CN107195575A - 一种硅片夹持平移机构 - Google Patents

一种硅片夹持平移机构 Download PDF

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CN107195575A
CN107195575A CN201710336509.7A CN201710336509A CN107195575A CN 107195575 A CN107195575 A CN 107195575A CN 201710336509 A CN201710336509 A CN 201710336509A CN 107195575 A CN107195575 A CN 107195575A
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蔡燕
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping

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Abstract

本发明公开了一种硅片夹持平移机构,属于光伏材料加工设备领域。该发明包括固定支架、平移气缸、夹持气缸和硅片夹持板,运送平移板水平滑动设置于平移导向杆,平移气缸输出端与运送平移板一侧中部固定,固定支架上方两侧分别水平设置有硅片夹持板,夹持导向杆垂直于平移导向杆,夹持导向杆两侧分别水平滑动设置有夹持平移板,夹持气缸输出端与夹持平移板一侧中部固定,固定支架两侧的硅片夹持板上分别水平依次对称设置有两个硅片卡槽。本发明结构设计合理,能够快速高效的将硅片逐块平稳的进行平移运送,提高了硅片加工的效率和质量,满足生产使用的需要。

Description

一种硅片夹持平移机构
技术领域
本发明属于光伏材料加工设备领域,尤其涉及一种硅片夹持平移机构。
背景技术
在晶体硅太阳电池的生产过程中,需要将已经经过制绒、高温扩散和刻蚀的硅片逐块均匀的进行传送,使得硅片能够继续进行后一道丝网印刷等工序的加工,硅片在丝网印刷过程中需要将硅片逐块均匀的进行传送,使得丝网印刷机构能够高效便捷的将硅片进行加工,现有的硅片平移机构结构复杂且操作麻烦,难以平稳准确的将硅片逐块平移至丝网印刷机构的加工工位进行生产加工,并且现有的硅片平移机构在将硅片的平移过程中,经常会由于平移机构的外力而将硅片造成损坏,也会在平移过程中将硅片的表面产生刮痕影响了硅片的生产加工质量,降低了硅片的加工效率,不能满足生产使用的需要。
发明内容
本发明所要解决的技术问题是克服现有技术中所存在的上述不足,而提供一种结构设计合理,能够快速高效的将硅片逐块平稳进行平移运送的硅片夹持平移机构。
为了解决上述技术问题,本发明所采用的技术方案是:一种硅片夹持平移机构,其特征在于:所述硅片夹持平移机构包括固定支架、平移气缸、夹持气缸和硅片夹持板,所述固定支架两侧分别竖直设置有隔断板,隔断板一侧两端与固定支架之间分别水平设置有平移导向杆,固定支架两侧分别水平设置有运送平移板,运送平移板水平滑动设置于平移导向杆,所述平移气缸水平设置在固定支架一侧中部,平移气缸平行于平移导向杆,平移气缸输出端与运送平移板一侧中部固定,固定支架两侧的运送平移板上侧分别水平设置有夹持导向槽,固定支架上方两侧分别水平设置有硅片夹持板,硅片夹持板下方两侧分别水平设置有与夹持导向槽相适配的夹持导向条,所述固定支架两侧分别水平设置有两根夹持导向杆,夹持导向杆垂直于平移导向杆,夹持导向杆两侧分别水平滑动设置有夹持平移板,夹持平移板对应侧的固定支架上水平设置有夹持气缸,夹持气缸输出端与夹持平移板一侧中部固定,夹持平移板上侧水平设置有平移导向槽,硅片夹持板下侧水平设置有与平移导向槽相适配的平移导向条,所述固定支架中部依次水平均匀设置有等高的前放置板、加工放置板和后放置板,加工放置板一侧的固定支架上设置有硅片加工机构,所述固定支架两侧的硅片夹持板上分别水平依次对称设置有两个硅片卡槽,硅片卡槽下侧与前放置板、加工放置板和后放置板上侧处于同一水平面。
进一步地,所述夹持导向槽和平移导向槽为T型导向槽,夹持导向条和平移导向条为T型导向条。
进一步地,所述前放置板、加工放置板和后放置板上侧表面设置有软质橡胶层。
本发明与现有技术相比,具有以下优点和效果:本发明结构简单,通过运送平移板水平滑动设置于平移导向杆,固定支架上方两侧分别水平设置有硅片夹持板,固定支架两侧的运送平移板上侧分别水平设置有夹持导向槽,硅片夹持板下方两侧分别水平设置有与夹持导向槽相适配的夹持导向条,夹持导向杆两侧分别水平滑动设置有夹持平移板,夹持平移板上侧水平设置有平移导向槽,硅片夹持板下侧水平设置有与平移导向槽相适配的平移导向条,固定支架两侧的硅片夹持板上分别水平依次对称设置有两个硅片卡槽,利用夹持气缸驱动夹持平移板,使能将前放置板和加工放置板上水平放置的硅片牢固的进行夹持,利用平移气缸驱动运送平移板,使能将前放置板和加工放置板上的硅片同步准确的进行平移,将前放置板上的硅片平移至加工放置板上,将加工放置板上的硅片平移至后放置板上,利用加工放置板一侧的硅片加工机构将硅片逐块进行生产加工,提高了硅片加工的效率和质量,利用前放置板、加工放置板和后放置板上侧表面设置有软质橡胶层,使能避免硅片在平移过程中表面产生刮痕,满足生产使用的需要。
附图说明
图1是本发明一种硅片夹持平移机构的主视图。
图2是本发明一种硅片夹持平移机构的俯视图。
图中:1.固定支架,2.平移气缸,3.夹持气缸,4.硅片夹持板,5.隔断板,6.平移导向杆,7.运送平移板,8.夹持导向槽,9.夹持导向条,10.夹持导向杆,11.夹持平移板,12.平移导向槽,13.平移导向条,14.前放置板,15.加工放置板,16.后放置板,17.硅片加工机构,18.硅片卡槽。
具体实施方式
为了进一步描述本发明,下面结合附图进一步阐述一种硅片夹持平移机构的具体实施方式,以下实施例是对本发明的解释而本发明并不局限于以下实施例。
如图1、图2所示,本发明一种硅片夹持平移机构,包括固定支架1、平移气缸2、夹持气缸3和硅片夹持板4,固定支架1两侧分别竖直设置有隔断板5,隔断板5一侧两端与固定支架1之间分别水平设置有平移导向杆6,固定支架1两侧分别水平设置有运送平移板7,运送平移板7水平滑动设置于平移导向杆6,平移气缸2水平设置在固定支架1一侧中部,平移气缸2平行于平移导向杆6,平移气缸2输出端与运送平移板7一侧中部固定,固定支架1两侧的运送平移板7上侧分别水平设置有夹持导向槽8,固定支架1上方两侧分别水平设置有硅片夹持板4,硅片夹持板4下方两侧分别水平设置有与夹持导向槽8相适配的夹持导向条9,本发明的固定支架1两侧分别水平设置有两根夹持导向杆10,夹持导向杆10垂直于平移导向杆6,夹持导向杆10两侧分别水平滑动设置有夹持平移板11,夹持平移板11对应侧的固定支架1上水平设置有夹持气缸3,夹持气缸3输出端与夹持平移板11一侧中部固定,夹持平移板11上侧水平设置有平移导向槽12,硅片夹持板4下侧水平设置有与平移导向槽12相适配的平移导向条13,本发明的固定支架1中部依次水平均匀设置有等高的前放置板14、加工放置板15和后放置板16,加工放置板15一侧的固定支架1上设置有硅片加工机构17,本发明的固定支架1两侧的硅片夹持板4上分别水平依次对称设置有两个硅片卡槽18,硅片卡槽18下侧与前放置板14、加工放置板15和后放置板16上侧处于同一水平面。
本发明的夹持导向槽8和平移导向槽12为T型导向槽,夹持导向条9和平移导向条13为T型导向条,确保硅片夹持板4能够水平准确的进行平移。本发明的前放置板14、加工放置板15和后放置板16上侧表面设置有软质橡胶层,使能避免硅片在平移过程中表面产生刮痕,提高了硅片生产加工的质量。
采用上述技术方案,本发明一种硅片夹持平移机构在使用的时候,通过运送平移板7水平滑动设置于平移导向杆6,固定支架1上方两侧分别水平设置有硅片夹持板4,固定支架1两侧的运送平移板7上侧分别水平设置有夹持导向槽8,硅片夹持板4下方两侧分别水平设置有与夹持导向槽8相适配的夹持导向条9,夹持导向杆10两侧分别水平滑动设置有夹持平移板11,夹持平移板11上侧水平设置有平移导向槽12,硅片夹持板4下侧水平设置有与平移导向槽12相适配的平移导向条13,固定支架1两侧的硅片夹持板4上分别水平依次对称设置有两个硅片卡槽18,利用夹持气缸3驱动夹持平移板11,使能将前放置板14和加工放置板15上水平放置的硅片牢固的进行夹持,利用平移气缸2驱动运送平移板7,使能将前放置板14和加工放置板15上的硅片同步准确的进行平移,将前放置板14上的硅片平移至加工放置板15上,将加工放置板15上的硅片平移至后放置板16上,通过前放置板14一侧设置有硅片放置机构,后放置板16一侧设置有硅片取离机构,在整个过程中,硅片放置机构能将未加工的硅片逐块放置在前放置板14上,硅片取离机构能将加工好的硅片逐块从后放置板16上取走,确保硅片能够连续进行生产加工,利用加工放置板15一侧的硅片加工机构17能将硅片逐块进行生产加工,利用前放置板14、加工放置板15和后放置板16上侧表面设置有软质橡胶层,使能避免硅片在平移过程中表面产生刮痕。通过这样的结构,本发明结构设计合理,能够快速高效的将硅片逐块平稳的进行平移运送,提高了硅片加工的效率和质量,满足生产使用的需要。
本说明书中所描述的以上内容仅仅是对本发明所作的举例说明。本发明所属技术领域的技术人员可以对所描述的具体实施例做各种各样的修改或补充或采用类似的方式替代,只要不偏离本发明说明书的内容或者超越本权利要求书所定义的范围,均应属于本发明的保护范围。

Claims (3)

1.一种硅片夹持平移机构,其特征在于:所述硅片夹持平移机构包括固定支架、平移气缸、夹持气缸和硅片夹持板,所述固定支架两侧分别竖直设置有隔断板,隔断板一侧两端与固定支架之间分别水平设置有平移导向杆,固定支架两侧分别水平设置有运送平移板,运送平移板水平滑动设置于平移导向杆,所述平移气缸水平设置在固定支架一侧中部,平移气缸平行于平移导向杆,平移气缸输出端与运送平移板一侧中部固定,固定支架两侧的运送平移板上侧分别水平设置有夹持导向槽,固定支架上方两侧分别水平设置有硅片夹持板,硅片夹持板下方两侧分别水平设置有与夹持导向槽相适配的夹持导向条,所述固定支架两侧分别水平设置有两根夹持导向杆,夹持导向杆垂直于平移导向杆,夹持导向杆两侧分别水平滑动设置有夹持平移板,夹持平移板对应侧的固定支架上水平设置有夹持气缸,夹持气缸输出端与夹持平移板一侧中部固定,夹持平移板上侧水平设置有平移导向槽,硅片夹持板下侧水平设置有与平移导向槽相适配的平移导向条,所述固定支架中部依次水平均匀设置有等高的前放置板、加工放置板和后放置板,加工放置板一侧的固定支架上设置有硅片加工机构,所述固定支架两侧的硅片夹持板上分别水平依次对称设置有两个硅片卡槽,硅片卡槽下侧与前放置板、加工放置板和后放置板上侧处于同一水平面。
2.根据权利要求1所述的一种硅片夹持平移机构,其特征在于:所述夹持导向槽和平移导向槽为T型导向槽,夹持导向条和平移导向条为T型导向条。
3.根据权利要求1所述的一种硅片夹持平移机构,其特征在于:所述前放置板、加工放置板和后放置板上侧表面设置有软质橡胶层。
CN201710336509.7A 2017-05-13 2017-05-13 一种硅片夹持平移机构 Pending CN107195575A (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109003920A (zh) * 2018-07-21 2018-12-14 江苏德尔科测控技术有限公司 一种硅片清洗设备

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