CN107220440A - A kind of automatic addition high-speed line bead probe method - Google Patents
A kind of automatic addition high-speed line bead probe method Download PDFInfo
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- CN107220440A CN107220440A CN201710392357.2A CN201710392357A CN107220440A CN 107220440 A CN107220440 A CN 107220440A CN 201710392357 A CN201710392357 A CN 201710392357A CN 107220440 A CN107220440 A CN 107220440A
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- speed line
- bead probe
- line bead
- automatic addition
- addition high
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/392—Floor-planning or layout, e.g. partitioning or placement
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- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
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- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
The invention discloses a kind of automatic addition high-speed line bead probe method, automatic addition high-speed line bead probe program is implanted in the skill instruments of cadence softwares first, then carrying out a key by the automatic addition high-speed line bead probe of execution program adds high-speed line bead probe.The Skill programs added automatically by writing of the present invention are simultaneously put into Skill menus and carry out a key and add automatically, realize high-speed line bead probe automatic addition;Solve the problem of the distance between the problem of adding high-speed line bead probe inefficiencys manually in the past and manual management and control bead probe do not meet test request;By adding high-speed line bead probe automatically, the manually operated workload of engineer is reduced, Layout design efficiencies are improved.
Description
Technical field
The present invention relates to a kind of automatic addition high-speed line bead probe method, specifically one kind is based on
Cadence skill automatic addition high-speed line bead probe method, belongs to PCB design technical field.
Background technology
With the continuous development of electronic industry, high speed signal is on the increase, while the requirement more and more higher to signal quality,
Parts density on PCB is more and more closeer, and space is less and less, and the difficulty of PCB design is also increasing, respective design engineer's
Workload is also increasing.
In especially PCB Layout designs, the project cycle is shorter and shorter, and PCB space is less and less, puts test point
Space is also limited, how quickly to add the measuring point of high-speed line, and is allowed to meet test request, improves the work effect of engineer
Rate seems extremely important.
The content of the invention
In view of the shortcomings of the prior art, the invention provides a kind of automatic addition high-speed line bead probe method, its
High-speed line bead probe automatic addition can be realized, the manually operated workload of engineer is reduced, Layout designs are improved
Efficiency.
The present invention solves its technical problem and adopted the technical scheme that:A kind of automatic addition high-speed line bead probe side
Method, it is characterized in that, automatic addition high-speed line bead probe program is implanted to the skill instruments of cadence softwares first
In, then carry out key addition high-speed line bead probe by performing automatic addition high-speed line bead probe program.
Further, the method for the automatic addition high-speed line bead probe includes step in detail below:
Step 1, the program that automatic addition high-speed line bead probe in pcb board are set is write;
Step 2, automatic addition high-speed line bead probe program is put into the skill instrument dishes of cadence softwares
Dan Zhong;
Step 3, automatic addition high-speed line bead probe program is performed according to demand;
Step 4, tracetrace high-speed line bead probe are chosen in automatic addition.
Further, the compiling procedure of the program of the automatic addition high-speed line bead probe comprises the following steps:
1), selection is currently needed for adding high-speed line bead probe trace;
2), high-speed line bead probe are packaged.
Further, selection is currently needed for adding high-speed line bead probe trace from design documentation.
Further, according to different trace width when selection is currently needed for adding high-speed line bead probe trace
The different bead probe of selection;Named when being packaged to high-speed line bead probe using correspondence trace width.
Further, automatic addition high-speed line bead probe process includes modification high-speed line bead probe mistake
Journey, the process of the modification high-speed line bead probe is:By changing automatic addition high-speed line bead probe in pcb board
The program, is then put into the skill tools menus of cadence softwares by partial profiles in program, finally right
The background data base of Layout designs is directly changed, so as to realize that a key adds the high-speed line bead for choosing trace automatically
probe。
Further, the modification process of the partial profiles is:It is first turned on the correspondence configuration text under installation path
Part, then carries out configuration modification, and amended configuration file finally is updated into the journey to automatic addition high-speed line bead probe
In sequence.
Further, the method for the automatic addition high-speed line bead probe is further comprising the steps of:
Step 5, Done orders are exported after addition high-speed line bead probe.
The beneficial effects of the invention are as follows:The present invention sets automatic addition high-speed line bead probe in pcb board by writing
Skill programs, then the Skill programs are put into Skill menus, perform the Skill programs just can a key add automatically
Plus trace bead probe are chosen, realize high-speed line bead probe automatic addition;The present invention is solved to be added manually in the past
Plus the problem of high-speed line bead probe inefficiencys and the distance between manual management and control bead probe do not meet test
It is required that the problem of;The present invention reduces the manually operated workload of engineer, carried by adding high-speed line bead probe automatically
High Layout design efficiencies.
Brief description of the drawings
Fig. 1 is flow chart of the method for the present invention;
Fig. 2 is the flow chart that automatic addition high-speed line bead probe are carried out using the present invention;
Fig. 3 is without using the schematic diagram for (being not added with bead probe) before the method for the invention;
To correspond to the schematic diagram that bead probe are encapsulated, (numerical value in title represents corresponding high-speed line trace to Fig. 4
width);
Fig. 5 is bead probe test schematic diagrams, and solder mask (solder mask window) and paste are opened on correspondence trace
Mask (scolding tin windowing), the tin on the copper face exposed, chaining pin is tested by the upper tin part of contact;
Fig. 6 is that now the distance between bead probe are testable using the schematic diagram after the method for the invention
In the range of, meet test request;
Fig. 7 is the distance between two bead probe schematic diagram, and this parameter is default value, has been set in a program.
Embodiment
For the technical characterstic for illustrating this programme can be understood, below by embodiment and with reference to its accompanying drawing to the present invention
It is described in detail.Following disclosure provides many different embodiments or example is used for realizing the different structure of the present invention.
In order to simplify disclosure of the invention, hereinafter the part and setting of specific examples are described.In addition, the present invention can be not
With repeat reference numerals in example and/or letter.This repetition is for purposes of simplicity and clarity, itself not indicate to be begged for
By the relation between various embodiments and/or setting.It should be noted that part illustrated in the accompanying drawings is painted not necessarily to scale
System.Present invention omits the description to known assemblies and treatment technology and process to avoid being unnecessarily limiting the present invention.
A kind of automatic addition high-speed line bead probe of present invention method, it is first by automatic addition high-speed line bead
Probe Skill programs are implanted in the skill instruments of cadence softwares, then by performing automatic addition high-speed line bead
Probe Skill programs carry out key addition high-speed line bead probe.
Further, as shown in figure 1, the method for the automatic addition high-speed line bead probe includes walking in detail below
Suddenly:
Step 1, the program that automatic addition high-speed line bead probe in pcb board are set is write;
Step 2, automatic addition high-speed line bead probe program is put into the skill instrument dishes of cadence softwares
Dan Zhong;
Step 3, automatic addition high-speed line bead probe program is performed according to demand;
Step 4, tracetrace high-speed line bead probe are chosen in automatic addition;
Step 5, Done orders are exported after addition high-speed line bead probe.
Further, the compiling procedure of the program of the automatic addition high-speed line bead probe comprises the following steps:
1), selection is currently needed for adding high-speed line bead probe trace;
2), high-speed line bead probe are packaged.
Further, selection is currently needed for adding high-speed line bead probe trace (trace is from design documentation
The title that copper cash on PCB is corresponded in PCB design).
Further, according to different trace width when selection is currently needed for adding high-speed line bead probe trace
The different bead probe of selection;Named when being packaged to high-speed line bead probe using correspondence trace width.
Further, automatic addition high-speed line bead probe process includes modification high-speed line bead probe mistake
Journey, the process of the modification high-speed line bead probe is:By changing automatic addition high-speed line bead probe in pcb board
The program, is then put into the skill tools menus of cadence softwares by partial profiles in program, finally right
The background data base of Layout designs is directly changed, so as to realize that a key adds the high-speed line bead for choosing trace automatically
probe。
Further, the modification process of the partial profiles is:It is first turned on the correspondence configuration text under installation path
Part, then carries out configuration modification, and amended configuration file finally is updated into the journey to automatic addition high-speed line bead probe
In sequence.
The present invention sets automatic addition high-speed line bead in pcb board in Cadence Layout designs by writing
The Skill programs, are then put into Skill menus by probe program, and performing the Skill programs, just one key of energy adds automatically
Plus trace bead probe are chosen, realize high-speed line bead probe automatic addition.
As shown in Fig. 2 the process for carrying out automatic addition high-speed line bead probe using the method for the present invention is as follows:
1. running Skill programs, selection is currently needed for adding bead probe trace, as shown in Figure 4;
2. obtain the width of trace selected in 1;
3. according to trace width consistent bead probe of Auto-matching trace width in lists encapsulation, preferential row
Being listed in first place, (such as TPB_5_0_TRACE, it is 5mil to represent trace width, in the bead of the bottom layers of addition in PCB top layers
probe);
4. the distance between two bead probe centers are default values, set in a program;
5. operation Skill terminates, bead probe additions are completed, and export Done orders.
Contrast before and after bead probe is added using the method for the invention as shown in Figure 3 and Figure 6, in Fig. 6
The distance between bead probe meet test request in testable scope;Bead probe list as shown in figure 4,
Numerical value in title represents corresponding high-speed line trace width;Bead probe test is as shown in figure 5, in correspondence trace
On open solder mask (solder mask window) and paste mask (scolding tin windowing), the tin on the copper face exposed, chaining pin passes through contact
Upper tin part is tested;The distance between two bead probe have been set as shown in fig. 7, this parameter (68mil) is default value
Determine in a program.
The present invention configures text by changing the part of automatic addition high-speed line bead probe Skill programs in pcb board
The Skill programs, are then put into Skill menus by part, the Layout background data bases designed are directly changed, energy
Enough keys add the bead probe for choosing trace automatically, realize high-speed line bead probe automatic addition.Part configures text
The modification process of part is:Open the X under correspondence installation path (such as X disks):/Cadence/Home/pcbenv/
In allegro.ilinit files, addition such as next line word,
(load"X:Skill/add_bead_probe.il "), restart design software, you can import this skill.
When present invention selection is currently needed for adding bead probe trace, addition is needed from the choosing of design documentation center
Bead probe trace.In being typically designed, the HW High Way on PCB top layers is required for addition.
The problem of present invention solved in the past addition high-speed line bead probe inefficiencys manually and manual management and control
Not the problem of the distance between bead probe do not meet test request.Using the present invention, high-speed line is set to add bead automatically
Probe, reduces the manually operated workload of engineer, improves Layout design efficiencies.
In addition, the application of the present invention is not limited to technique, mechanism, the system of the specific embodiment described in specification
Make, material composition, means, method and step., will be easy as one of ordinary skill in the art from the disclosure
Ground understands, for current technique that is existing or will developing later, mechanism, manufacture, material composition, means, method or
Step, the knot that the function or acquisition that wherein their execution are substantially the same with the corresponding embodiment that the present invention is described are substantially the same
Really, they can be applied according to the present invention.Therefore, appended claims of the present invention are intended to these techniques, mechanism, system
Make, material composition, means, method or step are included in its protection domain.
Claims (8)
1. a kind of automatic addition high-speed line bead probe method, it is characterized in that, first by automatic addition high-speed line bead
Probe program is implanted in the skill instruments of cadence softwares, then by performing automatic addition high-speed line bead
Probe program carries out key addition high-speed line bead probe.
2. a kind of automatic addition high-speed line bead probe according to claim 1 method, it is characterized in that, it is described automatic
Adding high-speed line bead probe method includes step in detail below:
Step 1, the program that automatic addition high-speed line bead probe in pcb board are set is write;
Step 2, automatic addition high-speed line bead probe program is put into the skill tools menus of cadence softwares;
Step 3, automatic addition high-speed line bead probe program is performed according to demand;
Step 4, trace high-speed line bead probe are chosen in automatic addition.
3. a kind of automatic addition high-speed line bead probe according to claim 2 method, it is characterized in that, it is described automatic
The compiling procedure of addition high-speed line bead probe program comprises the following steps:
1), selection is currently needed for adding high-speed line bead probe trace;
2), high-speed line bead probe are packaged.
4. a kind of automatic addition high-speed line bead probe according to claim 3 method, it is characterized in that, from design text
Selection is currently needed for adding high-speed line bead probe trace in shelves.
5. a kind of automatic addition high-speed line bead probe according to claim 3 method, it is characterized in that, selection is current
Different bead probe are selected according to different trace width when needing to add high-speed line bead probe trace;To height
Named when fast line bead probe are packaged using correspondence trace width.
6. a kind of automatic addition high-speed line bead probe according to claim 2 method, it is characterized in that, automatic addition
High-speed line bead probe process includes modification high-speed line bead probe process, the modification high-speed line bead probe
Process be:Add partial profiles in high-speed line bead probe program in pcb board automatically by changing, then should
Program is put into the skill tools menus of cadence softwares, and finally the Layout background data bases designed are directly repaiied
Change, so as to realize that a key adds the high-speed line bead probe for choosing trace automatically.
7. a kind of automatic addition high-speed line bead probe according to claim 6 method, it is characterized in that, the part
The modification process of configuration file is:The corresponding configuration file under installation path is first turned on, configuration modification is then carried out, finally will
Amended configuration file is updated into automatic addition high-speed line bead probe program.
8. the method for automatic addition high-speed line bead probe according to claim 2 to 7 any one a kind of, its feature
It is that the method for the automatic addition high-speed line bead probe is further comprising the steps of:
Step 5, Done orders are exported after addition high-speed line bead probe.
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Cited By (1)
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CN116738898A (en) * | 2023-05-04 | 2023-09-12 | 合芯科技(苏州)有限公司 | Method, device, equipment and storage medium for rapidly checking mechanism diagram |
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Application publication date: 20170929 |