CN107163899A - A kind of semiconductor transducer casting glue and preparation method thereof - Google Patents
A kind of semiconductor transducer casting glue and preparation method thereof Download PDFInfo
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- CN107163899A CN107163899A CN201710363086.8A CN201710363086A CN107163899A CN 107163899 A CN107163899 A CN 107163899A CN 201710363086 A CN201710363086 A CN 201710363086A CN 107163899 A CN107163899 A CN 107163899A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/08—Polyurethanes from polyethers
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
- C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
- C08G18/6666—Compounds of group C08G18/48 or C08G18/52
- C08G18/667—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38
- C08G18/6681—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/32 or C08G18/3271 and/or polyamines of C08G18/38
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
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- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
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- C09J11/06—Non-macromolecular additives organic
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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Abstract
The invention discloses a kind of semiconductor transducer casting glue and preparation method thereof.The casting glue includes raw material：Nickel foam, nano-sized carbon leads dioctyl phthalate, sodium citrate, sorbierite, polyvinylidene ethane, terminal hydroxy group polyoxypropyleneglycol, toluene di-isocyanate(TDI), digest cellulose, alkyd resin, dimethylbenzene, acrylic resin, castor oil, talcum powder, anhydrous cyclohexanone, ammonia hydroxymethyl-propane, poly- propyl alcohol, deionized water, titanium dioxide, butanol.Weigh raw material；By nickel foam, nano-sized carbon, dioctyl phthalate, polyvinylidene ethane, toluene di-isocyanate(TDI), digest cellulose, alkyd resin, dimethylbenzene, acrylic resin, anhydrous cyclohexanone, ammonia hydroxymethyl-propane, titanium dioxide and talcum powder mixed melting；Sodium citrate, sorbierite, terminal hydroxy group polyoxypropyleneglycol, castor oil, poly- propyl alcohol, butanol are mixed again, integral tune viscosity is finally stirred.Casting glue of the present invention is comprehensive good, and low for equipment requirements, production cost is low.
Description
Technical field
The invention belongs to semiconductor transducer preparing technical field, and in particular to a kind of semiconductor transducer casting glue and
Its preparation method.
Background technology
Casting glue is also known as electronic pastes, for the bonding of electronic component, sealing, embedding and coating protection.Electron pouring sealant
Species is a lot, in terms of material type, is divided into epoxy resin embedding adhesive, organic siliconresin casting glue, polyurethane pouring sealant.At present,
Electronics field application it is most be polyurethane pouring sealant, its excellent performance, damping, weatherability are strong, adhesive property is good, but lead
Electrically poor, the electric charge being trapped on polyurethane pouring sealant breaks through the conductor gap of fish contact, rushes at problem, produces spark even quick-fried
It is fried.Therefore, the electric conductivity for improving polyurethane pouring sealant is necessary.
The Chinese patent of application number 201410358073.8 discloses a kind of anti-lightning polyurethane pouring sealant and its preparation side
Method.The casting glue includes uniformly containing metallic, the content of metallic in polyurethane pouring sealant, the polyurethane pouring sealant
For the 0.01~0.5% of polyurethane pouring sealant quality.Preparation method, comprises the following steps：1）Prepare polyol component：By 167~
309 grams of two or more PPGs vacuum dehydration at 110~120 DEG C, cools to 50 DEG C, add 1 gram catalyst,
0.01~0.02 gram of metallic, is well mixed, and logical nitrogen is packed, and obtains polyol component；2）Prepare polyisocyanates
Component：
By 60~100 grams of PPG, 8~13 grams of epoxy resin, 67~110 grams of fire retardant at 110~120 DEG C
Vacuum dehydration or drying process, cool to 40 DEG C, add 105~144 grams of isocyanates, and 70~80 DEG C are reacted 3~5 hours,
Logical nitrogen is packed, and obtains polyisocyanate component；3）Prepare anti-lightning polyurethane pouring sealant：By polyol component and many isocyanides
Acid esters component in mass ratio 1：1 is well mixed, and is placed in closed container, deaeration 15 minutes at 20~35 DEG C are poured into and wait to fill
On sealing, room temperature solidification in 24 hours or heating rapid curing obtain anti-lightning polyurethane pouring sealant.Polyurethane of the present invention
Casting glue uses epoxy resin, introduces polyurethane chain using the reactivity of its secondary hydroxyl and isocyanates, is met using epoxide group
Thunderbolt the open loop of energy-absorbing scission of link and consume electric energy, with obtain anti-lightning effect；Polyurethane pouring sealant of the present invention uses metal
Particle is to obtain antistatic aggregation, so as to play a part of anti-lightning；The preparation method of polyurethane pouring sealant of the present invention,
Its technique is simple, and production power consumption is low, is produced without " three wastes "；Polyurethane pouring sealant prepared by the present invention can be used for outdoor electrical element
Deng the embedding of component, play a part of anti-lightning, fire-retardant, waterproof and dustproof, damping and fixation after solidification.But embedding of the present invention
The easy aging of glue, influences the service life of electronic product.
The content of the invention
In view of the shortcomings of the prior art, it is an object of the invention to provide a kind of semiconductor transducer casting glue and its system
Preparation Method, the casting glue good fluidity, ageing resistance is strong, good weatherability, it is ensured that casting glue improves conductive on the premise of insulating
Coefficient, reduces the risk of high-voltage breakdown.
To solve prior art problem, the technical scheme that the present invention takes is：
A kind of semiconductor transducer casting glue, including the raw material counted by weight：1-8 parts of nickel foam, nano-sized carbon 12-30
Part, lead 8-14 parts of dioctyl phthalate, 1-4 parts of sodium citrate, 0.8-1.8 parts of sorbierite, 1-4 parts of polyvinylidene ethane, end
12-43 parts of hydroxyl polyoxypropyleneglycol, 12-20 parts of toluene di-isocyanate(TDI), 1-6 parts of digest cellulose, alkyd resin 12-20
Part, 1-8 parts of dimethylbenzene, 5-8 parts of acrylic resin, 1-8 parts of castor oil, 1-7 parts of talcum powder, anhydrous cyclohexanone 12-30 parts, ammonia hydroxyl
2-9 parts of methylpropane, poly- propyl alcohol 22-39 parts, 9-22 parts of deionized water, 1-3 parts of titanium dioxide, 2-8 parts of butanol.
It is as improved, above-mentioned semiconductor transducer casting glue, including the raw material counted by weight：Nickel foam 2
Part, 14 parts of nano-sized carbon, 12 parts of dioctyl phthalate of neck, 3 parts of sodium citrate, 1.2 parts of sorbierite, 2.4 parts of polyvinylidene ethane,
22.7 parts of terminal hydroxy group polyoxypropyleneglycol, 14.8 parts of toluene di-isocyanate(TDI), 5.7 parts of digest cellulose, alkyd resin 14.5
Part, 6.5 parts of dimethylbenzene, 6.5 parts of acrylic resin, 3.4 parts of castor oil, 3 parts of talcum powder, anhydrous 24.5 parts of cyclohexanone, ammonia hydroxyl first
6.8 parts of base propane, poly- 25.8 parts of propyl alcohol, 14.8 parts of deionized water, 2.5 parts of titanium dioxide, 4.8 parts of butanol.
It is that the mesh number of titanium dioxide is 200-300 mesh as improved.
The preparation method of above-mentioned semiconductor transducer casting glue, comprises the following steps：Step 1, raw material is weighed；Step 2,
By nickel foam, nano-sized carbon, neck dioctyl phthalate, polyvinylidene ethane, toluene di-isocyanate(TDI), digest cellulose, alkyd
Resin, dimethylbenzene, acrylic resin, anhydrous cyclohexanone, ammonia hydroxymethyl-propane, titanium dioxide and talcum powder mixed melting obtain composition
A；Step 3, sodium citrate, sorbierite, terminal hydroxy group polyoxypropyleneglycol, castor oil, poly- propyl alcohol, butanol are mixed and obtains group
Compound B；Step 4, composition B and castor oil are added in composition A and stirred, add deionized water regulation viscosity.
It is that the temperature melted in step 2 is 600-800 DEG C as improved.
It is that mixing speed is 120-180rpm in step 3 as improved.
Beneficial effect
Compared with prior art, casting glue electric conductivity of the present invention is improved, good fluidity, flexible, hardening time under low temperature
Short, weatherability is strong, non-aging.Preparation method is simple, low for equipment requirements, low production cost.
Embodiment
Embodiment 1
A kind of semiconductor transducer casting glue, including the raw material counted by weight：1 part of nickel foam, 12 parts of nano-sized carbon leads benzene
8 parts of diformazan dioctyl phthalate, 1 part of sodium citrate, 0.8 part of sorbierite, 1 part of polyvinylidene ethane, terminal hydroxy group polyoxypropyleneglycol
12 parts, 12 parts of toluene di-isocyanate(TDI), 1-6 parts of digest cellulose, 12 parts of alkyd resin, 1 part of dimethylbenzene, 5 parts of acrylic resin,
1 part of castor oil, 1 part of talcum powder, anhydrous 12 parts of cyclohexanone, 2 parts of ammonia hydroxymethyl-propane, poly- 22 parts of propyl alcohol, 9 parts of deionized water, titanium
1 part of white powder, 2 parts of butanol.
The mesh number of the titanium dioxide is 200 mesh.
The preparation method of above-mentioned semiconductor transducer casting glue, comprises the following steps：Step 1, raw material is weighed；Step 2,
By nickel foam, nano-sized carbon, neck dioctyl phthalate, polyvinylidene ethane, toluene di-isocyanate(TDI), digest cellulose, alkyd
Resin, dimethylbenzene, acrylic resin, anhydrous cyclohexanone, ammonia hydroxymethyl-propane, titanium dioxide and talcum powder mixed melting obtain composition
A；Step 3, sodium citrate, sorbierite, terminal hydroxy group polyoxypropyleneglycol, castor oil, poly- propyl alcohol, butanol are mixed and obtains group
Compound B；Step 4, composition B and castor oil are added in composition A and stirred, add deionized water regulation viscosity.
Wherein, the temperature melted in step 2 is 600 DEG C.
Mixing speed is 120rpm in step 3.
Casting glue prepared by embodiment 1 is transparent, and shore hardness 92, elongation at break 85% is hardening time 0.3s, anti-oxidant
Time is long, 70 DEG C, and humidity is 20 times placements 60 days, and colloid turns yellow slightly.
Embodiment 2
A kind of semiconductor transducer casting glue, including the raw material counted by weight：2 parts of nickel foam, 14 parts of nano-sized carbon leads benzene
12 parts of diformazan dioctyl phthalate, 3 parts of sodium citrate, 1.2 parts of sorbierite, 2.4 parts of polyvinylidene ethane, terminal hydroxy group PPOX two
22.7 parts of alcohol, 14.8 parts of toluene di-isocyanate(TDI), 5.7 parts of digest cellulose, 14.5 parts of alkyd resin, 6.5 parts of dimethylbenzene, propylene
6.5 parts of acid resin, 3.4 parts of castor oil, 3 parts of talcum powder, anhydrous 24.5 parts of cyclohexanone, 6.8 parts of ammonia hydroxymethyl-propane, poly- propyl alcohol
25.8 parts, 14.8 parts of deionized water, 2.5 parts of titanium dioxide, 4.8 parts of butanol.
The mesh number of the titanium dioxide is 260 mesh.
The preparation method of above-mentioned semiconductor transducer casting glue, comprises the following steps：Step 1, raw material is weighed；Step 2,
By nickel foam, nano-sized carbon, neck dioctyl phthalate, polyvinylidene ethane, toluene di-isocyanate(TDI), digest cellulose, alkyd
Resin, dimethylbenzene, acrylic resin, anhydrous cyclohexanone, ammonia hydroxymethyl-propane, titanium dioxide and talcum powder mixed melting obtain composition
A；Step 3, sodium citrate, sorbierite, terminal hydroxy group polyoxypropyleneglycol, castor oil, poly- propyl alcohol, butanol are mixed and obtains group
Compound B；Step 4, composition B and castor oil are added in composition A and stirred, add deionized water regulation viscosity.
Wherein, the temperature melted in step 2 is 700 DEG C.
Mixing speed is 150rpm in step 3.
Casting glue prepared by embodiment 2 is transparent, and shore hardness 95, elongation at break 88% is hardening time 0.2s, anti-oxidant
Time is long, and 70 DEG C of humidity are 20% time placement 65 days, and colloid turns yellow slightly.
Embodiment 3
A kind of semiconductor transducer casting glue, including the raw material counted by weight：8 parts of nickel foam, 30 parts of nano-sized carbon leads benzene
14 parts of diformazan dioctyl phthalate, 4 parts of sodium citrate, 1.8 parts of sorbierite, 4 parts of polyvinylidene ethane, terminal hydroxy group polyoxypropyleneglycol
43 parts, 20 parts of toluene di-isocyanate(TDI), 6 parts of digest cellulose, 20 parts of alkyd resin, 1-8 parts of dimethylbenzene, 8 parts of acrylic resin,
8 parts of castor oil, 7 parts of talcum powder, anhydrous 30 parts of hexamethylene, 2-9 parts of ammonia hydroxymethyl-propane, poly- 39 parts of propyl alcohol, 22 parts of deionized water, titanium
3 parts of white powder, 8 parts of butanol.
Wherein, the mesh number of titanium dioxide is 300 mesh.
The preparation method of above-mentioned semiconductor transducer casting glue, comprises the following steps：Step 1, raw material is weighed；Step 2,
By nickel foam, nano-sized carbon, neck dioctyl phthalate, polyvinylidene ethane, toluene di-isocyanate(TDI), digest cellulose, alkyd
Resin, dimethylbenzene, acrylic resin, anhydrous cyclohexanone, ammonia hydroxymethyl-propane, titanium dioxide and talcum powder mixed melting obtain composition
A；Step 3, sodium citrate, sorbierite, terminal hydroxy group polyoxypropyleneglycol, castor oil, poly- propyl alcohol, butanol are mixed and obtains group
Compound B；Step 4, composition B and castor oil are added in composition A and stirred, add deionized water regulation viscosity.
The temperature melted in step 2 is 800 DEG C.
Mixing speed is 180rpm in step 3.
Casting glue prepared by embodiment 3 is transparent, and shore hardness 88, elongation at break 85% is hardening time 0.3s, anti-oxidant
Time is long, is placed 62 days at 70 DEG C, colloid turns yellow slightly.
Embodiment 4
A kind of semiconductor transducer casting glue, including the raw material counted by weight：1 part of nickel foam, 12 parts of nano-sized carbon leads benzene
8 parts of diformazan dioctyl phthalate, 1 part of sodium citrate, 0.8 part of sorbierite, 1 part of polyvinylidene ethane, terminal hydroxy group polyoxypropyleneglycol
12 parts, 12 parts of toluene di-isocyanate(TDI), 1-6 parts of digest cellulose, 12 parts of alkyd resin, 1 part of dimethylbenzene, 5 parts of acrylic resin,
1 part of castor oil, 1 part of talcum powder, anhydrous 12 parts of cyclohexanone, 2 parts of ammonia hydroxymethyl-propane, poly- 22 parts of propyl alcohol, 9 parts of deionized water, titanium
1 part of white powder, 2 parts of butanol.
The mesh number of the titanium dioxide is 200 mesh.
The preparation method of above-mentioned semiconductor transducer casting glue, comprises the following steps：Step 1, raw material is weighed；Step 2,
By nickel foam, nano-sized carbon, neck dioctyl phthalate, polyvinylidene ethane, toluene di-isocyanate(TDI), digest cellulose, alkyd
Resin, dimethylbenzene, acrylic resin, anhydrous cyclohexanone, ammonia hydroxymethyl-propane, titanium dioxide and talcum powder mixed melting obtain composition
A；Step 3, sodium citrate, sorbierite, terminal hydroxy group polyoxypropyleneglycol, castor oil, poly- propyl alcohol, butanol are mixed and obtains group
Compound B；Step 4, composition B and castor oil are added in composition A and stirred, add deionized water regulation viscosity.
The temperature melted in step 2 is 800 DEG C.
Mixing speed is 180rpm in step 3.
Casting glue prepared by embodiment 4 is transparent, and shore hardness 94, elongation at break 88% is hardening time 0.2s, anti-oxidant
Time is long, is placed 68 days at 70 DEG C, colloid turns yellow slightly.
It is seen from the above data that casting glue hardness of the present invention is big, stretch-proof, hardening time is short, anti-oxidant under high temperature
Ability is strong, the Chinese patent with application number 201410358073.8《A kind of anti-lightning polyurethane pouring sealant and preparation method thereof》's
Embodiment is compared, and performance is improved, and cost is lower, and step is simpler, is adapted to industrialization.
Claims (6)
1. a kind of semiconductor transducer casting glue, it is characterised in that including the raw material counted by weight：1-8 parts of nickel foam,
12-30 parts of nano-sized carbon, leads 8-14 parts of dioctyl phthalate, 1-4 parts of sodium citrate, 0.8-1.8 parts of sorbierite, polyvinylidene second
1-4 parts of alkane, 12-43 parts of terminal hydroxy group polyoxypropyleneglycol, 12-20 parts of toluene di-isocyanate(TDI), 1-6 parts of digest cellulose, alcohol
12-20 parts of acid resin, 1-8 parts of dimethylbenzene, 5-8 parts of acrylic resin, 1-8 parts of castor oil, 1-7 parts of talcum powder, anhydrous cyclohexanone
12-30 parts, 2-9 parts of ammonia hydroxymethyl-propane, poly- propyl alcohol 22-39 parts, 9-22 parts of deionized water, 1-3 parts of titanium dioxide, 2-8 parts of butanol.
2. a kind of semiconductor transducer casting glue according to claim 1, it is characterised in that including counting by weight
Raw material：2 parts of nickel foam, 14 parts of nano-sized carbon leads 12 parts of dioctyl phthalate, 3 parts of sodium citrate, 1.2 parts of sorbierite, poly- second
2.4 parts of diene ethane, 22.7 parts of terminal hydroxy group polyoxypropyleneglycol, 14.8 parts of toluene di-isocyanate(TDI), digest cellulose 5.7
Part, 14.5 parts of alkyd resin, 6.5 parts of dimethylbenzene, 6.5 parts of acrylic resin, 3.4 parts of castor oil, 3 parts of talcum powder, anhydrous hexamethylene
24.5 parts of ketone, 6.8 parts of ammonia hydroxymethyl-propane, poly- 25.8 parts of propyl alcohol, 14.8 parts of deionized water, 2.5 parts of titanium dioxide, 4.8 parts of butanol.
3. a kind of semiconductor transducer casting glue according to claim 1, it is characterised in that the mesh number of titanium dioxide is
200-300 mesh.
4. the preparation method of a kind of semiconductor transducer casting glue according to claim 1, it is characterised in that step 1,
Weigh raw material；Step 2, by nickel foam, nano-sized carbon, neck dioctyl phthalate, polyvinylidene ethane, toluene di-isocyanate(TDI),
Digest cellulose, alkyd resin, dimethylbenzene, acrylic resin, anhydrous cyclohexanone, ammonia hydroxymethyl-propane, titanium dioxide and talcum powder
Mixed melting obtains composition A；Step 3, by sodium citrate, sorbierite, terminal hydroxy group polyoxypropyleneglycol, castor oil, poly- propyl alcohol,
Butanol mixes to obtain composition B；Step 4, composition B and castor oil are added in composition A and stirred, add deionized water
Adjust viscosity.
5. a kind of preparation method of semiconductor transducer casting glue according to claim 4, it is characterised in that step 2
The temperature of middle melting is 600-800 DEG C.
6. a kind of preparation method of semiconductor transducer casting glue according to claim 4, it is characterised in that step 3
Middle mixing speed is 120-180rpm.
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| CN102643623A (en) * | 2012-04-05 | 2012-08-22 | 艾伦塔斯电气绝缘材料(珠海)有限公司 | Polyurethane resin potting adhesive with high bonding strength and preparation method thereof |
| CN104861919A (en) * | 2014-11-22 | 2015-08-26 | 湖北回天新材料股份有限公司 | Polyurethane pouring sealant without settlement during long-term storage and preparation method therefor |
| CN104497946A (en) * | 2015-01-26 | 2015-04-08 | 温州泓呈祥科技有限公司 | Adhesive resistant to water and deformation |
| CN104673175A (en) * | 2015-03-10 | 2015-06-03 | 济南骄泰信息技术有限公司 | Electronic pouring sealant convenient to produce and preparation method thereof |
| CN105482063A (en) * | 2015-12-29 | 2016-04-13 | 浙江荣泰科技企业有限公司 | Polyurethane pouring sealant and preparation method thereof |
| CN106244079A (en) * | 2016-08-31 | 2016-12-21 | 惠州富盛绝缘材料有限公司 | A kind of glue of the insulation tube of high temperature resistant low extraction |
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Application publication date: 20170915 |