CN107175400B - gold wire welding method - Google Patents
gold wire welding method Download PDFInfo
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- CN107175400B CN107175400B CN201710245439.4A CN201710245439A CN107175400B CN 107175400 B CN107175400 B CN 107175400B CN 201710245439 A CN201710245439 A CN 201710245439A CN 107175400 B CN107175400 B CN 107175400B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Wire Bonding (AREA)
Abstract
the invention provides a gold wire welding method, which comprises S1, fixing a substrate, selecting a first welding point and a second welding point; s2, selecting low ultrasonic power, setting the size of a solder ball, and carrying out gold wire ball burning on the gold solder wire; s3, gradually adjusting the pressure and the ultrasonic power of the chopper of the first welding point, eliminating the phenomena of solder ball flying, gold falling and non-adhesion, and completing the welding of the first welding point; and S4, gradually adjusting the pressure and the ultrasonic power of the chopper of the second welding spot, eliminating the gold and non-adhesion phenomena, and completing the welding of the second welding spot. And S5, burning the gold wire again. Controlling the size of a solder ball, the pressure of a chopper, ultrasonic power and ultrasonic time before and during welding; the phenomenon of gold falling caused by improper pressure, ultrasonic power and time of the riving knife is avoided, gold wire welding of the thin gold coating is effectively realized, and the phenomenon of non-bonding or gold falling of the gold wire welding is overcome.
Description
Technical Field
the invention relates to the technical field of semiconductor packaging, in particular to a gold wire welding method.
Background
in recent years, the semiconductor packaging industry has started to thrive and develop in china, and has a great pushing effect on the improvement of the chinese industrial technology. The gold wire bonding wire is mainly used for connecting an electrode on a semiconductor chip with an external metal bonding pad pin by a lead under the pressure and ultrasonic vibration of a cleaver at a certain temperature.
Gold wire bonding is generally used in the connection of leads in three ways: thermal ultrasonic ball bonding, ultrasonic wedge bonding, and thermal compression bonding; and the welding spot is formed by the combined action of heat, ultrasound and pressure. At present, more than 90% of semiconductor packaging technologies adopt the process for bonding wires, most of connecting materials adopted by the bonding wires are gold wires, and the process is called thermosonic gold wire ball bonding for short.
With the development of new materials and new devices, the rapid development of semiconductor technology has provided a serious challenge to the packaging technology. The general gold wire welding process is usually applied to a gold plating layer with the thickness of more than 100nm, and when the general gold wire welding process is applied to a thin gold plating layer with the thickness of less than 100nm, the phenomena of non-adhesion and gold plating layer adhesion are often generated. The aluminum wire is adopted to replace a gold wire to overcome the gold falling phenomenon in gold wire welding, however, an aluminum oxide layer is introduced into an electrode interface in the aluminum wire welding process, and in addition, the aluminum wire can be oxidized to a certain degree after being used for a period of time, so that the conductivity of the welding wire is influenced, and finally the signal detection of a weak current device is influenced.
disclosure of Invention
The present invention provides a gold wire bonding method that overcomes or at least partially solves the above-mentioned problems by solving the non-stick and gold plate stick-off phenomena that occur in the prior art gold wire bonding processes when a thin gold plating layer having a thickness of less than 100nm is applied.
according to an aspect of the present invention, there is provided a gold wire bonding method including:
S1, fixing the substrate, and selecting a first welding spot and a second welding spot;
S2, selecting low ultrasonic power, setting the size of a solder ball, and carrying out gold wire ball burning on the gold solder wire;
S3, gradually adjusting the pressure and the ultrasonic power of the chopper of the first welding point, eliminating the phenomena of solder ball flying, gold falling and non-adhesion, and completing the welding of the first welding point;
And S4, gradually adjusting the pressure and the ultrasonic power of the chopper of the second welding spot, eliminating the gold and non-adhesion phenomena, and completing the welding of the second welding spot.
preferably, in step S1, the substrate is a substrate with gold plating, including gold-plated silicon, printed circuit board, gallium arsenide substrate.
Preferably, in step S2, the solder ball size is set to 40-60 μm.
preferably, the step S3 specifically includes:
s31, optimizing the pressure of the riving knife, and setting the initial riving knife pressure to be 20% -60% of the maximum riving knife pressure value of the gold wire welding equipment;
s32, optimizing ultrasonic power parameters, setting the initial ultrasonic power to be 20% -60% of the maximum ultrasonic power of the gold wire welding equipment, and setting the initial time to be 20-200 ms;
And S33, welding the first welding point, and gradually adjusting the pressure and the ultrasonic power of the chopper to eliminate the phenomena of solder ball flying, gold falling and non-adhesion.
Preferably, the step S33 specifically includes:
if the solder ball flying phenomenon appears, the ultrasonic power is gradually reduced by 1 to 5 percent until the phenomenon disappears;
If the phenomenon that the gold welding wire is not bonded occurs, the pressure of the chopper is gradually increased by 1% -5% and the ultrasonic power is gradually increased by 1% -5% until the phenomenon disappears;
if the phenomenon of gold falling occurs, the pressure of the chopper is gradually reduced by 1% -5% amplitude, and meanwhile, the ultrasonic power is gradually reduced by 1% -5% amplitude until the phenomenon disappears.
Preferably, the step S3 further includes:
after the first welding point is welded, extending a gold welding wire out of a tail wire with the length of 150L-180% L, and then welding a second welding point, wherein L is the distance between the first welding point and the second welding point.
Preferably, the step S4 specifically includes:
s41, optimizing the pressure of the riving knife, and setting the initial riving knife pressure to be 20% -60% of the maximum riving knife pressure value of the gold wire welding equipment;
s42, optimizing ultrasonic power parameters, setting the initial ultrasonic power to be 20% -60% of the maximum ultrasonic power of the gold wire welding equipment, and setting the initial time to be 20-200 ms;
and S43, welding a second welding point, and gradually adjusting the pressure and the ultrasonic power of the chopper to eliminate gold and avoid adhesion.
Preferably, the step S43 specifically includes:
If the phenomenon that the gold welding wire is not bonded occurs, the pressure of the chopper is gradually increased by 1% -5% and the ultrasonic power is gradually increased by 1% -5% until the phenomenon disappears;
If the phenomenon of gold falling occurs, the pressure of the chopper is gradually reduced by 1% -5% amplitude, and meanwhile, the ultrasonic power is gradually reduced by 1% -5% amplitude until the phenomenon disappears.
preferably, the method further comprises the following steps:
and S5, after the second welding point is welded, carrying out gold wire ball burning again.
preferably, in step S5, after the second welding point is welded, the tail drawn length of the gold welding wire is 70-90% of the height of the welding head from the second welding point in the initial state.
the application provides a gold wire welding method, which comprises the steps of controlling the size of a solder ball, the pressure of an initial chopper, the initial ultrasonic power and the initial ultrasonic time before a welding process by optimizing parameters such as gold wire welding pressure, ultrasonic power and the like and an operation mode; the phenomenon of gold falling caused by overlarge pressure, overlarge ultrasonic power and overlong time and the phenomenon of adhesion prevention caused by overlarge pressure, overlarge ultrasonic power and overlong time are avoided; in the welding process, when the solder ball flying phenomenon appears, the phenomenon disappears by gradually reducing the ultrasonic power, and when the gold solder wire is not bonded, the phenomenon disappears by gradually increasing the pressure of the chopper and simultaneously gradually increasing the ultrasonic power; when the phenomenon of gold falling occurs, the phenomenon disappears by gradually reducing the pressure of the chopper and simultaneously gradually reducing the ultrasonic power, the gold wire welding of the thin gold coating is effectively realized, and the phenomenon of non-adhesion or gold falling of the gold wire welding is overcome.
Drawings
FIG. 1 is a flow chart of a gold wire bonding method according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a first solder joint before soldering according to an embodiment of the invention;
FIG. 3 is a schematic view of a first solder joint weld according to an embodiment of the invention;
FIG. 4 is a schematic diagram of a gold wire length process after first solder joint bonding according to an embodiment of the invention;
FIG. 5 is a schematic view of a second solder joint weld according to an embodiment of the invention;
FIG. 6 is a schematic view of a second weld spot being separated from the weld head after welding in accordance with an embodiment of the present invention;
FIG. 7 is a schematic view of a gold wire solder ball after second solder joint soldering according to an embodiment of the present invention.
Detailed Description
the following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
as shown in fig. 1, there is shown a gold wire bonding method comprising the steps of:
s1, fixing the substrate with the gold plating layer, and selecting a first welding point and a second welding point; a thin gold plating layer with a thickness of less than 100nm can be applied;
S2, selecting low ultrasonic power, setting the size of a solder ball, and carrying out gold wire ball burning on the gold solder wire;
S3, gradually adjusting the pressure and the ultrasonic power of the chopper of the first welding point, eliminating the phenomena of solder ball flying, gold falling and non-adhesion, and completing the welding of the first welding point;
and S4, gradually adjusting the pressure and the ultrasonic power of the chopper of the second welding spot, eliminating the gold and non-adhesion phenomena, and completing the welding of the second welding spot.
in this embodiment, in step S1, the substrate is a substrate with gold plating, including gold-plated silicon, printed circuit board, gallium arsenide substrate.
preferably, in step S2, a low ultrasound power mode is adopted, and the maximum power of the hardware device that can be used in this embodiment in the idle mode is 1.3W; the size of the solder ball is set to be 40-60 mu m, the phenomenon of blocking a chopper is easily caused when the size of the solder ball is too small, and the phenomenon of gold falling is easily caused when the size of the solder ball is too large.
Preferably, the step S3 specifically includes:
S31, optimizing the pressure of the riving knife, setting the initial riving knife pressure to be 20% -60% of the maximum riving knife pressure value of the gold wire welding equipment, easily causing the phenomenon of gold falling when the pressure is too large, otherwise, not bonding;
S32, optimizing ultrasonic power parameters, setting the initial ultrasonic power to be 20% -60% of the maximum ultrasonic power of the gold wire welding equipment, and setting the initial time to be 20-200 ms; the phenomenon of gold falling is easily caused by overlarge ultrasonic power and overlong time, otherwise, the bonding is not carried out; the pressure of the chopper and the ultrasonic power are cooperatively optimized, and the phenomenon of solder ball flying is easy to occur due to the over-high ultrasonic power and the over-low pressure;
And S33, welding the first welding point, and gradually adjusting the pressure and the ultrasonic power of the chopper to eliminate the phenomena of solder ball flying, gold falling and non-adhesion.
Preferably, the step S33 specifically includes:
if the solder ball flying phenomenon appears, the ultrasonic power is gradually reduced by 1 to 5 percent until the phenomenon disappears;
if the phenomenon that the gold welding wire is not bonded occurs, the pressure of the chopper is gradually increased by 1% -5% and the ultrasonic power is gradually increased by 1% -5% until the phenomenon disappears;
If the phenomenon of gold falling occurs, the pressure of the chopper is gradually reduced by 1% -5% amplitude, and meanwhile, the ultrasonic power is gradually reduced by 1% -5% amplitude until the phenomenon disappears.
Preferably, the step S3 further includes:
after the first welding point is welded, extending a gold welding wire out of a tail wire with the length of 150L-180% L, and then welding a second welding point, wherein L is the distance between the first welding point and the second welding point. Therefore, the shear stress caused by horizontally stretching the gold welding wire by the welding head is reduced, the first welding point is protected from being damaged to the maximum extent, in addition, the phenomenon of no adhesion or gold falling is caused by the large shear stress easily generated due to the excessively small distance, and the phenomenon of overhigh arch and influence on the electrical performance due to the excessively long distance.
Preferably, the step S4 specifically includes:
S41, optimizing the pressure of the riving knife, and setting the initial riving knife pressure to be 20% -60% of the maximum riving knife pressure value of the gold wire welding equipment;
s42, optimizing ultrasonic power parameters, setting the initial ultrasonic power to be 20% -60% of the maximum ultrasonic power of the gold wire welding equipment, and setting the initial time to be 20-200 ms;
and S43, welding a second welding point, and gradually adjusting the pressure and the ultrasonic power of the chopper to eliminate gold and avoid adhesion.
Preferably, the step S43 specifically includes:
If the phenomenon that the gold welding wire is not bonded occurs, the pressure of the chopper is gradually increased by 1% -5% and the ultrasonic power is gradually increased by 1% -5% until the phenomenon disappears;
If the phenomenon of gold falling occurs, the pressure of the chopper is gradually reduced by 1% -5% amplitude, and meanwhile, the ultrasonic power is gradually reduced by 1% -5% amplitude until the phenomenon disappears.
preferably, the method further comprises the following steps:
and S5, after the second welding point is welded, carrying out gold wire ball burning again.
Preferably, in step S5, after the second welding point is welded, the tail drawn length of the gold welding wire is 70-90% of the height of the welding head from the second welding point in the initial state. The stress of the gold welding wire and the stress of the second welding point are controlled within a proper range, the welding points are protected from being damaged to the maximum extent, in addition, the open circuit can be easily caused by the short tail, and the automatic ball burning can not be realized, and the short circuit can be easily caused by the long tail.
example 1
In the present embodiment, as shown in fig. 2 to 7, a wire bonding process is performed using a gold wire bonding machine using a silicon wafer with a 50nm thin gold plating layer as the first solder points 100 and the second solder points 200, and the parameters and bonding process of the gold wire bonding machine are adjusted as follows:
Fig. 2 is a schematic diagram before the first welding point is welded, a gold solder ball 301 is located at the end of a gold solder wire 302, the gold solder wire 302 passes through a riving knife 311, whether the gold solder wire 302 passes or not is controlled by a wire clamp 312, and the riving knife 311 and the wire clamp 312 form a welding head 310.
As shown in fig. 3, when the first welding spot welding is performed, the riving knife pressure is 40% of the maximum pressure; the low ultrasonic power mode (1.3W) is adopted, the ultrasonic power is 40% of the maximum power of the gold wire welding machine, the ultrasonic time is 100ms, the gold wire solder ball 301 is contacted with the welding point 100 under the action of the pressure of a chopper and the ultrasonic wave, the solder ball flying phenomenon occurs, the ultrasonic power is gradually reduced to 30%, the phenomenon disappears, and the gold falling phenomenon occurs. Further reducing the pressure of the chopper and the ultrasonic power which are respectively 30 percent and 20 percent, and eliminating the gold dropping phenomenon.
As shown in fig. 4, after the first welding point is welded, the wire holder 312 is in a released state, the welding head 310 is lifted, and the gold wire 302 connected to the welding point 301 is dragged out to form a tail wire, wherein the length H1 is 180% of the distance L between the two welding points, and L is the distance between the first welding point 100 and the second welding point 200.
As shown in fig. 5, when the second welding spot welding is performed, the riving knife pressure is 30% of the maximum pressure; the low ultrasonic power mode (1.3W) is adopted, the ultrasonic power is 20% of the maximum power, the ultrasonic time is 100ms, the non-bonding phenomenon appears, the pressure and the ultrasonic power are respectively increased by 35% and 30%, and the phenomenon disappears.
after welding of the second weld spot 200 is completed, the gripper 312 is in an unclamped state, and after the welding head 310 is lifted to the height H2, the gripper 312 changes to a clamped state, and the welding head 310 is continuously lifted to the height H3, and H2 is controlled to be 90% of H3, as shown in fig. 6, so that the gold wire 302 can be given as small force as possible, separation from the weld spot 200 is realized, and the second weld spot is protected from being damaged to the greatest extent.
As shown in fig. 7, after the two-point welding is completed, the discharge head 320 applies a voltage to the gold wire 302, and sintering of the gold wire tail is completed under the action of the electric spark to obtain a new gold wire solder ball 301, and the next welding process is waited for.
Example 2
In this embodiment, a printed circuit board with 300nm gold plating is selected as the first and second pads 100 and 200 for a wire bonding process using a gold wire bonding machine. The parameters of the wire bonding machine and the bonding process were adjusted as follows:
fig. 2 is a schematic diagram before the first welding point is welded, a gold solder ball 301 is located at the end of a gold solder wire 302, the gold solder wire 302 passes through a riving knife 311, whether the gold solder wire 302 passes or not is controlled by a wire clamp 312, and the riving knife 311 and the wire clamp 312 form a welding head 310.
as shown in fig. 3, when the first welding spot welding is performed, the riving knife pressure is 60% of the maximum pressure; the low ultrasonic power mode (1.3W) is adopted, the ultrasonic power is 60% of the maximum power, the ultrasonic time is 100ms, the gold wire solder ball 301 is contacted with the solder joint 100 under the action of the pressure of the chopper and the ultrasonic wave, the solder ball flying phenomenon occurs, the ultrasonic power is gradually reduced to 50%, and the phenomenon disappears.
as shown in fig. 4, after the first welding point is welded, the wire holder 312 is in a released state, the welding head 310 is lifted, and the gold wire 302 connected to the welding point 301 is dragged out to form a tail wire, wherein the length H1 is 150% of the distance L between the two welding points, and L is the distance between the first welding point 100 and the second welding point 200.
As shown in fig. 5, when the second welding spot welding is performed, the riving knife pressure is 60% of the maximum pressure; and (3) completing the second welding by adopting a low ultrasonic power mode (1.3W), wherein the ultrasonic power is 50% of the maximum power, and the ultrasonic time is 100 ms.
After the welding of the second welding point 200 is completed, the clamping device 312 is in the unclamped state, when the welding head 310 is lifted to the height H2, the clamping device 312 is changed to the clamped state, the welding head 310 is continuously lifted to the height H3, and H2 is controlled to be 70% of H3, as shown in fig. 6, so that the separation of the welding point from the welding point 200 is realized, and the second welding point is protected from being damaged to the maximum extent.
After the two-point welding is completed, the discharge head 320 applies voltage to the gold wire 302, sintering of the gold wire tail is completed under the action of electric sparks, a new gold wire solder ball 301 is obtained, and the next welding process is waited to be performed, as shown in fig. 7.
in summary, the present application provides a gold wire bonding method, which controls the size of a solder ball, the initial chopper pressure, the initial ultrasonic power and the initial ultrasonic time before the bonding process by optimizing parameters such as gold wire bonding pressure, ultrasonic power and the like and the operation mode; the phenomenon of gold falling caused by overlarge pressure, overlarge ultrasonic power and overlong time and the phenomenon of adhesion prevention caused by overlarge pressure, overlarge ultrasonic power and overlong time are avoided; in the welding process, when the solder ball flying phenomenon appears, the phenomenon disappears by gradually reducing the ultrasonic power, and when the gold solder wire is not bonded, the phenomenon disappears by gradually increasing the pressure of the chopper and simultaneously gradually increasing the ultrasonic power; when the phenomenon of gold falling occurs, the phenomenon disappears by gradually reducing the pressure of the chopper and simultaneously gradually reducing the ultrasonic power, the gold wire welding of the thin gold coating is effectively realized, and the phenomenon of non-adhesion or gold falling of the gold wire welding is overcome.
Finally, the method of the present application is only a preferred embodiment and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. a method of wire bonding, comprising:
s1, fixing the substrate, and selecting a first welding spot and a second welding spot; the method is applied to a thin gold plating layer with the thickness less than 100 nm;
S2, selecting low ultrasonic power, setting the size of a solder ball, and carrying out gold wire ball burning on the gold solder wire;
S3, gradually adjusting the pressure and the ultrasonic power of the chopper of the first welding point, eliminating the phenomena of solder ball flying, gold falling and non-adhesion, and completing the welding of the first welding point; the method specifically comprises the following steps:
S31, optimizing the pressure of the riving knife, and setting the initial riving knife pressure to be 20% -60% of the maximum riving knife pressure value of the gold wire welding equipment;
S32, optimizing ultrasonic power parameters, setting the initial ultrasonic power to be 20% -60% of the maximum ultrasonic power of the gold wire welding equipment, and setting the initial time to be 20-200 ms;
S33, welding the first welding point, gradually adjusting the pressure and the ultrasonic power of the chopper, and eliminating the phenomena of solder ball flying, gold falling and non-adhesion; if the solder ball flying phenomenon appears, the ultrasonic power is gradually reduced by 1 to 5 percent until the phenomenon disappears;
If the phenomenon that the gold welding wire is not bonded occurs, the pressure of the chopper is gradually increased by 1% -5% and the ultrasonic power is gradually increased by 1% -5% until the phenomenon disappears;
if the phenomenon of gold falling occurs, the pressure of the chopper is gradually reduced by 1-5% amplitude, and the ultrasonic power is gradually reduced by 1-5% amplitude at the same time until the phenomenon disappears;
and S4, gradually adjusting the pressure and the ultrasonic power of the chopper of the second welding spot, eliminating the gold and non-adhesion phenomena, and completing the welding of the second welding spot.
2. the gold wire bonding method according to claim 1, wherein the substrate in step S1 is a substrate with gold plating, including gold-plated silicon, printed circuit board, gallium arsenide substrate.
3. the gold wire bonding method according to claim 1, wherein in step S2, the solder ball size is set to 40-60 μm.
4. The gold wire bonding method according to claim 1, wherein the step S3 further comprises:
After the first welding point is welded, extending a gold welding wire out of a tail wire with the length of 150L-180% L, and then welding a second welding point, wherein L is the distance between the first welding point and the second welding point.
5. The gold wire bonding method according to claim 1, wherein the step S4 specifically includes:
s41, optimizing the pressure of the riving knife, and setting the initial riving knife pressure to be 20% -60% of the maximum riving knife pressure value of the gold wire welding equipment;
s42, optimizing ultrasonic power parameters, setting the initial ultrasonic power to be 20% -60% of the maximum ultrasonic power of the gold wire welding equipment, and setting the initial time to be 20-200 ms;
and S43, welding a second welding point, and gradually adjusting the pressure and the ultrasonic power of the chopper to eliminate gold and avoid adhesion.
6. the gold wire bonding method according to claim 5, wherein the step S43 specifically comprises:
If the phenomenon that the gold welding wire is not bonded occurs, the pressure of the chopper is gradually increased by 1% -5% and the ultrasonic power is gradually increased by 1% -5% until the phenomenon disappears;
if the phenomenon of gold falling occurs, the pressure of the chopper is gradually reduced by 1% -5% amplitude, and meanwhile, the ultrasonic power is gradually reduced by 1% -5% amplitude until the phenomenon disappears.
7. The gold wire bonding method according to claim 1, further comprising:
And S5, after the second welding point is welded, carrying out gold wire ball burning again.
8. the gold wire welding method according to claim 7, wherein in step S5, after the second welding point is welded, the tail wire of the gold wire is drawn to a length of 70-90% of the height of the welding head from the second welding point in the initial state.
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| CN201710245439.4A CN107175400B (en) | 2017-04-14 | 2017-04-14 | gold wire welding method |
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| CN201710245439.4A CN107175400B (en) | 2017-04-14 | 2017-04-14 | gold wire welding method |
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| CN107175400B true CN107175400B (en) | 2019-12-06 |
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| CN112117204B (en) * | 2020-09-10 | 2022-10-14 | 安徽龙芯微科技有限公司 | Manufacturing method of packaging structure |
| CN115464247A (en) * | 2022-09-16 | 2022-12-13 | 上海创贤半导体有限公司 | Power semiconductor ultrasonic aluminum wire welding method |
| CN116329830B (en) * | 2023-05-29 | 2023-08-29 | 宁波尚进自动化科技有限公司 | Welding method of chip pins |
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| CN1137173A (en) * | 1995-04-10 | 1996-12-04 | 富士通株式会社 | Wire bonding method, semiconductor device, capillary for wire bonding and ball bump forming method |
| CN1172350A (en) * | 1996-07-15 | 1998-02-04 | 松下电子工业株式会社 | Semiconductor equipment and its manufacturing method |
| CN102820236A (en) * | 2011-06-08 | 2012-12-12 | 无锡华润安盛科技有限公司 | Lead bonding method for lead frame plastically packaged in advance |
| CN105870268A (en) * | 2016-05-06 | 2016-08-17 | 长治虹源光电科技有限公司 | LED encapsulating technical method based on gold-plated wire |
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