CN107196646B - Ceramic packaging chip type self-heating low-power consumption constant temperature crystal oscillator - Google Patents
Ceramic packaging chip type self-heating low-power consumption constant temperature crystal oscillator Download PDFInfo
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- CN107196646B CN107196646B CN201710552765.XA CN201710552765A CN107196646B CN 107196646 B CN107196646 B CN 107196646B CN 201710552765 A CN201710552765 A CN 201710552765A CN 107196646 B CN107196646 B CN 107196646B
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- wafer
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03L—AUTOMATIC CONTROL, STARTING, SYNCHRONISATION, OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
- H03L1/00—Stabilisation of generator output against variations of physical values, e.g. power supply
- H03L1/02—Stabilisation of generator output against variations of physical values, e.g. power supply against variations of temperature only
- H03L1/04—Constructional details for maintaining temperature constant
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
Abstract
The invention discloses a ceramic packaging piece type self-heating low-power-consumption constant-temperature crystal oscillator, which comprises a base and a shell for sealing the base, wherein a wafer fixing table is arranged in the base, two ends of a wafer are connected with the wafer fixing table, and a crystal electrode and a heating resistance film are arranged on the surface of the wafer; and a temperature sensor is arranged below the wafer, and an OCXO temperature control and oscillation integrated circuit is arranged below the temperature sensor. The invention eliminates the temperature gradient between the temperature sensor and the crystal of the traditional temperature control circuit, and reduces the corresponding time of the temperature control circuit, thereby realizing accurate and rapid temperature control; the crystal and the circuit are packaged in the ceramic cavity, so that the miniaturization of the product is realized.
Description
Technical Field
The invention relates to a piezoelectric quartz crystal, in particular to a ceramic packaging piece type self-heating low-power-consumption constant-temperature crystal oscillator.
Background
The constant temperature crystal oscillator realizes the constant temperature of the crystal by controlling the ambient temperature at the periphery of the crystal, and the temperature control sensor, the heating body and the crystal wafer of the constant temperature crystal oscillator temperature control circuit inevitably have thermal gradient and energy loss, which directly causes the traditional constant temperature crystal oscillator to have larger power consumption and volume and longer stabilization time.
Disclosure of Invention
The invention aims to solve the technical problem of providing a ceramic packaging piece type self-heating low-power-consumption constant-temperature crystal oscillator which can eliminate the temperature gradient between a traditional temperature control circuit temperature sensor and a crystal and reduce the corresponding time of a temperature control circuit, thereby realizing accurate and rapid temperature control; the crystal and the circuit are packaged in the ceramic cavity, so that the miniaturization of the product is realized.
In order to solve the technical problems, the invention adopts the following technical scheme:
a ceramic packaging piece type self-heating low-power-consumption constant-temperature crystal oscillator comprises a base and a shell for sealing the base, wherein a wafer fixing table is arranged in the base, two ends of a wafer are connected with the wafer fixing table, and a crystal electrode and a heating resistance film are arranged on the surface of the wafer; and a temperature sensor is arranged below the wafer, and an OCXO temperature control and oscillation integrated circuit is arranged below the temperature sensor.
The base is the main carrier of the present invention, and the ceramic material is used to separate the wafer and the circuit part well.
The wafer mainly comprises a substrate, a crystal electrode and a heating resistance film, wherein the crystal electrode and the heating resistance film are arranged on the surface of the substrate; the crystal electrode is used for crystal oscillation, and the heating function of the wafer is realized after the heating resistance film is electrified.
The shell is used for being matched with the base to seal the whole cavity, and high vacuum seal welding is adopted in the invention, so that the vacuum and cleanness in the cavity of a product are ensured.
The temperature sensor is arranged in the crystal and positioned at the lower end of the wafer, so that the temperature change in the crystal can be directly sensed, and the stable and precise control of the product can be realized by combining a temperature control circuit.
Compared with the prior art, the invention adopting the technical scheme has the prominent characteristics that:
the wafer is used as a heater of the constant-temperature crystal oscillator, heat is directly heated to the wafer, temperature conduction delay and heat loss are avoided, and power consumption of a product is greatly reduced; the temperature sensor for the temperature control circuit is arranged in the crystal cavity, so that the temperature gradient between the temperature sensor and the crystal of the traditional temperature control circuit is eliminated, and the corresponding time of the temperature control circuit is shortened, thereby realizing accurate and rapid temperature control; the crystal and the circuit are packaged in the ceramic cavity, so that the miniaturization of the product is realized.
The further preferred technical scheme is as follows:
the base be equipped with installing zone and installing zone down, go up the fixed wafer of installing zone installation and temperature sensor, the fixed OCXO accuse temperature of installing zone installation is warm oscillation integrated circuit board down.
By providing the upper mounting area and the lower mounting area, the separation of the wafer from the circuit is facilitated.
The middle part of base be equipped with the installation bedplate, installation bedplate top is the installing zone, and installation bedplate below is installing zone down.
The structure of the base is an upper layer and a lower layer, wherein the upper layer is mainly used for placing a wafer and a temperature sensor; the lower layer is used for arranging product circuits and well separating the wafer from the circuit part.
The temperature control circuit in the OCXO temperature control and oscillation integrated circuit is a direct amplification type temperature control circuit and comprises a temperature sensor Rt and a heating resistance film Rh; the oscillating circuit is a classical colpis oscillating circuit.
Drawings
FIG. 1 is a cross-sectional view of an embodiment of the present invention;
FIG. 2 is a top view of the susceptor and wafer;
FIG. 3 is a schematic diagram of a temperature control circuit in an OCXO temperature control and oscillation integrated circuit;
fig. 4 is a schematic diagram of an oscillation circuit in an OCXO temperature controlled and oscillating integrated circuit;
description of reference numerals: 1-a base; 2-a wafer; 3-a housing; 4-a temperature sensor; 5-OCXO temperature control and oscillation integrated circuit; 6-a crystalline crystal electrode; 7-heating the resistive film.
Detailed Description
The present invention will be further described with reference to the following examples.
Referring to fig. 1 and 2, a ceramic package sheet type self-heating low-power consumption constant temperature crystal oscillator is composed of a base 1 and a shell 3 for closing the base 1, wherein a wafer fixing table is arranged in the base 1, two ends of a wafer 2 are connected with the wafer fixing table, and a crystal electrode 6 and a heating resistance film 7 are arranged on the surface of the wafer 2; the terminal of the crystal electrode 6 on the upper surface is c; the terminal of the crystal electrode 6 on the lower surface is d; two terminals a and b of the thermal resistance film 7; a temperature sensor 4 is arranged below the wafer 2, and an OCXO temperature control and oscillation integrated circuit 5 is arranged below the temperature sensor 4.
By providing an upper mounting area, a lower mounting area, separation of the wafer 2 from the circuitry is facilitated.
The middle part of base 1 is equipped with the installation bedplate, and installation bedplate top is the installing zone, and installation bedplate below is installing zone down.
The structure of the base 1 is an upper layer and a lower layer, wherein the upper layer is mainly used for placing the wafer 2 and the temperature sensor 4; the lower layer is used to lay out the product circuit, separating the wafer 2 and the circuit part well.
The susceptor 1 is the main carrier of the present invention, and the wafer 2 is well separated from the circuit part using a ceramic material.
The wafer 2 mainly comprises a substrate, a crystal electrode 6 and a heating resistance film 7, wherein the crystal electrode 6 and the heating resistance film are arranged on the surface of the substrate; the crystal electrode 6 is used for crystal oscillation, and the heating resistor film 7 realizes the function of heating the wafer 2 after the leading-out ends a and b are electrified.
The shell 3 is used for being matched with the base 1 to seal the whole cavity, and high vacuum seal welding is adopted in the invention to ensure the vacuum and cleanness in the product cavity.
The temperature sensor 4 is arranged in the crystal and positioned at the lower end of the wafer 2, can directly sense the temperature change in the crystal and is combined with a temperature control circuit to realize stable and precise control of products.
The OCXO temperature control and oscillation integrated circuit 5 realizes product oscillation and temperature control. Referring to fig. 3, the temperature control circuit adopts a direct amplification type temperature control circuit, where Rt is the temperature sensor 4, rh is the heating resistance film 7, and a and b are two nodes of the resistance film; referring to fig. 4, the oscillator circuit uses a classical colpis oscillator circuit, c, d, two connection points of the crystal electrodes.
The advantages of this embodiment are: the wafer 2 is used as a heater of the constant-temperature crystal oscillator, heat is directly heated on the wafer 2, temperature conduction delay and heat loss are avoided, and power consumption of a product is greatly reduced; the temperature sensor 4 for the temperature control circuit is arranged in the crystal cavity, so that the temperature gradient between the temperature sensor 4 and the crystal of the traditional temperature control circuit is eliminated, and the corresponding time of the temperature control circuit is shortened, thereby realizing accurate and rapid temperature control; the crystal and the circuit are packaged in the ceramic cavity, so that the miniaturization of the product is realized.
The above description is only an embodiment of the present invention, and the protection of the present invention is not limited thereto, and any changes or substitutions equivalent to the technical features of the present invention, which are conceivable by those skilled in the art, are covered within the protection scope of the present invention.
Claims (4)
1. The utility model provides a ceramic package piece formula self-heating low-power consumption constant temperature crystal oscillator, includes the base, seals the shell of base, its characterized in that: a wafer fixing table is arranged in the base, two ends of the wafer are connected with the wafer fixing table, a crystal electrode and a heating resistance film are arranged on the surface of the wafer, a wiring end of the crystal electrode on the upper surface is c, a wiring end of the crystal electrode on the lower surface is d, and two wiring ends of the heating resistance film are a and b; and a temperature sensor is arranged below the wafer, and an OCXO temperature control and oscillation integrated circuit is arranged below the temperature sensor.
2. The ceramic packaged chip self-heating low-power consumption oven controlled crystal oscillator of claim 1, characterized in that: the base be equipped with installing zone and installing zone down, go up the fixed wafer of installing zone installation and temperature sensor, the fixed OCXO accuse temperature of installing zone installation is warm oscillation integrated circuit board down.
3. The ceramic packaged chip self-heating low-power-consumption oven-controlled crystal oscillator according to claim 2, characterized in that: the middle part of base be equipped with the installation bedplate, installation bedplate top is the installing zone, installation bedplate below is installing zone down.
4. The ceramic packaged chip self-heating low-power consumption oven controlled crystal oscillator of claim 1, characterized in that: the temperature control circuit in the OCXO temperature control and oscillation integrated circuit is a direct amplification type temperature control circuit and comprises a temperature sensor Rt and a heating resistance film Rh; the oscillating circuit is a classical colpis oscillating circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710552765.XA CN107196646B (en) | 2017-07-07 | 2017-07-07 | Ceramic packaging chip type self-heating low-power consumption constant temperature crystal oscillator |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710552765.XA CN107196646B (en) | 2017-07-07 | 2017-07-07 | Ceramic packaging chip type self-heating low-power consumption constant temperature crystal oscillator |
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| Publication Number | Publication Date |
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| CN107196646A CN107196646A (en) | 2017-09-22 |
| CN107196646B true CN107196646B (en) | 2023-04-07 |
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| CN201710552765.XA Active CN107196646B (en) | 2017-07-07 | 2017-07-07 | Ceramic packaging chip type self-heating low-power consumption constant temperature crystal oscillator |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110336556A (en) * | 2018-12-31 | 2019-10-15 | 唐山晶源电子有限公司 | A kind of compact ceramic encapsulation chip crystal oscillator of frequency stabilization |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1700589A (en) * | 2004-05-19 | 2005-11-23 | 日本电波工业株式会社 | Constant temperature type crystal oscillator |
| EP1598931A1 (en) * | 2004-05-19 | 2005-11-23 | Nihon Dempa Kogyo Co., Ltd. | Constant temperature type crystal oscillator |
| CN101741314A (en) * | 2008-11-14 | 2010-06-16 | 日本电波工业株式会社 | Constant-temperature type crystal oscillator |
| CN104113302A (en) * | 2014-07-17 | 2014-10-22 | 深圳市福浪电子有限公司 | Vehicle-mounted crystal oscillator |
| JP2015033065A (en) * | 2013-08-06 | 2015-02-16 | 日本電波工業株式会社 | Crystal vibrator and crystal oscillator |
| CN104852728A (en) * | 2015-03-27 | 2015-08-19 | 台湾晶技股份有限公司 | Oven controlled crystal oscillator packaged by embedded heating device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5624864B2 (en) * | 2010-12-06 | 2014-11-12 | 日本電波工業株式会社 | Temperature controlled crystal oscillator and crystal oscillator |
-
2017
- 2017-07-07 CN CN201710552765.XA patent/CN107196646B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1700589A (en) * | 2004-05-19 | 2005-11-23 | 日本电波工业株式会社 | Constant temperature type crystal oscillator |
| EP1598931A1 (en) * | 2004-05-19 | 2005-11-23 | Nihon Dempa Kogyo Co., Ltd. | Constant temperature type crystal oscillator |
| CN101741314A (en) * | 2008-11-14 | 2010-06-16 | 日本电波工业株式会社 | Constant-temperature type crystal oscillator |
| JP2015033065A (en) * | 2013-08-06 | 2015-02-16 | 日本電波工業株式会社 | Crystal vibrator and crystal oscillator |
| CN104113302A (en) * | 2014-07-17 | 2014-10-22 | 深圳市福浪电子有限公司 | Vehicle-mounted crystal oscillator |
| CN104852728A (en) * | 2015-03-27 | 2015-08-19 | 台湾晶技股份有限公司 | Oven controlled crystal oscillator packaged by embedded heating device |
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| CN107196646A (en) | 2017-09-22 |
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