CN107148199A - A kind of conductive graphite pad and preparation method thereof - Google Patents
A kind of conductive graphite pad and preparation method thereof Download PDFInfo
- Publication number
- CN107148199A CN107148199A CN201710442971.5A CN201710442971A CN107148199A CN 107148199 A CN107148199 A CN 107148199A CN 201710442971 A CN201710442971 A CN 201710442971A CN 107148199 A CN107148199 A CN 107148199A
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- Prior art keywords
- graphite pad
- graphite
- low viscous
- pad
- mould release
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Carbon And Carbon Compounds (AREA)
- Gasket Seals (AREA)
Abstract
The invention discloses a kind of conductive graphite pad and preparation method thereof, including：The multiple single specifications or the Graphite pad of many specifications of horizontally spaced setting, the lower surface of each Graphite pad are coated with layer of silica gel；The lower surface bonds of Graphite pad have mould release membrance；The upper surface of Graphite pad is covered with low viscous diaphragm.The conductive graphite pad is using more convenient, beneficial to raising assembly working efficiency.The preparation method of the conductive graphite pad can be prevented effectively from adhesion between the adjoining graphite pad after shaping, and machining accuracy is high, stock utilization is high.
Description
Technical field
The present invention relates to Graphite pad manufacturing technology field, more particularly to a kind of conductive graphite pad and preparation method thereof.
Background technology
In recent years, continuing to develop with electronic technology, electronic product, which is constantly updated, regenerates, the size of its work package
Less and less, the speed and efficiency more and more higher of work, its caloric value are also increasing, therefore it is corresponding not require nothing more than its outfit
Heat abstractor, it is also to be ensured that heat abstractor has stronger heat-sinking capability, is made with ensureing the reliability of properties of product and extending it
Use the life-span.
Graphite as heat conduction and heat radiation material, because of its distinctive low-density (relative to metal class) and high heat conduction and heat radiation coefficient and
Low thermal resistance turns into the preferred material that hyundai electronicses class product solves heat conduction and heat radiation technology.Graphite heat radiation fin can not only be led along level
Heat, can also vertically heat conduction, especially with laminar structured, it is applied to any product
Surface, can also effectively play a part of heat conduction and heat radiation.
During fabrication, vertical process adds existing Graphite pad again after the general horizontal process processing graphite tablet using cutting knife
Work, or using AB combination dies to graphite tablet punch forming, so as to be molded multiple Graphite pads.In use, by Graphite pad by
It is individual to be pasted onto on electronic component.But, there is problems with：
When the 1st, being processed using cutting knife, without spacing between the Graphite pad after processing, easy adhesion between adjoining graphite pad, visitor
Family in-convenience in use.
When the 2nd, combining mold forming using AB, mould set position low precision, materials'use rate is low, and leftover pieces waste many, after processing
Product size can not meet more accurate electronic product size requirement.
3rd, in use, need to be pasted onto Graphite pad on electronic component one by one, assembly working efficiency is low.
The content of the invention
It is an object of the present invention to propose a kind of conductive graphite pad, using more convenient, work is assembled beneficial to improving
Make efficiency.
It is another object of the present invention to propose a kind of preparation method of conductive graphite pad, shaping can be prevented effectively from
Adhesion between adjoining graphite pad afterwards, machining accuracy is high, stock utilization is high.
For up to this purpose, the present invention uses following technical scheme：
A kind of conductive graphite pad, including：The multiple single specifications or the graphite of many specifications of horizontally spaced setting
Pad, the lower surface of each Graphite pad is coated with layer of silica gel；The lower surface bonds of the Graphite pad have mould release membrance；
The upper surface of the Graphite pad is covered with low viscous diaphragm.
As a further improvement on the present invention, the mould release membrance is PET net lattice film；The thickness of the mould release membrance is 0.05mm
~0.15mm.
As a further improvement on the present invention, the low viscous diaphragm is low viscous PET protection film；The low viscous diaphragm
Thickness is 0.1mm~0.15mm.
As a further improvement on the present invention, the thickness of the Graphite pad is 3.0mm~5.0mm.
A kind of preparation method of conductive graphite pad, comprises the following steps：
Step A：Blanking, prepares mould release membrance and low viscous diaphragm；
Step B：Punch forming, is rushed using with multiple cavity drifts and for the upper mould for installing multiple cavity drifts
Press forming device carries out punch forming to graphite tablet, is molded the Graphite pad of multiple single specifications or many specifications, and each
Stamping forming Graphite pad enters in the cavity of corresponding cavity drift；
Step C：Using with multiple ejector beams and positioned at the top of multiple ejector beams limiting plate Lifting Device to stone
Ink pad piece carries out top pressure：Low viscous diaphragm is positioned between ejector beam and limiting plate, ejector beam stretches into corresponding cavity
Graphite pad is ejected in the cavity of drift, and by coordinating top pressure Graphite pad Nian Jie with low viscous diaphragm film with limiting plate,
Form conductive graphite pad semi-finished product；
Step D：Conductive graphite pad semi-finished product are taken out, mould release membrance is pasted in the upper surface of Graphite pad, obtains heat conduction stone
Ink pad piece.
As a further improvement on the present invention, in the step B, during placing graphite tablet, graphite tablet had into silicon
The upper surface of glue-line is pasted onto the edge of a knife face of cavity drift.
As a further improvement on the present invention, in the step A, mould release membrance and low viscous diaphragm are prepared using die cutting device
When, respectively mould release membrance and low viscous diaphragm non-product contact fit a layer thickness for 0.075mm, weight 30g transparent guarantor
Cuticula.
Beneficial effects of the present invention are：A kind of conductive graphite pad proposed by the present invention, including horizontally spaced set
The multiple single specifications or the Graphite pad of many specifications put, the lower surface of each Graphite pad are coated with layer of silica gel；Graphite pads
The lower surface bonds of piece have mould release membrance；The upper surface of Graphite pad is covered with low viscous diaphragm.In use, mould release membrance is thrown off, will
Multiple Graphite pads are bonded on electronic component by layer of silica gel, then throw off low viscous diaphragm.It is bonded one by one compared to existing
Graphite pad, the conductive graphite pad substantially increases assembly working efficiency using more convenient.One kind proposed by the present invention is led
The preparation method of hot Graphite pad, punching press is carried out by using the punching press shaping equipment with multiple cavity drifts to graphite tablet
It is right with it that shaping, the Graphite pad of the multiple single specifications of one-shot forming or many specifications, and the Graphite pad being molded are respectively enterd
In the cavity for the cavity drift answered；In the cavity that corresponding cavity drift is stretched into by the ejector beam of Lifting Device, by stone
Ink pad piece is ejected, and coordinates top pressure Graphite pad Nian Jie with low viscous diaphragm with limiting plate by ejector beam, forms conductive graphite
Pad semi-finished product, finally take out conductive graphite pad semi-finished product, in the upper surface of the Graphite pad of conductive graphite pad semi-finished product
Mould release membrance is pasted, so as to obtain conductive graphite pad.This method, which can be prevented effectively between the adjoining graphite pad after shaping, glues
Connect, and the machining accuracy of Graphite pad is high, stock utilization is high.
Brief description of the drawings
Fig. 1 is a kind of structural representation for conductive graphite pad that the present invention is provided；
Fig. 2 is a kind of machining sketch chart of the conductive graphite pad of the invention provided in step B；
Fig. 3 is a kind of machining sketch chart of the conductive graphite pad of the invention provided in step C.
In figure：The low viscous diaphragms of 1-；2- graphite tablets；21- Graphite pads；3- mould release membrances；The upper moulds of 4-；41- cavity drifts；
Mould under 5-；6- Lifting Devices；61- ejector beams.
Embodiment
Further illustrate technical scheme below in conjunction with the accompanying drawings and by embodiment.
As shown in Figures 1 to 3, a kind of conductive graphite pad, including：Multiple single specifications of horizontally spaced setting or
The Graphite pad 21 of many specifications, the lower surface of each Graphite pad 21 is coated with layer of silica gel；The lower surface of Graphite pad 21 glues
It is connected to mould release membrance 3；The upper surface of Graphite pad 21 is covered with low viscous diaphragm 1.
A kind of conductive graphite pad proposed by the present invention, when in use, first throws off mould release membrance 3, then by multiple Graphite pads
It is bonded in by the layer of silica gel of its lower surface on electronic component, then throws off low viscous diaphragm 1, so as to realizes multiple graphite pads
Assembling of the piece on electronic component, the conductive graphite pad substantially increases assembly working efficiency using more convenient.
As a further improvement on the present invention, mould release membrance 3 is blue PET net lattice film；Use grid film with reduce its with
The contact area of Graphite pad, tears off grid film when being easy to use from Graphite pad.The thickness of mould release membrance 3 be 0.05mm~
0.15mm。
As a further improvement on the present invention, low viscous diaphragm 1 is blue PET protection film；The thickness of low viscous diaphragm 1
For 0.1mm~0.15mm.
In above-mentioned conductive graphite pad, Graphite pad 21 includes graphite substrate and is coated in the silicon of the upper surface of graphite substrate
Glue-line.Wherein, the thickness of Graphite pad 21 is 3.0mm~5.0mm, and the thickness of layer of silica gel is 0.05mm~0.1mm.
A kind of preparation method of conductive graphite pad, comprises the following steps：
Step A：Blanking, prepares mould release membrance 3 and low viscous diaphragm 1；
Step B：Punch forming, using the upper mould 4 with multiple cavity drifts 41, for installing multiple cavity drifts 41,
And the punching press shaping equipment of lower mould 5 carries out punch forming to graphite tablet 2, the graphite pads of multiple single specifications or many specifications are molded
Piece 21.Wherein, multiple cavity drifts 41 are installed on the lower surface of the upper mould 4 of punching press shaping equipment.Stamping forming Graphite pad
21 enter in the cavity of corresponding cavity drift 41；Especially, in placing graphite tablet 2, by having for graphite tablet 2
The upper surface of layer of silica gel is pasted onto the edge of a knife face of cavity drift 41, in order to fixed graphite material piece 2, graphite when preventing punch forming
Tablet 2 is moved and influences the machining accuracy of the Graphite pad of shaping.
Step C：Using the Lifting Device 6 of the limiting plate with multiple ejector beams 61 and positioned at the top of multiple ejector beams 61
Level pressure is carried out to Graphite pad 21：The movement of upper mould 4 in step B is attached in Lifting Device 6, wherein, the one of Lifting Device 6
Individual ejector beam 61 can correspond to the cavity for inserting a cavity drift 41；Low viscous diaphragm 1 is positioned over to the top of ejector beam 61
Between limiting plate, ejector beam 61 is driven in the cavity that it stretches into corresponding cavity drift 41 by drive device by graphite
Pad 21 is ejected, and coordinates top pressure Graphite pad 21 be bonded with low viscous diaphragm 3 with limiting plate, formed conductive graphite pad partly into
Product；Wherein, drive device is cylinder or hydraulic cylinder.
Step D：From Lifting Device 6 take out conductive graphite pad semi-finished product, pasted in the upper surface of Graphite pad 21 from
Type film 3, obtains conductive graphite pad.
As a further improvement on the present invention, in step A, mould release membrance 3 and low viscous diaphragm 1 are prepared using die cutting device
When, respectively mould release membrance 3 and low viscous diaphragm 1 non-product contact fit a layer thickness for 0.075mm, weight 30g it is transparent
Diaphragm, to protect the surface of mould release membrance 3 and low viscous diaphragm 1.
A kind of preparation method of conductive graphite pad proposed by the present invention, can be prevented effectively from the adjoining graphite pad after shaping
Adhesion between piece, and the machining accuracy of Graphite pad is high, shaping efficiency is high, stock utilization is high.
The technical principle of the present invention is described above in association with specific embodiment.These descriptions are intended merely to explain the present invention's
Principle, and limiting the scope of the invention can not be construed in any way.Based on explanation herein, the technology of this area
Personnel, which would not require any inventive effort, can associate other embodiments of the present invention, and these modes are fallen within
Within protection scope of the present invention.
Claims (7)
1. a kind of conductive graphite pad, it is characterised in that multiple single specifications or many rule including horizontally spaced setting
The Graphite pad (21) of lattice, the lower surface of each Graphite pad (21) is coated with layer of silica gel；The Graphite pad (21)
Lower surface bonds have mould release membrance (3)；The upper surface of the Graphite pad (21) is covered with low viscous diaphragm (1).
2. a kind of conductive graphite pad according to claim 1, it is characterised in that the mould release membrance (3) is PET net lattice
Film；The thickness of the mould release membrance (3) is 0.05mm~0.15mm.
3. a kind of conductive graphite pad according to claim 1, it is characterised in that the low viscous diaphragm (1) is low viscous
PET protection film；The thickness of the low viscous diaphragm (1) is 0.1mm~0.15mm.
4. a kind of conductive graphite pad according to claim 1, it is characterised in that the thickness of the Graphite pad (21) is
3.0mm~5.0mm.
5. a kind of preparation method of conductive graphite pad, it is characterised in that comprise the following steps：
Step A：Blanking, prepares mould release membrance (3) and low viscous diaphragm (1)；
Step B：Punch forming, using the upper mould with multiple cavity drifts (41) and for installing multiple cavity drifts (41)
(4) punching press shaping equipment carries out punch forming to graphite tablet (2), is molded the Graphite pad of multiple single specifications or many specifications
(21), and in the cavity of the corresponding cavity drift (41) of each stamping forming Graphite pad (21) entrance；
Step C：Using the Lifting Device of the limiting plate with multiple ejector beams (61) and positioned at the top of multiple ejector beams (61)
(6) top pressure is carried out to Graphite pad (21)：Low viscous diaphragm (1) is positioned over ejector beam (61) between limiting plate, ejector beam
(61) stretch into by Graphite pad (21) ejection in the cavity of corresponding cavity drift (41), and pushed up by coordinating with limiting plate
Press Graphite pad (21) Nian Jie with low viscous diaphragm (1), form conductive graphite pad semi-finished product；
Step D：Conductive graphite pad semi-finished product are taken out, mould release membrance (3) is pasted in the upper surface of Graphite pad (21), obtains heat conduction
Graphite pad.
6. the preparation method of a kind of conductive graphite pad according to claim 5, it is characterised in that in the step B, put
When putting graphite tablet (2), the upper surface with layer of silica gel of graphite tablet (2) is pasted onto to the edge of a knife face of cavity drift (41).
7. the preparation method of a kind of conductive graphite pad according to claim 5, it is characterised in that in the step A, adopt
When mould release membrance (3) and low viscous diaphragm (1) are prepared with die cutting device, respectively in the non-production of mould release membrance (3) and low viscous diaphragm (1)
Product contact surface fit a layer thickness for 0.075mm, weight 30g transparent protective film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710442971.5A CN107148199B (en) | 2017-06-13 | 2017-06-13 | Heat-conducting graphite gasket and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710442971.5A CN107148199B (en) | 2017-06-13 | 2017-06-13 | Heat-conducting graphite gasket and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107148199A true CN107148199A (en) | 2017-09-08 |
| CN107148199B CN107148199B (en) | 2023-07-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710442971.5A Active CN107148199B (en) | 2017-06-13 | 2017-06-13 | Heat-conducting graphite gasket and preparation method thereof |
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| Country | Link |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110696194A (en) * | 2019-10-16 | 2020-01-17 | 陈国才 | Punching and forming method for producing graphite composite gasket |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160279902A1 (en) * | 2013-11-01 | 2016-09-29 | Du Pont-Toray Co., Ltd. | Graphite laminated body |
| CN205902315U (en) * | 2016-08-12 | 2017-01-18 | 深圳市津田电子有限公司 | Compound graphite radiating sheet |
| CN206237724U (en) * | 2016-11-13 | 2017-06-09 | 沈开湘 | A kind of radiator structure for electronic component |
| CN206977895U (en) * | 2017-06-13 | 2018-02-06 | 昆山市飞荣达电子材料有限公司 | A kind of conductive graphite pad |
-
2017
- 2017-06-13 CN CN201710442971.5A patent/CN107148199B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160279902A1 (en) * | 2013-11-01 | 2016-09-29 | Du Pont-Toray Co., Ltd. | Graphite laminated body |
| CN205902315U (en) * | 2016-08-12 | 2017-01-18 | 深圳市津田电子有限公司 | Compound graphite radiating sheet |
| CN206237724U (en) * | 2016-11-13 | 2017-06-09 | 沈开湘 | A kind of radiator structure for electronic component |
| CN206977895U (en) * | 2017-06-13 | 2018-02-06 | 昆山市飞荣达电子材料有限公司 | A kind of conductive graphite pad |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110696194A (en) * | 2019-10-16 | 2020-01-17 | 陈国才 | Punching and forming method for producing graphite composite gasket |
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| Publication number | Publication date |
|---|---|
| CN107148199B (en) | 2023-07-07 |
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Effective date of registration: 20230607 Address after: 213200 No.139 Huaye Road, Jintan District, Changzhou City, Jiangsu Province Applicant after: Feirongda Technology (Jiangsu) Co.,Ltd. Address before: No. 258, Dongping Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province, 215311 Applicant before: KUNSHAN FEIRONGDA ELECTRONIC MATERIAL Co.,Ltd. |
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