CN107155288A - 收发器 - Google Patents

收发器 Download PDF

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Publication number
CN107155288A
CN107155288A CN201710117205.1A CN201710117205A CN107155288A CN 107155288 A CN107155288 A CN 107155288A CN 201710117205 A CN201710117205 A CN 201710117205A CN 107155288 A CN107155288 A CN 107155288A
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tubular structure
transceiver according
metal shell
sleeve
circuit board
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于保罗
梅多克罗夫特大卫
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Foxconn Kunshan Computer Connector Co Ltd
Foxconn Interconnect Technology Ltd
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Foxconn Kunshan Computer Connector Co Ltd
Foxconn Interconnect Technology Ltd
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/38—Mechanical coupling means having fibre to fibre mating means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4206—Optical features
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4244—Mounting of the optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0037—Housings with compartments containing a PCB, e.g. partitioning walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0058—Casings specially adapted for optoelectronic applications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/006—Casings specially adapted for signal processing applications, e.g. CATV, tuner, antennas amplifier

Abstract

本发明公开了一种收发器，其包括金属壳体、与金属壳体组装形成一收容腔的金属上壳、设置在金属壳体一端的对接端口及设置在收容腔内的电路板组件，所述对接端口用于与光纤连接器耦合，所述电路板组件包括电路板、设置于对接端口处的透镜及电磁屏蔽装置，所述透镜包括前端面，所述前端面设有向前延伸的管状结构，所述电磁屏蔽装置包括平板部及自平板部延伸出的套筒，所述平板部在前后方向上覆盖所述前端面，所述套筒在圆周方向覆盖管状结构。

Description

收发器
【技术领域】
本发明涉及一种收发器，尤其涉及收发器的EMI屏蔽结构。
【背景技术】
随着成本压力的增加，人们将塑料透镜用于SFP+收发器和其他收发器，因为塑料透镜比金属光学组件便宜很多。然而，随着数据速率和端口密度的增加，EMI(electron-magnetic interference，电子磁干扰)问题变得越来越严重。如图18所示，为现有技术SFP+收发器设计。通常部分金属外壳151封装在电光组件(EOSA)的收发器内。EMI圈152有助于减少周围模块的辐射。然而，由于光纤通常是由塑料成型，所以塑料透镜153有相当大的逸出孔径154，EMI可以很容易从中逸出。
如图19所示，在现有技术SFP+收发器中，A1为逸出孔径的长度，所述A1的长度比透镜的长度小的多，B1为逸出孔径的最小尺寸，B1的尺寸和透镜的直径一样大。在较低数据速率中，逸出孔径较大是可以容忍的，但是数据速率在25G、28G时的信号逸出是不能忽略的。因此，需要找到一种方法，减少逸出孔径的大小或增加辐射逸出的长度。
同时，解决方案必须是便宜的并且足够精确，如引入一个额外的部件不会导致装配违反FOCIS或MSA规范。应当确保改进的解决方案与所有现有的光纤连接器兼容。
【发明内容】
本发明主要目的是提供一种可降低电磁干扰的收发器，且低成本并能够保持严格的公差符合FOCIS和MSA规范。
为解决上述技术问题，本发明采用如下技术方案：一种收发器，其包括：金属壳体、与金属壳体组装形成一收容腔的金属上壳、设置在金属壳体一端的对接端口及设置在收容腔内的电路板组件，所述对接端口用于与光纤连接器耦合，所述电路板组件包括电路板、设置于对接端口处的透镜及电磁屏蔽装置，所述透镜包括前端面，所述前端面设有向前延伸的管状结构，所述电磁屏蔽装置包括平板部及自平板部延伸出的套筒，所述平板部在前后方向上覆盖所述前端面，所述套筒在圆周方向覆盖管状结构。
本发明通过抽引EMI金属套筒来解决上述问题。这不仅有助于减小逸出孔径的尺寸，也通过发射辐射增加了屏蔽长度，进而能够满足FOCIS和MSA规范不影响线缆组件之间的兼容性。
【附图说明】
图1是包括SFP+收发器和与SFP+收发器配合的LC型光纤连接器的光纤组件的立体图。
图2是图1所示的SFP+收发器和LC型光纤连接器的分解图。
图3是图2所示的SFP+收发器和LC型光纤连接器另一视角的分解图。
图4是图1所示的SFP+收发器和LC型光纤连接器的横截面。
图5是图4所示的SFP+收发器与LC型光纤连接器的局部放大图。
图6是图1所示的SFP+收发器的前视图。
图7是图6所示的SFP+收发器的前视图。
图8是图6所示的SFP+收发器的分解图。
图9是图8所示的SFP+收发器另一视角的分解图。
图10是图8所示的SFP+收发器另一视角的分解图。
图11是图8所示的SFP+收发器中电路板组件的分解图。
图12是图11所示的SFP+收发器中电路板组件的进一步分解图。
图13是图12所示的SFP+收发器中电路板组件的进一步分解图。
图14是图12所示的SFP+收发器中电路板组件另一视角的进一步分解图。
图15是图6所示的SFP+收发器的剖视图。
图16是图15所示的SFP+收发器局部放大的剖视图。
图17是图15所示的SFP+收发器进一步局部放大的剖视图。
图18是现有技术光学透镜模块的立体图。
图19是现有技术与本发明SFP+收发器所示的套筒封闭管状结构的剖视图。
图20是套筒与管状结构之间发生全干涉配合的剖视图。
图21是本实施例套筒与管状结构之间发生涉配合的剖视图。
【具体实施方式】
如图1-17所示，为符合本发明的SFP+(Small Form Factor Pluggable)收发器10，所述SFP+收发器10适用于与LC型光纤连接器100对接。所述SFP+收发器10可收容于安装在电路板(未图示)上的金属壳体(未图示)内。所述SFP+收发器10设有金属压铸壳体20。所述金属压铸壳体20包括位于上述金属壳体前开口附近的对接端口22和位于上述金属壳体后端的连接端口24。所述对接端口22用于与LC型光纤连接器100耦合。所述连接端口24用于连接安装于上述电路板上的相应的卡缘电连接器。进一步，金属压铸壳体20设有适于锁定上述金属壳体的锁孔的锁扣凸块26和适于从上述锁孔沿前后方向上运动去释放锁扣凸块26的滑块28。
金属上盖50由金属料带形成，所述金属料带成本较低。所述金属上盖50与金属压铸壳体20组装，形成一收容腔。电路板组件30设置在收容腔内，所述电路板组件30包括电路板31、在前端用于与LC型光纤连接器100耦合的光电模块32及设置于后端用于连接上述卡缘电连接器的若干导电片34。可以理解的是，光电模块32包括一个设有45度反射结构的透镜36以耦合LC型光纤连接器100，所述光电模块32在LC型光纤连接器100和电路板31之间发射或接收光信号。金属接地圈60包覆于所述金属上盖50和所述金属压铸壳体20上以与上述金属壳体内部配合。
值得注意的是，所述透镜36包括在前后方向向前延伸的管状结构40的前端面38，所述管状结构40用于耦合相应的LC型光纤连接器100。进一步，所述管状结构40为一对。与现有技术相比，本发明提供了一种金属电磁屏蔽装置70，其包括设有套筒74的平板部72，所述套筒74通过抽引工艺覆盖相应的前端面38和管状结构40。进一步，所述套筒74为一对。值得注意的是，所述套筒74还包括覆盖管状结构40环形前端面42的凸缘76以减少可能的逸出孔径(直径)的大小。如图19所示，在本实施例中，B2为逸出孔径的最小尺寸，B2的长度比用于凸缘76的透镜直径更小。可以理解的是，与现有技术相比，在对接端口附近，套筒74沿其轴向方向提供电磁屏蔽，而现有技术仅提供了一种如图16所示相对短的屏蔽尺寸A。如图19所示，在本实施例中，A2为逸出孔径的长度，A2的长度和套管的长度一样。另一方面，平板部72还屏蔽了沿前后方向的间隙S附近可能出现的逸出。
如图20所示，为套筒74和管状结构40之间出现的问题。FOCIS预计端口外直径与内直径之间的位置公差在25微米内。除非EMI套筒和透镜端口之间存在干涉配合，否则这是不可能的。干涉配合在套筒74和管状结构40之间的干涉配合会引起塑料变形，从而使得LC光纤连接器100的光纤插针171不能可靠地完全插入管状结构40，这可能导致光学耦合问题。如图21所示，为解决上述问题，调整管状结构40使得对接部仅在管状结构40整个长度的短部分接触。将对接部完全从光纤需要插入的地方移开，将完全消除光纤被夹持的危害。通过设置对接部181，我们也可以控制套筒74的对接部181使得公差比其余管状结构40的长度更紧。
如图17所示，本发明的另一个特点是在管状结构40和套筒74之间的干涉在整个长度中只有一部分B沿轴向方向，这可以减少由于干扰之间的管状结构40变形的风险，从而保证与LC型光纤连接器对接的兼容。换句话说，管状结构40和套筒74之间沿轴向方向设有周向空间C。在本实施例中，透镜36和金属电磁屏蔽装置70之间的干涉可通过粘合剂来实现，所述粘合剂可选择加或不加微小干涉配。如图21所示，在本实施例中，管状结构40设有一个与前端面38相邻的凸面182，凸面182与套筒内壁74干涉。

Claims (10)

1.一种收发器，其包括：金属壳体、与金属壳体组装形成一收容腔的金属上壳、设置在金属壳体一端的对接端口及设置在收容腔内的电路板组件，所述对接端口用于与光纤连接器耦合，所述电路板组件包括电路板、设置于对接端口处的透镜及电磁屏蔽装置，所述透镜包括前端面，所述前端面设有向前延伸的管状结构，所述电磁屏蔽装置包括平板部及自平板部延伸出的套筒，其特征在于：所述平板部在前后方向上覆盖所述前端面，所述套筒在圆周方向覆盖管状结构。
2.根据权利要求1的收发器，其特征在于，所述套筒还包括凸缘，所述凸缘覆盖管状结构的环形前端面。
3.根据权利要求1的收发器，其特征在于，所述套管和管状结构之间干涉配合。
4.根据权利要求3的收发器，其特征在于，所述套管和管状结构之间在管状结构的根部干涉配合。
5.根据权利要求4的收发器，其特征在于，所述套管和管状结构之间除根部以外的部分用胶固定。
6.根据权利要求4的收发器，其特征在于，所述金属壳体和套筒在干涉配合处形成环形间隙，所述平板部遮蔽蔽所述环形间隙。
7.根据权利要求1的收发器，其特征在于，所述电磁屏蔽装置通过金属抽引工艺制成。
8.根据权利要求7的收发器，其特征在于，所述电磁屏蔽装置包括一对平板部，各平板部分别具有自平板部延伸出的套筒。
9.根据权利要求1的收发器，其特征在于，所述金属壳体还包括在所述金属壳体另一端的连接端口，所述连接端口用于连接外部的卡缘电连接器。
10.根据权利要求9的收发器，其特征在于，所述电路板组件还包括在前端用于与光纤连接器耦合的光电模块及用于连接上述卡缘电连接器的若干导电片。
CN201710117205.1A 2016-03-02 2017-03-01 收发器 Pending CN107155288A (zh)

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CN107608033A (zh) * 2017-09-30 2018-01-19 武汉电信器件有限公司 一种光纤适配器结构

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