CN107170849B - 一种条型超表面结构偏振相关窄带探测器及其制备与应用 - Google Patents
一种条型超表面结构偏振相关窄带探测器及其制备与应用 Download PDFInfo
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- CN107170849B CN107170849B CN201710308855.4A CN201710308855A CN107170849B CN 107170849 B CN107170849 B CN 107170849B CN 201710308855 A CN201710308855 A CN 201710308855A CN 107170849 B CN107170849 B CN 107170849B
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- quantum dots
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- silicon
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- 238000002360 preparation method Methods 0.000 title claims abstract description 19
- 239000002096 quantum dot Substances 0.000 claims abstract description 71
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 55
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 51
- 239000010703 silicon Substances 0.000 claims abstract description 51
- 238000010521 absorption reaction Methods 0.000 claims abstract description 25
- 239000010931 gold Substances 0.000 claims abstract description 22
- 229910052737 gold Inorganic materials 0.000 claims abstract description 22
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 7
- 238000004528 spin coating Methods 0.000 claims abstract description 7
- 230000003287 optical effect Effects 0.000 claims abstract description 6
- 238000005566 electron beam evaporation Methods 0.000 claims abstract description 4
- 238000012545 processing Methods 0.000 claims abstract description 4
- 238000011161 development Methods 0.000 claims abstract description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 27
- 239000010410 layer Substances 0.000 claims description 21
- 238000001514 detection method Methods 0.000 claims description 20
- 239000000377 silicon dioxide Substances 0.000 claims description 13
- 230000001413 cellular effect Effects 0.000 claims description 10
- 238000010276 construction Methods 0.000 claims description 10
- 230000000737 periodic effect Effects 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 7
- 238000010894 electron beam technology Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 239000002344 surface layer Substances 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 238000004891 communication Methods 0.000 claims description 2
- 239000000835 fiber Substances 0.000 claims description 2
- 238000010183 spectrum analysis Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000001259 photo etching Methods 0.000 claims 1
- 230000010287 polarization Effects 0.000 abstract description 11
- 230000000694 effects Effects 0.000 abstract description 4
- 230000002596 correlated effect Effects 0.000 abstract description 2
- 230000032900 absorption of visible light Effects 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- 238000000862 absorption spectrum Methods 0.000 description 5
- 238000013461 design Methods 0.000 description 5
- 230000005684 electric field Effects 0.000 description 5
- 238000004088 simulation Methods 0.000 description 5
- 239000010408 film Substances 0.000 description 4
- 230000003595 spectral effect Effects 0.000 description 4
- 241000790917 Dioxys <bee> Species 0.000 description 3
- 229910003978 SiClx Inorganic materials 0.000 description 3
- 239000006096 absorbing agent Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000012822 chemical development Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007687 exposure technique Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- VDGJOQCBCPGFFD-UHFFFAOYSA-N oxygen(2-) silicon(4+) titanium(4+) Chemical compound [Si+4].[O-2].[O-2].[Ti+4] VDGJOQCBCPGFFD-UHFFFAOYSA-N 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
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- 239000010409 thin film Substances 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
- H01L31/035209—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions comprising a quantum structures
- H01L31/035218—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions comprising a quantum structures the quantum structure being quantum dots
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/09—Devices sensitive to infrared, visible or ultraviolet radiation
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Light Receiving Elements (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
Abstract
Description
Claims (13)
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CN201710308855.4A CN107170849B (zh) | 2017-05-04 | 2017-05-04 | 一种条型超表面结构偏振相关窄带探测器及其制备与应用 |
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CN201710308855.4A CN107170849B (zh) | 2017-05-04 | 2017-05-04 | 一种条型超表面结构偏振相关窄带探测器及其制备与应用 |
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CN107170849A CN107170849A (zh) | 2017-09-15 |
CN107170849B true CN107170849B (zh) | 2019-06-18 |
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CN108444927B (zh) * | 2018-03-12 | 2020-01-21 | 华中科技大学 | 一种光谱分析芯片及其制备方法 |
CN110797419B (zh) * | 2019-10-29 | 2021-04-06 | 华中科技大学 | 一种叉指电极结构偏振相关窄带探测器、其制备和应用 |
CN110943138B (zh) * | 2019-12-11 | 2021-10-08 | 唐鑫 | 基于干涉增强结构的胶体量子点红外焦平面阵列及制备方法 |
CN111969072B (zh) * | 2020-08-17 | 2022-09-02 | 南方科技大学 | 一种基于量子点光栅增强的光电探测器及其制备方法和探测光的调整方法 |
CN112859206B (zh) * | 2021-01-26 | 2022-02-15 | 华中科技大学 | 一种将高斯光整形成平顶光的全介质超透镜的制备方法 |
CN114823941B (zh) * | 2022-04-29 | 2024-04-02 | 聊城大学 | 一种谐振增强型光电探测器及制作方法 |
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CN102110736B (zh) * | 2010-11-09 | 2012-05-23 | 北京理工大学 | 一种基于胶体量子点的红外光电探测器及其制备方法 |
CN103367370B (zh) * | 2012-03-27 | 2016-04-06 | 北京邮电大学 | 亚波长光栅反射增强型硅基宽光谱集成光探测器及其制备方法 |
CN103500703B (zh) * | 2013-10-10 | 2016-02-17 | 中国科学院上海技术物理研究所 | 提高CdS和CdSe纳米材料电导率和光电流的方法 |
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