CN107204334A - A kind of encapsulating structure of UVLED lamps - Google Patents

A kind of encapsulating structure of UVLED lamps Download PDF

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Publication number
CN107204334A
CN107204334A CN201710447509.4A CN201710447509A CN107204334A CN 107204334 A CN107204334 A CN 107204334A CN 201710447509 A CN201710447509 A CN 201710447509A CN 107204334 A CN107204334 A CN 107204334A
Authority
CN
China
Prior art keywords
glue line
encapsulating structure
lamp socket
leds
chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710447509.4A
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Chinese (zh)
Inventor
李恒彦
王亚山
黄敏
李儒维
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
XIAMEN UM OPTO TECH Co Ltd
Original Assignee
XIAMEN UM OPTO TECH Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by XIAMEN UM OPTO TECH Co Ltd filed Critical XIAMEN UM OPTO TECH Co Ltd
Priority to CN201710447509.4A priority Critical patent/CN107204334A/en
Publication of CN107204334A publication Critical patent/CN107204334A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/56Materials, e.g. epoxy or silicone resin

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention provides a kind of encapsulating structure of UV LEDs, it is used for the glass cover-plate for covering the lamp socket including a lamp socket, UV chips and one, the downward indent of top surface of the lamp socket offers a groove, the UV chips are fixed with the bottom surface of the groove, the glass cover-plate is bonded by a glue line and covered on the top surface of the lamp socket, and metal powder and/or ceramic powder are disposed with the glue line.The encapsulating structure of the UV LEDs can weaken transmitted intensity of the UV light in glue line by being disposed with metal powder and/or ceramic powder in glue line, so as to retain the most bonding characteristic of glue line.

Description

A kind of encapsulating structure of UVLED lamps
Technical field
The present invention relates to LED illumination device field, more particularly to a kind of encapsulating structure of UV LEDs.
Background technology
UV LEDs are one kind of LED, are the black lights of Single wavelength, typically in below 400nm.Pass through setting for specialty Meter makes UV LEDs that different shape, the hot spot of different irradiation level is presented, and meets edge sealing, and the production in the field such as printing needs.It has There are life-span of overlength, cold light source, non-thermal radiation, performance stable number of times of changing few and with bactericidal action, than traditional light source more Safety and environmental protection, thus had a wide range of applications in each fields such as printing, industrial photocuring, sterilization antivirus, false proof, medical, beauty.
At present, UV LEDs are generally directly weldingly fixed on lamp socket, or use benzene in encapsulation using glass cover-plate Glass cover-plate is adhesively fixed on lamp socket by the organic materials such as ring, silica gel.The structure that organic material is adhesively fixed, cost is low, easily Operation, but organic material UV resistance is poor, and ageing resistace is poor, and organic material contains C-O bonds, and it is bonded easily by ultraviolet Interrupt, for a long time by meeting aging after ultraviolet irradiation, mechanical strength weakens, and such as phenyl ring glue-line, UV lines can interrupt its C-O key Knot, forms cracking, makes its yellow, and then makes encapsulating structure remitted its fury, finally results in glass cover-plate and comes off.Then, directly adopt Glass cover-plate is fixed on to the structure on lamp socket with the mode of welding, ageing resistace is strong, fixation, but its material is expensive, Cost is high, and complex process reduces production efficiency.
Therefore the encapsulating structure for selecting a kind of high aging-resisting type, simple to operate, cost low is highly desirable to.
The content of the invention
In view of the shortcomings of the prior art, the present invention is intended to provide a kind of encapsulating structure of UV LEDs, from the encapsulation knot of lamp Structure, which is improved, starts with, can the poor technical problem with complex process so as to solve the anti-aging type of existing encapsulating structure.
In order to solve the above-mentioned technical problem, the technical solution adopted in the present invention is, a kind of encapsulating structure of UV LEDs, It is used for the glass cover-plate for covering the lamp socket including a lamp socket, UV chips and one, the downward indent of top surface of the lamp socket is opened up Have and the UV chips are fixed with a groove, the bottom surface of the groove, the glass cover-plate is bonded by a glue line and covered On the top surface of the lamp socket, metal powder and/or ceramic powder are disposed with the glue line.The program passes through in glue line In be disposed with metal powder and/or ceramic powder, transmitted intensity of the UV light in glue line can be weakened, so as to retain glue line Most bonding characteristic.The amount of the mixture of addition metal powder or ceramic powder or metal powder and ceramic powder is control in bonding The 30%-80% of glue-line amount.
Preferably, the metal powder is silver powder, and the particle diameter of silver powder is 10-80 microns.
Preferably, the abundance of the metal powder and/or ceramic powder in the glue line is by layer surface to layer bottom Gradually successively decrease in face.The program makes the distribution of metal powder or/and ceramic powder in glue line from top to bottom gradually successively decrease, and can make UV Light transmitted intensity in glue line successively decreases from the top layer of layer to deep layer, zero is reduced in certain depth, to retain bonding The most bonding characteristic of glue-line.
Preferably, the UV chips are a plurality of, and a plurality of UV chips rectangular arrays are arranged in the bottom surface of the groove On.
Preferably, the UV chips be by UV LED chips melten glass encapsulation form, the UV LED chips with it is described Lamp socket is electrically connected.
Preferably, the glue line is organic material glue line.
The beneficial effect brought compared with prior art of the present invention is:The present invention in glue line by being disposed with gold Belong to powder and/ceramic powder, and metal powder and/or ceramic powder being distributed as in glue line are gradually successively decreased from top to bottom, so as to subtract Weak ultraviolet line retains the most viscosity of glue line, used into meeting UV LEDs to the transmitted intensity of glue line This is low, under glue-line encapsulating structure simple to operate, improves the mechanical strength of the encapsulating structure, also increases the optional of cohesive material Scope, it is simple in construction, it is easy to operate, improve production efficiency.
Brief description of the drawings
Fig. 1 is the structural representation of the embodiment of the present invention;
Fig. 2 is the cross-sectional view of the embodiment of the present invention.
Embodiment
In conjunction with the drawings and specific embodiments, the present invention is further described.
Embodiment 1
Referring to Fig. 1 and Fig. 2, the present invention relates to a kind of encapsulating structure of UV LEDs, including a lamp socket 10, four UV chips 20 And one be used to cover the glass cover-plate 30 of lamp socket 10, the downward indent of top surface 11 of lamp socket 10 offers a groove 12, four UV The rectangular array of chip 20 is arranged on the bottom surface 121 of groove 12, and then each UV chips 20 are to melt glass by UV LED chips Glass encapsulation is formed, and UV LED chips are electrically connected with lamp socket 10.
Glass cover-plate 30 is bonded by a glue line 40 and covered on the top surface 11 of lamp socket 10,40 arrangement in glue line There is silver powder, the particle diameter of silver powder is 10-80 microns, and the addition of silver powder is the 30% of glue line 40, and silver powder is in glue line 40 Interior abundance is gradually to be successively decreased to layer bottom surface by layer surface.Silver powder is added in glue line 40, is manually operable addition It can be added by machine operations, first brush a thin layer of adhesive glue on the top surface 11 of lamp socket 10, silver powder is then spread in adhesive glue, Then adhesive glue is painted again, is repeated with this, silver powder from down to up successively increases, so as to weaken ultraviolet light to adhesive glue The transmitted intensity of layer, retains the most viscosity of glue line, is meeting UV LEDs using low, the simple to operate glue-line of cost Under encapsulating structure, the mechanical strength of the encapsulating structure is improved.In addition, glue-line of the glue line 40 using organic material, such as phenyl ring Glue-line.
Embodiment 2
The structure of the present embodiment is substantially the same with embodiment 1, and structure identical is not described in detail, and only describes the ground differed Side.In the present embodiment, arrangement is ceramic powder in glue line 40, the particle diameter of ceramic powder is 20-80 microns, and ceramic powder adds Dosage is the 55% of glue line 40, and abundance of the ceramic powder in glue line 40 is gradually to be passed to layer bottom surface by layer surface Subtract.The step that ceramic powder is added in glue line 40 is consistent with embodiment 1.
Embodiment 3
The structure of the present embodiment is substantially the same with embodiment 1, and structure identical is not described in detail, and only describes the ground differed Side.In the present embodiment, what is arranged in glue line 40 is the mixture of ceramic powder and silver powder, and the particle diameter of silver powder is micro- for 10-80 Rice, the particle diameter of ceramic powder is 20-80 microns, and the addition of silver powder and ceramic powder mixture is the 80% of glue line 40, and ceramics The abundance of powder and silver powder mixture in glue line 40 is gradually to be successively decreased to layer bottom surface by layer surface.Ceramic powder and silver powder are mixed The step that compound is added in glue line 40 is consistent with embodiment 1.
It should be noted that the glue line of the present invention can also use inorganic glue-line, metal powder is added in glue line And/or ceramic powder, add the optional scope of glue line material.
The preferred embodiments of the present invention are these are only, its scope of the claims are not thereby limited, for those skilled in the art For member, other various corresponding changes and deformation are made in technical scheme that can be as described above and design, and own These change and deformation should all belong within the protection domain of the claims in the present invention.

Claims (6)

1. a kind of encapsulating structure of UV LEDs, including a lamp socket(10), UV chips(20)And one be used for cover the lamp socket (10)Glass cover-plate(30), the lamp socket(10)Top surface(11)Downward indent offers a groove(12), the groove (12)Bottom surface(121)On be fixed with the UV chips(20), the glass cover-plate(30)Pass through a glue line(40)Bond Cover in the lamp socket(10)Top surface(11)On, it is characterised in that:In the glue line(40)Be disposed with metal powder and/or Ceramic powder.
2. the encapsulating structure of UV LEDs as claimed in claim 1, it is characterised in that:The metal powder is silver powder, silver powder Particle diameter is 10-80 microns.
3. the encapsulating structure of UV LEDs as claimed in claim 1, it is characterised in that:The metal powder and/or ceramic powder exist The glue line(40)Interior abundance is gradually to be successively decreased to layer bottom surface by layer surface.
4. the encapsulating structure of UV LEDs as claimed in claim 1, it is characterised in that:The UV chips(20)To be a plurality of, A plurality of UV chips(20)Rectangular array is arranged in the groove(12)Bottom surface on(121).
5. the encapsulating structure of UV LEDs as claimed in claim 1, it is characterised in that:The UV chips(20)It is by UV The encapsulation of LED chip melten glass is formed, the UV LED chips and the lamp socket(10)Electrical connection.
6. the encapsulating structure of UV LEDs as claimed in claim 1, it is characterised in that:The glue line(40)For organic material Matter glue line.
CN201710447509.4A 2017-06-14 2017-06-14 A kind of encapsulating structure of UVLED lamps Pending CN107204334A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710447509.4A CN107204334A (en) 2017-06-14 2017-06-14 A kind of encapsulating structure of UVLED lamps

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710447509.4A CN107204334A (en) 2017-06-14 2017-06-14 A kind of encapsulating structure of UVLED lamps

Publications (1)

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CN107204334A true CN107204334A (en) 2017-09-26

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109713092A (en) * 2018-12-29 2019-05-03 中山市奥利安光电科技有限公司 The encapsulating structure of UV LED and the packaging method of UV LED

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080009086A1 (en) * 2006-07-09 2008-01-10 Anthony Joseph Whitehead Method of packaging light emitting diodes
CN106025037A (en) * 2016-05-27 2016-10-12 厦门市三安光电科技有限公司 Ultraviolet light emitting diode packaging structure and manufacturing method therefor
CN106159060A (en) * 2015-04-09 2016-11-23 湖南博元照明科技有限公司 A kind of LED packaging technology
CN106206920A (en) * 2016-08-29 2016-12-07 上海瑞丰光电子有限公司 LED encapsulation structure, method for packing and there is the LED of this LED encapsulation structure
CN207052603U (en) * 2017-06-14 2018-02-27 厦门煜明光电有限公司 A kind of encapsulating structure of UVLED lamps

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080009086A1 (en) * 2006-07-09 2008-01-10 Anthony Joseph Whitehead Method of packaging light emitting diodes
CN106159060A (en) * 2015-04-09 2016-11-23 湖南博元照明科技有限公司 A kind of LED packaging technology
CN106025037A (en) * 2016-05-27 2016-10-12 厦门市三安光电科技有限公司 Ultraviolet light emitting diode packaging structure and manufacturing method therefor
CN106206920A (en) * 2016-08-29 2016-12-07 上海瑞丰光电子有限公司 LED encapsulation structure, method for packing and there is the LED of this LED encapsulation structure
CN207052603U (en) * 2017-06-14 2018-02-27 厦门煜明光电有限公司 A kind of encapsulating structure of UVLED lamps

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109713092A (en) * 2018-12-29 2019-05-03 中山市奥利安光电科技有限公司 The encapsulating structure of UV LED and the packaging method of UV LED

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