests
Difference.
The content of the invention
The present invention for solve the technical scheme that uses of above-mentioned technical problem be to provide it is a kind of based on ATE radio frequencies CP tests
Calibration method, wherein, concrete technical scheme is：
The present invention proposes what a kind of influence caused in volume production test to test system impedance mismatch was calibrated
Method, step includes：
In radio frequency chip flow, making auxiliary goes embedding structure as standard component on disk.Auxiliary goes embedding structure to include
Three kinds of structures：Open a way (open), short-circuit (short), transmission line (thru).Embedding structural requirement is gone to correspond to the radio frequency of measured device
The position of pin.
Further, S parameter is carried out in the frequency band that measured device works to standard component using ATE test resources passage
Test.
Further, record the concrete numerical value by the way that obtained test system error is tested standard component, and data are literary
Part is stored in inside test system.
Further, the standard component test data stored before is called, the ATE of measured device is surveyed by certain algorithm
The result of test system is modified processing, eliminates wherein error percentage, obtains measured device actual value.
The present invention has the advantages that relative to prior art：The present invention proposes a kind of collimation technique, by auxiliary
Help embedding structure so that the test error that test system impedance mismatch is brought is eliminated in the CP test process of radio frequency products.
It is final to improve test yield so as to obtain more accurately test result, save testing cost.
Brief description of the drawings
Fig. 1 removes the schematic diagram of embedding structure for auxiliary.
Fig. 2 removes the schematic diagram of embedding result for auxiliary.
Fig. 3 is the schematic diagram of transmission line S parameter.
Fig. 4 is the schematic diagram of short-circuit S parameter.
Fig. 5 is the schematic diagram of open circuit S parameter.
Fig. 6 is the schematic diagram of 5nH_900MHz inductance S parameters.
Fig. 7 is the schematic diagram that 5nH_900MHz inductance goes embedding rear S parameter.
Embodiment
CP is tested：Wafer sort；
ATE：ATE, the test system combined by test machine and computer.
Usually require to use Network Analyzer during existing finished product (FT) radio frequency products test, Network Analyzer uses preceding
It need to accordingly be calibrated, be come inside compensating test instrument, the systematic error that cable and adapter are brought, it is existing at present corresponding ripe
Calibrating device and calibration method.But the test of the radio frequency products for wafer level, Network Analyzer does not support pin card probe
The scheme of partial calibration.And Network Analyzer is generally used for engineering test, it is not appropriate for volume production and uses.
When ATE test equipments test CP radio frequency productses, tester table can also be calibrated to radio frequency resource, but also can only school
Standard arrives test machine signal output port, can not then be calibrated for the transmission line after output port to chip pin.It is right
The error brought in this part, in existing test, we often just do not deal with, or use the result tested using FT to be used as ginseng
Examine, directly to offset, but this compensation is inaccurate, and radio frequency products has Frequency Response, i.e., at different frequencies, its
The performance of loss is also different, so also brings the compensation work of complexity.
Its principle of the current calibration of mature Network Analyzer is that the measurement record based on the S parameter to standard component is protected
Deposit, error term is compensated again during test.And existing radio frequency testing board also supports the test of S parameter.
The present invention proposes what a kind of influence caused in volume production test to test system impedance mismatch was calibrated
Method, step includes：
In radio frequency chip flow, making auxiliary goes embedding structure as standard component on disk.Auxiliary goes embedding structure to include
Three kinds of structures：Open a way (open), short-circuit (short), transmission line (thru) goes embedding structural requirement to correspond to the radio frequency of measured device
The position of pin.
Further, S parameter is carried out in the frequency band that measured device works to standard component using ATE test resources passage
Test.
Further, record the concrete numerical value by the way that obtained test system error is tested standard component, and data are literary
Part is stored in inside test system.
Further, the standard component test data stored before is called, the ATE of measured device is surveyed by certain algorithm
The result of test system is modified processing, eliminates wherein error percentage, obtains measured device actual value.
Now the application of the present invention in the test of a chip volume production is described in detail for embodiment：
Embodiment one：
This example is implemented in the test to inductance, by the test to inductance S parameter, by the measurable inductance of computing
Inductance value and Q values.
1) mark included in the wafer in 9 kinds of inductance, figure indicates its inductance value and working frequency respectively, with 5nH_
Exemplified by 900MHz, the design inductance value for representing inductance is 5nH, and working frequency is 900MHz.In wafer manufacturing, we make with
The corresponding standard component of Inductive position goes embedding result as auxiliary：Transmission line, short circuit, open circuit.
2) test system is before to inductance measurement, and probe card is first pricked on standard component, and auxiliary is measured respectively and goes embedding structure
Transmission line, open circuit, the S parameter of short circuit, and preserve test data file.
3) test system tests the S parameter of this 9 kinds of inductance respectively.Below figure is by taking 5nH_900MHz inductance as an example.
4) test data file of standard component before calling, the S parameter of the inductance after De- embedding is obtained by calculating.It is as follows
By taking 5nH_900MHz inductance as an example.
5) calculated by the extraction to S parameter, obtain the inductance value and Q values of inductance.
From test result it can be seen that：Standard component, which is made, as auxiliary on wafer during flow goes embedding structure, it is embedding by going
Processing, can accurately measure the characterisitic parameter of inductance.
When being tested for CP radio frequency productses, the impedance mismatch of ATE test measurement circuitry causes test result to be forbidden
Really, test failure is caused.It is proposed by the present invention it is a kind of can eliminate the collimation technique of ATE measurement circuitry systematic errors, so as to
To more accurate more reliable test result.
Although the present invention is disclosed as above with preferred embodiment, so it is not limited to the present invention, any this area skill
Art personnel, without departing from the spirit and scope of the present invention, when a little modification can be made and perfect, therefore the protection model of the present invention
Enclose when by being defined that claims are defined.
Claims (7)
1. a kind of calibration method tested based on ATE radio frequencies CP, it is characterised in that：In radio frequency chip flow, made on disk
Embedding structure is gone as standard component as auxiliary.
2. the collimation technique as claimed in claim 1 tested based on ATE radio frequencies CP, it is characterised in that：Auxiliary removes embedding structure bag
Containing three kinds of structures：Open circuit, short circuit, transmission line.
3. the collimation technique as claimed in claim 2 tested based on ATE radio frequencies CP, it is characterised in that：Remove embedding structural requirement pair
Should be in the position of the radio frequency pin of measured device.
4. the collimation technique as claimed in claim 3 tested based on ATE radio frequencies CP, it is characterised in that：Utilize ATE test resources
Passage carries out the test of S parameter to standard component in the frequency band that measured device works.
5. the collimation technique as claimed in claim 4 tested based on ATE radio frequencies CP, it is characterised in that：Record is by standard
The concrete numerical value for the test system error that part test is obtained.
6. the collimation technique as claimed in claim 5 tested based on ATE radio frequencies CP, it is characterised in that：After record, by data text
Part is stored in inside test system.
7. the collimation technique as claimed in claim 6 tested based on ATE radio frequencies CP, it is characterised in that：Call what is stored before
Standard component test data, processing is modified to the result of the ATE test of measured device by algorithm, eliminates wherein error
Composition, obtains measured device actual value.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710444970.4A CN107247225A (en) | 2017-06-12 | 2017-06-12 | A kind of calibration method tested based on ATE radio frequencies CP |
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| CN201710444970.4A CN107247225A (en) | 2017-06-12 | 2017-06-12 | A kind of calibration method tested based on ATE radio frequencies CP |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108982972A (en) * | 2018-08-22 | 2018-12-11 | 西安飞芯电子科技有限公司 | A kind of micro- inductance measurement method and apparatus |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102062834A (en) * | 2009-11-12 | 2011-05-18 | 上海华虹Nec电子有限公司 | Radio frequency (RF) test method for semiconductor RF device |
| CN102313862A (en) * | 2010-07-08 | 2012-01-11 | 上海华虹Nec电子有限公司 | De-embedding method for on-wafer four-port radio frequency device during radio frequency test |
| CN102543958A (en) * | 2010-12-08 | 2012-07-04 | 台湾积体电路制造股份有限公司 | De-embedding on-wafer devices |
| CN102903700A (en) * | 2011-07-28 | 2013-01-30 | 上海华虹Nec电子有限公司 | Radio-frequency test pattern structure in scribing trench |
| CN103063999A (en) * | 2012-12-21 | 2013-04-24 | 上海宏力半导体制造有限公司 | De-embedding method |
| CN103839921A (en) * | 2012-11-26 | 2014-06-04 | 上海华虹宏力半导体制造有限公司 | Through si via radio frequency test structure and parasitic extracting method thereof |
| CN104569632A (en) * | 2013-10-16 | 2015-04-29 | 上海华虹宏力半导体制造有限公司 | Optimal noise coefficient testing method |
| CN105891628A (en) * | 2016-03-30 | 2016-08-24 | 清华大学 | Universal four-port on-wafer high-frequency de-embedding method |
-
2017
- 2017-06-12 CN CN201710444970.4A patent/CN107247225A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102062834A (en) * | 2009-11-12 | 2011-05-18 | 上海华虹Nec电子有限公司 | Radio frequency (RF) test method for semiconductor RF device |
| CN102313862A (en) * | 2010-07-08 | 2012-01-11 | 上海华虹Nec电子有限公司 | De-embedding method for on-wafer four-port radio frequency device during radio frequency test |
| CN102543958A (en) * | 2010-12-08 | 2012-07-04 | 台湾积体电路制造股份有限公司 | De-embedding on-wafer devices |
| CN102903700A (en) * | 2011-07-28 | 2013-01-30 | 上海华虹Nec电子有限公司 | Radio-frequency test pattern structure in scribing trench |
| CN103839921A (en) * | 2012-11-26 | 2014-06-04 | 上海华虹宏力半导体制造有限公司 | Through si via radio frequency test structure and parasitic extracting method thereof |
| CN103063999A (en) * | 2012-12-21 | 2013-04-24 | 上海宏力半导体制造有限公司 | De-embedding method |
| CN104569632A (en) * | 2013-10-16 | 2015-04-29 | 上海华虹宏力半导体制造有限公司 | Optimal noise coefficient testing method |
| CN105891628A (en) * | 2016-03-30 | 2016-08-24 | 清华大学 | Universal four-port on-wafer high-frequency de-embedding method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108982972A (en) * | 2018-08-22 | 2018-12-11 | 西安飞芯电子科技有限公司 | A kind of micro- inductance measurement method and apparatus |
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Application publication date: 20171013 |
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