CN107204334A - A kind of encapsulating structure of UVLED lamps - Google Patents
A kind of encapsulating structure of UVLED lamps Download PDFInfo
- Publication number
- CN107204334A CN107204334A CN201710447509.4A CN201710447509A CN107204334A CN 107204334 A CN107204334 A CN 107204334A CN 201710447509 A CN201710447509 A CN 201710447509A CN 107204334 A CN107204334 A CN 107204334A
- Authority
- CN
- China
- Prior art keywords
- glue line
- encapsulating structure
- lamp socket
- leds
- chips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003292 glue Substances 0.000 claims abstract description 46
- 239000000843 powder Substances 0.000 claims abstract description 38
- 239000000919 ceramic Substances 0.000 claims abstract description 23
- 239000011521 glass Substances 0.000 claims abstract description 15
- 229910052751 metal Inorganic materials 0.000 claims abstract description 14
- 239000002184 metal Substances 0.000 claims abstract description 14
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 16
- 239000011368 organic material Substances 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 6
- 238000005538 encapsulation Methods 0.000 claims description 5
- 230000003247 decreasing effect Effects 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 230000032683 aging Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000004224 protection Effects 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000006750 UV protection Effects 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 230000000844 anti-bacterial effect Effects 0.000 description 1
- 230000002155 anti-virotic effect Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- -1 ring Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
Abstract
The present invention provides a kind of encapsulating structure of UV LEDs, it is used for the glass cover-plate for covering the lamp socket including a lamp socket, UV chips and one, the downward indent of top surface of the lamp socket offers a groove, the UV chips are fixed with the bottom surface of the groove, the glass cover-plate is bonded by a glue line and covered on the top surface of the lamp socket, and metal powder and/or ceramic powder are disposed with the glue line.The encapsulating structure of the UV LEDs can weaken transmitted intensity of the UV light in glue line by being disposed with metal powder and/or ceramic powder in glue line, so as to retain the most bonding characteristic of glue line.
Description
Technical field
The present invention relates to LED illumination device field, more particularly to a kind of encapsulating structure of UV LEDs.
Background technology
UV LEDs are one kind of LED, are the black lights of Single wavelength, typically in below 400nm.Pass through setting for specialty
Meter makes UV LEDs that different shape, the hot spot of different irradiation level is presented, and meets edge sealing, and the production in the field such as printing needs.It has
There are life-span of overlength, cold light source, non-thermal radiation, performance stable number of times of changing few and with bactericidal action, than traditional light source more
Safety and environmental protection, thus had a wide range of applications in each fields such as printing, industrial photocuring, sterilization antivirus, false proof, medical, beauty.
At present, UV LEDs are generally directly weldingly fixed on lamp socket, or use benzene in encapsulation using glass cover-plate
Glass cover-plate is adhesively fixed on lamp socket by the organic materials such as ring, silica gel.The structure that organic material is adhesively fixed, cost is low, easily
Operation, but organic material UV resistance is poor, and ageing resistace is poor, and organic material contains C-O bonds, and it is bonded easily by ultraviolet
Interrupt, for a long time by meeting aging after ultraviolet irradiation, mechanical strength weakens, and such as phenyl ring glue-line, UV lines can interrupt its C-O key
Knot, forms cracking, makes its yellow, and then makes encapsulating structure remitted its fury, finally results in glass cover-plate and comes off.Then, directly adopt
Glass cover-plate is fixed on to the structure on lamp socket with the mode of welding, ageing resistace is strong, fixation, but its material is expensive,
Cost is high, and complex process reduces production efficiency.
Therefore the encapsulating structure for selecting a kind of high aging-resisting type, simple to operate, cost low is highly desirable to.
The content of the invention
In view of the shortcomings of the prior art, the present invention is intended to provide a kind of encapsulating structure of UV LEDs, from the encapsulation knot of lamp
Structure, which is improved, starts with, can the poor technical problem with complex process so as to solve the anti-aging type of existing encapsulating structure.
In order to solve the above-mentioned technical problem, the technical solution adopted in the present invention is, a kind of encapsulating structure of UV LEDs,
It is used for the glass cover-plate for covering the lamp socket including a lamp socket, UV chips and one, the downward indent of top surface of the lamp socket is opened up
Have and the UV chips are fixed with a groove, the bottom surface of the groove, the glass cover-plate is bonded by a glue line and covered
On the top surface of the lamp socket, metal powder and/or ceramic powder are disposed with the glue line.The program passes through in glue line
In be disposed with metal powder and/or ceramic powder, transmitted intensity of the UV light in glue line can be weakened, so as to retain glue line
Most bonding characteristic.The amount of the mixture of addition metal powder or ceramic powder or metal powder and ceramic powder is control in bonding
The 30%-80% of glue-line amount.
Preferably, the metal powder is silver powder, and the particle diameter of silver powder is 10-80 microns.
Preferably, the abundance of the metal powder and/or ceramic powder in the glue line is by layer surface to layer bottom
Gradually successively decrease in face.The program makes the distribution of metal powder or/and ceramic powder in glue line from top to bottom gradually successively decrease, and can make UV
Light transmitted intensity in glue line successively decreases from the top layer of layer to deep layer, zero is reduced in certain depth, to retain bonding
The most bonding characteristic of glue-line.
Preferably, the UV chips are a plurality of, and a plurality of UV chips rectangular arrays are arranged in the bottom surface of the groove
On.
Preferably, the UV chips be by UV LED chips melten glass encapsulation form, the UV LED chips with it is described
Lamp socket is electrically connected.
Preferably, the glue line is organic material glue line.
The beneficial effect brought compared with prior art of the present invention is：The present invention in glue line by being disposed with gold
Belong to powder and/ceramic powder, and metal powder and/or ceramic powder being distributed as in glue line are gradually successively decreased from top to bottom, so as to subtract
Weak ultraviolet line retains the most viscosity of glue line, used into meeting UV LEDs to the transmitted intensity of glue line
This is low, under glue-line encapsulating structure simple to operate, improves the mechanical strength of the encapsulating structure, also increases the optional of cohesive material
Scope, it is simple in construction, it is easy to operate, improve production efficiency.
Brief description of the drawings
Fig. 1 is the structural representation of the embodiment of the present invention；
Fig. 2 is the cross-sectional view of the embodiment of the present invention.
Embodiment
In conjunction with the drawings and specific embodiments, the present invention is further described.
Embodiment 1
Referring to Fig. 1 and Fig. 2, the present invention relates to a kind of encapsulating structure of UV LEDs, including a lamp socket 10, four UV chips 20
And one be used to cover the glass cover-plate 30 of lamp socket 10, the downward indent of top surface 11 of lamp socket 10 offers a groove 12, four UV
The rectangular array of chip 20 is arranged on the bottom surface 121 of groove 12, and then each UV chips 20 are to melt glass by UV LED chips
Glass encapsulation is formed, and UV LED chips are electrically connected with lamp socket 10.
Glass cover-plate 30 is bonded by a glue line 40 and covered on the top surface 11 of lamp socket 10,40 arrangement in glue line
There is silver powder, the particle diameter of silver powder is 10-80 microns, and the addition of silver powder is the 30% of glue line 40, and silver powder is in glue line 40
Interior abundance is gradually to be successively decreased to layer bottom surface by layer surface.Silver powder is added in glue line 40, is manually operable addition
It can be added by machine operations, first brush a thin layer of adhesive glue on the top surface 11 of lamp socket 10, silver powder is then spread in adhesive glue,
Then adhesive glue is painted again, is repeated with this, silver powder from down to up successively increases, so as to weaken ultraviolet light to adhesive glue
The transmitted intensity of layer, retains the most viscosity of glue line, is meeting UV LEDs using low, the simple to operate glue-line of cost
Under encapsulating structure, the mechanical strength of the encapsulating structure is improved.In addition, glue-line of the glue line 40 using organic material, such as phenyl ring
Glue-line.
Embodiment 2
The structure of the present embodiment is substantially the same with embodiment 1, and structure identical is not described in detail, and only describes the ground differed
Side.In the present embodiment, arrangement is ceramic powder in glue line 40, the particle diameter of ceramic powder is 20-80 microns, and ceramic powder adds
Dosage is the 55% of glue line 40, and abundance of the ceramic powder in glue line 40 is gradually to be passed to layer bottom surface by layer surface
Subtract.The step that ceramic powder is added in glue line 40 is consistent with embodiment 1.
Embodiment 3
The structure of the present embodiment is substantially the same with embodiment 1, and structure identical is not described in detail, and only describes the ground differed
Side.In the present embodiment, what is arranged in glue line 40 is the mixture of ceramic powder and silver powder, and the particle diameter of silver powder is micro- for 10-80
Rice, the particle diameter of ceramic powder is 20-80 microns, and the addition of silver powder and ceramic powder mixture is the 80% of glue line 40, and ceramics
The abundance of powder and silver powder mixture in glue line 40 is gradually to be successively decreased to layer bottom surface by layer surface.Ceramic powder and silver powder are mixed
The step that compound is added in glue line 40 is consistent with embodiment 1.
It should be noted that the glue line of the present invention can also use inorganic glue-line, metal powder is added in glue line
And/or ceramic powder, add the optional scope of glue line material.
The preferred embodiments of the present invention are these are only, its scope of the claims are not thereby limited, for those skilled in the art
For member, other various corresponding changes and deformation are made in technical scheme that can be as described above and design, and own
These change and deformation should all belong within the protection domain of the claims in the present invention.
Claims (6)
1. a kind of encapsulating structure of UV LEDs, including a lamp socket（10）, UV chips（20）And one be used for cover the lamp socket
（10）Glass cover-plate（30）, the lamp socket（10）Top surface（11）Downward indent offers a groove（12）, the groove
（12）Bottom surface（121）On be fixed with the UV chips（20）, the glass cover-plate（30）Pass through a glue line（40）Bond
Cover in the lamp socket（10）Top surface（11）On, it is characterised in that：In the glue line（40）Be disposed with metal powder and/or
Ceramic powder.
2. the encapsulating structure of UV LEDs as claimed in claim 1, it is characterised in that：The metal powder is silver powder, silver powder
Particle diameter is 10-80 microns.
3. the encapsulating structure of UV LEDs as claimed in claim 1, it is characterised in that：The metal powder and/or ceramic powder exist
The glue line（40）Interior abundance is gradually to be successively decreased to layer bottom surface by layer surface.
4. the encapsulating structure of UV LEDs as claimed in claim 1, it is characterised in that：The UV chips（20）To be a plurality of,
A plurality of UV chips（20）Rectangular array is arranged in the groove（12）Bottom surface on（121）.
5. the encapsulating structure of UV LEDs as claimed in claim 1, it is characterised in that：The UV chips（20）It is by UV
The encapsulation of LED chip melten glass is formed, the UV LED chips and the lamp socket（10）Electrical connection.
6. the encapsulating structure of UV LEDs as claimed in claim 1, it is characterised in that：The glue line（40）For organic material
Matter glue line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710447509.4A CN107204334A (en) | 2017-06-14 | 2017-06-14 | A kind of encapsulating structure of UVLED lamps |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710447509.4A CN107204334A (en) | 2017-06-14 | 2017-06-14 | A kind of encapsulating structure of UVLED lamps |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107204334A true CN107204334A (en) | 2017-09-26 |
Family
ID=59907023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710447509.4A Pending CN107204334A (en) | 2017-06-14 | 2017-06-14 | A kind of encapsulating structure of UVLED lamps |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107204334A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109713092A (en) * | 2018-12-29 | 2019-05-03 | 中山市奥利安光电科技有限公司 | The encapsulating structure of UV LED and the packaging method of UV LED |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080009086A1 (en) * | 2006-07-09 | 2008-01-10 | Anthony Joseph Whitehead | Method of packaging light emitting diodes |
| CN106025037A (en) * | 2016-05-27 | 2016-10-12 | 厦门市三安光电科技有限公司 | Ultraviolet light emitting diode packaging structure and manufacturing method therefor |
| CN106159060A (en) * | 2015-04-09 | 2016-11-23 | 湖南博元照明科技有限公司 | A kind of LED packaging technology |
| CN106206920A (en) * | 2016-08-29 | 2016-12-07 | 上海瑞丰光电子有限公司 | LED encapsulation structure, method for packing and there is the LED of this LED encapsulation structure |
| CN207052603U (en) * | 2017-06-14 | 2018-02-27 | 厦门煜明光电有限公司 | A kind of encapsulating structure of UVLED lamps |
-
2017
- 2017-06-14 CN CN201710447509.4A patent/CN107204334A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080009086A1 (en) * | 2006-07-09 | 2008-01-10 | Anthony Joseph Whitehead | Method of packaging light emitting diodes |
| CN106159060A (en) * | 2015-04-09 | 2016-11-23 | 湖南博元照明科技有限公司 | A kind of LED packaging technology |
| CN106025037A (en) * | 2016-05-27 | 2016-10-12 | 厦门市三安光电科技有限公司 | Ultraviolet light emitting diode packaging structure and manufacturing method therefor |
| CN106206920A (en) * | 2016-08-29 | 2016-12-07 | 上海瑞丰光电子有限公司 | LED encapsulation structure, method for packing and there is the LED of this LED encapsulation structure |
| CN207052603U (en) * | 2017-06-14 | 2018-02-27 | 厦门煜明光电有限公司 | A kind of encapsulating structure of UVLED lamps |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109713092A (en) * | 2018-12-29 | 2019-05-03 | 中山市奥利安光电科技有限公司 | The encapsulating structure of UV LED and the packaging method of UV LED |
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