CN107172816A - A kind of method and system of establishment DIP types part encapsulation - Google Patents
A kind of method and system of establishment DIP types part encapsulation Download PDFInfo
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- CN107172816A CN107172816A CN201710469976.7A CN201710469976A CN107172816A CN 107172816 A CN107172816 A CN 107172816A CN 201710469976 A CN201710469976 A CN 201710469976A CN 107172816 A CN107172816 A CN 107172816A
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- restricted area
- dip
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- centered
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
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- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
This application discloses a kind of method of establishment DIP parts encapsulation, methods described includes：The DIP types part is placed on printed circuit board (PCB) model, part restricted area is set in the package centered on the pin of the DIP types part, by the firework control part rule setting of design for manufacture in the part restricted area, SMD type part is placed on the printed circuit board (PCB) model according to firework control part rule；By this method can be avoided from origin because hypotelorism is brought between part scolding tin it is bad the problem of, so as to improve operating efficiency, shorten the R＆D cycle, the competitiveness of enhancing storage product；Disclosed herein as well is a kind of system of establishment DIP parts encapsulation, with above beneficial effect.
Description
Technical field
The present invention relates to printed circuit board (PCB) manufacture, more particularly to a kind of method and system of establishment DIP types part encapsulation.
Background technology
Printed circuit board is also known as PCB, is the supplier of electronic component electrical connection.The design of printed circuit board (PCB)
Mainly layout design；It is the mistake for greatly reducing wiring and assembling using the major advantage of circuit board, improves Automated water
Gentle productive labor rate.
With the raising and the diminution of small product size of storage properties of product, pcb board density is increasing, almost all of to deposit
Store up mainboard and all use two-sided processing procedure.In the prior art, the welding of DIP types part uses wave-soldering mode, due to two-sided processing procedure
Printed circuit board (PCB) (as shown in Figure 1) DIP types part and SMD type part (surface mount device) be individually positioned in above and below two
On face, the pin of DIP type parts needs the position welded to be in same plane with SMD type part, when carrying out wave-soldering, SMD
The carrier of type part can cause to block to a part of region of surrounding, cause occlusion area can not contact scolding tin.Therefore, SMD is worked as
During the pin hypotelorism of type part and DIP type parts, the pin of DIP type parts, which is in occlusion area, to cause scolding tin bad
Problem.
Therefore, how to solve printed circuit board (PCB) DIP type part scolding tin bad, be that those skilled in the art need solution at present
Technical problem.
The content of the invention
The purpose of the application is to provide a kind of method and system of establishment DIP types part encapsulation, solves printed circuit board (PCB) DIP
The problem of type part scolding tin is bad.
In order to solve the above technical problems, the application provides a kind of method and system of establishment DIP types part encapsulation, this method
Including：
The DIP types part is placed on printed circuit board (PCB) model；
Part restricted area is set in the package centered on the pin of the DIP types part；
By the firework control part rule setting of design for manufacture in the part restricted area；
SMD type part is placed on the printed circuit board (PCB) model according to firework control part rule.
Optionally, part restricted area is set to include in the package centered on the pin of the DIP types part：
Determine the DIP types part and the SMD type part line and the position relationship in stream plate direction；
Described zero is set in the package centered on the pin of the DIP types part according to the position relationship
Part restricted area, wherein, the stream plate direction is the direction of motion of the printed circuit board (PCB) model when carrying out wave-soldering.
Optionally, when the position relationship is parallel, in the envelope centered on the pin of the DIP types part
The part restricted area is set to include in dress：
160mil is extended out centered on the pin and sets up the loop wire of closing, and in the package surrounds the loop wire
Region be set to the part restricted area.
Optionally, when the position relationship is vertical, in the envelope centered on the pin of the DIP types part
The part restricted area is set to include in dress：
100mil is extended out centered on the pin and sets up the loop wire of closing, and in the package surrounds the loop wire
Region be set to the part restricted area.
Present invention also provides a kind of system of establishment DIP types part encapsulation, the system includes：
DIP placement modules, for placing the DIP types part on printed circuit board (PCB) model；
Part restricted area setup module, for setting zero in the package centered on the pin of the DIP types part
Part restricted area；
Firework control part rule setting module, for by the firework control part rule setting of design for manufacture in the part
Restricted area；
SMD placement modules, for placing SMD type zero on the printed circuit board (PCB) model according to firework control part rule
Part.
Optionally, part restricted area setup module includes：
Position relationship judging unit, for determining DIP types part and the SMD type part line and the position in stream plate direction
Relation；
Part restricted area setting unit, for according to the position relationship using the pin of the DIP types part in
The heart sets the part restricted area in the package, wherein, the stream plate direction is the printing electricity when carrying out wave-soldering
The direction of motion of road Slab.
Optionally, part restricted area setting unit includes：
Parallel restricted area sets subelement, for when the position relationship is parallel, being extended out centered on the pin
160mil sets up the loop wire of closing, and the region in the package surrounding the loop wire is set to the part restricted area.
Optionally, part restricted area setting unit includes：
Vertical restricted area sets subelement, for when the position relationship is vertical, being extended out centered on the pin
100mil sets up the loop wire of closing, and the region in the package surrounding the loop wire is set to the part restricted area.
The invention provides a kind of method of DIP types part encapsulation, the DIP types zero are placed on printed circuit board (PCB) model
Part；Part restricted area is set in the package centered on the pin of the DIP types part, and by design for manufacture
Firework control part rule setting is in the part restricted area；Put according to firework control part rule on the printed circuit board (PCB) model
Put SMD type part.
This method sets a restricted area aspect centered on the pin of DIP type parts, is put outside this restricted area aspect
Put SMD type part and do not result in the problem of scolding tin is bad, and firework control part rule is set in the aspect of restricted area, if Xiang Gai areas
Place SMD type part and then have to select unrestricted region layer face in domain.When SMD type part is placed on outside the aspect of restricted area, SMD type
Part and DIP type parts have been maintained for safe distance, and the scolding tin brought by hypotelorism between part is avoided from origin not
Good the problem of, so as to improve operating efficiency, shorten the R＆D cycle, the competitiveness of enhancing storage product.The application is also provided simultaneously
A kind of system of establishment DIP types parts encapsulation, with above-mentioned beneficial effect, will not be repeated here.
Brief description of the drawings
In order to illustrate more clearly of the embodiment of the present application, the required accompanying drawing used in embodiment will be done simply below
Introduce, it should be apparent that, drawings in the following description are only some embodiments of the present application, for ordinary skill people
For member, on the premise of not paying creative work, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is that part crosses wave-soldering schematic diagram；
Hardware environment residing for a kind of method for establishment DIP parts encapsulation that Fig. 2 is provided by the embodiment of the present application is illustrated
Figure；
A kind of flow chart of the method for establishment DIP parts encapsulation that Fig. 3 is provided by the embodiment of the present application；
The flow chart of the method for another establishment DIP parts encapsulation that Fig. 4 is provided by the embodiment of the present application；
The flow chart of the method for another establishment DIP part encapsulation that Fig. 5 is provided by the embodiment of the present application；
When Fig. 6 is DIP types part shown in Fig. 5 and SMD type part line and perpendicular or parallel stream plate direction, SMD type part
Put schematic diagram；
Fig. 7 is part restricted area when DIP types part shown in Fig. 5 and SMD type part line and stream plate direction are perpendicular or parallel
Setting schematic diagram；
A kind of structural representation of the system for establishment DIP parts encapsulation that Fig. 8 is provided by the embodiment of the present application.
Embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present application clearer, below in conjunction with the embodiment of the present application
In accompanying drawing, the technical scheme in the embodiment of the present application is clearly and completely described, it is clear that described embodiment is
Some embodiments of the present application, rather than whole embodiments.Based on the embodiment in the application, those of ordinary skill in the art
The every other embodiment obtained under the premise of creative work is not made, belongs to the scope of the application protection.
A kind of method and system of establishment DIP types part encapsulation provided herein, can apply to following hardware
Jing Zhong：
Fig. 2 is refer to, the hardware at method that Fig. 2 encapsulates for a kind of establishment DIP types part provided herein
Environment schematic, including printed circuit board (PCB) package center 101, print circuit plates making center 102.
Wherein, printed circuit board (PCB) package center 101 is that custom IC is assembled into chip final products device, for example：
Altium Desinger or protel99se computer etc. is installed, as long as can be according to schematic diagram to printed circuit board (PCB)
The equipment being packaged, does not do specific limitation to monitor terminal 101 herein.Print circuit plates making center 102, is used
Come the printed circuit board (PCB) progress manufacture in kind obtained to encapsulation, including to printed circuit board (PCB) progress wave-soldering, according to printing
The wire laying mode of circuit board connects each circuit component.
It refer to Fig. 3, a kind of flow chart of the method for establishment DIP types part encapsulation that Fig. 3 provides for the embodiment of the present application.
This method includes：
Step S201：The DIP types part is placed on printed circuit board (PCB) model；
Wherein, this step is carried out in computer software, due to having other parts on printed circuit board (PCB) model,
Tried one's best when placing DIP type parts and keep each part on printed circuit board (PCB) model uniformly to arrange, to avoid a part excessively compact another
A problem of part is excessively sparse.DIP (Dual In-line Package, be called dual-inline package), DIP types part tool
There are two row's pins, it is necessary to be inserted on the chip carrier socket with DIP structures, it is of course also possible to be directly inserted in identical welding hole number
Welded on the circuit board arranged with geometry.Because DIP type parts have pin, the welding of pin is to place DIP types zero
What the back side of the plate face of the printed circuit board (PCB) of part was completed.
Step S202：Part restricted area is set in the package centered on the pin of DIP type parts；
Wherein, part restricted area (Lead_Bot_Smd) is a region for forbidding SMD type part to place.Due to DIP types
Part has two row's pins, and a scope delimited centered on each pin, takes the union of all scopes to be used as part limit
Area processed, being placed on SMD type part does not influence the welding of DIP type part pins when outside part restricted area.Appoint of course, it is possible to use
Meaning shape draws the line, but design and fabrication for convenience, can delimit circular scope using pin as the center of circle, and by institute
The union of some circular scopes is set to part restricted area.It is understood that the union due to taking all circular scopes, circular
Narrow and small class delta-shaped region is had with circular junction, these regions in theory can place other parts, but
It is that other parts itself are to occupy certain area, narrow and small region can not possibly be placed in actually manufacture, therefore can be by zero
Part restricted area is optimized, and makes a more smooth shape.
Step S203：By the firework control part rule setting of design for manufacture in the part restricted area；
Design for manufacture (Design for manufacture, also known as DFM), referring to the design of product needs to meet production
The requirement of product manufacture, with good manufacturability so that product is with minimum cost, most short time, highest quality system
Create.
Firework control part rule (Rule) is that one kind forbids placing part in designing printed circuit board model in designated area
Rule, place SMD type part when due to by firework control part rule limited, can and DIP type parts pin keep pacify
Full distance, solves the problem of scolding tin is bad from root.
In this embodiment, design for manufacture refers to the design to printed circuit board (PCB) model, the basis designed herein
On firework control part rule can be set in some region of printed circuit board (PCB) model, this region is turned into part restricted area, i.e.,
SMD type part can not be placed in this region.
Step S204：According to firework control part rule, SMD type part is placed on the printed circuit board (PCB) model；
Wherein, firework control part rule is set again due to first placing DIP types part, so firework control part rule is not intended to limit
The placement of DIP type parts.And when placing SMD type part, firework control part rule can be limited the placement location of SMD type part
It is fixed, i.e. SMD type part cannot be placed by setting the region of firework control part rule, that is to say, that SMD type part, which must be placed at, to be set
Outside the part restricted area for having put part firework control rule.SMD type part can be placed in the arbitrary region outside part restricted area, certainly
The requirement of wiring problem and the circuit board feature uniformity is accounted for, SMD type part is disposed close to the suitable of part restricted area
Suitable position, does not carry out other restrictions to the placement location of SMD type part herein.
Fig. 4 is referred to below, the method that another establishment DIP parts that Fig. 4 is provided by the embodiment of the present application are encapsulated
Flow chart.
This embodiment is on the basis of above-described embodiment, according to DIP types part and SMD type part line and stream plate direction
Position relationship, to determine the size of part restricted area, and then determine the putting position of SMD parts.
Specific steps can include：
Step S301：The DIP types part is placed on printed circuit board (PCB) model.
Step S302：According to the DIP types part and the SMD type part line and the position relationship in plate direction is flowed, with
The part restricted area is set in the package centered on the pin of the DIP types part；
Wherein, because printed circuit board (PCB) uses wave-soldering, printed circuit board (PCB) in crest welder to a direction move into
Row welding, mobile direction is referred to as stream plate direction.It is worth noting that, the direction that stream plate direction sprays with scolding tin is not to hang down
Straight, the angle of the two but an obtuse angle so will result in blocking between circuit component, the bad situation of scolding tin occur.
Certainly during stream plate, the circumstance of occlusion between circuit component is caused by two aspect factors, is on the one hand
The distance between part, is on the other hand line and the position relationship in stream plate direction between part.Wherein, DIP types part and SMD zero
Part is placed in same printed circuit board, and the two is not in same plane, but the pin of DIP type parts and SMD type zero
At grade, the wave-soldering in this step is that the pin of DIP type parts is welded to part, therefore, is produced in wave-soldering
Block actually SMD type part blocking to the pins of DIP type parts.It is understood that DIP types part in the step
Actually refer to the pin center of DIP type parts and the line of SMD type Central of the parts with SMD type part line.
It is understood that when the line between circuit component is parallel with stream plate direction, the block surface between circuit component
Product is maximum；When the line between circuit component is vertical with stream plate direction, the shielded area between circuit component is minimum；
When the line between circuit component is with flowing both not parallel plate direction or out of plumb, the shielded area between circuit component is in maximum
Between shielded area and minimum shielded area, shielded area now can be calculated by geometry certainly or experimental data is obtained,
The computational methods not to shielded area are defined herein, certainly when not knowing specific data, can be blocked according to maximum
Area carries out the delimitation of part restricted area.
Step S303：By to the firework control part rule setting of the design of manufacture in the part restricted area.
Step S304：SMD type part is placed on the printed circuit board (PCB) model according to firework control part rule.
Referring to Fig. 5, the flow for the method that another establishment DIP part that Fig. 5 is provided by the embodiment of the present application is encapsulated
Figure.This embodiment be on the basis of above-described embodiment, in DIP types part and SMD type part line and parallel stream plate direction,
The size of part restricted area is determined, and then determines the putting position of SMD parts.
Specific steps can include：
Step S401：The DIP types part is placed on printed circuit board (PCB) model.
Step S402：When the DIP types part is with the SMD type part line and parallel stream plate direction, drawn with described
Extend out the loop wire that 160mil sets up closing centered on pin, and the region in the package surrounding the loop wire be set to it is described
Part restricted area.
This step is roughly the same with the S302 contents of above step, and here is omitted.
Step S403：By the firework control part rule setting of design for manufacture in the part restricted area；
Step S404：SMD type part is placed on the printed circuit board (PCB) model according to firework control part rule.
The embodiment of the present application also provides a kind of method of establishment DIP parts encapsulation.This embodiment is in above-described embodiment
On the basis of, when DIP types part is with SMD type part line and vertical stream plate direction, the size of part restricted area is determined, and then really
Determine the putting position of SMD parts, the flow chart of this embodiment is roughly the same with Fig. 5, simply DIP types part connects with SMD type part
Line and the position relationship in stream plate direction are changed, and here is omitted.
For DIP types part and SMD type part line and the position relationship in stream plate direction, Fig. 6, Fig. 7 are refer to, Fig. 6 is
DIP types part and SMD type part line and flow plate direction it is perpendicular or parallel when, SMD type part puts schematic diagram；Fig. 7 is DIP
The setting schematic diagram of part restricted area when type part is with SMD type part line and perpendicular or parallel stream plate direction.
Because the embodiment of components of system as directed and the embodiment of method part are mutually corresponding, therefore the embodiment of components of system as directed please
Referring to the description of the embodiment of method part, it wouldn't repeat here.
Fig. 8, the system architecture signal that Fig. 8 encapsulates for a kind of establishment DIP types part provided herein are referred to below
Figure, the system can include：
DIP placement modules 100, for placing the DIP types part on printed circuit board (PCB) model；
Part restricted area setup module 200, for being set in the package centered on the pin of the DIP types part
Part restricted area,
Firework control part rule setting module 300, by the design for manufacture firework control part rule setting described zero
Part restricted area；
SMD placement modules 400, for being placed on the printed circuit board according to the Rule (firework control part rule)
SMD type part；
In addition, in the system for another establishment DIP types part encapsulation that the embodiment of the present application is provided, part restricted area
Demarcation method regulation, be allowed to more efficiently avoid the problem of scolding tin is bad.
Further, part restricted area setup module 200 includes：
Position relationship judging unit 210, for determining DIP types part and the SMD type part line and flowing plate direction
Position relationship；
Part restricted area setting unit 220 is according to the position relationship centered on the pin of the DIP types part
The part restricted area is set in the package, wherein, the stream plate direction is the printed circuit when carrying out wave-soldering
The direction of motion of plate.
In addition, the embodiment of the present application provides the system that a kind of establishment DIP types part is encapsulated, at two kinds in particular cases again
To the demarcation method regulation of part restricted area, it is allowed to more efficiently avoid the problem of scolding tin is bad.
Further, part restricted area setting unit 220 includes：
Parallel restricted area sets subelement 221, outer centered on the pin for when the position relationship is parallel
Expand the loop wire that 160mil sets up closing, and the region in the package surrounding the loop wire is set to the part limitation
Area.
Further, part restricted area setting unit 220 includes：
Parallel restricted area sets subelement 222, outer centered on the pin for when the position relationship is vertical
Expand the loop wire that 100mil sets up closing, and the region in the package surrounding the loop wire is set to the part limitation
Area.
The method and system to a kind of establishment DIP types part encapsulation provided herein are described in detail above.
The embodiment of each in specification is described by the way of progressive, what each embodiment was stressed be with other embodiment not
Between same part, each embodiment identical similar portion mutually referring to.For system disclosed in embodiment, due to it
Correspond to the method disclosed in Example, so description is fairly simple, related part is referring to method part illustration.Should
Point out, for those skilled in the art, can also be to this Shen on the premise of the application principle is not departed from
Some improvement and modification please be carry out, these are improved and modification is also fallen into the application scope of the claims.
It should also be noted that, in this manual, such as first and second or the like relational terms be used merely to by
One entity or operation make a distinction with another entity or operation, and not necessarily require or imply these entities or operation
Between there is any this actual relation or order.Moreover, term " comprising ", "comprising" or its any other variant meaning
Covering including for nonexcludability, so that process, method, article or equipment including a series of key elements not only include that
A little key elements, but also other key elements including being not expressly set out, or also include be this process, method, article or
The intrinsic key element of equipment.In the absence of more restrictions, the key element limited by sentence "including a ...", is not arranged
Except also there is other identical element in the process including the key element, method, article or equipment.
Claims (8)
1. a kind of method of establishment DIP types part encapsulation, it is characterised in that methods described includes：
The DIP types part is placed on printed circuit board (PCB) model；
Part restricted area is set in the package centered on the pin of the DIP types part；
By the firework control part rule setting of design for manufacture in the part restricted area；
SMD type part is placed on the printed circuit board (PCB) model according to firework control part rule.
2. method according to claim 1, it is characterised in that in the encapsulation centered on the pin of the DIP types part
Middle setting part restricted area includes：
Determine the DIP types part and the SMD type part line and the position relationship in stream plate direction；
The part is set to limit in the package centered on the pin of the DIP types part according to the position relationship
Area processed, wherein, the stream plate direction is the direction of motion of the printed circuit board (PCB) when carrying out wave-soldering.
3. method according to claim 2, it is characterised in that when the position relationship for it is parallel when, with the DIP types part
The pin centered on set the part restricted area to include in the package：
The loop wire that 160mil sets up closing, and the area in the package surrounding the loop wire are extended out centered on the pin
Domain is set to the part restricted area.
4. method according to claim 2, it is characterised in that when the position relationship for it is vertical when, with the DIP types part
The pin centered on set the part restricted area to include in the package：
The loop wire that 100mil sets up closing, and the area in the package surrounding the loop wire are extended out centered on the pin
Domain is set to the part restricted area.
5. a kind of system of establishment DIP types part encapsulation, it is characterised in that the system includes：
DIP placement modules, for placing the DIP types part on printed circuit board (PCB) model；
Part restricted area setup module, for setting part to limit in the package centered on the pin of the DIP types part
Area processed；
Firework control part rule setting module, for the firework control part rule setting of design for manufacture to be limited in the part
Area；
SMD placement modules, for placing SMD type part on the printed circuit board (PCB) model according to firework control part rule.
6. system according to claim 5, it is characterised in that part restricted area setup module includes：
Position relationship judging unit, for determining the DIP types part and the SMD type part line and the position in stream plate direction
Relation；
Part restricted area setting unit, for according to the position relationship centered on the pin of the DIP types part
The part restricted area is set in the encapsulation, wherein, the stream plate direction is the printed circuit board (PCB) when carrying out wave-soldering
The direction of motion.
7. system according to claim 6, it is characterised in that part restricted area setting unit includes：
Parallel restricted area sets subelement, for when the position relationship is parallel, being extended out centered on the pin
160mil sets up the loop wire of closing, and the region in the package surrounding the loop wire is set to the part restricted area.
8. system according to claim 6, it is characterised in that part restricted area setting unit includes：
Vertical restricted area sets subelement, for when the position relationship is vertical, being extended out centered on the pin
100mil sets up the loop wire of closing, and the region in the package surrounding the loop wire is set to the part restricted area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710469976.7A CN107172816B (en) | 2017-06-20 | 2017-06-20 | Method and system for creating DIP type part package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710469976.7A CN107172816B (en) | 2017-06-20 | 2017-06-20 | Method and system for creating DIP type part package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107172816A true CN107172816A (en) | 2017-09-15 |
| CN107172816B CN107172816B (en) | 2020-03-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710469976.7A Active CN107172816B (en) | 2017-06-20 | 2017-06-20 | Method and system for creating DIP type part package |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1620228A (en) * | 2003-11-21 | 2005-05-25 | 华为技术有限公司 | Method of realizing local crest welding and printed circuit board |
| CN101582094A (en) * | 2008-05-14 | 2009-11-18 | 英业达股份有限公司 | Through hole arrangement system and through hole arrangement method |
| CN104681458A (en) * | 2013-11-27 | 2015-06-03 | 广东美的制冷设备有限公司 | Double-row pin integrated circuit chip encapsulation structure and encapsulation design method |
| CN106852020A (en) * | 2017-02-21 | 2017-06-13 | 郑州云海信息技术有限公司 | A kind of manufacture method of raising PCBA production efficiencys |
-
2017
- 2017-06-20 CN CN201710469976.7A patent/CN107172816B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1620228A (en) * | 2003-11-21 | 2005-05-25 | 华为技术有限公司 | Method of realizing local crest welding and printed circuit board |
| CN101582094A (en) * | 2008-05-14 | 2009-11-18 | 英业达股份有限公司 | Through hole arrangement system and through hole arrangement method |
| CN104681458A (en) * | 2013-11-27 | 2015-06-03 | 广东美的制冷设备有限公司 | Double-row pin integrated circuit chip encapsulation structure and encapsulation design method |
| CN106852020A (en) * | 2017-02-21 | 2017-06-13 | 郑州云海信息技术有限公司 | A kind of manufacture method of raising PCBA production efficiencys |
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| Publication number | Publication date |
|---|---|
| CN107172816B (en) | 2020-03-06 |
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