CN107195753A - A kind of LED and preparation method thereof - Google Patents
A kind of LED and preparation method thereof Download PDFInfo
- Publication number
- CN107195753A CN107195753A CN201710388830.XA CN201710388830A CN107195753A CN 107195753 A CN107195753 A CN 107195753A CN 201710388830 A CN201710388830 A CN 201710388830A CN 107195753 A CN107195753 A CN 107195753A
- Authority
- CN
- China
- Prior art keywords
- led
- pin
- main body
- body connecting
- connecting portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- 238000009434 installation Methods 0.000 claims abstract description 33
- 238000005452 bending Methods 0.000 claims abstract description 11
- 238000001125 extrusion Methods 0.000 claims description 4
- 238000005516 engineering process Methods 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 3
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of LED, it includes pin, and pin includes main body connecting portion, installation portion and the freedom portion being sequentially connected；The junction bending of main body connecting portion and installation portion；The junction bending of installation portion and freedom portion；Main body connecting portion is used for the body for connecting the LED.In LED disclosed by the invention, pin has main body connecting portion, installation portion and the freedom portion being sequentially connected, installation portion in the middle of wherein is bent respectively with the main body connecting portion of its both sides and the junction of freedom portion, pcb board surface can be affixed on, so that whole LED can be assemblied in pcb board in surface-pasted mode.The invention also discloses a kind of preparation method applied to above-mentioned LED, the LED prepared using the production method is applied to PCB mounting technologies.
Description
Technical field
The present invention relates to Mechanical Industry Technology field, more specifically to a kind of LED, a kind of LED preparation is further related to
Method.
Background technology
LED (Light Emitting Diode, Light-Emitting Diode) is often used as indicator lamp, or group in circuit and instrument
Into word, numeral etc. with display.LED need to be assemblied in pcb board, and with component high density on pcb board, highly reliable, miniaturization,
Low cost, installs the demand of automation, increasing pcb board design uses surface mounting technology, but draws with linear pattern
The LED (as shown in Figure 1) of pin is difficult to be applied to above-mentioned surface mounting technology, therefore LED is applied to pcb board surface mount
Technology, is those skilled in the art's technical problem urgently to be resolved hurrily.
The content of the invention
In view of this, the present invention provides a kind of LED, and its pin has three parts being sequentially connected, wherein, middle peace
Dress portion is bent respectively with the main body connecting portion of its both sides and the junction of freedom portion, pcb board surface can be affixed on, so that entirely
LED can be assemblied in pcb board in surface-pasted mode.The present invention also provides a kind of preparation method applied to above-mentioned LED, energy
Obtain the effect for making LED be applied to PCB surface mounting technology.
To achieve the above object, the present invention provides following technical scheme：
A kind of LED, including pin, the pin include main body connecting portion, installation portion and the freedom portion being sequentially connected；It is described
The junction bending of main body connecting portion and the installation portion；The junction bending of the installation portion and the freedom portion；The master
Body connecting portion is used for the body for connecting the LED.
It is preferred that, in above-mentioned LED, the pin is the pin of advance comprising.
It is preferred that, in above-mentioned LED, the main body connecting portion, the installation portion and the freedom portion are integral type structure.
It is preferred that, in above-mentioned LED, the pin is the pin of extrusion forming.
It is preferred that, in above-mentioned LED, the pin is parallel to each other, pacified for main body connecting portion in two, and two pins
Dress portion is parallel to each other, and freedom portion is parallel to each other.
A kind of LED preparation method, for the LED described in any one in above-mentioned technical proposal, including：
1) pin with the main body connecting portion, the installation portion and the freedom portion is prepared；
2) die bond is carried out to the pin；
3) to step 2) in be fixed on the chip of the pin and be packaged.
The present invention provides a kind of LED, and it includes pin, main body connecting portion that pin includes being sequentially connected, installation portion and oneself
By portion；The junction bending of main body connecting portion and installation portion；The junction bending of installation portion and freedom portion；Main body connecting portion is used for
Connect the body of the LED.
In the LED that the present invention is provided, pin has main body connecting portion, installation portion and the freedom portion being sequentially connected, wherein in
Between installation portion bent respectively with the main body connecting portion of its both sides and the junction of freedom portion, pcb board surface can be affixed on so that
Whole LED is set to be assemblied in pcb board in surface-pasted mode.
The present invention also provides a kind of preparation method applied to above-mentioned LED, and the LED prepared using the production method is applied to
PCB mounting technologies.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the accompanying drawing used required in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is the structural representation of LED in the prior art；
Fig. 2 is the main structure diagram of pin provided in an embodiment of the present invention；
Fig. 3 is the side structure schematic view of pin shown in Fig. 2；
Fig. 4 is LED provided in an embodiment of the present invention structural representation；
Wherein, in figure 2 above -4：
Pin 101；Main body connecting portion 111；Installation portion 112；Freedom portion 113.
Embodiment
The embodiment of the invention discloses a kind of LED, its pin has three parts being sequentially connected, wherein, middle peace
Dress portion is bent respectively with the main body connecting portion of its both sides and the junction of freedom portion, pcb board surface can be affixed on, so that entirely
LED can be assemblied in pcb board in surface-pasted mode.The embodiment of the invention also discloses a kind of system applied to above-mentioned LED
Preparation Method, can obtain the effect for making LED be applied to PCB surface mounting technology.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
Fig. 2-Fig. 4 is referred to, the embodiment of the present invention provides a kind of LED, it includes pin 101, pin 101 includes connecting successively
Main body connecting portion 111, installation portion 112 and the freedom portion 113 connect；The junction bending of main body connecting portion 111 and installation portion 112；
The junction bending of installation portion 112 and freedom portion 113；Main body connecting portion 111 is used for the body for connecting the LED.
In LED provided in an embodiment of the present invention, pin 101 has main body connecting portion 111, the installation portion 112 being sequentially connected
With freedom portion 113, wherein, middle installation portion 112 is punished with the main body connecting portion 111 of its both sides and the connection of freedom portion 113
Do not bend, pcb board surface can be affixed on, so that whole LED can be assemblied in pcb board in surface-pasted mode.As above LED
In, freedom portion 113 is used for the surface for being covered on pcb board, and welds (mode for being specially Reflow Soldering) in pcb board.
In the LED that above-described embodiment is provided, pin 101 is the pin of advance comprising, refers specifically to pin 101 for producing
Before LED, the bending pin configuration with aforementioned body connecting portion 111, installation portion 112 and freedom portion 113 is first shaped to.
In the LED that the present embodiment is provided, the advance comprising of pin 101 can avoid carrying out pin 101 to molded LED
Processing, avoids the risk that mechanical stress damage occurs inside LED, and beneficial to equipment investment is saved, improve LED product completely
Yield, so as to reduce cost, lifts properties of product.
For the ease of manufacturing, in above-mentioned LED, main body connecting portion 111, installation portion 112 and the freedom portion of pin 101
113 are set to integral structure.In addition, above-mentioned pin 101 is specially the pin 101 of extrusion forming.
In above-mentioned LED, pin 101 is parallel to each other for main body connecting portion 111 in two, and two pins 101, installation portion
112 are parallel to each other, and freedom portion 113 is parallel to each other.
The embodiment of the present invention also provides a kind of LED preparation method, and it is applied to the LED that above-described embodiment is provided, and it is wrapped
Include following steps：
1) the above-mentioned pin 101 with main body connecting portion 111, installation portion 112 and freedom portion 113 is prepared；
The specific step is that pin 101 is prepared by the way of extrusion forming, and linear pin 101 is formed after extruding
Bending pin 101 with main body connecting portion 111, installation portion 112 and freedom portion 113；
2) die bond is carried out to pin 101；
Installation LED chip and gold thread is needed in the step；
3) to step 2) in be fixed on the chip of pin 101 and be packaged；
Gold thread also needs to be encapsulated in inside encapsulating material in the step.
Carry out above-mentioned steps 1) before, LED need to be designed, progress step 1 is needed according to design after design), or
In step 1) after, step 2) before, carry out LED designs, then according to design needs, walked from suitable pin 101
It is rapid 2).
A kind of LED preparation method of offer of the embodiment of the present invention, the LED that the preparation method application above-described embodiment is provided,
The LED with pin 101 can be made to be applied to pcb board surface mounting technology.
Certainly, LED provided in an embodiment of the present invention preparation method also has its of the relevant LED of above-described embodiment offer
Its effect, will not be repeated here.
The embodiment of each in this specification is described by the way of progressive, and what each embodiment was stressed is and other
Between the difference of embodiment, each embodiment identical similar portion mutually referring to.
The foregoing description of the disclosed embodiments, enables professional and technical personnel in the field to realize or using the present invention.
A variety of modifications to these embodiments will be apparent for those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, it is of the invention
The embodiments shown herein is not intended to be limited to, and is to fit to and principles disclosed herein and features of novelty phase one
The most wide scope caused.
Claims (6)
1. a kind of LED, it is characterised in that including pin, main body connecting portion that the pin includes being sequentially connected, installation portion and from
By portion；The junction bending of the main body connecting portion and the installation portion；The junction of the installation portion and the freedom portion is curved
Folding；The main body connecting portion is used for the body for connecting the LED.
2. LED according to claim 1, it is characterised in that the pin is the pin of advance comprising.
3. LED according to claim 1, it is characterised in that the main body connecting portion, the installation portion and the freedom portion
For integral type structure.
4. LED according to claim 1, it is characterised in that the pin is the pin of extrusion forming.
5. LED according to claim 1, it is characterised in that the pin is main body company in two, and two pins
Socket part is parallel to each other, installation portion is parallel to each other, and freedom portion is parallel to each other.
6. a kind of LED preparation method, for the LED described in claim 1-5 any one, it is characterised in that including：
1) pin with the main body connecting portion, the installation portion and the freedom portion is prepared；
2) die bond is carried out to the pin；
3) to step 2) in be fixed on the chip of the pin and be packaged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710388830.XA CN107195753A (en) | 2017-05-25 | 2017-05-25 | A kind of LED and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710388830.XA CN107195753A (en) | 2017-05-25 | 2017-05-25 | A kind of LED and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107195753A true CN107195753A (en) | 2017-09-22 |
Family
ID=59875051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710388830.XA Pending CN107195753A (en) | 2017-05-25 | 2017-05-25 | A kind of LED and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107195753A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101976659A (en) * | 2010-09-03 | 2011-02-16 | 中兴通讯股份有限公司 | Outer package-free crystal device and manufacturing method thereof |
| CN203445148U (en) * | 2013-09-12 | 2014-02-19 | 江苏稳润光电有限公司 | Infrared light emitting diode packaging structure suitable for SMT process |
| CN205645884U (en) * | 2016-05-30 | 2016-10-12 | 厦门华联电子有限公司 | Be fit for LED that reflow soldering pasted dress |
| CN206774580U (en) * | 2017-05-25 | 2017-12-19 | 宁波升谱光电股份有限公司 | A kind of LED |
-
2017
- 2017-05-25 CN CN201710388830.XA patent/CN107195753A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101976659A (en) * | 2010-09-03 | 2011-02-16 | 中兴通讯股份有限公司 | Outer package-free crystal device and manufacturing method thereof |
| CN203445148U (en) * | 2013-09-12 | 2014-02-19 | 江苏稳润光电有限公司 | Infrared light emitting diode packaging structure suitable for SMT process |
| CN205645884U (en) * | 2016-05-30 | 2016-10-12 | 厦门华联电子有限公司 | Be fit for LED that reflow soldering pasted dress |
| CN206774580U (en) * | 2017-05-25 | 2017-12-19 | 宁波升谱光电股份有限公司 | A kind of LED |
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