CN211296682U - Constant temperature crystal oscillator - Google Patents
Constant temperature crystal oscillator Download PDFInfo
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- CN211296682U CN211296682U CN202020303655.7U CN202020303655U CN211296682U CN 211296682 U CN211296682 U CN 211296682U CN 202020303655 U CN202020303655 U CN 202020303655U CN 211296682 U CN211296682 U CN 211296682U
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Abstract
The utility model discloses an oven controlled crystal oscillator, include crystal assembly and the oscillation chip subassembly that can heat crystal assembly, the oscillation chip subassembly is including a ceramic base, ceramic base has first installation face and second installation face, be equipped with installation supporting platform on the edge of first installation face, it is equipped with heating resistor to press from both sides between ceramic base's first installation face and the second installation face, ceramic base's installation supporting platform's last plane has a protecting cover through welded fastening, oscillation chip subassembly and crystal assembly all hold in sealed space, be equipped with heating resistor between first installation face and the second installation face, heating resistor also heats the protecting cover when to ceramic base heating. The utility model discloses set up heating resistor in ceramic base, also heat ceramic package and protecting cover when heating resistor heating ceramic base. Also heat the protecting cover when heating resistance heating ceramic base, the protecting cover is with crystal assembly seal parcel to have the function that the heating is heated, can carry out effectual regulation to the temperature in the space.
Description
Technical Field
The utility model relates to an oscillator, in particular to constant temperature crystal oscillator.
Background
The constant temperature crystal oscillator is mainly characterized in that the temperature of the quartz crystal is kept constant at a specific working temperature through a temperature control circuit and a closed structure, so that the variation of the output frequency caused by the change of the ambient temperature can be reduced to the minimum, and the stability of the output frequency of the oscillator is realized.
Compared with the traditional oven controlled crystal oscillator with larger size and volume, the miniaturized oven controlled crystal oscillator is limited by the requirement of size structure, the temperature stability of the oven controlled tank is not easy to maintain, and is easy to be influenced by the temperature change of the external environment; therefore, the applicant of the present invention has developed an oven controlled crystal oscillator with a wrapped heating housing and a quartz crystal package, which combines a heating resistor and a housing with a ceramic base structure, so as to enable a heating source to heat the ceramic base and also heat the housing, so as to keep the temperature in the sealed space constant, reduce the dissipation of heat generated by the heater, and improve various factors influencing the temperature stability to help achieve the stable output of oscillation frequency, thereby solving the problems and the loss of the prior art.
SUMMERY OF THE UTILITY MODEL
The utility model aims at the above-mentioned defect of prior art, provide an oven controlled crystal oscillator.
For solving the above-mentioned defect of prior art, the utility model provides a technical scheme is: the utility model provides an oven controlled crystal oscillator, includes the crystal assembly and can be right the crystal assembly carries out the oscillation chip subassembly that heats, the oscillation chip subassembly is including a ceramic base, ceramic base has first installation face and second installation face, be equipped with installation supporting platform on the edge of first installation face, it is equipped with heating resistor to press from both sides between the first installation face of ceramic base and the second installation face, ceramic base's installation supporting platform's last plane has a protecting cover through welded fastening, the protecting cover with ceramic base welding, formation a sealed space, oscillation chip subassembly and crystal assembly all hold in the sealed space, be equipped with heating resistor between first installation face and the second installation face, heating resistor is right also heating when ceramic base heats the protecting cover.
As an improvement of the oven controlled crystal oscillator, the protecting cover is a metal member.
As an improvement of the constant temperature crystal oscillator of the utility model, the protecting cover and the welding position of the ceramic base are metallic tin.
As an improvement of the utility model, the crystal assembly is welded by the metal tin on the upper plane of the mounting and supporting platform of the ceramic base, the ceramic base is heated while the protective cover is heated with the crystal assembly.
As an improvement of the utility model, install the oscillation chip control circuit on the second installation face, still be connected with temperature control circuit, oscillation circuit and oscillation chip on the oscillation chip control circuit, heating resistor with temperature control circuit connects, the oscillation chip passes through the wiring pin and connects oscillation chip control circuit.
As an improvement of the oven controlled crystal oscillator of the present invention, the temperature control circuit includes a temperature control circuit control unit and a temperature control circuit adjusting element.
As an improvement of the oven controlled crystal oscillator of the present invention, the protection cover is heated by the heating resistor while being capable of adjusting and controlling the temperature in the sealed space, the temperature in the space that makes the seal is kept in a constant temperature state.
As an improvement of the utility model, the crystal component includes a ceramic package and pastes quartz wafer and lid on this ceramic package through the conducting resin in the last metal lid that forms sealed cavity of ceramic package, ceramic package's installation bottom surface is equipped with an inner circuit, quartz wafer is located in the sealed cavity, quartz wafer through contact pin with inner circuit connects, ceramic package's underrun metal tin soldering is in ceramic base's installation supporting platform's last plane.
As an improvement of the present invention, the crystal assembly is located above the oscillating chip assembly, the oscillating chip corresponds to the heating resistor, and the heating resistor heats the ceramic base while facing the oscillating chip, the protecting cover and the ceramic package.
The utility model provides another scheme is: a method of packaging an oven-controlled crystal oscillator, comprising the steps of:
s1), manufacturing a crystal assembly, preparing a ceramic package with a mounting groove, and sticking a quartz wafer in the mounting groove of the ceramic package through conductive adhesive; welding a metal cover on the upper plane of the ceramic package for sealing the mounting groove and forming a sealed cavity;
s2) manufacturing a vibrating chip assembly; preparing a ceramic base with a mounting groove, wherein the diameter or the width of the ceramic base is larger than that of the ceramic package; an oscillating chip is arranged in the mounting groove of the ceramic base; the oscillation chip is connected with the oscillation chip control circuit through a wiring pin; a heating resistor is embedded in the ceramic base, and the oscillating chip control circuit is embedded in the lower end surface of the ceramic base;
s3) assembling the crystal assembly and the oscillating chip assembly; welding the ceramic package on the crystal assembly on the upper plane of the mounting and supporting platform of the ceramic base in a welding mode; tightly connecting the ceramic package and the ceramic base together;
s4) welding a protective cover; the protective cover is welded on the upper plane of the mounting support platform of the ceramic base in a soldering mode; sealing both the crystal assembly and the oscillating chip assembly in the space; the heating resistor heats the ceramic base and also heats the ceramic package and the protective cover.
Compared with the prior art, the utility model has the advantages that: the utility model discloses set up heating resistor in ceramic base, also heat ceramic package and protecting cover when heating resistor heating ceramic base. The ceramic package can also receive and rapidly transfer heat, thereby maintaining the temperature in the space, preventing a distance temperature difference between the wafer and the oscillation chip, and reducing heat loss in heat transfer between the wafer and the oscillation chip. Also heating the protecting cover when heating resistance heating ceramic base, the protecting cover is with the sealed parcel of crystal assembly to have the function that the heating is heated, can carry out effectual regulation to the temperature in the space, prevent that the difference in temperature from bringing the influence to this product. The protecting cover with the heating function can further heat the crystal assembly in the protecting cover, reduce the temperature difference between the wafer and the oscillating chip and stabilize the signal output of the product. The protecting cover can be heated to further reduce the temperature influence of the external environment on the crystal assembly and the oscillating chip in the space.
Drawings
The invention and its advantageous technical effects are described in further detail below with reference to the accompanying drawings and embodiments, in which:
fig. 1 is a sectional view of the present invention.
Reference symbol names: 1. the chip package comprises a crystal assembly 2, an oscillating chip assembly 3, a protective cover 4, a space 5, metal tin 11, a ceramic package 12, conductive adhesive 13, a quartz wafer 14, a sealed cavity 15, a metal cover 16, an internal circuit 21, a ceramic base 22, a first mounting surface 23, a second mounting surface 24, a mounting and supporting platform 25, a heating resistor 26, an oscillating chip 27 and an oscillating chip control circuit.
Detailed Description
The invention will be further described below with reference to the drawings and specific examples, but the embodiments of the invention are not limited thereto.
As shown in FIG. 1, an oven controlled crystal oscillator comprises a crystal assembly 1 and an oscillation chip assembly 2 capable of heating the crystal assembly 1, wherein the oscillation chip assembly 2 comprises a ceramic base 21, the ceramic base 21 is provided with a first mounting surface 22 and a second mounting surface 23, a mounting and supporting platform 24 is arranged on the edge of the first mounting surface 22, a heating resistor 25 is clamped between the first mounting surface 22 and the second mounting surface 23 of the ceramic base 21, a protective cover 3 is fixed on the upper plane of the mounting and supporting platform 24 of the ceramic base 21 by welding, the protective cover 3 is welded with the ceramic base 21, a sealed space 4 is formed, the oscillating chip component 2 and the crystal component 1 are both accommodated in the sealed space 4, a heating resistor 25 is arranged between the first mounting surface 22 and the second mounting surface 23, and the heating resistor 25 heats the ceramic base 21 and the protective cover 3 at the same time.
Preferably, the protective cover 3 is a metal member. The protecting cover of metal material can be heated more fast to with the crystal assembly of heat transfer to in the space, all form a heating whole around making the crystal assembly, wrap up the crystal assembly. The influence of the external environment on the crystal assembly is reduced.
Preferably, the welding position of the protective cover 3 and the ceramic base 21 is metal tin 5 or metal silver. The metal tin or the metal silver has higher activity in metal, has stronger heat conduction capability and reduces heat loss.
Preferably, the crystal assembly 1 is soldered to the upper plane of the mounting support platform 24 of the ceramic base 21 by metal tin or metal silver, and the ceramic base 21 heats up the protective cover 3 and the crystal assembly 1 at the same time. The limitation of the heat transmission distance between the wafer and the oscillation chip can be solved by adopting a mode of directly heating the ceramic base; the influence of the external environment on the heat in the space can be reduced.
Preferably, the second mounting surface 23 is provided with an oscillation chip control circuit 27, the oscillation chip control circuit 27 is further connected with a temperature control circuit, an oscillation circuit and an oscillation chip 26, the heating resistor 25 is connected with the temperature control circuit, and the oscillation chip 26 is connected with the oscillation chip control circuit 27 through a wiring pin.
Preferably, the temperature control circuit includes a temperature control circuit control unit and a temperature control circuit adjustment element. The circuits form circuit paths and can mutually transmit temperature information and heating instruction information.
Preferably, the temperature of the protective cover 3 in the sealed space 4 can be adjusted and controlled while being heated by the heating resistor 25, so that the temperature in the sealed space 4 is kept in a constant temperature state.
Preferably, the crystal assembly 1 includes a ceramic package 11, a quartz chip 13 adhered to the ceramic package 11 through a conductive adhesive 12, and a metal cover 15 covering the ceramic package 11 to form a sealed cavity 14, wherein an inner circuit 16 is disposed on a mounting bottom surface of the ceramic package 11, the quartz chip 13 is located in the sealed cavity 14, the quartz chip 13 is connected to the inner circuit 16 through a contact pin, and a bottom surface of the ceramic package 11 is soldered to an upper plane of a mounting support platform 24 of the ceramic base 21 through a metal tin.
Preferably, the crystal assembly 1 is located above the oscillating chip assembly 2, the oscillating chip 28 corresponds to the heating resistor 25, and the heating resistor 25 heats the ceramic base 21 and also heats the oscillating chip 26, the cover 3, and the ceramic package 11.
A method of packaging an oven-controlled crystal oscillator, comprising the steps of:
s1), manufacturing a crystal component 1, preparing a ceramic package 11 with a mounting groove, and adhering a quartz wafer in the mounting groove of the ceramic package through conductive adhesive; welding a metal cover on the upper plane of the ceramic package for sealing the mounting groove and forming a sealed cavity;
s2) making the oscillating chip assembly 2; preparing a ceramic base with a mounting groove, wherein the diameter or the width of the ceramic base is larger than that of the ceramic package; an oscillating chip is arranged in the mounting groove of the ceramic base; the oscillation chip is connected with the oscillation chip control circuit through a wiring pin; a heating resistor is embedded in the ceramic base, and the oscillating chip control circuit is embedded in the lower end surface of the ceramic base;
s3) assembling the crystal assembly 1 and the oscillation chip assembly 2; welding the ceramic package 11 on the crystal assembly on the upper plane of the mounting support platform 24 of the ceramic base 21 in a welding manner; tightly connecting the ceramic package and the ceramic base together;
s4) welding the protective cover 3; the protective cover 3 is welded on the upper plane of the mounting support platform of the ceramic base 21 in a soldering mode; the crystal component 1 and the oscillating chip component 2 are sealed in the space 4; the heating resistor 25 heats the ceramic base 21 and also heats the ceramic package 11 and the cover 3.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and structures of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. An oven-controlled crystal oscillator includes a crystal assembly and an oscillating chip assembly capable of heating the crystal assembly, the oscillating chip component is characterized by comprising a ceramic base, wherein the ceramic base is provided with a first mounting surface and a second mounting surface, an installation supporting platform is arranged on the edge of the first installation surface, a heating resistor is clamped between the first installation surface and the second installation surface of the ceramic base, the upper plane of the mounting and supporting platform of the ceramic base is fixedly provided with a protective cover by welding, the protective cover and the ceramic base are welded to form a sealed space, the oscillating chip assembly and the crystal assembly are accommodated in the sealed space, a heating resistor is arranged between the first mounting surface and the second mounting surface, and the ceramic base is heated by the heating resistor and the protective cover.
2. The oven-controlled crystal oscillator according to claim 1, characterized in that the cover is a metal member.
3. The oven controlled crystal oscillator of claim 2, wherein the solder joint of the cover and the ceramic base is metallic tin.
4. The oven-controlled crystal oscillator according to claim 1, wherein said crystal assembly is soldered to an upper surface of a mounting support platform of said ceramic base by metal tin, said ceramic base heating while simultaneously heating said cover and said crystal assembly.
5. The oven-controlled crystal oscillator according to claim 1, characterized in that an oscillation chip control circuit is mounted on the second mounting surface, a temperature control circuit, an oscillation circuit and an oscillation chip are further connected to the oscillation chip control circuit, the heating resistor is connected to the temperature control circuit, and the oscillation chip is connected to the oscillation chip control circuit through a wiring pin.
6. The oven controlled crystal oscillator of claim 5, wherein the temperature controlled circuit comprises a temperature controlled circuit control unit and a temperature controlled circuit adjustment element.
7. The oven-controlled crystal oscillator according to claim 1, characterized in that the protective cover is capable of adjusting and controlling the temperature in the sealed space to maintain the temperature in the sealed space in an oven-controlled state while being heated by the heating resistor.
8. The oven-controlled crystal oscillator according to claim 4, wherein the crystal assembly comprises a ceramic package, a quartz wafer bonded to the ceramic package through a conductive adhesive, and a metal cap covering the ceramic package to form a sealed cavity, the ceramic package has a bottom surface provided with an internal circuit, the quartz wafer is located in the sealed cavity, the quartz wafer is connected to the internal circuit through contact pins, and the bottom surface of the ceramic package is soldered to the upper plane of the mounting support platform of the ceramic base through a metal tin.
9. The oven-controlled crystal oscillator of claim 8, wherein the crystal assembly is located above the oscillating die assembly, the oscillating die corresponds to the heating resistor, and the heating resistor heats the ceramic base while heating the oscillating die, the cover, and the ceramic package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020303655.7U CN211296682U (en) | 2020-03-12 | 2020-03-12 | Constant temperature crystal oscillator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020303655.7U CN211296682U (en) | 2020-03-12 | 2020-03-12 | Constant temperature crystal oscillator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211296682U true CN211296682U (en) | 2020-08-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020303655.7U Active CN211296682U (en) | 2020-03-12 | 2020-03-12 | Constant temperature crystal oscillator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211296682U (en) |
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2020
- 2020-03-12 CN CN202020303655.7U patent/CN211296682U/en active Active
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