CN107225329A - A kind of method for improving glass copper facing bonding strength - Google Patents
A kind of method for improving glass copper facing bonding strength Download PDFInfo
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- CN107225329A CN107225329A CN201710554715.5A CN201710554715A CN107225329A CN 107225329 A CN107225329 A CN 107225329A CN 201710554715 A CN201710554715 A CN 201710554715A CN 107225329 A CN107225329 A CN 107225329A
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- glass
- laser
- bonding strength
- copper facing
- cmg
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/3568—Modifying rugosity
- B23K26/3584—Increasing rugosity, e.g. roughening
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/60—Preliminary treatment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Surface Treatment Of Glass (AREA)
Abstract
The present invention discloses a kind of method for improving glass copper facing bonding strength, is made using excimer laser process after glass baseplate surface roughening, the method that can significantly improve bonding strength between coating and glass substrate.Control is realized to Laser Processing effect by changing parameter setting during Laser Processing, make to produce diverse microcosmic array of structures on surface, then the glass surface pattern after being handled with three-dimensional parameter sign is measured using 3 d surface topography, and copper-plated adhesion strength is assessed by scratch test, be conducive to maximizing using Laser Processing energy, save the processing time used, control processing effect, to reach preferable roughened surface, so as to significantly improve the quality of coating film on glass.
Description
Technical field
It is surface-treated the invention belongs to coating film on glass technical field, more particularly to one kind by excimer laser process
Method for improving glass copper facing bonding strength.
Background technology
In technical field of electronic encapsulation, high performance Electronic Packaging requires that circuit board and baseplate material should after ideally combining
This has optimal attribute.Due to inexpensive, environment-friendly and high-performance, glass is substituted as a kind of very promising substrate
Material receives extensive concern.Replace traditional printed circuit board (PCB) with glass, the method for copper plating film enjoys favor in its surface.
Strip conductor is deposited in insulating glass substrate surface, the manufacture to electronic component is critically important.However, due to metal-plated
The mismatch of physics, chemistry and mechanical performance between layer and glass substrate, carrying out metallising in smooth glass surface is
Highly difficult.If there is no enough adhesivenesses between substrate and coating, even if after plated film, coating is also very easy under coming off
Come.Therefore, it is the key factor that coating film on glass technology is able to develop to improve the adhesiveness between coating and substrate.
Forefathers are by studying interface roughness, it is indicated that surface preparation is the key for realizing high-quality bonding, and
And metal, alloy and ceramics have been successfully applied to using the method for Laser Surface Treatment raising adhesion strength, in coating film on glass
Field yet there are no further investigation.
Improving surface roughness improves the effective way of adhesion property between glass and copper film.By being surface-treated, such as
Gas ions roughening, mechanical wear, chemical modification, pearly-lustre sandblasting, coating can be improved by improving the method for glass surface roughness
Adhesiveness.However, these surface treatment methods can only produce random surface, it is difficult to control the effect processed in glass surface.
Therefore, need a kind of processing method for producing even grain structure badly, by controllable glass surface treatment technology, show
Write and improve coating film on glass adhesive strength, this plays key effect for the development of coating film on glass technology.
The content of the invention
Weak point regarding to the issue above, can the invention provides a kind of method for improving glass copper facing bonding strength
To significantly improve the bonding strength of copper film and glass substrate.
In order to achieve the above object, the technical solution adopted by the present invention is：
A kind of method for improving glass copper facing bonding strength, comprises the following steps：
Step 1, selection CMG glass substrates；
Step 2, CMG glass substrates are placed on the table, adjustment workbench makes the standard point that excimer laser sends
Sub- laser beam is directed at Working position；
Step 3, the distance according to focal position adjustment CMG glass substrates to focal plane；
Step 4, by changing laser processing parameter, different textured pattern structures are formed in glass surface, difference is obtained
Etch depth and three-dimensional surface roughness feature, the laser processing parameter includes：Laser repetition rate, laser energy are close
Degree, attenuator position；
Step 5, the good roughened surface of excimer laser process cleaned 5 minutes with undiluted Decon 90, be used in combination
Deionized water rinsing 3-5 minutes；
Step 6, activate using catalyst solution glass surface and with deionized water rinsing 3-5 minutes；
Step 7, by treated glass substrate immersion copper plating groove soak 10 minutes, be finally rinsed and dry；
Step 8, the copper-plated quality on glass is quantitatively detected by scratch test；
Step 9, measuring three-dimensional morphology is finally carried out, and cut test result is mutually tied with three-dimensional surface roughness parameter
Close, find the critical load of coating failure.
Preferably, in step 1, the size of CMG glass substrates is 40mm*40mm, and thickness is 100 μm.
Preferably, in step 3, CMG glass substrates are below focal plane at 2mm positions.
Preferably, in step 4, using unitary variant method, repetition rate, energy density are probed into successively, in unit area
Pulse number, attenuator position set different value when to etch depth, the influence of crudy；Etching depth depends on laser
Energy density and unit area on pulse number, and can be by improving energy density, the pulse in unit area
Count with laser pulse repetition frequency to improve crudy.
Preferably, the fixed pulse duration is 20ns, the minimum energy of laser-induced thermal etching is 140mJ, the position of attenuator
It is set to 0.9.
Preferably, the absorptivity of light of the CMG glass to wavelength between 193nm to 308nm is more than 80%, using wavelength
It is surface-treated for 248nm KrF excimer lasers, laser energy can be effectively utilized.
The method that the present invention improves glass copper facing bonding strength, makes glass baseplate surface coarse using excimer laser process
After change, the method that bonding strength between coating and glass substrate can be significantly improved.By changing laser parameter to Laser Processing
Effect realizes control, makes to produce diverse microcosmic array of structures on surface, is characterized using 3 d surface topography measurement and three-dimensional parameter
Glass surface pattern after processing, and copper-plated adhesion strength is assessed by scratch test, be conducive to maximization to use laser
Machining energy, saves the processing time used, processing effect is controlled, to reach preferable roughened surface, so as to significantly improve glass
The quality of glass plated film.
Brief description of the drawings
Fig. 1 excimer laser process system schematics；
The 3 d surface topography of glass substrate after Fig. 2 excimer laser process；
The glass surface copper facing effect of Fig. 3 roughenings；
Glass baseplate surface scratch test Comparative result before and after Fig. 4 excimer laser process.
Wherein, in Fig. 1,1- excimer lasers, 2- attenuators, 3- beam expanders and reshaper, 4- light beam scanning units, 5-
Object lens, 6- masks, 7- imaging lens, 8-X, Y, Z workbench；
In Fig. 4, the smooth glass substrate surface scratch test result before (a) excimer laser process, when load is 1.0N
When, there is glass baseplate surface coarse after layering failure (b) excimer laser process, load just occurs when increasing to 12.6N
Layering failure, significantly improves the adhesion between glass/copper film.
Embodiment
The present invention provides a kind of method for improving glass copper facing bonding strength, and glass surface is carried out using PRK
Roughening, can significantly improve the bonding strength of copper film and glass substrate.
Quasi-molecule laser source is ultraviolet light pulse, with stronger pulse energy and photon energy, crudy it is high and
Smaller to area to be machined ambient influence, material is not in the phenomenons such as scaling loss, residue and burr.In addition, PRK arteries and veins
Narrower width is rushed, does not have time enough a large amount of diffusion heats around in material processing, therefore heat affected area is very
It is small or even be not present, it can so ensure the precision and quality of processing.With Nd:YAG (λ=1.06 μm) and CO2(the μ of λ=10.6
M) laser is compared, and PRK wavelength is shorter, and light beam can be made to be focused into the spot of very little, obtains higher energy close
Degree, and produce on workpiece less heat affected area.Therefore, it is processed using PRK.
However, the divergence and inhomogeneities of PRK are quite big, light beam coherence is poor, is covered so generally using
Modular system, makes beam uniformity, produces optimal process effect.
The glass selects commercialization CMG glass, and commercial CMG glass is a kind of borosilicic acid salt form glass, and its surface has one layer
Ceria, can be less than 320nm light with absorbing wavelength.The physical characteristic of CMG glass shows that it can meet Electronic Packaging
It is required that.Therefore, experimental study is carried out from CMG glass.
When excimer laser process wavelength is in [193, the 308] nm of interval, coating is more than 80% to the absorptivity of light.For
KrF excimer lasers, wavelength is 248nm, and light quantum has 5eV energy, it is sufficient to break chemical bond, causes uptake zone internal pressure
Power increase, and launched in the way of blast.Therefore, from KrF excimer lasers.
Different etch depth and three-dimensional surface roughness feature can be obtained by changing laser processing parameter, change is covered
Mould shape can form different textured patterns in glass surface, and produce the controllable adhesion of size, improve copper facing on glass
Adhesiveness, so as to improve the quality of coating film on glass.The 3 d surface topography of glass substrate after excimer laser process, such as schemes
Shown in 2.
In order to realize best adhesiving effect, the influence of each machined parameters of system research is optimized to process.
Control to processing effect is realized by the pulse number in the energy density of change Laser Processing, unit area, repetition rate,
Help to maximally utilise laser energy, reduce process time.
Metallising is carried out to the glass surface with particular texture structure.For the denseness and thickness of coating, to work
The parameters such as temperature, chemical concentrations and soak time are optimized；The glass surface copper facing effect of roughening, as shown in Figure 3.
Adhesive strength between glass and plated film is quantified using scratch test, the critical value of failure is found.
Before processing, it is necessary to be adjusted according to the thickness focusing position of sample, to ensure laser processing quality.
The setting of laser-processing system such as Fig. 1, laser beam passes through beam delivery system, as needed in vertically and horizontally side
Reflect to change transmission direction upwards.Beam delivery system it is main by excimer laser, attenuator, beam expander and reshaper,
Light beam scanning unit, object lens, mask, imaging len, X, Y, Z workbench composition, for the extension of light beam, shaping, scanning and figure
As projection.After this, it is projected onto on mask plane, and light beam is adjusted by the mask aperture of different size and dimensions
Shapes and sizes.Finally, light beam produces about 1 by a projecting lens：10 downscaled images are to installed in numerical control work
Specimen surface on platform.Attenuator (from 0.0-0.95 setting scope) close to diaphragm, by absorb or reflecting part light beam come
Reduce the energy of laser beam.
In laser ablation process, workbench can be moved in X-axis and Y direction, and can be rotated in the Z-axis direction.In behaviour
During work, it is always ensured that the test specimen machining area on workbench is vertical with laser beam.
Because focal plane produces most uniform energy density, so the light beam on focal plane position is deviateed is uneven
, non-uniform beam of light can be used for coarse Surface Machining.In addition, being needed when being processed test specimen positioned at non-focal plane position more
Laser energy come reach remove material purpose.
Because the ultimate resolution of optical system is limited by diffraction effect, it is directly proportional to the wavelength of radiation, and accurate point
Sub- laser has relatively short wavelength (ultraviolet ray range) and burst length (20ns) so that high intensity energy is in very thin table
Layer material is absorbed, and can effectively remove the material of target area.This in glass baseplate surface formation microstructure for having
Significance.
The present invention provides a kind of method for significantly improving glass copper facing bonding strength, and whole flow process is：PRK adds
Work glass substrate -3 d surface topography measurement and sign-electroless copper-cut test-critical load analysis, are specifically included following
Step：
Suitable sample is chosen, here using interior CMG glass substrates, size is 40mm*40mm, and thickness is 100um.
Glass substrate sample is got out, cleaning surface is dirty, placed on the table, adjustment workbench is directed at laser beam
Working position.
Glass substrate is adjusted to the distance of focal plane according to focal position, this Experimental comparison focal plane and focal plane with
Processing effect at lower 2mm positions.According to three-dimensional parameter value size, determine that sample is being easier below focal plane at 2mm positions
Process rough surface.
Using unitary variant method, repetition rate, energy density, the pulse number in unit area, attenuator are probed into successively
To etch depth, the influence of crudy during the setting different value of position.As a result show, the energy that etching depth depends on laser is close
Pulse number on degree and unit area, and can be by improving energy density, pulse number and laser in unit area
Pulse recurrence frequency improves crudy.Here the fixed pulse duration is 20ns, test result indicates that, laser-induced thermal etching is most
Small energy is 140mJ, and the position of attenuator is optimal for 0.9, and compromise considers crudy and process time to set processing to join
Numerical value.
The controllability of Laser Surface Treatment can be carried out by machined parameters, output pulse energy and attenuator position excellent
Change, to process the rough surface that adhesiveness is best.
The good roughened surface of excimer laser process is cleaned 5 minutes with undiluted Decon 90, and uses deionization
Water is rinsed 3-5 minutes.
Glass surface is activated with catalyst solution and with deionized water rinsing 3-5 minutes.
Treated glass substrate immersion copper plating groove is soaked 10 minutes, is finally rinsed and dries.
The copper-plated quality on glass is quantitatively detected by scratch test.
Finally, measuring three-dimensional morphology is carried out, and cut test result is combined with three-dimensional surface roughness parameter, is found
The critical load of coating failure；Glass baseplate surface scratch test Comparative result before and after excimer laser process, as shown in Figure 4.
Claims (6)
1. a kind of method for improving glass copper facing bonding strength, it is characterised in that comprise the following steps：
Step 1, selection CMG glass substrates；
Step 2, CMG glass substrates are placed on the table, adjustment workbench swashs the quasi-molecule that excimer laser sends
Beam alignment Working position；
Step 3, the distance according to focal position adjustment CMG glass substrates to focal plane；
Step 4, by changing laser processing parameter, different textured pattern structures are formed in glass surface, different erosions are obtained
Depth and three-dimensional surface roughness feature are carved, the laser processing parameter is included：Laser repetition rate, laser energy density, decline
Subtract device position；
Step 5, the good roughened surface of excimer laser process cleaned 5 minutes with undiluted Decon 90, and spend from
Sub- water is rinsed 3-5 minutes；
Step 6, activate using catalyst solution glass surface and with deionized water rinsing 3-5 minutes；
Step 7, by treated glass substrate immersion copper plating groove soak 10 minutes, be finally rinsed and dry；
Step 8, the copper-plated quality on glass is quantitatively detected by scratch test；
Step 9, measuring three-dimensional morphology is finally carried out, and cut test result is combined with three-dimensional surface roughness parameter, looked for
The critical load failed to coating.
2. the method for glass copper facing bonding strength is improved as claimed in claim 1, it is characterised in that in step 1, CMG glass
The size of substrate is 40mm*40mm, and thickness is 100 μm.
3. the method for glass copper facing bonding strength is improved as claimed in claim 1, it is characterised in that in step 3, CMG glass
Substrate is below focal plane at 2mm positions.
4. the method for glass copper facing bonding strength is improved as claimed in claim 1, it is characterised in that in step 4, using single
Quantity method, when probing into repetition rate, energy density, the pulse number in unit area, attenuator position setting different value successively
To etch depth, the influence of crudy；The pulse number that etching depth is depended in the energy density and unit area of laser,
And processing matter can be improved by improving energy density, the pulse number in unit area and laser pulse repetition frequency
Amount.
5. the method for glass copper facing bonding strength is improved as claimed in claim 1, it is characterised in that the fixed pulse duration
For 20ns, the minimum energy of laser-induced thermal etching is 140mJ, and the position of attenuator is 0.9.
6. the method for glass copper facing bonding strength is improved as claimed in claim 1, it is characterised in that CMG glass exists to wavelength
The absorptivity of light between 193nm to 308nm is more than 80%, uses wavelength to carry out surface for 248nm KrF excimer lasers
Processing, can effectively utilize laser energy.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108956670A (en) * | 2018-07-13 | 2018-12-07 | 北京工业大学 | Prepare the method for modifying with high cohesive force polyvinyl chloride surface |
| CN113774384A (en) * | 2021-09-15 | 2021-12-10 | 上海莘芝光电科技有限公司东莞分公司 | Scheme for reducing three-dimensional line spraying cost through laser etching and chemical polishing |
| CN113774384B (en) * | 2021-09-15 | 2024-06-25 | 心之光电子科技(广东)有限公司 | Scheme for reducing three-dimensional circuit spraying cost through laser etching and chemical polishing |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1049686A (en) * | 1989-08-22 | 1991-03-06 | 中国人民解放军装甲兵工程学院 | The method of roll plating of non-metallic surface |
| CN1096484A (en) * | 1993-06-18 | 1994-12-21 | 杨德庆 | The method of embedded with metal on on-metallic article |
| CN1096826A (en) * | 1993-06-25 | 1994-12-28 | 刘振魁 | Method for showering metallizing on non-metallic material |
| US5750212A (en) * | 1991-08-03 | 1998-05-12 | Lpkf Cad/Cam Systeme Gmbh | Process for the deposition of structured metallic coatings on glass substrates |
| CN101021009A (en) * | 2007-03-09 | 2007-08-22 | 湖南大学 | Nickel pre-coating process and nickel pre-coating solution for magnesium alloy surface |
| CN101067206A (en) * | 2007-06-06 | 2007-11-07 | 南开大学 | ABS plastic surface non-palladium activating treatment new technology |
| CN102036927A (en) * | 2008-04-18 | 2011-04-27 | 康宁股份有限公司 | Methods and systems for forming microstructures in glass substrates |
| CN105935837A (en) * | 2016-05-30 | 2016-09-14 | 湖北工业大学 | Laser texturing method for improving adhesive force of surface of weathering resistant steel |
| CN106041313A (en) * | 2016-06-22 | 2016-10-26 | 中南大学 | Uniform modification processing method of transparent medium microstructures |
| CN106277811A (en) * | 2016-08-12 | 2017-01-04 | 海南大学 | A kind of glass substrate and the film plating process of glass surface |
| CN106906646A (en) * | 2017-03-02 | 2017-06-30 | 昆明理工大学 | A kind of carbon fiber surface metallization treating method |
| US20170194225A1 (en) * | 2015-12-30 | 2017-07-06 | International Business Machines Corporation | Low cost hermetic micro-electronics |
| CN106925895A (en) * | 2017-03-16 | 2017-07-07 | 上海理工大学 | Based on the micro-machined glassy carbon electrode surface coarsening preparation method of ultra-short pulse laser |
-
2017
- 2017-07-10 CN CN201710554715.5A patent/CN107225329A/en active Pending
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1049686A (en) * | 1989-08-22 | 1991-03-06 | 中国人民解放军装甲兵工程学院 | The method of roll plating of non-metallic surface |
| US5750212A (en) * | 1991-08-03 | 1998-05-12 | Lpkf Cad/Cam Systeme Gmbh | Process for the deposition of structured metallic coatings on glass substrates |
| CN1096484A (en) * | 1993-06-18 | 1994-12-21 | 杨德庆 | The method of embedded with metal on on-metallic article |
| CN1096826A (en) * | 1993-06-25 | 1994-12-28 | 刘振魁 | Method for showering metallizing on non-metallic material |
| CN101021009A (en) * | 2007-03-09 | 2007-08-22 | 湖南大学 | Nickel pre-coating process and nickel pre-coating solution for magnesium alloy surface |
| CN101067206A (en) * | 2007-06-06 | 2007-11-07 | 南开大学 | ABS plastic surface non-palladium activating treatment new technology |
| CN102036927A (en) * | 2008-04-18 | 2011-04-27 | 康宁股份有限公司 | Methods and systems for forming microstructures in glass substrates |
| US20170194225A1 (en) * | 2015-12-30 | 2017-07-06 | International Business Machines Corporation | Low cost hermetic micro-electronics |
| CN105935837A (en) * | 2016-05-30 | 2016-09-14 | 湖北工业大学 | Laser texturing method for improving adhesive force of surface of weathering resistant steel |
| CN106041313A (en) * | 2016-06-22 | 2016-10-26 | 中南大学 | Uniform modification processing method of transparent medium microstructures |
| CN106277811A (en) * | 2016-08-12 | 2017-01-04 | 海南大学 | A kind of glass substrate and the film plating process of glass surface |
| CN106906646A (en) * | 2017-03-02 | 2017-06-30 | 昆明理工大学 | A kind of carbon fiber surface metallization treating method |
| CN106925895A (en) * | 2017-03-16 | 2017-07-07 | 上海理工大学 | Based on the micro-machined glassy carbon electrode surface coarsening preparation method of ultra-short pulse laser |
Non-Patent Citations (2)
| Title |
|---|
| BAOFENG HE ETC: "Improvingcopperplatingadhesiononglassusinglasermachining", 《OPTICSANDLASERSINENGINEERING》 * |
| JIAN XU: "Selective metallization on insulator surfaces with femtosecond laser pulses", 《OPTICS EXPRESS》 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108956670A (en) * | 2018-07-13 | 2018-12-07 | 北京工业大学 | Prepare the method for modifying with high cohesive force polyvinyl chloride surface |
| CN108956670B (en) * | 2018-07-13 | 2021-03-30 | 北京工业大学 | Modification method for preparing polyvinyl chloride surface with high adhesive force |
| CN113774384A (en) * | 2021-09-15 | 2021-12-10 | 上海莘芝光电科技有限公司东莞分公司 | Scheme for reducing three-dimensional line spraying cost through laser etching and chemical polishing |
| CN113774384B (en) * | 2021-09-15 | 2024-06-25 | 心之光电子科技(广东)有限公司 | Scheme for reducing three-dimensional circuit spraying cost through laser etching and chemical polishing |
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Application publication date: 20171003 |