CN107186357A - The laser cutting system and method for IC-card - Google Patents
The laser cutting system and method for IC-card Download PDFInfo
- Publication number
- CN107186357A CN107186357A CN201710409503.8A CN201710409503A CN107186357A CN 107186357 A CN107186357 A CN 107186357A CN 201710409503 A CN201710409503 A CN 201710409503A CN 107186357 A CN107186357 A CN 107186357A
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- CN
- China
- Prior art keywords
- card
- laser
- stuck
- ocr
- cut
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The embodiment of the invention discloses a kind of laser cutting system of IC-card and method, the diced system includes industrial computer, laser, galvanometer light splitting mirror assembly, OCR positioners, operating desk, conveying device, transparent pressing plate and vacuum adsorption table, wherein, the laser, galvanometer light splitting mirror assembly, OCR positioners, conveying device, operating desk and vacuum adsorption table are connected with industrial computer；The laser is carbon dioxide laser；Conveying device conveying is to be cut to get stuck greatly；Transparent pressing plate carries card angle preformed hole；Vacuum adsorption table is got stuck greatly using air pressure absorption fixation；OCR positioners are used to detect the position got stuck greatly；The positional information that industrial computer is detected according to OCR positioners, controls galvanometer light splitting mirror assembly and then adjustment laser beam is cut.The embodiment of the present invention solves that processing efficiency is low, energy consumption is big, noise is big and the problem of complex operation, and then reduce the production cost of IC-card by using laser cutting IC-card.
Description
Technical field
The present invention relates to the laser cutting system and method for the processing technique field of IC-card, more particularly to a kind of IC-card.
Background technology
In the prior art, the punching of IC-card is to use female mould, and the interior edge of former is equal to the outer of formpiston equal to product
Shape, be put between two moulds and get stuck greatly, two moulds " easy edge " and cross the product for obtaining IC-card shape.
However, different size of IC-card is accomplished by changing different moulds, processing efficiency is low, and the punching operation energy of mould
Consumption is big, and noise is big, requires high to operating personnel.
The content of the invention
Technical problem to be solved of the embodiment of the present invention is there is provided a kind of laser cutting system of IC-card and method,
So that high in machining efficiency, energy consumption is small, noise is small and simple to operate.
In order to solve the above-mentioned technical problem, the embodiment of the present invention proposes a kind of laser cutting system of IC-card, including work
Control machine, laser, galvanometer light splitting mirror assembly, OCR positioners, operating desk, conveying device, transparent pressing plate and vacuum adsorption table,
Wherein, the laser, galvanometer light splitting mirror assembly, OCR positioners, conveying device, operating desk and vacuum adsorption table be and work
Control machine is connected；The laser is carbon dioxide laser；Conveying device conveying is to be cut to get stuck greatly；Transparent pressing plate is with card
Angle preformed hole, the temperature distortion that gets stuck greatly is prevented for flattening big get stuck；Vacuum adsorption table is got stuck greatly using air pressure absorption fixation；
OCR positioners are used to detect the position got stuck greatly；The positional information that industrial computer is detected according to OCR positioners, controls galvanometer
Light splitting mirror assembly so adjust laser beam cut.
Correspondingly, the embodiment of the present invention additionally provides a kind of laser cutting method of IC-card, including：
A, to be cut big get stuck be sent to predeterminated position on operating desk and be fixed；
B, by the transparent pressing plate with card angle preformed hole be pressed on it is to be cut it is big get stuck on, the position got stuck greatly on positioning action platform
Put；
C, according to positioning use carbon dioxide laser to cut out the R angles of IC-card with pre-set velocity, obtain completing the kilocalorie that R angles are cut
Material, wherein, the scope of pre-set velocity is 400mm/s ~ 600mm/s, and the power bracket of carbon dioxide laser is 140W ~ 160W, ripple
Long scope is 9.13 μm ~ 9.95 μm；
D, by complete the cutting of R angles it is big get stuck to be sent to adsorb in vacuum adsorption table fix, the kilocalorie on positioning vacuum absorptive table
The position of material；
E, according to positioning use the carbon dioxide laser with pre-set velocity cutting IC-card straight line, obtain corresponding multiple IC
Card.
The embodiment of the present invention is by proposing the laser cutting system and method for a kind of IC-card, the laser cutting system of the IC-card
System includes industrial computer, laser, galvanometer light splitting mirror assembly, OCR positioners, operating desk, conveying device and transparent pressing plate, passes through
Using laser cutting IC-card, solve that processing efficiency is low, energy consumption is big, noise is big and the problem of complex operation, and then reduce IC
The production cost of card.
Brief description of the drawings
Fig. 1 is the structural representation of the laser cutting system of the IC-card of the embodiment of the present invention.
Fig. 2 is the schematic flow sheet of the laser cutting method of the IC-card of the embodiment of the present invention.
Fig. 3 is that the multi-station laser of the embodiment of the present invention cuts the schematic diagram got stuck greatly.
Drawing reference numeral explanation
Industrial computer 10
Laser 20
Galvanometer light splitting mirror assembly 30
OCR positioners 40
Operating desk 50
Cool down backing plate 51
Fixing device 52
Top plate cylinder 53
Conveying device 60
Get stuck switching mechanism 61
Material pulling mechanism 62
Transparent pressing plate 70
Laser cover 80.
Embodiment
It should be noted that in the case where not conflicting, the feature in embodiment and embodiment in the application can phase
Mutually combine, the present invention is described in further detail with specific embodiment below in conjunction with the accompanying drawings.
If directional in the embodiment of the present invention indicate（Such as up, down, left, right, before and after ...）It is only used for explaining at certain
One particular pose（As shown in drawings）Under relative position relation, motion conditions between each part etc., if the particular pose is sent out
During raw change, then directionality indicates also correspondingly therewith to change.
If in addition, the description for being related to " first ", " second " etc. in the present invention be only used for describe purpose, and it is not intended that
Indicate or imply its relative importance or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ",
At least one this feature can be expressed or be implicitly included to the feature of " second ".
Refer to Fig. 1, the laser cutting system of the IC-card of the embodiment of the present invention mainly include industrial computer 10, laser 20,
Galvanometer light splitting mirror assembly 30, OCR positioners 40, operating desk 50, conveying device 60, transparent pressing plate 70 and vacuum adsorption table（Figure
It is not shown）.
Laser 20, galvanometer light splitting mirror assembly 30, OCR positioners 40, conveying device 60, operating desk 50 and vacuum suction
Platform is connected with industrial computer 10.Preferably, laser 20 is carbon dioxide laser 20.
Conveying device 60 includes get stuck switching mechanism 61 and material pulling mechanism 62.Conveying device 60 conveys to be cut big get stuck
Fixed to operating desk 50, cut the R angles of IC-card, after the completion of cutting, big get stuck for completing the cutting of R angles is delivered to vacuum suction
Platform, cuts the straight line of IC-card, obtains several IC-cards；Next big get stuck to be cut is delivered to operating desk 50 simultaneously.
For example, the conveying switching of switching mechanism 61 that gets stuck gets stuck greatly, material pulling mechanism 62 can draw material axle to pull using drawing material cylinder to drive.
Transparent pressing plate 70 carries card angle preformed hole, and the temperature distortion that gets stuck greatly is prevented for flattening big get stuck.OCR positioners
40 are used to detect the position got stuck greatly in operating desk 50 and vacuum adsorption table.Industrial computer 10 is detected according to OCR positioners 40
Positional information, control galvanometer light splitting mirror assembly 30 and then adjustment laser beam are cut.
Vacuum adsorption table is got stuck greatly using air pressure absorption fixation, and such as vacuum adsorption table includes stage body, multiple located at stage body
On sucker and the vavuum pump that is connected with sucker, its intermediate pump is connected with industrial computer 10, and the control vavuum pump of industrial computer 10 is taken out
Sucker and it is big get stuck between air, got stuck greatly using air pressure absorption fixation.
As a kind of embodiment, operating desk 50 includes：Place the big cooling backing plate 51 got stuck greatly that gets stuck and cool down；It is located at
Electrically connect on cooling backing plate 51 and with industrial computer 10, for the fixed fixing device 52 got stuck greatly；And be butted under cooling backing plate 51
End face, applies the top plate cylinder 53 of upward pressure.Top plate cylinder 53 acts on cooling backing plate 51, makes cooling backing plate 51 and transparent pressure
Plate 70 compress it is to be cut it is big get stuck, preventing from getting stuck greatly deforms upon.For example, fixing device 52 can using cylinder and with cylinder pair
The clamp answered, which is fixed, to get stuck greatly.
As a kind of embodiment, the laser cutting system of IC-card also includes：The laser cover 80 covered in outside laser beam；And
Be connected with industrial computer 10, toward laser cover 80 in fill circulation inert gas aerating device.
As a kind of embodiment, OCR positioners 40 include：Shoot the camera of the IC-card image on cooling platform；With
Camera and industrial computer 10 are connected, and cool down the IC-card positional information on platform according to framing, and positional information is sent to work
The processor of control machine 10.
Fig. 2 is refer to, the laser cutting method of the IC-card of the embodiment of the present invention includes step A, B, C, D, E.
A, to be cut big get stuck be sent to predeterminated position on operating desk 50 and be fixed.
B, by the transparent pressing plate 70 with card angle preformed hole be pressed on it is to be cut it is big get stuck on, it is big on positioning action platform 50
The position got stuck.
C, according to positioning use carbon dioxide laser to cut out the R angles of IC-card with pre-set velocity, obtain completing what R angles were cut
Get stuck greatly, wherein, the scope of pre-set velocity is 400mm/s ~ 600mm/s, the power bracket of carbon dioxide laser for 140W ~
160W, wave-length coverage is 9.13 μm ~ 9.95 μm.Preferably, the power of carbon dioxide laser is 150W, and wavelength is 9.3 μm.This hair
The IC-card that bright embodiment solves such as PCB, PET, PQ, FKS various material is easily deformed and cut insufficient ask in cutting
Topic, the cutting of the IC-card of various material can be met simultaneously.Preferably, pre-set velocity is 500mm/s, with 500mm/s's during cutting
Speed is cut, and has both been not in cut insufficient and overheating deforming problem, the speed of cutting can be greatly improved again.
D, big get stuck that will complete to cut at R angles are sent in vacuum adsorption table on absorption fixation, positioning vacuum absorptive table
The position got stuck greatly.
E, according to positioning use the carbon dioxide laser with pre-set velocity cutting IC-card straight line, obtain corresponding many
Individual IC-card.
Fig. 3 is refer to, the embodiment of the present invention can simultaneously be cut using multi-station laser 20, the process whole-course automation of cutting
Control, greatly improves cutting efficiency.The embodiment of the present invention at least has the following technical effect that：
1）It is simple to operate.Existing IC-card cutting is completed by plant equipment, and the supporting comparison such as frock clamp is more, debug,
Replacing etc. is required for artificial operation, to personnel requirement with relatively high；And the embodiment of the present invention is the selection to program, behaviour
It is more convenient, it is more convenient to safeguard, without changing easy-consuming fitting.
2）Energy-saving and environmental protection.Existing IC-card cutting equipment is controlled by pneumatic original paper and electronic original paper, when equipment works
Vibrations are big, noise is big, and mechanical movement frequency is high, and it is big that equipment produces heat；And the embodiment of the present invention is integrated by multiple lasers 20
On one device, while carrying out transient heating work on one big get stuck, laser heat loss is small, active control unit is certainly
Body generates heat, and greatly reduces energy consumption and uses.
3）Saving personnel, place.For example, integrated 16 laser of the embodiment of the present invention is in an equipment, while at one
740mm*460mm big get stuck carries out heating operation, equivalent to 10 IC-card pressing equipments of an equipment capacity to 16 IC-cards
Production capacity, greatly improve efficiency, save operating personnel and using area.
Although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of changes, modification can be carried out to these embodiments, replace without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention limits by appended claims and its equivalency range.
Claims (9)
1. a kind of laser cutting system of IC-card, it is characterised in that including industrial computer, laser, galvanometer light splitting mirror assembly, OCR
Positioner, operating desk, conveying device, transparent pressing plate and vacuum adsorption table, wherein, the laser, galvanometer light splitting mirror assembly,
OCR positioners, conveying device, operating desk and vacuum adsorption table are connected with industrial computer；The laser swashs for carbon dioxide
Light device；Conveying device conveying is to be cut to get stuck greatly；Transparent pressing plate carries card angle preformed hole, and kilocalorie is prevented for flattening big get stuck
Expect temperature distortion；Vacuum adsorption table is got stuck greatly using air pressure absorption fixation；OCR positioners are used to detect the position got stuck greatly；
The positional information that industrial computer is detected according to OCR positioners, controls galvanometer light splitting mirror assembly and then adjustment laser beam is cut
Cut.
2. the laser cutting system of IC-card as claimed in claim 1, it is characterised in that the operating desk includes：Place kilocalorie
Expect and cool down the cooling backing plate got stuck greatly；On cooling backing plate and with industry control mechatronics, the fixation got stuck greatly for fixation
Device；And cooling backing plate lower surface is butted on, apply the top plate cylinder of upward pressure.
3. the laser cutting system of IC-card as claimed in claim 1, it is characterised in that the conveying device includes the conversion that gets stuck
Mechanism and material pulling mechanism.
4. the laser cutting system of IC-card as claimed in claim 1, it is characterised in that also include：Cover in outside laser beam
Laser cover；And be connected with industrial computer, toward laser cover in fill circulation inert gas aerating device.
5. the laser cutting system of IC-card as claimed in claim 1, it is characterised in that the OCR positioners include：Shoot
Cool down the camera of the IC-card image on platform；It is connected with camera and industrial computer, the IC-card position on platform is cooled down according to framing
Confidence is ceased, and positional information is sent to the processor of industrial computer.
6. a kind of laser cutting method of IC-card, it is characterised in that applied to the IC-card as any one of claim 1-5
Laser cutting system, including：
A, to be cut big get stuck be sent to predeterminated position on operating desk and be fixed；
B, by the transparent pressing plate with card angle preformed hole be pressed on it is to be cut it is big get stuck on, the position got stuck greatly on positioning action platform
Put；
C, according to positioning use carbon dioxide laser to cut out the R angles of IC-card with pre-set velocity, obtain completing the kilocalorie that R angles are cut
Material, wherein, the scope of pre-set velocity is 400mm/s ~ 600mm/s, and the power bracket of carbon dioxide laser is 140W ~ 160W, ripple
Long scope is 9.13 μm ~ 9.95 μm；
D, by complete the cutting of R angles it is big get stuck to be sent to adsorb in vacuum adsorption table fix, the kilocalorie on positioning vacuum absorptive table
The position of material；
E, according to positioning use the carbon dioxide laser with pre-set velocity cutting IC-card straight line, obtain corresponding multiple IC
Card.
7. the laser cutting method of IC-card as claimed in claim 6, it is characterised in that the wavelength of the carbon dioxide laser is
9.3μm。
8. the laser cutting method of IC-card as claimed in claim 6, it is characterised in that the power of the carbon dioxide laser is
150W。
9. the laser cutting method of IC-card as claimed in claim 6, it is characterised in that the pre-set velocity is 500mm/s.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710409503.8A CN107186357B (en) | 2017-06-02 | 2017-06-02 | The laser cutting system and method for IC card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710409503.8A CN107186357B (en) | 2017-06-02 | 2017-06-02 | The laser cutting system and method for IC card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107186357A true CN107186357A (en) | 2017-09-22 |
| CN107186357B CN107186357B (en) | 2019-09-06 |
Family
ID=59877524
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710409503.8A Active CN107186357B (en) | 2017-06-02 | 2017-06-02 | The laser cutting system and method for IC card |
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| Country | Link |
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| CN (1) | CN107186357B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107570883A (en) * | 2017-10-17 | 2018-01-12 | 深圳华创兆业科技股份有限公司 | Laser Grinder |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1954954A (en) * | 2005-10-27 | 2007-05-02 | 鸿富锦精密工业（深圳）有限公司 | Mould processing device |
| CN101670492A (en) * | 2009-09-16 | 2010-03-17 | 苏州德龙激光有限公司 | Designing method for LED wafer tri-laser-beam scribing equipment |
| CN101795808A (en) * | 2007-07-24 | 2010-08-04 | Eo技术有限公司 | Laser processing apparatus and method using beam split |
| CN101817119A (en) * | 2010-05-20 | 2010-09-01 | 什邡市明日宇航工业股份有限公司 | Laser welding method of rhenium alloy thin sheet |
| CN202070851U (en) * | 2011-05-24 | 2011-12-14 | 苏州天弘激光股份有限公司 | Radio-frequency (R-F) printed circuit board assembly (PCBA) one-off cutting forming device |
| CN103639595A (en) * | 2013-11-28 | 2014-03-19 | 华中科技大学 | Method for restraining magnesium alloy element burning loss in high-energy density beam machining |
| CN203765174U (en) * | 2014-01-27 | 2014-08-13 | 深圳英诺激光科技有限公司 | Laser cutting machine enabling LED chip to crack easily |
| CN104400283A (en) * | 2014-09-25 | 2015-03-11 | 北京航星机器制造有限公司 | Welding device for titanium alloy skin structural member for framework |
| WO2016128287A1 (en) * | 2015-02-13 | 2016-08-18 | Scanlab Ag | Multi-head laser system having a sensor unit with a movable optical guiding element |
| KR101659496B1 (en) * | 2015-01-20 | 2016-09-23 | (주)엔에스 | Laser cutting apparatus |
| JP2017069340A (en) * | 2015-09-29 | 2017-04-06 | 株式会社東京精密 | Laser processing apparatus and laser processing method |
-
2017
- 2017-06-02 CN CN201710409503.8A patent/CN107186357B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1954954A (en) * | 2005-10-27 | 2007-05-02 | 鸿富锦精密工业（深圳）有限公司 | Mould processing device |
| CN101795808A (en) * | 2007-07-24 | 2010-08-04 | Eo技术有限公司 | Laser processing apparatus and method using beam split |
| CN101670492A (en) * | 2009-09-16 | 2010-03-17 | 苏州德龙激光有限公司 | Designing method for LED wafer tri-laser-beam scribing equipment |
| CN101817119A (en) * | 2010-05-20 | 2010-09-01 | 什邡市明日宇航工业股份有限公司 | Laser welding method of rhenium alloy thin sheet |
| CN202070851U (en) * | 2011-05-24 | 2011-12-14 | 苏州天弘激光股份有限公司 | Radio-frequency (R-F) printed circuit board assembly (PCBA) one-off cutting forming device |
| CN103639595A (en) * | 2013-11-28 | 2014-03-19 | 华中科技大学 | Method for restraining magnesium alloy element burning loss in high-energy density beam machining |
| CN203765174U (en) * | 2014-01-27 | 2014-08-13 | 深圳英诺激光科技有限公司 | Laser cutting machine enabling LED chip to crack easily |
| CN104400283A (en) * | 2014-09-25 | 2015-03-11 | 北京航星机器制造有限公司 | Welding device for titanium alloy skin structural member for framework |
| KR101659496B1 (en) * | 2015-01-20 | 2016-09-23 | (주)엔에스 | Laser cutting apparatus |
| WO2016128287A1 (en) * | 2015-02-13 | 2016-08-18 | Scanlab Ag | Multi-head laser system having a sensor unit with a movable optical guiding element |
| JP2017069340A (en) * | 2015-09-29 | 2017-04-06 | 株式会社東京精密 | Laser processing apparatus and laser processing method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107570883A (en) * | 2017-10-17 | 2018-01-12 | 深圳华创兆业科技股份有限公司 | Laser Grinder |
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| Publication number | Publication date |
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| CN107186357B (en) | 2019-09-06 |
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