CN107167970B - Display substrate and display device - Google Patents
Display substrate and display device Download PDFInfo
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- CN107167970B CN107167970B CN201710404651.0A CN201710404651A CN107167970B CN 107167970 B CN107167970 B CN 107167970B CN 201710404651 A CN201710404651 A CN 201710404651A CN 107167970 B CN107167970 B CN 107167970B
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- 239000000758 substrate Substances 0.000 title claims abstract description 70
- 239000010410 layer Substances 0.000 claims abstract description 147
- 229910052751 metal Inorganic materials 0.000 claims abstract description 116
- 239000002184 metal Substances 0.000 claims abstract description 116
- 239000011241 protective layer Substances 0.000 claims abstract description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 10
- 238000010586 diagram Methods 0.000 description 7
- 239000004973 liquid crystal related substance Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000010408 film Substances 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000009194 climbing Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136227—Through-hole connection of the pixel electrode to the active element through an insulation layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
- H01L27/1244—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits for preventing breakage, peeling or short circuiting
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses a display substrate and display equipment, wherein the display substrate comprises a signal terminal, the signal terminal comprises a plurality of metal contact pieces, and each metal contact piece comprises a first metal layer; an insulating layer disposed on the surface of the first metal layer; a second metal layer disposed on the surface of the insulating layer; a protective layer disposed on a surface of the second metal layer; and the projection of the second metal layer on the display substrate is positioned in the projection of the first metal layer on the display substrate. The invention can ensure that the protective layer is in sealed contact with the second metal layer, and the second metal layer can not be broken when covering the insulating layer and the first metal layer.
Description
Technical Field
The invention relates to the field of liquid crystal displays, in particular to a display substrate and display equipment.
Background
A Thin Film Transistor Liquid Crystal Display (TFT-LCD for short) is an important flat panel Display device, and its main structure is two Display substrates provided to a cell: the liquid crystal display panel comprises an array substrate, a color film substrate and a liquid crystal layer filled between the array substrate and the color film substrate. The array substrate is provided with a grid line, a data line and pixel units limited by the grid line and the data line, wherein each pixel unit comprises a Thin Film Transistor (TFT) and a pixel electrode. In the display process, the TFT is used as a switch to control the application of a driving electric field to the liquid crystal, thereby controlling the rotation of the liquid crystal and realizing the display of pictures.
A signal terminal (Bonding lead) area is an interface area in the display substrate, and an external signal enters the interface area in the display substrate and is connected to the signal terminal of the display substrate through a Chip On Film (COF). The driving signal and the pixel data enter the display area of the display substrate through the signal terminal, so the design structure of the signal terminal is directly related to whether the signal is supplied smoothly. Fig. 7 is a cross-sectional view showing a structure of a signal terminal of the prior art, which includes a substrate 1, a lower metal layer 2, an insulating layer 3, an upper metal layer 4 and a protective layer 5, wherein the upper metal layer 4 contacts the lower metal layer 2 through a plurality of via holes 6, and a pixel electrode of a top layer is bridged with the upper metal layer 4 through a conductive line.
The inventors of the present application have found in long-term research and development that the following problems exist in the structure of such a signal terminal of the prior art: the edges of its upper metal layer 4 and lower metal layer 2 on the same side are flush in the vertical direction, which has the disadvantage of causing two metal layers to overlap, making the slope at its edge steeper, making the coverage of the protective layer 5 covering the upper metal layer 4 poor, or even easy to fall off. As shown in fig. 8, a schematic structural diagram of a prior art signal terminal is shown in fig. 9, after exposure development is performed on the insulating layer 3 on the lower metal layer in the process of manufacturing a via hole, and a schematic structural diagram of the prior art signal terminal is left after the photoresist 7 is removed.
In addition, as shown in fig. 10, which is a top view of a signal terminal in the prior art, a plurality of via holes 6 are uniformly arranged along the extending direction of the signal terminal, but a gap 21 between two adjacent via holes 6 is small, and in the process of exposing and developing the insulating layer 3 on the lower metal layer 2, problems such as diffraction between the adjacent via holes 6 are easily caused, so that after exposure and development, the slopes of the photoresist 7 and the insulating layer 3 are steep and substantially at a right angle, which is not favorable for the climbing of the upper metal layer 4, and even when coating, the upper metal layer 4 may be broken.
Disclosure of Invention
The invention mainly provides a display substrate and display equipment, and aims to solve the problems that in a signal terminal of the display substrate in the prior art, due to the fact that the edges of an upper metal layer and a lower metal layer on the same side are flush, the two metal layers are overlapped, the gradient of the edges of the two metal layers is steep, and a protective layer covering the upper metal layer is poor in coverage property and even easy to fall off.
In order to solve the technical problems, the invention adopts a technical scheme as follows:
a display substrate comprising a plurality of signal terminals, each of said signal terminals comprising a plurality of metal contacts, each of said metal contacts comprising:
a first metal layer; the insulating layer is arranged on the surface of the first metal layer; the second metal layer is arranged on the surface of the insulating layer; the protective layer is arranged on the surface of the second metal layer; wherein a projection of the second metal layer on the display substrate is located within a projection of the first metal layer on the display substrate.
In order to solve the above technical problems, another technical solution adopted by the present invention is as follows:
a display device comprising the display substrate of any one of the above and a driving circuit, and the driving circuit connects gate lines and data lines of the display substrate through the plurality of signal terminals, respectively.
The invention has the beneficial effects that: different from the situation of the prior art, the projection of the second metal layer on the display substrate is positioned in the projection of the first metal layer on the display substrate, so that the situation that the edges of the two metal layers are aligned is not superposed, the gradient of the edges is gentle, the protective layer can be ensured to be in sealing contact with the second metal layer, and the protective layer covered on the upper metal layer has good coverage and is not easy to fall off.
Drawings
FIG. 1 is a schematic cross-sectional view of a signal terminal according to an embodiment of a display substrate of the invention;
FIG. 2 is a schematic view of a portion of a structure of a signal terminal of an embodiment of a display substrate according to the present invention, after exposing and developing an insulating layer on a first metal layer, a photoresist is left;
FIG. 3 is a schematic view of a portion of the structure of a signal terminal of an embodiment of a display substrate of the present invention, after removing the photoresist, leaving a first metal layer and an insulating layer;
FIG. 4 is a top view of a portion of a signal terminal along an extending direction of the signal terminal according to an embodiment of the display substrate of the present invention;
FIG. 5 is a schematic view of a portion of a display substrate according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a portion of one embodiment of a display device of the present invention;
FIG. 7 is a schematic diagram of a partial cross-sectional structure of an embodiment of a signal terminal of a display substrate according to the prior art;
FIG. 8 is a schematic diagram of a portion of a structure of a prior art display substrate in which a photoresist is left after an insulating layer on a first metal layer is exposed and developed during a manufacturing process of a signal terminal of the prior art display substrate;
FIG. 9 is a schematic diagram of a partial structure of a signal terminal of a display substrate of the prior art, in which a lower metal layer and a partial insulating layer are left after a photoresist is removed during a manufacturing process;
fig. 10 is a partial structure top view of a signal terminal of a display substrate of the related art along an extending direction thereof.
Detailed Description
Example one
Referring to fig. 1 to 5, fig. 1 is a schematic partial cross-sectional structure of a signal terminal 300 of a display substrate 500 according to the present invention, fig. 2 is a schematic partial structure of a photoresist 70 left after exposing and developing an insulating layer 30 on a first metal layer 20 during a manufacturing process of the signal terminal 300 of the display substrate 500 according to the present invention, fig. 3 is a schematic partial structure of the first metal layer 20 and the insulating layer 30 left after removing the photoresist 70 during the manufacturing process of the signal terminal 300 of the display substrate 500 according to the present invention, fig. 4 is a schematic partial structure top view of the signal terminal 300 of the display substrate 500 according to the present invention along an extending direction thereof, and fig. 5 is a schematic partial structure of the display substrate 500 according to the present invention.
As can be seen from fig. 1 to 5, a display substrate 500 according to the present invention includes a plurality of signal terminals 300 disposed around a display area 400, and external signals are connected to the signal terminals 300 of the display substrate 500 through a flip-chip film 200. Wherein, the driving signal and the pixel data enter the display area 400 of the display substrate 500 via the signal terminals 300, each of the signal terminals 300 comprises a plurality of metal contact pieces 100, each of the metal contact pieces 100 comprises:
and a first metal layer 20 formed on one surface of the base substrate 10.
And the insulating layer 30 is arranged on the surface of the first metal layer 20.
And a second metal layer 40 disposed on a surface of the insulating layer 30, the first metal layer 20 and the second metal layer 40 sandwiching the insulating layer 30.
And the protective layer 50 is arranged on the surface of the second metal layer 40 and is used for preventing the second metal layer 40 from being conducted with other conductors.
Wherein the projection of the second metal layer 40 on the display substrate 500 is located within the projection of the first metal layer 20 on the display substrate 500.
In this embodiment, the distance between the edge of the first metal layer 20 and the edge of the second metal layer 40 on the same side in the horizontal direction is greater than or equal to a first predetermined distance 12, and the first predetermined distance 12 can ensure that the protection layer 50 is in sealed contact with the second metal layer 40. As shown in fig. 1, the second metal layer 40 on the same side is recessed inward by a distance greater than or equal to the first predetermined distance 12, so that the passivation layer 50 may have a gentle slope, which may not make a bad contact with the second metal layer 40, and may not cause a crack thereof.
In this embodiment, the first preset distance 12 may be selected to be greater than 1 um. This value is an empirical value obtained through a number of experiments. The first preset distance 12 may also be 2um, 3um, etc.
In this embodiment, the second metal layer 40 is electrically connected to the pixel electrode through a wire.
In this embodiment, each of the metal contact pads 100 is provided with a plurality of via holes 60 along the extending direction thereof, the via holes 60 penetrate through the insulating layer 30, the second metal layer 40 penetrates through the via holes 60 to be in contact with the first metal layer 20, the distance between two adjacent via holes 60 is greater than or equal to a second preset distance 11, and the second preset distance 11 can ensure that the second metal layer 40 is not broken when the insulating layer 30 is etched to expose the first metal layer 20 during the fabrication of the via holes 60, and the slope of the insulating layer 30 corresponding to the via holes 60 can make the second metal layer 40 cover the insulating layer 30 and the first metal layer 20. As shown in fig. 4, in the present invention, the distance between two adjacent via holes 60 is greater than or equal to the second preset distance 11, and during the process of exposing and developing the insulating layer 30 on the first metal layer 20, the problems such as diffraction between the adjacent via holes 60 are not easily caused, and the slopes of the photoresist 70 and the insulating layer 30 are not relatively steep after the exposure and development.
As shown in fig. 2 and 3, since the distance between two adjacent via holes 60 is greater than or equal to the second preset distance 11, after the insulating layer 30 is exposed and developed, the slope of the photoresist 70 becomes relatively gentle, and the slope of the first metal layer 20 also becomes relatively gentle, which is beneficial for the climbing of the second metal layer 40 and does not cause the fracture of the second metal layer 40 during coating.
In this embodiment, the second preset distance 11 may be selected to be greater than 8um, which is an empirical value obtained through a plurality of experiments. The second preset distance 11 may also be 9um, 10um, 12um, etc.
In this embodiment, the metal pads 100 are connected to the gate lines and the data lines of the display substrate 500 in a one-to-one correspondence.
In this embodiment, the insulating layer 30 may be made of silicon dioxide, and the protective layer 50 may be made of aluminum oxide.
In this embodiment, the first metal layer 20 or the second metal layer 40 may be made of copper.
According to the invention, the projection of the second metal layer 40 on the display substrate 500 is positioned in the projection of the first metal layer 20 on the display substrate 500, so that the two metal layers are not overlapped, the gradient at the edge is gentle, the protective layer 50 can be ensured to be in sealing contact with the second metal layer 40, and the protective layer 50 covered on the upper metal layer has good coverage and is not easy to fall off. In addition, the distance between two adjacent via holes 60 is greater than or equal to a second preset distance 11, and the second preset distance 11 can ensure that the second metal layer 40 does not break when the insulating layer 30 and the first metal layer 20 are covered by the slope of the insulating layer 30 corresponding to the via holes 60 after the insulating layer 30 is etched to expose the first metal layer 20 when the via holes 60 are manufactured.
Example two
Referring to fig. 6, fig. 6 is a schematic partial structure diagram of a display device 800 according to the present invention. As can be seen from fig. 6, a display device 800 according to the present invention includes a driving circuit 600 and the display substrate 500 according to the first embodiment, and the driving circuit 600 respectively connects a gate line (not shown) and a data line (not shown) of the display substrate 500 through the signal terminals 300 and drives the display substrate 500.
The display substrate 500 has already been described in detail in the first embodiment, and the description is not repeated here.
The display device 800 of the invention, which comprises the signal terminal 300 of the display substrate 500, can ensure that the protective layer 50 is in sealing contact with the second metal layer 40 by enabling the projection of the second metal layer 40 on the display substrate 500 to be positioned in the projection of the first metal layer 20 on the display substrate 500, so that the two metal layers are not overlapped, the gradient at the edge is gentle, and the protective layer 50 covered on the upper metal layer has good coverage and is not easy to fall off. In addition, the distance between two adjacent via holes 60 is greater than or equal to a second preset distance 11, and the second preset distance 11 can ensure that the second metal layer 40 does not break when the insulating layer 30 and the first metal layer 20 are covered by the slope of the insulating layer 30 corresponding to the via holes 60 after the insulating layer 30 is etched to expose the first metal layer 20 when the via holes 60 are manufactured.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (8)
1. A display substrate comprising a plurality of signal terminals, each of said signal terminals comprising a plurality of metal contacts, each of said metal contacts comprising:
a first metal layer;
the insulating layer is arranged on the surface of the first metal layer;
the second metal layer is arranged on the surface of the insulating layer;
the protective layer is arranged on the surface of the second metal layer;
wherein a projection of the second metal layer on the display substrate is within a projection of the first metal layer on the display substrate; the distance between the edge of the first metal layer and the edge of the second metal layer on the same side in the horizontal direction is greater than or equal to a first preset distance, and the first preset distance can ensure that the protective layer is in sealed contact with the second metal layer; wherein, first preset distance is greater than 1 um.
2. The display substrate of claim 1, wherein the second metal layer is electrically connected to the pixel electrode through a conductive wire.
3. The display substrate of claim 1, wherein each of the metal contacts has a plurality of via holes along an extending direction thereof, the via holes penetrate through the insulating layer, the second metal layer penetrates through the via holes to be in contact with the first metal layer, a distance between two adjacent via holes is greater than or equal to a second predetermined distance, and the second predetermined distance ensures that, when the via holes are formed, after the insulating layer is etched to expose the first metal layer, a slope of the insulating layer corresponding to the via holes can prevent the second metal layer from breaking when the insulating layer covers the first metal layer.
4. The display substrate of claim 3, wherein the second predetermined distance is greater than 8 um.
5. The display substrate of claim 1, wherein the plurality of metal contacts are connected to a plurality of gate lines and data lines of the display substrate in a one-to-one correspondence.
6. The display substrate according to claim 1, wherein the insulating layer is made of silicon dioxide, and the protective layer is made of aluminum oxide.
7. The display substrate of claim 1, wherein the first metal layer or the second metal layer is made of copper.
8. A display device comprising a display substrate according to any one of claims 1 to 7 and a driving circuit, wherein the driving circuit connects gate lines and data lines of the display substrate via the plurality of signal terminals, respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710404651.0A CN107167970B (en) | 2017-06-01 | 2017-06-01 | Display substrate and display device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710404651.0A CN107167970B (en) | 2017-06-01 | 2017-06-01 | Display substrate and display device |
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| CN107167970A CN107167970A (en) | 2017-09-15 |
| CN107167970B true CN107167970B (en) | 2020-06-05 |
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| CN108538859A (en) * | 2018-04-24 | 2018-09-14 | 深圳市华星光电技术有限公司 | The production method of array substrate |
| CN109491159B (en) * | 2018-11-21 | 2022-02-08 | 厦门天马微电子有限公司 | Array substrate and display panel |
| CN109585459A (en) | 2018-12-05 | 2019-04-05 | 惠科股份有限公司 | Preparation method, array substrate, display panel and the display device of array substrate |
| CN111509008B (en) * | 2020-04-20 | 2023-12-12 | 京东方科技集团股份有限公司 | Array substrate, manufacturing method thereof, display panel and display device |
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| KR100560401B1 (en) * | 2003-11-04 | 2006-03-14 | 엘지.필립스 엘시디 주식회사 | Thin film transistor substrate of horizontal electronic field applying type and fabricating method thereof |
| CN100388101C (en) * | 2005-10-12 | 2008-05-14 | 友达光电股份有限公司 | Fan type wire structure |
| CN203241671U (en) * | 2013-05-13 | 2013-10-16 | 深圳市华星光电技术有限公司 | Fan-out line structure of array substrate and display panel |
| CN103676379B (en) * | 2013-12-24 | 2016-03-30 | 合肥京东方光电科技有限公司 | Array base palte and display device |
| KR102192227B1 (en) * | 2014-10-02 | 2020-12-17 | 엘지디스플레이 주식회사 | Pad structure and display device having the same |
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Effective date of registration: 20171013 Address after: 518000 No. 9-2 Ming Avenue, Gongming street, Guangming District, Guangdong, Shenzhen Applicant after: Shenzhen Huaxing photoelectric semiconductor display technology Co., Ltd. Address before: 518006 9-2, Guangming Road, Guangming New District, Guangdong, Shenzhen Applicant before: Shenzhen Huaxing Optoelectronic Technology Co., Ltd. |
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