CN107217235A - A kind of LED evaporation process - Google Patents
A kind of LED evaporation process Download PDFInfo
- Publication number
- CN107217235A CN107217235A CN201710282115.8A CN201710282115A CN107217235A CN 107217235 A CN107217235 A CN 107217235A CN 201710282115 A CN201710282115 A CN 201710282115A CN 107217235 A CN107217235 A CN 107217235A
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- CN
- China
- Prior art keywords
- evaporation
- substrate
- temperature
- minutes
- tin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001704 evaporation Methods 0.000 title claims abstract description 77
- 230000008020 evaporation Effects 0.000 title claims abstract description 77
- 238000000034 method Methods 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 45
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 33
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 14
- 239000011248 coating agent Substances 0.000 claims abstract description 9
- 238000000576 coating method Methods 0.000 claims abstract description 9
- 230000014759 maintenance of location Effects 0.000 claims abstract description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 27
- TVQLLNFANZSCGY-UHFFFAOYSA-N disodium;dioxido(oxo)tin Chemical group [Na+].[Na+].[O-][Sn]([O-])=O TVQLLNFANZSCGY-UHFFFAOYSA-N 0.000 claims description 10
- 229940079864 sodium stannate Drugs 0.000 claims description 10
- 238000007747 plating Methods 0.000 claims description 6
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims 1
- 229910052708 sodium Inorganic materials 0.000 claims 1
- 239000011734 sodium Substances 0.000 claims 1
- 238000002834 transmittance Methods 0.000 abstract description 5
- 230000005540 biological transmission Effects 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000011324 bead Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
A kind of LED evaporation process, belongs to LED manufacturing technology field, comprises the following steps：(1) substrate is selected, the use of tin is that substrate is once deposited coating；(2) hardening agent is coated to the substrate surface after being once deposited, is then toasted；(3) secondary evaporation is carried out to the substrate after baking, secondary evaporation is vacuum state；(4) vacuum is adjusted to 10 after secondary evaporation‑1~10‑2Pa, temperature is adjusted to 210~220 DEG C, and the retention time is 10~15 minutes so that the stability of tin layers is high after evaporation；(5) the evaporation substrate for treating step (4) is cooled to normal temperature with blower fan, obtains finished product.The present invention has the characteristics of improving LED brightness, improve panel electric conductivity and improve panel light transmission rate, and the present invention improves LED brightness, strengthens illuminating effect；The present invention improves panel electric conductivity and light transmittance, strengthens LED performance.
Description
Technical field
The invention belongs to LED manufacturing technology field, more particularly to a kind of LED evaporation process.
Background technology
LED support is the bottom susceptor of LED lamp bead before encapsulation, on the basis of LED support, and chip is fixed,
Burn-on positive and negative electrode, then it is once in package shape with packaging plastic.At present, there is brightness not enough in LED, and panel light transmission rate is not high to ask
Topic.
The content of the invention
The technical problems to be solved by the invention are to provide a kind of raising LED brightness, improve panel electric conductivity and carry
The LED evaporation process of high panel light transmission rate.
To solve the above problems, a kind of LED evaporation process of the present invention, comprises the following steps：
(1) substrate is selected, the use of tin is that substrate is once deposited coating, evaporation temperature is 160~180 DEG C, evaporation
Time is 2~3 minutes, and tin thickness is 1~2um；
(2) hardening agent is coated to the substrate surface after being once deposited, is then toasted, baking time is 45~55 points
Clock, baking temperature is 75~85 DEG C；
(3) secondary evaporation is carried out to the substrate after baking, secondary evaporation is vacuum state, and vacuum is 10-4~10-5Pa,
Secondary evaporation temperature is 480~500 DEG C, and secondary evaporation time is 7~9 minutes, and tin thickness is 9~10um；
(4) vacuum is adjusted to 10 after secondary evaporation-1~10-2Pa, temperature is adjusted to 210~220 DEG C, retention time
For 10~15 minutes so that the stability of tin layers is high after evaporation；
(5) the evaporation substrate for treating step (4) is cooled to normal temperature with blower fan, obtains finished product.
The hardening agent is sodium stannate and sodium hydroxide, and the ratio of sodium stannate and sodium hydroxide is 9:1 or 11:1.
Compared with prior art, the present invention has advantages below：There is the present invention brightness of raising LED, raising panel to lead
Electrically with panel light transmission rate is improved the characteristics of, the present invention improves LED brightness, strengthens illuminating effect；The present invention improves panel and led
Electrical and light transmittance, strengthens LED performance.
Embodiment
Embodiment 1
A kind of LED evaporation process, comprises the following steps：(1) substrate is selected, the use of tin is that coating is once steamed substrate
Plating, evaporation temperature is 160 DEG C, and evaporation time is 2 minutes, and tin thickness is 1um；(2) substrate surface to after being once deposited is applied
Upper hardening agent, is then toasted, and baking time is 45 minutes, and baking temperature is 75 DEG C；(3) two are carried out to the substrate after baking
Secondary evaporation, secondary evaporation is vacuum state, and vacuum is 10-4Pa, secondary evaporation temperature is 480 DEG C, and secondary evaporation time is 7 points
Clock, tin thickness is 9um；(4) vacuum is adjusted to 10 after secondary evaporation-1Pa, temperature is adjusted to 210 DEG C, and the retention time is
10 minutes so that the stability of tin layers is high after evaporation；(5) the evaporation substrate for treating step (4) is cooled to normal temperature with blower fan,
Obtain finished product.
Hardening agent is sodium stannate and sodium hydroxide, and the ratio of sodium stannate and sodium hydroxide is 9:1.
It is demonstrated experimentally that LED brightness highest under this parameter；Panel electric conductivity and light transmittance are higher.
Embodiment 2
A kind of LED evaporation process, comprises the following steps：(1) substrate is selected, the use of tin is that coating is once steamed substrate
Plating, evaporation temperature is 170 DEG C, and evaporation time is 2 minutes, and tin thickness is 1um；(2) substrate surface to after being once deposited is applied
Upper hardening agent, is then toasted, and baking time is 50 minutes, and baking temperature is 80 DEG C；(3) two are carried out to the substrate after baking
Secondary evaporation, secondary evaporation is vacuum state, and vacuum is 10-4Pa, secondary evaporation temperature is 490 DEG C, and secondary evaporation time is 8 points
Clock, tin thickness is 10um；(4) vacuum is adjusted to 10 after secondary evaporation-2Pa, temperature is adjusted to 215 DEG C, and the retention time is
13 minutes so that the stability of tin layers is high after evaporation；(5) the evaporation substrate for treating step (4) is cooled to normal temperature with blower fan,
Obtain finished product.
Hardening agent is sodium stannate and sodium hydroxide, and the ratio of sodium stannate and sodium hydroxide is 11:1.
It is demonstrated experimentally that LED brightness highest under this parameter；Panel electric conductivity and light transmittance highest.
Therefore, the present embodiment is preferred embodiment.
Embodiment 3
A kind of LED evaporation process, comprises the following steps：(1) substrate is selected, the use of tin is that coating is once steamed substrate
Plating, evaporation temperature is 180 DEG C, and evaporation time is 3 minutes, and tin thickness is 2um；(2) substrate surface to after being once deposited is applied
Upper hardening agent, is then toasted, and baking time is 55 minutes, and baking temperature is 85 DEG C；(3) two are carried out to the substrate after baking
Secondary evaporation, secondary evaporation is vacuum state, and vacuum is 10-5Pa, secondary evaporation temperature is 500 DEG C, and secondary evaporation time is 9 points
Clock, tin thickness is 10um；(4) vacuum is adjusted to 10 after secondary evaporation-2Pa, temperature is adjusted to 220 DEG C, and the retention time is
15 minutes so that the stability of tin layers is high after evaporation；(5) the evaporation substrate for treating step (4) is cooled to normal temperature with blower fan,
Obtain finished product.
Hardening agent is sodium stannate and sodium hydroxide, and the ratio of sodium stannate and sodium hydroxide is 11:1.
It is demonstrated experimentally that LED brightness is higher under this parameter；Panel electric conductivity and light transmittance highest.
Claims (5)
1. a kind of LED evaporation process, it is characterised in that:Comprise the following steps：
(1) substrate is selected, the use of tin is that substrate is once deposited coating, evaporation temperature is 160~180 DEG C, evaporation time
For 2~3 minutes, tin thickness was 1~2um；
(2) hardening agent is coated to the substrate surface after being once deposited, is then toasted, baking time is 45~55 minutes, is dried
Roasting temperature is 75~85 DEG C；
(3) secondary evaporation is carried out to the substrate after baking, secondary evaporation is vacuum state, and vacuum is 10-4~10-5Pa, it is secondary
It is 480~500 DEG C that temperature, which is deposited, and secondary evaporation time is 7~9 minutes, and tin thickness is 9~10um；
(4) vacuum is adjusted to 10 after secondary evaporation-1~10-2Pa, temperature is adjusted to 210~220 DEG C, and the retention time is 10~
15 minutes；
(5) the evaporation substrate for treating step (4) is cooled to normal temperature with blower fan, obtains finished product.
2. a kind of LED evaporation process according to claim 1, it is characterised in that：The hardening agent is sodium stannate and hydroxide
The ratio of sodium, sodium stannate and sodium hydroxide is 9:1 or 11:1.
3. a kind of LED evaporation process according to claim 1, it is characterised in that：Comprise the following steps：
(1) substrate is selected, the use of tin is that substrate is once deposited coating, evaporation temperature is 160 DEG C, and evaporation time is 2 points
Clock, tin thickness is 1um；
(2) hardening agent is coated to the substrate surface after being once deposited, is then toasted, baking time is 45 minutes, baking temperature
Spend for 75 DEG C；
(3) secondary evaporation is carried out to the substrate after baking, secondary evaporation is vacuum state, and vacuum is 10-4Pa, secondary evaporation temperature
Spend for 480 DEG C, secondary evaporation time is 7 minutes, and tin thickness is 9um；
(4) vacuum is adjusted to 10 after secondary evaporation-1Pa, temperature is adjusted to 210 DEG C, and the retention time is 10 minutes so that steamed
The stability of tin layers is high after plating；
(5) the evaporation substrate for treating step (4) is cooled to normal temperature with blower fan, obtains finished product.
4. a kind of LED evaporation process according to claim 1, it is characterised in that：Comprise the following steps：
(1) substrate is selected, the use of tin is that substrate is once deposited coating, evaporation temperature is 170 DEG C, and evaporation time is 2 points
Clock, tin thickness is 1um；
(2) hardening agent is coated to the substrate surface after being once deposited, is then toasted, baking time is 50 minutes, baking temperature
Spend for 80 DEG C；
(3) secondary evaporation is carried out to the substrate after baking, secondary evaporation is vacuum state, and vacuum is 10-4Pa, secondary evaporation temperature
Spend for 490 DEG C, secondary evaporation time is 8 minutes, and tin thickness is 10um；
(4) vacuum is adjusted to 10 after secondary evaporation-2Pa, temperature is adjusted to 215 DEG C, and the retention time is 13 minutes so that steamed
The stability of tin layers is high after plating；
(5) the evaporation substrate for treating step (4) is cooled to normal temperature with blower fan, obtains finished product.
5. a kind of LED evaporation process according to claim 1, it is characterised in that：Comprise the following steps：
(1) substrate is selected, the use of tin is that substrate is once deposited coating, evaporation temperature is 180 DEG C, and evaporation time is 3 points
Clock, tin thickness is 2um；
(2) hardening agent is coated to the substrate surface after being once deposited, is then toasted, baking time is 55 minutes, baking temperature
Spend for 85 DEG C；
(3) secondary evaporation is carried out to the substrate after baking, secondary evaporation is vacuum state, and vacuum is 10-5Pa, secondary evaporation temperature
Spend for 500 DEG C, secondary evaporation time is 9 minutes, and tin thickness is 10um；
(4) vacuum is adjusted to 10 after secondary evaporation-2Pa, temperature is adjusted to 220 DEG C, and the retention time is 15 minutes so that steamed
The stability of tin layers is high after plating；
(5) the evaporation substrate for treating step (4) is cooled to normal temperature with blower fan, obtains finished product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710282115.8A CN107217235A (en) | 2017-04-26 | 2017-04-26 | A kind of LED evaporation process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710282115.8A CN107217235A (en) | 2017-04-26 | 2017-04-26 | A kind of LED evaporation process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107217235A true CN107217235A (en) | 2017-09-29 |
Family
ID=59943788
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710282115.8A Pending CN107217235A (en) | 2017-04-26 | 2017-04-26 | A kind of LED evaporation process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107217235A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106229392A (en) * | 2016-08-31 | 2016-12-14 | 山东浪潮华光光电子股份有限公司 | A kind of manufacture method of the ito thin film improving LED anti-ESD ability |
| CN106298242A (en) * | 2016-09-30 | 2017-01-04 | 铜陵市超越电子有限公司 | A kind of metallized film production technology |
-
2017
- 2017-04-26 CN CN201710282115.8A patent/CN107217235A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106229392A (en) * | 2016-08-31 | 2016-12-14 | 山东浪潮华光光电子股份有限公司 | A kind of manufacture method of the ito thin film improving LED anti-ESD ability |
| CN106298242A (en) * | 2016-09-30 | 2017-01-04 | 铜陵市超越电子有限公司 | A kind of metallized film production technology |
Non-Patent Citations (2)
| Title |
|---|
| 刘全校: "《包装材料成型加工技术》", 31 January 2017, 印刷工业出版社 * |
| 孙承松: "《薄膜技术及应用》", 31 August 1998, 东北大学出版社 * |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170929 |