CN107228989B - MEMS electric field sensor with insulating sealing structure - Google Patents
MEMS electric field sensor with insulating sealing structure Download PDFInfo
- Publication number
- CN107228989B CN107228989B CN201710555618.8A CN201710555618A CN107228989B CN 107228989 B CN107228989 B CN 107228989B CN 201710555618 A CN201710555618 A CN 201710555618A CN 107228989 B CN107228989 B CN 107228989B
- Authority
- CN
- China
- Prior art keywords
- electric field
- mems electric
- mems
- temperature
- cavity structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000005684 electric field Effects 0.000 title claims abstract description 99
- 238000007789 sealing Methods 0.000 title claims abstract description 27
- 238000005259 measurement Methods 0.000 claims abstract description 25
- 239000002184 metal Substances 0.000 claims description 32
- 238000001514 detection method Methods 0.000 claims description 21
- 238000012544 monitoring process Methods 0.000 claims description 16
- 230000001105 regulatory effect Effects 0.000 claims description 4
- 230000035945 sensitivity Effects 0.000 claims description 4
- 238000004364 calculation method Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
- 230000003993 interaction Effects 0.000 claims description 2
- 239000000565 sealant Substances 0.000 claims description 2
- 238000013461 design Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 230000006698 induction Effects 0.000 description 4
- 208000025274 Lightning injury Diseases 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 230000001788 irregular Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000005686 electrostatic field Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229920006335 epoxy glue Polymers 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R29/00—Arrangements for measuring or indicating electric quantities not covered by groups G01R19/00 - G01R27/00
- G01R29/12—Measuring electrostatic fields or voltage-potential
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geophysics And Detection Of Objects (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Abstract
A MEMS electric field sensor of an insulating sealing structure, comprising: an insulating sealing shell, wherein the inside of the insulating sealing shell is of a cavity structure; and the MEMS electric field measurement module is arranged in the cavity structure and is used for detecting an external electric field.
Description
Technical Field
The invention relates to the technical field of sensors, in particular to an MEMS electric field sensor with an insulating sealing structure.
Background
The atmospheric electric field monitoring and lightning early warning have important application requirements in the fields of aerospace, weather, electric power, petrochemical industry and the like. The aircraft may be subjected to natural lightning or induced lightning during the launch and lift-off process, causing direct damage or indirect damage thereto. Since the development of aerospace activity, people have suffered from serious accidents of lightning striking the aircraft for many times, and the loss is huge. The damage to the power grid caused by lightning stroke is serious, including line flashover, lightning stroke tripping, power transmission and transformation equipment fault, line unplanned outage and the like, and the safe operation and normal power supply behavior of the power grid are directly affected. The petrochemical enterprises need to store and use a large amount of inflammable substances in the production process, inflammable gas and dust are easy to generate, and once lightning stroke occurs, great economic loss and casualties can be caused. Therefore, by monitoring and analyzing the changes of the intensity, the polarity and the like of the atmospheric electric field, the changes of the atmospheric electric field which possibly cause lightning strike danger are identified, and early warning is carried out before the disaster comes, so that the method has very important significance for lightning protection and disaster reduction work.
The commercialized electrostatic field sensor at home and abroad basically adopts the traditional machining technology, has mechanical parts easy to wear, has some problems in the aspects of volume, power consumption, other performances and the like, and cannot be widely applied.
Disclosure of Invention
In view of the above technical problems, in order to overcome the defects in the prior art, the present invention provides a MEMS electric field sensor with an insulating sealing structure.
According to an aspect of the present invention, there is provided a MEMS electric field sensor of an insulating sealing structure, comprising: an insulating sealing shell, wherein the inside of the insulating sealing shell is of a cavity structure; and the MEMS electric field measurement module is arranged in the cavity structure and is used for detecting an external electric field.
According to an embodiment of the present invention, the MEMS electric field sensor, the MEMS electric field measurement module includes: the MEMS electric field sensitive chip is used for detecting an external electric field to generate an induced current signal; and the driving detection circuit unit is used for driving the MEMS electric field sensitive chip to work and detecting an induction current signal output by the MEMS electric field sensitive chip to realize the calculation of the detected electric field information.
According to the MEMS electric field sensor provided by the embodiment of the invention, the top of the package of the MEMS electric field sensitive chip is provided with the metal cover plate, and the MEMS electric field measurement module further comprises a metal detection polar plate which is electrically connected with the metal cover plate.
According to the MEMS electric field sensor provided by the embodiment of the invention, the insulating sealing shell comprises an upper shell and a lower shell, and the joint of the upper shell and the lower shell is sealed by adopting sealant and/or a sealing ring to form a sealed cavity structure.
According to one embodiment of the invention, the bottom of the lower shell is provided with a fixed column, and the fixed column fixedly supports the MEMS electric field measurement module accommodated in the cavity structure.
According to the MEMS electric field sensor of the embodiment of the invention, the inner surface of at least one of the upper shell and the lower shell is plated with a metal layer, and the metal layer is electrically connected with the metal detection polar plate or the metal cover plate.
According to the MEMS electric field sensor provided by the embodiment of the invention, the cavity structure is internally provided with the temperature and humidity monitoring control unit which is used for feeding back and/or adjusting the temperature around the MEMS electric field measuring module and monitoring the humidity change in the cavity structure.
According to an embodiment of the present invention, the temperature and humidity monitoring and controlling unit includes: a temperature sensor; a humidity sensor; an A/D converter, which is used for converting the detected analog signals into digital signals together with the temperature sensor and the humidity sensor; the central processing unit receives the digital signals sent by the A/D converter and sends control signals and/or alarm signals; a temperature adjusting device for adjusting the temperature in the cavity structure based on the control signal; and the alarm device reminds the sealing state of the MEMS electric field sensor based on the alarm signal.
According to an embodiment of the invention, the temperature regulating device comprises a heating device.
According to the MEMS electric field sensor provided by the embodiment of the invention, the lower shell is provided with the through hole, the through hole is used for penetrating the electric wire for supplying power or exchanging signals to the MEMS electric field measuring module, and the through hole is sealed after the electric wire is penetrated.
From the above technical scheme, the invention has the following beneficial effects:
The MEMS electric field sensitive chip technology with low power consumption is adopted, mechanical parts which are easy to wear by a motor are not needed, the power consumption is reduced, the mass production is easy, and the reliability of products is improved.
The chip packaging cover plate is electrically connected with the metal detection polar plate, so that the electric field induction area is increased, and the sensitivity of the sensor is improved.
The temperature control design is adopted, so that the temperature drift of the sensor is restrained, and the zero point stability is improved.
By adopting the sealing structure design, the influence of environmental humidity on the encapsulation of the MEMS electric field sensitive chip is avoided, and the accuracy and long-term stability of electric field detection are improved.
The humidity monitoring design is adopted to monitor the sealing state of the MEMS electric field sensor, so that the reliability of electric field detection data is improved.
Drawings
FIG. 1 is a cross-sectional view of a MEMS electric field sensor structure with an insulating seal structure according to an embodiment of the present invention;
FIG. 2 is a cross-sectional view of the insulating seal housing of FIG. 1;
FIG. 3 is a cross-sectional view of the upper housing of the insulating seal MEMS electric field sensor in one embodiment;
FIG. 4 is a cross-sectional view of a lower housing of an insulating seal MEMS electric field sensor in accordance with one embodiment;
Fig. 5 is a block diagram of a temperature and humidity monitoring control unit of an insulating seal structure MEMS electric field sensor according to another embodiment of the present invention.
Detailed Description
Some embodiments of the present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which some, but not all embodiments are shown. Indeed, various embodiments of the invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will satisfy applicable legal requirements.
The present invention will be further described in detail below with reference to specific embodiments and with reference to the accompanying drawings, in order to make the objects, technical solutions and advantages of the present invention more apparent.
An embodiment of the present invention provides an MEMS electric field sensor with an insulating seal structure, and fig. 1 is a cross-sectional view of an MEMS electric field sensor with an insulating seal structure according to an embodiment of the present invention, as shown in fig. 1, the MEMS electric field sensor with an edge seal structure includes an insulating seal housing 1, and a cavity structure is formed inside the insulating seal housing; and the MEMS electric field measurement module is arranged in the cavity structure and is used for detecting an external electric field.
The MEMS electric field measurement module comprises an MEMS electric field sensitive chip 2 and a drive detection circuit unit 3, wherein the MEMS electric field sensitive chip 2 is used for detecting an external electric field to generate an induced current signal; the driving detection circuit unit 3 drives the MEMS electric field sensitive chip 2 to work and detects the induction current signal output by the MEMS electric field sensitive chip to realize the calculation of the detected electric field information. As shown in fig. 1, the MEMS electric field sensitive chip 2 and the driving detection circuit unit 3 are stacked, and in other embodiments, the two may be arranged in other manners, such as a horizontal arrangement or a side-by-side arrangement.
The MEMS electric field sensitive chip 2 detects an external electric field through a charge induction principle, a packaging base is made of insulating materials, and the top is a metal cover plate; the MEMS electric field measurement module may further include a metal detection electrode plate 4 for increasing sensitivity of electric field detection, and a hole is punched in a central position or a non-central position of the metal detection electrode plate 4, so as to be welded and fixed with the packaging metal cover plate, or alternatively, the metal detection electrode plate may be welded and fixed directly or fixed by adhesion without punching. The shape of the metal detection polar plate 4 can be round, rectangle, square, regular or irregular polygon, or arc, cuboid, cube, sphere, other regular or irregular solid shapes, or combination of different surfaces and bodies.
Fig. 2 is a cross-sectional view of the insulating seal housing in fig. 1, where the shape of the insulating seal housing 1 may be a cylinder, an elliptic cylinder, a cuboid, a cube, or other regular or irregular polygons, as shown in fig. 2, the insulating seal housing 1 is made of an insulating material, and includes an upper housing 11 and a lower housing 12, the cross section of the upper housing 11 is a convex arc, or of course may also be a flat top or a concave arc, and the lower housing 12 is a cylinder with an open top, the MEMS electric field measurement module is disposed in the lower housing 12, the upper housing 11 and the lower housing 12 are fastened and connected to form a cavity structure for accommodating the MEMS electric field measurement module, as shown in fig. 1, a fixed column 13 may also be disposed at the bottom of the lower housing 12, and the fixed column 13 fixedly supports the MEMS electric field measurement module accommodated in the cavity structure. The lower housing 12 is provided with a through hole for passing through a wire for supplying power or signal interaction to the MEMS electric field measurement module, and the through hole may be provided on a bottom wall or a side wall of the lower housing, preferably in a central position of the bottom wall. The sealing glue is coated at the joint of the upper shell 11 and the lower shell 12 and at the through hole of the lower shell 12 penetrating into the electric wire in a spin mode to seal the inner cavity structure of the insulating sealing shell, and the sealing glue can be glass glue, silicon rubber, AB glue, epoxy glue and the like.
Fig. 3 is a cross-sectional view of an upper shell of an embodiment of an insulating sealed housing, fig. 4 is a cross-sectional view of a lower shell of an embodiment of an insulating sealed housing, as shown in fig. 3, wherein at least a portion of the inner surface of the upper shell 11 is plated with a first metal layer 111, as shown in fig. 4, and at least a portion of the inner surface of the lower shell 12 is plated with a second metal layer 121. The first metal layer 111 and/or the second metal layer 121 are electrically connected with the metal detection electrode plate 4 or the metal cover plate, so that the sensitivity of electric field detection is further increased.
In another embodiment of the present invention, as shown in fig. 1, a temperature and humidity monitoring control unit 5 is further disposed in the cavity structure in the insulating sealed housing 1, for feeding back and/or adjusting the temperature around the MEMS electric field measurement module and monitoring the humidity change in the cavity structure.
Fig. 5 is a block diagram of a temperature and humidity monitoring control unit according to another embodiment of the present invention, and as shown in fig. 5, the temperature and humidity monitoring control unit includes: a temperature sensor, a humidity sensor, an A/D converter, a Central Processing Unit (CPU), a temperature regulating device and an alarm device; the temperature sensor is used for monitoring the temperature near the MEMS electric field sensitive chip 2; the humidity sensor is used for monitoring humidity change of the cavity inside the insulating sealed shell and evaluating sealing performance of the insulating sealed shell, the A/D converter is used for collecting data of the temperature sensor and the humidity sensor and converting the data into digital signals to be sent to the CPU, the CPU confirms whether the temperature is located in a proper working temperature interval of the MEMS electric field measuring module, and if not, the temperature regulating device is controlled to regulate the ambient temperature of the MEMS electric field measuring module to the proper working temperature interval. For example, when the temperature sensor detects that the temperature is lower than a certain value, the CPU controls the temperature adjusting device, such as the heating device, to heat the MEMS electric field sensitive chip of the MEMS electric field measuring module. The CPU also judges whether the measured humidity changes within a certain range, if the measured humidity exceeds the range, the CPU judges that the sealing performance of the insulating sealing shell fails, and a sealing failure prompt is given through an alarm device.
In one embodiment, the MEMS electric field sensor of the insulating sealing structure can also be fixed on a metal bracket for atmospheric electric field measurement. The metal support may or may not be grounded, and the support may be other material such as wood, plastic, etc., or may be directly mounted on some device or placed on the ground for electric field measurement in other embodiments without using a support.
The MEMS electric field sensor with the insulating sealing structure in the embodiment of the invention can be applied to lightning early warning, industrial electrostatic measurement, direct current or alternating current electric field measurement of a power grid and related electrostatic field measurement devices besides measuring an atmospheric electric field.
It should be noted that the shapes and dimensions of the various components in the drawings do not reflect the actual sizes and proportions, but merely illustrate the contents of the embodiments of the present invention.
The directional terms mentioned in the embodiments, such as "upper", "lower", "front", "rear", "left", "right", etc., are merely directions with reference to the drawings, and are not intended to limit the scope of the present invention. In addition, the above embodiments may be mixed with each other or other embodiments based on design and reliability, i.e. the technical features of the different embodiments may be freely combined to form more embodiments.
It should be noted that, in the drawings or the text of the specification, implementations not shown or described are all forms known to those of ordinary skill in the art, and not described in detail. Furthermore, the above definitions of the elements and methods are not limited to the specific structures, shapes or modes mentioned in the embodiments, and may be simply modified or replaced by those of ordinary skill in the art.
The foregoing description of the embodiments has been provided for the purpose of illustrating the general principles of the invention, and is not meant to limit the invention thereto, but to limit the invention thereto, and any modifications, equivalents, improvements and equivalents thereof may be made without departing from the spirit and principles of the invention.
Claims (8)
1. A MEMS electric field sensor of an insulating sealing structure, comprising:
An insulating sealed shell (1) with a cavity structure inside; and
The MEMS electric field measurement module is arranged in the cavity structure and is used for detecting an external electric field;
The MEMS electric field measurement module comprises an MEMS electric field sensitive chip, wherein the top of the package of the MEMS electric field sensitive chip is provided with a metal cover plate, and the MEMS electric field measurement module further comprises a metal detection polar plate, and a hole is punched at the central position or the non-central position of the metal detection polar plate and is used for being fixed with the metal cover plate so as to realize electric connection;
The insulating sealed shell comprises an upper shell body and a lower shell body, the section of the upper shell body is in a convex arc shape or a concave arc shape, at least one part of the inner surface of the upper shell body is plated with a first metal layer, at least one part of the inner surface of the lower shell body is plated with a second metal layer, and the first metal layer and/or the second metal layer are/is electrically connected with the metal detection polar plate or the metal cover plate so as to increase the sensitivity of electric field detection.
2. The MEMS electric field sensor of claim 1, wherein the MEMS electric field measurement module comprises:
the MEMS electric field sensitive chip (2) is used for detecting an external electric field to generate an induced current signal; and
The driving detection circuit unit (3) is used for driving the MEMS electric field sensitive chip (2) to work and detecting the output induced current signal to realize the calculation of the detected electric field information.
3. MEMS electric field sensor according to any of claims 1-2, wherein the junction of the upper housing (11) and the lower housing (12) is sealed with a sealant and/or sealing ring, forming a sealed cavity structure.
4. A MEMS electric field sensor according to claim 3, wherein a fixed post (13) is provided at the bottom of the lower housing (12), the fixed post (13) fixedly supporting a MEMS electric field measurement module housed in the cavity structure.
5. A MEMS electric field sensor according to claim 3, wherein a temperature and humidity monitoring control unit (5) is further provided within the cavity structure for feeding back and/or adjusting the temperature around the MEMS electric field measurement module and monitoring humidity changes within the cavity structure.
6. The MEMS electric field sensor according to claim 5, wherein the temperature and humidity monitoring control unit comprises:
A temperature sensor;
a humidity sensor;
an A/D converter, which is used for converting the detected analog signals into digital signals together with the temperature sensor and the humidity sensor;
The central processing unit receives the digital signals sent by the A/D converter and sends control signals and/or alarm signals;
a temperature adjusting device for adjusting the temperature in the cavity structure based on the control signal; and
And the alarm device reminds the sealing state of the MEMS electric field sensor based on the alarm signal.
7. The MEMS electric field sensor of claim 6, wherein the temperature regulating device comprises a heating device.
8. A MEMS electric field sensor according to claim 3, wherein the lower housing (12) is provided with a through hole for passing a wire for supplying power or signal interaction to the MEMS electric field measurement module, the through hole being sealed after the wire is passed.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710405990 | 2017-05-31 | ||
| CN2017104059900 | 2017-05-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107228989A CN107228989A (en) | 2017-10-03 |
| CN107228989B true CN107228989B (en) | 2024-05-03 |
Family
ID=59955896
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710555618.8A Active CN107228989B (en) | 2017-05-31 | 2017-07-10 | MEMS electric field sensor with insulating sealing structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107228989B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107846083B (en) * | 2017-12-05 | 2024-04-30 | 广东电网有限责任公司江门供电局 | System and method for wireless energy supply to MEMS electric field sensor and corresponding electric field sensor |
| CN108663562A (en) * | 2018-08-07 | 2018-10-16 | 北京中科飞龙传感技术有限责任公司 | A kind of contactless cable voltage measurement sensor |
| CN109752604B (en) * | 2019-01-30 | 2021-07-27 | 中国科学院电子学研究所 | Packaging assembly and packaging method of electric field sensor and electric field sensor |
| CN114184853A (en) * | 2021-12-14 | 2022-03-15 | 中国电力科学研究院有限公司 | Power frequency electric field measuring device |
| CN115290993B (en) * | 2022-10-10 | 2023-01-13 | 中国科学院空天信息创新研究院 | Omnidirectional electrostatic field detection device for spherical electrode |
| CN118169480A (en) * | 2024-03-29 | 2024-06-11 | 北京中科飞龙传感技术有限责任公司 | MEMS atmospheric electric field sensor and assembly method thereof |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101359013A (en) * | 2007-08-01 | 2009-02-04 | 中国科学院电子学研究所 | Package-avoiding electromagnetic drive type small-sized electric-field sensor |
| CN101683966A (en) * | 2008-09-24 | 2010-03-31 | 中国科学院电子学研究所 | Anti-static accumulation packaging structure for miniature electric field sensor |
| CN103529311A (en) * | 2013-09-30 | 2014-01-22 | 清华大学 | Hydrophobic dual-sealing photoelectric electric-field sensor applicable to high-humidity environment |
| CN103633036A (en) * | 2013-08-07 | 2014-03-12 | 中国科学院电子学研究所 | Electric field sensor packaging element based on high-resistance material |
| CN103675948A (en) * | 2013-12-31 | 2014-03-26 | 北京维天信气象设备有限公司 | Automatic weather station |
| CN105629083A (en) * | 2016-01-21 | 2016-06-01 | 晋江知保企业管理咨询有限公司 | Power frequency electric field detection device |
| CN106672890A (en) * | 2016-12-13 | 2017-05-17 | 北京中科飞龙传感技术有限责任公司 | Packaging cover plate of sensitivity-strengthened electric field sensor and packaging method |
| CN207148228U (en) * | 2017-05-31 | 2018-03-27 | 北京中科飞龙传感技术有限责任公司 | A kind of MEMS electric-field sensors of insulation and sealing structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103308782B (en) * | 2012-03-16 | 2016-01-27 | 中国科学院电子学研究所 | Rotary resonance type three-dimensional electric field sensor |
-
2017
- 2017-07-10 CN CN201710555618.8A patent/CN107228989B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101359013A (en) * | 2007-08-01 | 2009-02-04 | 中国科学院电子学研究所 | Package-avoiding electromagnetic drive type small-sized electric-field sensor |
| CN101683966A (en) * | 2008-09-24 | 2010-03-31 | 中国科学院电子学研究所 | Anti-static accumulation packaging structure for miniature electric field sensor |
| CN103633036A (en) * | 2013-08-07 | 2014-03-12 | 中国科学院电子学研究所 | Electric field sensor packaging element based on high-resistance material |
| CN103529311A (en) * | 2013-09-30 | 2014-01-22 | 清华大学 | Hydrophobic dual-sealing photoelectric electric-field sensor applicable to high-humidity environment |
| CN103675948A (en) * | 2013-12-31 | 2014-03-26 | 北京维天信气象设备有限公司 | Automatic weather station |
| CN105629083A (en) * | 2016-01-21 | 2016-06-01 | 晋江知保企业管理咨询有限公司 | Power frequency electric field detection device |
| CN106672890A (en) * | 2016-12-13 | 2017-05-17 | 北京中科飞龙传感技术有限责任公司 | Packaging cover plate of sensitivity-strengthened electric field sensor and packaging method |
| CN207148228U (en) * | 2017-05-31 | 2018-03-27 | 北京中科飞龙传感技术有限责任公司 | A kind of MEMS electric-field sensors of insulation and sealing structure |
Non-Patent Citations (2)
| Title |
|---|
| 杨鹏飞 ; 陈博 ; 闻小龙 ; 彭春荣 ; 夏善红 ; 郝一龙 ; .一种基于MEMS芯片的新型地面大气电场传感器.电子与信息学报.2016,38(06),第1536-1540页. * |
| 闻小龙 ; 任天令 ; 夏善红 ; .一种电极型MEMS电场传感器封装结构.电子与信息学报.2016,38(11),第2960-2964页. * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107228989A (en) | 2017-10-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107228989B (en) | MEMS electric field sensor with insulating sealing structure | |
| CN203451989U (en) | Friction pendulum vibration isolation support with self-test function | |
| US10718802B2 (en) | MEMS-based atmospheric electric field sensor on the ground | |
| CN201477060U (en) | Crack detection device based on conductive paint | |
| JP2007108073A (en) | Ground stress measuring device and ground stress measuring method | |
| CN201909670U (en) | Passive wireless vibrating sensor | |
| CN202582741U (en) | Temperature rise monitoring device for dry type hollow reactor | |
| CN209927396U (en) | Wireless excitation monitoring sensing device | |
| CN205038238U (en) | Electrified special support instrument of superfrequency sensor that detects of GIS | |
| CN207249002U (en) | Balloon borne formula MEMS soundings electric-field sensor and its integrated system | |
| CN201251454Y (en) | High-voltage transmission line pole tower safe operation monitor | |
| CN207148228U (en) | A kind of MEMS electric-field sensors of insulation and sealing structure | |
| CN210664719U (en) | Electronic truck scale | |
| CN101354271B (en) | High-voltage transmission line pole tower operation safe monitor | |
| CN206891621U (en) | A kind of encapsulating structure of ceramic capacitive pressure sensors | |
| CN202522290U (en) | Universal liquid sensor for acousto-optic wireless alarming | |
| CN111198305A (en) | Liquid level potential sensor | |
| CN201004434Y (en) | Gas density switch using gas compensation | |
| CN203837784U (en) | A multifunctional weighing sensor | |
| CN206116356U (en) | Automatic survey two ingredient silica gel stabilizing effect's of subassembly terminal box module | |
| CN206671055U (en) | A kind of cardboard ring crush intensity test device | |
| CN209230512U (en) | A kind of hydraulic support height potential difference detector | |
| CN203537710U (en) | Stable humiture sensor fixing structure | |
| CN112113599A (en) | Safety type liquid level height and liquid level potential integrated test device | |
| CN203553011U (en) | Explosion-proof mercury limit switch |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |