CN107146845A - A kind of flexible display substrates stripping off device and method - Google Patents
A kind of flexible display substrates stripping off device and method Download PDFInfo
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- CN107146845A CN107146845A CN201710312469.2A CN201710312469A CN107146845A CN 107146845 A CN107146845 A CN 107146845A CN 201710312469 A CN201710312469 A CN 201710312469A CN 107146845 A CN107146845 A CN 107146845A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
- B32B43/006—Delaminating
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The present invention discloses a kind of flexible display substrates stripping off device and method, is related to display manufacturing technology field, to improve the image display quality of flexible display apparatus.The flexible display substrates stripping off device includes:Objective table, forms the rigid substrates of flexible display base plate for carrying, and flexible display substrates are contacted with objective table, and rigid substrates include relative the first side and the second side;Laser generator above objective table, the laser that laser generator is sent can be moved horizontal reciprocating between the first side of rigid substrates and the second side of rigid substrates;When being peeled off to flexible display substrates, the laser that laser generator is sent carries out scanning at least twice to rigid substrates and irradiated, when wherein at least twice sweep irradiates, laser light incident is to the incident direction of rigid substrates, and the angle between the direction for the second side that rigid substrates are pointed to the first side of rigid substrates differs.
Description
Technical field
The present invention relates to display manufacturing technology field, more particularly to a kind of flexible display substrates stripping off device and method.
Background technology
The features such as deformable, flexible because flexible display apparatus has, flexible display apparatus obtains more and more extensive
Using flexible display apparatus generally includes flexible display substrates, and flexible display substrates are a kind of based on flexible substrate substrate manufacture
The display base plate of formation.
At present, the preparation method of flexible display substrates typically uses following process, i.e.,:In rigid substrates (such as glass base
Plate) on form flexible substrate substrate, prepare the multiple dot structures being arranged in array on flexible substrate substrate, formed be located at it is firm
Property substrate on flexible display substrates, afterwards again using laser irradiate scanning method be laser-stripping method (Laser Lift-
Off, LLO) flexible display substrates to be peeled off, laser scanning irradiation rigid substrates, laser light incident to rigid substrates is simultaneously passed through
Rigid substrates are radiated at flexible substrate substrate towards on the surface of rigid substrates, make table of the flexible substrate substrate towards rigid substrates
Face is decomposed, flexible substrate substrate and rigid substrates separation, and then flexible display substrates are removed from rigid substrates, are completed
The preparation of flexible display substrates.
In the preparation method of existing flexible display substrates, flexible display substrates are shelled using laser-stripping method
From when, laser light incident to rigid substrates is simultaneously radiated at flexible substrate substrate towards on the surface of rigid substrates through rigid substrates
When, the usual vertical irradiation rigid substrates of laser, when there is impurity or dust on the rigid substrates dorsad surface of flexible substrate substrate
Deng foreign matter when, the foreign matter can stop scanning to the laser light incident at this to rigid substrates and be radiated at flexible liner through rigid substrates
Substrate is towards on the surface of rigid substrates, thus flexible substrate substrate is towards area corresponding with foreign matter on the surface of rigid substrates
Domain can not effectively be decomposed, flexible substrate substrate towards region corresponding with foreign matter on the surface of rigid substrates can not with it is firm
Property substrate separation, when subsequently flexible display substrates are removed from rigid substrates, cause flexible display substrates corresponding with foreign matter
Region is deformed upon, or even the dot structure in flexible display substrates region corresponding with foreign matter is had undesirable effect, for example,
The thin film transistor (TFT) of the dot structure in the region is caused to leave on the rigid substrate, so as to cause the picture of flexible display apparatus
Display quality is reduced, for example, occurring the phenomenon of stain or dim spot during flexible display apparatus display picture.
The content of the invention
It is an object of the invention to provide a kind of flexible display substrates stripping off device, the picture for improving flexible display apparatus
Face display quality.
To achieve these goals, the present invention provides following technical scheme:
A kind of flexible display substrates stripping off device, including:
Objective table, forms the rigid substrates of flexible display base plate, flexible display substrates and the objective table for carrying
Contact, the rigid substrates include relative the first side and the second side;
Laser generator above the objective table, the laser that the laser generator is sent can be in the rigid base
Horizontal reciprocating is moved between first side of plate and the second side of the rigid substrates;
When being peeled off to flexible display substrates, the laser that the laser generator is sent the rigid substrates are carried out to
Few twice sweep irradiation, when wherein at least twice sweep irradiates, the incident direction of laser light incident to the rigid substrates is and described
The angle that first side of rigid substrates is pointed between the direction of the second side of the rigid substrates is differed.
Preferably, the laser that the laser generator is sent carries out scanning at least twice to the rigid substrates and irradiated, its
In scanning irradiation at least twice when, the incident direction of the laser light incident that the laser generator is sent to the rigid substrates not phase
Together.
Preferably, the laser that the laser generator is sent carries out scanning at least twice to the rigid substrates and irradiated, its
In scanning irradiation at least twice when, the incidence angle of the laser light incident that the laser generator is sent to the rigid substrates not phase
Together.
Further, the laser generator includes the laser generator for generating laser and supplies laser emitting and incident
To the laser beam emitting head of the rigid substrates, the laser beam emitting head can be along the first side or described perpendicular to the rigid substrates
The direction of second side of rigid substrates is moved back and forth, and the laser generator also includes regulation laser light incident to the rigid substrates
Incidence angle angle regulator.
Further, the laser level of the laser generator generation is incident to the laser beam emitting head, and the angle is adjusted
Regulating device is included rotatably arranged with the reflector plate in the laser beam emitting head, and the reflector plate generates the laser generator
Laser reflection to the rigid substrates.
Preferably, the objective table can be around 180 ° of rotations of vertical direction.
When the flexible display substrates stripping off device provided using the present invention is peeled off to flexible display substrates, first by shape
Rigid substrates into flexible display base plate are placed on objective table, and wherein flexible display substrates are contacted with objective table, i.e., flexible
Display base plate is down;Then the laser that laser generator is sent is made in the horizontal direction in the first side of rigid substrates and rigid substrates
The second side between move, the laser sent using laser generator is carried out scanning at least twice to rigid substrates and irradiated, and is being swashed
In the irradiation of scanning at least twice that light is carried out to rigid substrates, when wherein at least twice sweep irradiates, laser light incident to rigid base
Angle between the direction for the second side that rigid substrates are pointed in the incident direction of plate and the first side of rigid substrates is differed, because
This, when there is the foreign matters such as impurity or dust on the rigid substrates dorsad surface of flexible display substrates, in laser to rigid substrates
In the irradiation of scanning at least twice carried out, when wherein at least twice sweep irradiates, incident direction of the foreign matter along laser is aobvious in flexibility
Show that the flexible substrate substrate of substrate is differed towards location of projection on the surface of rigid substrates, with laser vertical in the prior art
Foreign matter is caused to be compared in flexible substrate substrate towards location of projection is constant on the surface of rigid substrates when being incident to rigid substrates,
It can prevent flexible substrate substrate from can not effectively be decomposed towards region corresponding with foreign matter on the surface of rigid substrates, prevent
Flexible substrate substrate can not be separated towards region corresponding with foreign matter on the surface of rigid substrates with rigid substrates, so that after preventing
Continue and cause flexible display substrates region corresponding with foreign matter to occur exception when flexible display substrates are removed from rigid substrates, enter
And improve the image display quality of flexible display apparatus.
The present invention also aims to provide a kind of flexible display substrates stripping means, for improving flexible display apparatus
Image display quality.To achieve these goals, the present invention provides following technical scheme:
A kind of flexible display substrates stripping means, including:
The rigid substrates for being formed with flexible display substrates are placed on objective table;
Make the laser that laser generator is sent carry out the rigid substrates scanning at least twice to irradiate, wherein at least is twice
During scanning irradiation, the incident direction of the laser light incident to the rigid substrates points to institute with the first side of the rigid substrates
Angle between the direction for the second side for stating rigid substrates is differed.
Preferably, the laser for sending laser generator carries out scanning irradiation at least twice to the rigid substrates
In step, the laser that laser generator is sent is carried out twice sweep irradiation to the rigid substrates, send laser generator
Laser to the rigid substrates carry out twice sweep irradiation the step of include:
Laser is incident to the rigid substrates with the first incident direction, the rigid substrates are carried out with scanning for the first time and is shone
Penetrate;
Laser is incident to the rigid substrates with the second incident direction, the rigid substrates are carried out with second of scanning and is shone
Penetrate.
Preferably, laser is incident to the rigid substrates with the first incident direction described, the rigid substrates are entered
In the step of row scanning irradiation for the first time, the incidence angle of laser light incident to the rigid substrates is the first incidence angle;
Laser is incident to the rigid substrates with the second incident direction described, the rigid substrates are carried out second
In the step of scanning irradiation, the incidence angle of laser light incident to the rigid substrates is the second incidence angle, second incidence angle with
First incidence angle is differed.
Preferably, laser is incident to the rigid substrates with the first incident direction, first is carried out to the rigid substrates
During scanning irradiation, the direction for the second side that the rigid substrates are pointed in first side of the laser along the rigid substrates is moved;Make to swash
Light is incident to the rigid substrates with the second incident direction, when the rigid substrates are carried out with second of scanning irradiation, laser edge
Point to the direction movement of the first side of the rigid substrates in second side of the rigid substrates;
Or,
Laser is incident to the rigid substrates with the first incident direction, the rigid substrates are carried out with the first scanning and is irradiated
When, the direction for the first side that the rigid substrates are pointed in second side of the laser along the rigid substrates is moved;Make laser with second
Incident direction is incident to the rigid substrates, when the rigid substrates being carried out with second scanning irradiating, and laser is along the rigidity
Point to the direction movement of the second side of the rigid substrates in first side of substrate.
Preferably, the first incident direction of laser and the first side of the rigid substrates point to the second of the rigid substrates
Angle between the direction of side is acute angle, and the second incident direction of laser points to the rigidity with the first side of the rigid substrates
Angle between the direction of second side of substrate is obtuse angle;
Or,
First incident direction of laser points to the side of the second side of the rigid substrates with the first side of the rigid substrates
Angle between is obtuse angle, and the second incident direction of laser points to the rigid substrates with the first side of the rigid substrates
Angle between the direction of second side is acute angle.
Preferably, the laser for sending laser generator carries out scanning irradiation at least twice to the rigid substrates
In step, the laser that laser generator is sent is carried out twice sweep irradiation to the rigid substrates, send laser generator
Laser to the rigid substrates carry out twice sweep irradiation the step of include:
Laser is incident to the rigid substrates with the 3rd incident direction, the rigid substrates are carried out with scanning for the first time and is shone
Penetrate;
The objective table is set to rotate 180 ° around vertical direction;
Laser is incident to the rigid substrates with the 3rd incident direction, the rigid substrates are carried out with second of scanning and is shone
Penetrate.
Preferably, laser is incident to the rigid substrates with the 3rd incident direction, first is carried out to the rigid substrates
When secondary scanning is irradiated and second of scanning of rigid substrates progress is irradiated, laser refers to along the first side of the rigid substrates
Moved to the direction of the second side of the rigid substrates, or, laser points to described firm along the second side of the rigid substrates
Property substrate the first side direction movement.
Preferably, the laser for sending laser generator carries out scanning irradiation at least twice to the rigid substrates
In step, the laser that laser generator is sent is carried out twice sweep irradiation to the rigid substrates, send laser generator
Laser to the rigid substrates carry out twice sweep irradiation the step of include:
Laser is incident to the rigid substrates with the 4th incident direction, the rigid substrates are carried out with scanning for the first time and is shone
Penetrate;
The objective table is set to rotate 180 ° around vertical direction;
Laser is incident to the rigid substrates with the 5th incident direction, the rigid substrates are carried out with second of scanning and is shone
Penetrate, wherein, corresponding incidence angle and laser are with the 5th incidence side when laser is incident to the rigid substrates with the 4th incident direction
Differed to corresponding incidence angle when being incident to the rigid substrates.
The flexible display substrates stripping means is had with above-mentioned flexible display substrates stripping off device relative to prior art
Some Dominant Facies are same, will not be repeated here.
Brief description of the drawings
Accompanying drawing described herein is used for providing a further understanding of the present invention, constitutes the part of the present invention, this hair
Bright schematic description and description is used to explain the present invention, does not constitute inappropriate limitation of the present invention.In the accompanying drawings:
Fig. 1 is the schematic diagram of flexible display substrates stripping off device provided in an embodiment of the present invention;
Fig. 2 is Tu1Zhong A areas enlarged drawing;
Fig. 3 is a kind of mode that flexible display substrates stripping off device provided in an embodiment of the present invention peels off flexible display substrates
In to rigid substrates carry out for the first time scanning irradiate when schematic diagram;
Fig. 4 is a kind of mode that flexible display substrates stripping off device provided in an embodiment of the present invention peels off flexible display substrates
In rigid substrates are carried out with schematic diagram when second scanning is irradiated;
Fig. 5 is another side that flexible display substrates stripping off device provided in an embodiment of the present invention peels off flexible display substrates
In formula rigid substrates are carried out with schematic diagram when scanning is irradiated for the first time;
Fig. 6 is another side that flexible display substrates stripping off device provided in an embodiment of the present invention peels off flexible display substrates
In formula rigid substrates are carried out with schematic diagram when second of scanning is irradiated;
Fig. 7 is another side that flexible display substrates stripping off device provided in an embodiment of the present invention peels off flexible display substrates
In formula rigid substrates are carried out with schematic diagram when scanning is irradiated for the first time;
Fig. 8 is another side that flexible display substrates stripping off device provided in an embodiment of the present invention peels off flexible display substrates
In formula rigid substrates are carried out with schematic diagram when second of scanning is irradiated;
Fig. 9 is another side that flexible display substrates stripping off device provided in an embodiment of the present invention peels off flexible display substrates
In formula rigid substrates are carried out with schematic diagram when scanning is irradiated for the first time;
Figure 10 is another that flexible display substrates stripping off device provided in an embodiment of the present invention peels off flexible display substrates
In mode rigid substrates are carried out with schematic diagram when second of scanning is irradiated;
Figure 11 is the flow chart one of flexible display substrates stripping means provided in an embodiment of the present invention;
Figure 12 is the flowchart 2 of flexible display substrates stripping means provided in an embodiment of the present invention;
Figure 13 is the flow chart 3 of flexible display substrates stripping means provided in an embodiment of the present invention;
Figure 14 is the flow chart four of flexible display substrates stripping means provided in an embodiment of the present invention.
Reference:
10- objective tables, 20- laser generators,
21- laser generators, 22- laser beam emitting heads,
23- reflector plates, 30- rigid substrates,
The sides of 31- first, the sides of 32- second,
33- flexible display substrates, 40- foreign matters,
The foreign matters of 41- first are projected, the projection of the foreign matters of 42- second.
Embodiment
In order to further illustrate flexible display substrates stripping off device provided in an embodiment of the present invention and method, with reference to saying
Bright book accompanying drawing is described in detail.
Referring to Fig. 1, flexible display substrates stripping off device provided in an embodiment of the present invention includes objective table 10 and laser is sent out
Raw device 20, objective table 10 is used to carry the rigid substrates 30 for forming flexible display base plate 33, flexible display substrates 33 and loading
Platform 10 is contacted, and rigid substrates 30 include relative the first side 31 and the second side 32;Laser generator 20 is located at the upper of objective table 10
Side, the laser that laser generator 20 is sent can between the first side 31 of rigid substrates 30 and the second side 32 of rigid substrates 30 water
It is flat to move back and forth;When being peeled off to flexible display substrates 33, the laser that laser generator 20 is sent enters to rigid substrates 30
Row scanning irradiation at least twice, when wherein at least twice sweep irradiates, the incident direction of laser light incident to rigid substrates 30 is and firm
Property substrate 30 the first side 31 point to rigid substrates 30 the second side 32 direction between angle differ.
For example, please continue to refer to Fig. 1, flexible display substrates stripping off device provided in an embodiment of the present invention includes loading
Platform 10 and laser generator 20, objective table 10, which is used to carry, forms the rigid substrates 30 of flexible display base plate 33, when being formed with
When the rigid substrates 30 of flexible display substrates 33 are placed on objective table 10, rigid substrates 30 upward, the court of flexible display substrates 33
Under, flexible display substrates 33 are contacted with objective table 10, and rigid substrates 30 include relative the first side 31 and the second side 32, for example,
It is considered that the left side of rigid substrates 30 is that the right side of rigid substrates 30 in the first side 31 of rigid substrates 30, Fig. 1 is firm in Fig. 1
Second side 32 of property substrate 30;Laser generator 20 is located at the top of objective table 10, and laser generator 20 is used to send laser, swashed
It is radiated at after the laser emitting that optical generator 20 is sent on rigid substrates 30, laser light incident to rigid substrates 30 simultaneously passes through rigid base
Plate 30 is radiated at flexible display substrates 33 towards on the surface of rigid substrates 30, makes flexible display substrates 33 towards rigid substrates 30
Surface decompose, the laser that laser generator 20 is sent can be in the first side 31 and the second side of rigid substrates 30 of rigid substrates 30
Horizontal reciprocating is moved between 32, that is to say, that as shown in figure 1, the laser that sends of laser generator 20 can rigid substrates in Fig. 1
Horizontal reciprocating is moved between 30 left side and right side, to be scanned irradiation to rigid substrates 30.
When using flexible display substrates stripping off device provided in an embodiment of the present invention, Flexible Displays base will be formed with first
The rigid substrates 30 of plate 33 according to rigid substrates 30 upward, rule is placed on objective table 10 flexible display substrates 33 facing downward,
Flexible display substrates 33 are contacted with objective table 10;Then the laser for sending laser generator 20, and send out laser generator 20
The laser gone out horizontal reciprocating between the first side 31 of rigid substrates 30 and the second side 32 of rigid substrates 30 is moved, with to rigidity
Substrate 30 is scanned irradiation at least twice, and in rigid substrates 30 are scanned with irradiation at least twice, wherein at least is twice
During scanning irradiation, the incident direction of laser light incident to rigid substrates 30 points to rigid substrates with the first side 31 of rigid substrates 30
Angle between the direction of 30 the second side 32 is differed, for example, being to the progress twice sweep irradiation of rigid substrates 30 with laser
Example is illustrated, referring to Fig. 3, when first time being scanned irradiation to rigid substrates 30, laser light incident to rigid substrates 30
Incident direction be oblique bottom right in Fig. 3 direction, the second side 32 of rigid substrates 30 is pointed in the first side 31 of rigid substrates 30
Direction be in Fig. 3 by left side point on the right side of direction, now, the incident direction of laser light incident to rigid substrates 30 and rigid base
The angle that first side 31 of plate 30 points between the direction of the second side 32 of rigid substrates 30 is to be present in rigid base in α 1, Fig. 3
The foreign matters such as impurity, dust on the upper surface of plate 30 40 are in flexible display substrates 33 towards the projection on the surface of rigid substrates 30
That is the first foreign matter projection 41 is located at the right side immediately below foreign matter 40, referring to Fig. 4, being scanned at second to rigid substrates 30
During irradiation, the incident direction of laser light incident to rigid substrates 30 is the direction of oblique lower-left in Fig. 4, the first side of rigid substrates 30
31 sensing rigid substrates 30 the second side 32 directions be Fig. 4 in by left side point on the right side of direction, laser light incident to rigid base
Angle between the direction for the second side 32 that rigid substrates 30 are pointed in the incident direction of plate 30 and the first side 31 of rigid substrates 30
For α 2, the foreign matters 40 such as impurity, dust on the upper surface of rigid substrates 30 are present in Fig. 4 in flexible display substrates 33 towards firm
Property substrate 30 surface on projection be left sides that the second foreign matter projection 42 is located at immediately below foreign matter 40, with first time to rigid base
The position of the first foreign matter projection 41 is different in Fig. 3 when plate 30 is scanned irradiation.
From the foregoing, working as using flexible display substrates stripping off device provided in an embodiment of the present invention to flexible display substrates
33 when being peeled off, and first the rigid substrates 30 for being formed with flexible display substrates 33 are placed on objective table 10, wherein flexible aobvious
Show that substrate 33 is contacted with objective table 10, i.e., flexible display substrates 33 are down;Then the laser that laser generator 20 is sent is made firm
Property the first side 31 of substrate 30 and the second side 32 of rigid substrates 30 between horizontal reciprocating move, sent using laser generator 20
Laser irradiation is scanned at least twice to rigid substrates 30, the scanning at least twice carried out to rigid substrates 30 in laser is shone
Hit, when wherein at least twice sweep irradiates, the incident direction of laser light incident to rigid substrates 30 and the first of rigid substrates 30
The angle that side 31 is pointed between the direction of the second side 32 of rigid substrates 30 is differed, therefore, when rigid substrates 30 are dorsad flexible
When there is the foreign matters 40 such as impurity or dust on the surface of display base plate 33, swept at least twice to what rigid substrates 30 were carried out in laser
Retouch in irradiation, when wherein at least twice sweep irradiates, incident direction of the foreign matter 40 along laser is in flexible display substrates 33 towards firm
Location of projection is differed on the surface of property substrate 30, causes different when being incident to rigid substrates 30 with laser vertical in the prior art
Thing 40 is compared in flexible display substrates 33 towards location of projection is constant on the surface of rigid substrates 30, can prevent Flexible Displays
Substrate 33 prevents Flexible Displays base towards can not effectively be decomposed with the corresponding region of foreign matter 40 on the surface of rigid substrates 30
Plate 33 with the corresponding region of foreign matter 40 with rigid substrates 30 towards that can not separate on the surface of rigid substrates 30, so as to prevent follow-up
Flexible display substrates 33 are caused to occur with the corresponding region of foreign matter 40 when flexible display substrates 33 are removed from rigid substrates 30
It is abnormal, and then improve the image display quality of flexible display apparatus.
In the above-described embodiments, when being peeled off to flexible display substrates 33, laser is scanned photograph to rigid substrates 30
The number of times penetrated can be set according to actual needs, for example, the number of times that laser is scanned irradiation to rigid substrates 30 can be with
Twice, now, in first time rigid substrates 30 to be scanned with irradiation and second is scanned irradiation to rigid substrates 30
When, the incident direction of laser light incident to rigid substrates 30 points to the second of rigid substrates 30 with the first side 31 of rigid substrates 30
Angle between the direction of side 32 is differed;Or, the number of times that laser is scanned irradiation to rigid substrates 30 can be three times
Or more than three times, now, when being arbitrarily scanned irradiation to rigid substrates 30 twice, the incidence of laser light incident to rigid substrates 30
Angle between direction, the direction for the second side 32 for pointing to rigid substrates 30 with the first side 31 of rigid substrates 30 is differed, or
Person, when being scanned irradiation to rigid substrates 30 every time, the incident direction of laser light incident to rigid substrates 30, with rigid substrates
The angle that 30 the first side 31 is pointed between the direction of the second side 32 of rigid substrates 30 is differed.In the embodiment of the present invention
In, so that rigid substrates 30 are scanned with the number of times of irradiation to illustrate exemplified by twice.
In above-described embodiment, in rigid substrates 30 are scanned with irradiation at least twice, wherein at least twice sweep shines
When penetrating, the incident direction of laser light incident to rigid substrates 30 points to the of rigid substrates 30 with the first side 31 of rigid substrates 30
Angle between the direction of two sides 32 is differed, in actual applications, can be realized and be scanned at least twice using various ways
Laser light incident points to the of rigid substrates 30 with the first side 31 of rigid substrates 30 to the incident direction of rigid substrates 30 during irradiation
Angle between the direction of two sides 32 is differed.For example, the laser that laser generator 20 is sent is carried out at least to rigid substrates 30
Twice sweep irradiates, when wherein at least twice sweep irradiates, the laser light incident that laser generator 20 is sent to rigid substrates 30
Incident direction is differed, i.e., real by changing laser light incident that laser generator 20 sends to the incident direction of rigid substrates 30
Laser light incident, to the incident direction of rigid substrates 30, refers to the first side 31 of rigid substrates 30 during scanning irradiation at least twice now
Differed to the angle between the direction of the second side 32 of rigid substrates 30.
In actual applications, change the laser light incident that sends of laser generator 20 to rigid substrates 30 incident direction when,
Laser light incident that laser generator 20 sends can only be changed to the incident direction of rigid substrates 30, without changing laser generator
20 laser light incidents sent enter to the incidence angle of rigid substrates 30 so that laser carries out twice sweep irradiation to rigid substrates 30 as an example
Row explanation, referring to Fig. 3, when first time being scanned irradiation to rigid substrates 30, laser light incident enters to rigid substrates 30
Direction of the direction for oblique bottom right θ 1 in Fig. 3 is penetrated, the incidence angle of laser light incident to rigid substrates 30 is θ 1, laser light incident to rigidity
Folder between the direction for the second side 32 that rigid substrates 30 are pointed in the incident direction of substrate 30 and the first side 31 of rigid substrates 30
Angle is α 1, and the foreign matters 40 such as impurity, dust on the upper surface of rigid substrates 30 are present in Fig. 3 in the direction of flexible display substrates 33
Projection on the surface of rigid substrates 30 is the right side that the first foreign matter projection 41 is located at immediately below foreign matter 40;Referring to Fig. 4,
Secondary when being scanned irradiation to rigid substrates 30, the incident direction of laser light incident to rigid substrates 30 is oblique lower-left θ in Fig. 4
1 direction, the incidence angle of laser light incident to rigid substrates 30 is θ 1, the incident direction and rigidity of laser light incident to rigid substrates 30
The angle that first side 31 of substrate 30 points between the direction of the second side 32 of rigid substrates 30 is to be present in rigidity in α 2, Fig. 4
The foreign matters such as impurity, dust on the upper surface of substrate 30 40 are in flexible display substrates 33 towards the throwing on the surface of rigid substrates 30
Shadow is the left sides that the second foreign matter projection 42 is located at immediately below foreign matter 40, the when rigid substrates 30 being scanned with irradiation with first time
The position of one foreign matter projection 41 is different.
Change the laser light incident that sends of laser generator 20 to rigid substrates 30 incident direction when, can also pass through and change
The laser light incident that laser generator 20 is sent is realized to the incidence angle of rigid substrates 30, i.e. what laser generator 20 was sent swashs
Light is scanned irradiation to rigid substrates 30 at least twice, when wherein at least twice sweep irradiates, what laser generator 20 was sent
The incidence angle of laser light incident to rigid substrates 30 is differed.Carried out so that laser carries out twice sweep irradiation to rigid substrates 30 as an example
Illustrate, referring to Fig. 5, when first time being scanned irradiation to rigid substrates 30, the incidence of laser light incident to rigid substrates 30
Angle is θ 2, and the incident direction of laser light incident to rigid substrates 30 is the direction of oblique bottom right θ 2 in Fig. 5, laser light incident to rigid base
Angle between the direction for the second side 32 that rigid substrates 30 are pointed in the incident direction of plate 30 and the first side 31 of rigid substrates 30
For α 3, the foreign matters 40 such as impurity, dust on the upper surface of rigid substrates 30 are present in Fig. 5 in flexible display substrates 33 towards firm
Property substrate 30 surface on projection be right sides that the first foreign matter projection 41 is located at immediately below foreign matter 40;Referring to Fig. 6, second
Secondary when being scanned irradiation to rigid substrates 30, the incidence angle of laser light incident to rigid substrates 30 is θ 3, laser light incident to rigidity
The direction that the incident direction of substrate 30 is oblique bottom right θ 3 in Fig. 6, the incident direction and rigidity of laser light incident to rigid substrates 30
The angle that first side 31 of substrate 30 points between the direction of the second side 32 of rigid substrates 30 is to be present in rigidity in α 4, Fig. 6
The foreign matters such as impurity, dust on the upper surface of substrate 30 40 are in flexible display substrates 33 towards the throwing on the surface of rigid substrates 30
Shadow is the right side that the second foreign matter projection 42 is located at immediately below foreign matter 40, when being scanned irradiation to rigid substrates 30 due to first time
Laser light incident is to firm when the incidence angle θ 2 of laser light incident to rigid substrates 30 is scanned irradiation with second to rigid substrates 30
Property substrate 30 incidence angle θ 3 differ, thus, the position of position and the first foreign matter projection 41 of the second foreign matter projection 42 not phase
Together.
In the above-described embodiments, change the laser light incident that sends of laser generator 20 to rigid substrates 30 incidence angle when,
It can be realized by angle regulator, for example, please continue to refer to Fig. 1, laser generator 20 includes sharp for generating
The laser generator 21 and confession laser emitting of light and the laser beam emitting head 22 for being incident to rigid substrates 30, laser beam emitting head 22 can edge
Direction perpendicular to the first side 31 of rigid substrates 30 or the second side 32 of rigid substrates 30 is moved back and forth, and laser generator 20 is also
Include the angle regulator of regulation laser light incident to the incidence angle of rigid substrates 30.It is sharp to adjust by angle regulator
Light is incident to the incidence angle of rigid substrates 30, to change laser light incident that laser generator 20 sends to the incidence of rigid substrates 30
Direction, and then change laser light incident to the incident direction of rigid substrates 30 and the first side 31 sensing rigid substrates of rigid substrates 30
Angle between the direction of 30 the second side 32, is realized in rigid substrates 30 are scanned with irradiation at least twice, wherein extremely
During few twice sweep irradiation, the incident direction of laser light incident to rigid substrates 30 is pointed to just with the first side 31 of rigid substrates 30
Angle between the direction of second side 32 of property substrate 30 is differed.
In above-described embodiment, angle regulator regulation laser light incident to the way of realization of the incidence angle of rigid substrates 30 can
A variety of to have, for example, laser beam emitting head 22 can be installed in rotation on laser generator 21, angle regulator is also set
Put on laser generator 21, when need adjust laser light incident to rigid substrates 30 incidence angle when, angle regulator driving
Laser beam emitting head 22 is rotated, to adjust the rotational angle of laser beam emitting head 22, regulation laser by 22 outgoing of laser beam emitting head when
Direction, so as to adjust laser light incident to the incidence angle of rigid substrates 30;Or, in embodiments of the present invention, refer to Fig. 1 and figure
2, laser beam emitting head 22 is located at the side of laser generator 21, and the laser level that laser generator 21 is generated is incident to Laser emission
First 22, angle regulator includes the reflector plate 23 being rotatably arranged in laser beam emitting head 22, and reflector plate 23 is located at level
Before the direction of propagation for being incident to the laser of laser beam emitting head 22, the laser level that laser generator 21 is generated is incident to Laser emission
First 22, and reflector plate 23 is incident to, reflector plate 23 is by laser reflection, and the laser after reflected 23 reflection is by laser beam emitting head 22
Light-emitting window outgoing, and be incident to rigid substrates 30, i.e., the laser reflection that reflector plate 23 generates laser generator 21 to rigidity
Substrate 30, laser beam emitting head 22 is past along the first side 31 or the direction of the second side 32 of rigid substrates 30 perpendicular to rigid substrates 30
When moving again, irradiation is scanned to rigid substrates 30, when need adjust laser light incident to rigid substrates 30 incidence angle when, make
Reflector plate 23 is rotated, and adjusts the angle of reflector plate 23, so as to adjust the laser after reflected 23 reflection by laser beam emitting head 22
Light-emitting window outgoing angle, regulation laser by 22 outgoing of laser beam emitting head when direction, so as to adjust laser light incident to rigidity
The incidence angle of substrate 30.
In embodiments of the present invention, laser light incident is changed to the incident direction and the first of rigid substrates 30 of rigid substrates 30
, can also be by adjusting the first of rigid substrates 30 when the angle between the direction of the second side 32 of rigid substrates 30 is pointed in side 31
Position where side 31 and the second side of rigid substrates 30 32, specifically, referring to Fig. 1, objective table 10 can be around vertical direction
180 ° of rotations.For example, illustrated so that laser carries out twice sweep irradiation to rigid substrates 30 as an example, please continue to refer to figure
7, when first time being scanned irradiation to rigid substrates 30, the incidence angle of laser light incident to rigid substrates 30 is θ 4, and laser enters
Direction of the incident direction of rigid substrates 30 for oblique bottom right θ 4 in Fig. 7 is incident upon, the first side 31 of rigid substrates 30 is firm in Fig. 7
Property substrate 30 left side, the second side 32 of rigid substrates 30 is the right side of rigid substrates 30 in Fig. 7, laser light incident to rigid substrates
Angle between the direction for the second side 32 that rigid substrates 30 are pointed in 30 incident direction and the first side 31 of rigid substrates 30 is α
It is present in the foreign matters 40 such as impurity, dust on the upper surface of rigid substrates 30 in 5, Fig. 7 in flexible display substrates 33 towards rigidity
Projection on the surface of substrate 30 is the right sides that the first foreign matter projection 41 is located at immediately below foreign matter 40, and relative foreign matter 40 just under
Side is close to the second side 32 of rigid substrates 30;Complete after the first time scanning irradiation to rigid substrates 30, rotate objective table 10, make
Objective table 10 rotates 180 ° around vertical direction, referring to Fig. 8, the first side 31 of rigid substrates 30 is rigid substrates 30 in Fig. 8
Right side, the second side 32 of rigid substrates 30 is the left side of rigid substrates 30 in Fig. 8;Then rigid substrates 30 are swept for the second time
Irradiation is retouched, please continue to refer to Fig. 8, when being scanned irradiation to rigid substrates 30 second, laser light incident to rigid substrates 30
Incidence angle remain as θ 4, the incident direction of laser light incident to rigid substrates 30 is the direction of oblique bottom right θ 4 in Fig. 8, and laser enters
It is incident upon the direction that the incident direction of rigid substrates 30 points to the second side 32 of rigid substrates 30 with the first side 31 of rigid substrates 30
Between angle be the foreign matters 40 such as the impurity, the dust that are present in α 6, Fig. 8 on the upper surface of rigid substrates 30 in Flexible Displays base
Plate 33 is that the second foreign matter projects 42 right sides being located at immediately below foreign matter 40 towards the projection on the surface of rigid substrates 30, and relatively
The underface of foreign matter 40 is close to the first side 31 of rigid substrates 30, with being scanned irradiation to rigid substrates 30 for the first time in Fig. 7
When the first foreign matter projection 41 position it is different.
In above-described embodiment, by adjusting laser light incident to the incident direction of rigid substrates 30, or, by adjusting rigidity
Position where first side 31 of substrate 30 and the second side 32 of rigid substrates 30, changes laser light incident entering to rigid substrates 30
Angle between the direction for the second side 32 for penetrating the first side 31 sensing rigid substrates 30 of direction and rigid substrates 30.Actually should
, can also be by adjusting laser light incident simultaneously to the incident direction of rigid substrates 30 and the first side of rigid substrates 30 in
31 and rigid substrates 30 the second side 32 where position, change laser light incident to the incident direction and rigid base of rigid substrates 30
Point to the angle between the direction of the second side 32 of rigid substrates 30 in first side 31 of plate 30.For example, with laser to rigidity
Substrate 30 illustrated exemplified by twice sweep irradiation, referring to Fig. 9, being scanned irradiation to rigid substrates 30 in first time
When, the incidence angle of laser light incident to rigid substrates 30 is θ 5, and the first side 31 of rigid substrates 30 is a left side for rigid substrates 30 in Fig. 9
Side, the second side 32 of rigid substrates 30 is the right side of rigid substrates 30 in Fig. 9, the incident direction of laser light incident to rigid substrates 30
For the direction of oblique bottom right θ 5 in Fig. 9, the incident direction of laser light incident to rigid substrates 30 and the first side 31 of rigid substrates 30
Angle between the direction for the second side 32 for pointing to rigid substrates 30 is to be present on the upper surface of rigid substrates 30 in α 7, Fig. 9
The foreign matter 40 such as impurity, dust flexible display substrates 33 towards the projection on the surface of rigid substrates 30 be the projection of the first foreign matter
41 are located at immediately below the right side immediately below foreign matter 40, and relative foreign matter 40 close to the second side 32 of rigid substrates 30;Complete to firm
Property substrate 30 first time scanning irradiation after, rotate objective table 10, make objective table 10 around vertical direction rotate 180 °, refer to figure
10, now, the first side 31 of rigid substrates 30 is the right side of rigid substrates 30 in Figure 10, and the second side 32 of rigid substrates 30 is figure
The left side of rigid substrates 30 in 10;Then rigid substrates 30 are carried out with second of scanning to irradiate, please continue to refer to Figure 10, second
Secondary when being scanned irradiation to rigid substrates 30, the incidence angle of laser light incident to rigid substrates 30 is θ 6, laser light incident to rigidity
The direction that the incident direction of substrate 30 is oblique lower-left θ 6 in Figure 10, the incident direction and rigidity of laser light incident to rigid substrates 30
The angle that first side 31 of substrate 30 points between the direction of the second side 32 of rigid substrates 30 is to be present in rigidity in α 8, Figure 10
The foreign matters such as impurity, dust on the upper surface of substrate 30 40 are in flexible display substrates 33 towards the throwing on the surface of rigid substrates 30
Shadow is the left side that the second foreign matter projection 42 is located at immediately below foreign matter 40, and the second foreign matter projection 42 is also close with respect to immediately below foreign matter 40
Second side 32 of rigid substrates 30, laser light incident is to rigid substrates 30 when being scanned irradiation to rigid substrates 30 due to first time
Incidence angle θ 6 when being scanned irradiation to rigid substrates 30 with second laser light incident to rigid substrates 30 incidence angle θ 5 not
It is identical, thus, the position that the position of the second foreign matter projection 42 projects 41 with the first foreign matter is differed.
Figure 11 is referred to, the embodiment of the present invention also provides a kind of flexible display substrates stripping means, applied to real as described above
The flexible display substrates stripping off device described in example is applied, the flexible display substrates stripping off device includes:
Step S100, the rigid substrates for being formed with flexible display substrates are placed on objective table.
Step S200, make the laser that laser generator is sent to rigid substrates carry out at least twice scanning irradiate, wherein extremely
During few twice sweep irradiation, the incident direction of laser light incident to rigid substrates points to rigid substrates with the first side of rigid substrates
The second side direction between angle differ.
Each embodiment in this specification is described by the way of progressive, identical similar portion between each embodiment
Divide mutually referring to what each embodiment was stressed is the difference with other embodiment.It is real especially for method
Apply for example, because it is substantially similar to device embodiment, so describing fairly simple, related part is referring to device embodiment
Part explanation.
In the above-described embodiments, when being peeled off to flexible display substrates, laser is scanned irradiation to rigid substrates
Number of times can be set according to actual needs, in embodiments of the present invention, and irradiation is scanned to rigid substrates with laser
Number of times is illustrates exemplified by twice, now, when twice sweep irradiates, the incident direction of laser light incident to rigid substrates, with
The angle that first side of rigid substrates is pointed between the direction of the second side of rigid substrates is differed.
When laser carries out twice sweep irradiation to rigid substrates, photograph can be scanned to rigid substrates by regulation twice
Laser light incident realizes when twice sweep irradiates that laser light incident to rigid substrates enters to the incident direction of rigid substrates when penetrating
Angle between the direction for the second side for penetrating the first side sensing rigid substrates of direction and rigid substrates is differed, specifically, please
Refering to Figure 12, the step of alloing the laser that laser generator is sent to carry out twice sweep irradiation to rigid substrates includes:
Step S210, laser is incident to rigid substrates with the first incident direction, first time scanning is carried out to rigid substrates
Irradiation.
Step S220, laser is set to be incident to rigid substrates with the second incident direction, carrying out second to rigid substrates scans
Irradiation.
The incidence angle of laser light incident to rigid substrates can be set as the first incidence angle in step S210, in step S220
The incidence angle of middle laser light incident to rigid substrates can be set as the second incidence angle, and the first incidence angle can phase with the second incidence angle
Together, can also be different, it is preferable that the first incidence angle is different from the second incidence angle.
In step S210 and step S220, when laser is scanned irradiation to rigid substrates, the moving direction of laser can
To set according to actual needs, for example, when first time being scanned irradiation to rigid substrates, i.e. make laser incident with first
Direction is incident to rigid substrates, when rigid substrates are carried out with the first scanning irradiation, and first side of the laser along rigid substrates is pointed to firm
Property substrate the second side direction movement, when second is scanned irradiation to rigid substrates, i.e. make laser incident with second
Direction is incident to rigid substrates, when rigid substrates are carried out with second of scanning irradiation, and second side of the laser along rigid substrates is pointed to
The direction movement of first side of rigid substrates;Or, when first time being scanned irradiation to rigid substrates, i.e. make laser with
First incident direction is incident to rigid substrates, and when rigid substrates being carried out with the first scanning irradiating, laser is along the second of rigid substrates
The direction movement of the first side of rigid substrates is pointed in side, when second is scanned irradiation to rigid substrates, i.e. make laser with
Second incident direction is incident to rigid substrates, when rigid substrates being carried out with second scanning irradiating, and laser is along the of rigid substrates
Point to the direction movement of the second side of rigid substrates in side.It is so designed that, is irradiated completing the first time scanning to rigid substrates
Afterwards, when carrying out second of scanning irradiation to rigid substrates, the laser beam emitting head of laser generator is scanned for the first time without being back to
Position before irradiation, thus the step of flexible display substrates are peeled off and time can be simplified, efficiency is improved, it is cost-effective.
In the above-described embodiments, when laser is incident to rigid substrates with the first incident direction, the first incident direction and rigidity
The angle that first side of substrate points between the direction of the second side of rigid substrates is acute angle, laser with the second incident angles extremely
During rigid substrates, the angle between the direction of the second side of rigid substrates is pointed in the first side of the second incident direction and rigid substrates
For obtuse angle;Or, when laser is with the first incident angles to rigid substrates, the first side of the first incident direction and rigid substrates refers to
It is obtuse angle to the angle between the direction of the second side of rigid substrates, when laser is with the second incident angles to rigid substrates, the
The angle that first side of two incident directions and rigid substrates is pointed between the direction of the second side of rigid substrates is acute angle.So set
Meter, can make it that incident direction of the foreign matter along laser is in flexible substrate substrate direction when scanning irradiation to rigid substrates twice
Location of projection on the surface of rigid substrates it is in larger distance, prevent rigid substrates are scanned twice irradiate when, foreign matter edge
The incident direction of laser is overlapping towards the location of projection appearance on the surface of rigid substrates in flexible substrate substrate, so as to
Further improve the image display quality of flexible display apparatus.
When laser carries out twice sweep irradiation to rigid substrates, photograph can be scanned to rigid substrates by regulation twice
The position of first side of rigid substrates and the second side when penetrating, i.e., by making the first side of rigid substrates and the position pair of the second side
Adjust, realize when twice sweep irradiates, the incident direction of laser light incident to rigid substrates and the first side of rigid substrates are pointed to just
Angle between the direction of second side of property substrate is differed, and specifically, refers to Figure 13, the laser for sending laser generator
The step of carrying out twice sweep irradiation to rigid substrates can include:
Step S230, laser is incident to rigid substrates with the 3rd incident direction, first time scanning is carried out to rigid substrates
Irradiation.
Step S240, make objective table around vertical direction rotate 180 °.
Step S250, laser is set to be incident to rigid substrates with the 3rd incident direction, carrying out second to rigid substrates scans
Irradiation.
In step S230 and step S250, when laser is scanned irradiation to rigid substrates, the moving direction of laser can
Think:Make laser with the 3rd incident angles to rigid substrates, rigid substrates are carried out with scanning irradiation for the first time and to rigid base
When plate carries out second of scanning irradiation, the direction that laser points to the second side of rigid substrates along the first side of rigid substrates is moved
It is dynamic, or, the direction that laser points to the first side of rigid substrates along the second side of rigid substrates is moved.It is so designed that, complete
After the first time scanning irradiation of paired rigid substrate, when rigid substrates being carried out with second scanning irradiating, laser generator swashs
Light emitting head can simplify the step of flexible display substrates are peeled off without the position before being back to scanning irradiation for the first time
And the time, efficiency is improved, it is cost-effective.
When laser carries out twice sweep irradiation to rigid substrates, when can be by adjusting laser light incident to rigid substrates simultaneously
It is incident find and rigid substrates the first side and the position of the second side, realize when twice sweep irradiates, laser light incident is extremely
Point to angle between the direction of the second side of rigid substrates not phase in first side of the incident direction of rigid substrates and rigid substrates
Together, specifically, Figure 14 is referred to, the step of making the laser that laser generator is sent carry out twice sweep irradiation to rigid substrates can
With including:
Step S260, laser is incident to rigid substrates with the 4th incident direction, first time scanning is carried out to rigid substrates
Irradiation.
Step S270, make objective table around vertical direction rotate 180 °.
Step S280, laser is set to be incident to rigid substrates with the 5th incident direction, carrying out second to rigid substrates scans
Irradiation, wherein, corresponding incidence angle and laser are with the 5th incident direction when laser is incident to rigid substrates with the 4th incident direction
Corresponding incidence angle is differed when being incident to rigid substrates.
The foregoing is only a specific embodiment of the invention, but protection scope of the present invention is not limited thereto, any
Those familiar with the art the invention discloses technical scope in, change or replacement can be readily occurred in, should all be contained
Cover within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (14)
1. a kind of flexible display substrates stripping off device, it is characterised in that including:
Objective table, forms the rigid substrates of flexible display base plate for carrying, and flexible display substrates are contacted with the objective table,
The rigid substrates include relative the first side and the second side;
Laser generator above the objective table, the laser that the laser generator is sent can be in the rigid substrates
Horizontal reciprocating is moved between first side and the second side of the rigid substrates;
When being peeled off to flexible display substrates, the laser that the laser generator is sent carries out at least two to the rigid substrates
Secondary scanning irradiation, when wherein at least twice sweep irradiates, the incident direction of laser light incident to the rigid substrates, with the rigidity
The angle that first side of substrate is pointed between the direction of the second side of the rigid substrates is differed.
2. flexible display substrates stripping off device according to claim 1, it is characterised in that what the laser generator was sent
Laser carries out scanning at least twice to the rigid substrates and irradiated, when wherein at least twice sweep irradiates, the laser generator
The incident direction of the laser light incident sent to the rigid substrates is differed.
3. flexible display substrates stripping off device according to claim 2, it is characterised in that what the laser generator was sent
Laser carries out scanning at least twice to the rigid substrates and irradiated, when wherein at least twice sweep irradiates, the laser generator
The incidence angle of the laser light incident sent to the rigid substrates is differed.
4. flexible display substrates stripping off device according to claim 3, it is characterised in that the laser generator includes using
In the laser generator and confession laser emitting of generation laser and the laser beam emitting head for being incident to the rigid substrates, the laser hair
Penetrating head can move back and forth along the first side or the direction of the second side of the rigid substrates perpendicular to the rigid substrates, described to swash
Optical generator also includes regulation laser light incident to the angle regulator of the incidence angle of the rigid substrates.
5. flexible display substrates stripping off device according to claim 4, it is characterised in that the laser generator generation
Laser level is incident to the laser beam emitting head, and the angle regulator is included rotatably arranged with the laser beam emitting head
Reflector plate, the laser reflection that the reflector plate generates the laser generator to the rigid substrates.
6. flexible display substrates stripping off device according to claim 1, it is characterised in that the objective table can be around vertical side
Rotated to 180 °.
7. a kind of flexible display substrates stripping means, it is characterised in that including:
The rigid substrates for being formed with flexible display substrates are placed on objective table;
Make the laser that laser generator is sent carry out the rigid substrates scanning at least twice to irradiate, wherein at least twice sweep
During irradiation, the incident direction of the laser light incident to the rigid substrates is pointed to described firm with the first side of the rigid substrates
Angle between the direction of second side of property substrate is differed.
8. flexible display substrates stripping means according to claim 7, it is characterised in that described to send laser generator
Laser to the rigid substrates carry out at least twice scanning irradiate the step of in, make the laser that laser generator is sent to described
Rigid substrates carry out twice sweep irradiation, the laser that laser generator is sent is carried out twice sweep irradiation to the rigid substrates
The step of include:
Laser is incident to the rigid substrates with the first incident direction, the rigid substrates are carried out with scanning for the first time and is irradiated;
Laser is incident to the rigid substrates with the second incident direction, the rigid substrates are carried out with second of scanning and is irradiated.
9. flexible display substrates stripping means according to claim 8, it is characterised in that make laser enter with first described
Penetrate direction and be incident to the rigid substrates, the rigid substrates are carried out in the step of scanning is irradiated for the first time, laser light incident is extremely
The incidence angle of the rigid substrates is the first incidence angle;
Laser is set to be incident to the rigid substrates with the second incident direction described, carrying out second to the rigid substrates scans
In the step of irradiation, the incidence angle of laser light incident to the rigid substrates is the second incidence angle, second incidence angle with it is described
First incidence angle is differed.
10. flexible display substrates stripping means according to claim 8, it is characterised in that
Laser is set to be incident to the rigid substrates with the first incident direction, when the rigid substrates are carried out with the first scanning irradiation,
Move in the direction for the second side that the rigid substrates are pointed in the first side of the laser along the rigid substrates;Make laser incident with second
Direction is incident to the rigid substrates, when the rigid substrates being carried out with second scanning irradiating, and laser is along the rigid substrates
The second side point to the rigid substrates the first side direction movement;
Or,
Laser is set to be incident to the rigid substrates with the first incident direction, when the rigid substrates are carried out with the first scanning irradiation,
Move in the direction for the first side that the rigid substrates are pointed in the second side of the laser along the rigid substrates;Make laser incident with second
Direction is incident to the rigid substrates, when the rigid substrates being carried out with second scanning irradiating, and laser is along the rigid substrates
The first side point to the rigid substrates the second side direction movement.
11. flexible display substrates stripping means according to claim 8, it is characterised in that the first incident direction of laser
Angle between the direction for the second side that the rigid substrates are pointed to the first side of the rigid substrates is acute angle, the of laser
The angle that first side of two incident directions and the rigid substrates is pointed between the direction of the second side of the rigid substrates is blunt
Angle;
Or,
First side of the first incident direction of laser and the rigid substrates point to the second side of the rigid substrates direction it
Between angle be obtuse angle, the second incident direction of laser points to the second of the rigid substrates with the first side of the rigid substrates
Angle between the direction of side is acute angle.
12. flexible display substrates stripping means according to claim 7, it is characterised in that described to send out laser generator
The laser gone out is carried out in the step of scanning is irradiated at least twice to the rigid substrates, makes the laser that laser generator is sent to institute
State rigid substrates and carry out twice sweep irradiation, the laser that laser generator is sent is carried out twice sweep photograph to the rigid substrates
The step of penetrating includes:
Laser is incident to the rigid substrates with the 3rd incident direction, the rigid substrates are carried out with scanning for the first time and is irradiated;
The objective table is set to rotate 180 ° around vertical direction;
Laser is incident to the rigid substrates with the 3rd incident direction, the rigid substrates are carried out with second of scanning and is irradiated.
13. flexible display substrates stripping means according to claim 12, it is characterised in that make laser with the 3rd incidence side
To the rigid substrates are incident to, the rigid substrates are carried out with scanning irradiation for the first time and second is carried out to the rigid substrates
During secondary scanning irradiation, the direction that laser points to the second side of the rigid substrates along the first side of the rigid substrates is moved,
Or, the direction that laser points to the first side of the rigid substrates along the second side of the rigid substrates is moved.
14. flexible display substrates stripping means according to claim 7, it is characterised in that described to send out laser generator
The laser gone out is carried out in the step of scanning is irradiated at least twice to the rigid substrates, makes the laser that laser generator is sent to institute
State rigid substrates and carry out twice sweep irradiation, the laser that laser generator is sent is carried out twice sweep photograph to the rigid substrates
The step of penetrating includes:
Laser is incident to the rigid substrates with the 4th incident direction, the rigid substrates are carried out with scanning for the first time and is irradiated;
The objective table is set to rotate 180 ° around vertical direction;
Laser is incident to the rigid substrates with the 5th incident direction, the rigid substrates carried out with second of scanning and is irradiated,
Wherein, corresponding incidence angle is entered with laser with the 5th incident direction when laser is incident to the rigid substrates with the 4th incident direction
Corresponding incidence angle is differed when being incident upon the rigid substrates.
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CN112020781A (en) * | 2018-04-20 | 2020-12-01 | 深圳市柔宇科技股份有限公司 | Laser stripping method and laser stripping equipment for display panel |
CN114447257A (en) * | 2022-01-17 | 2022-05-06 | 深圳市华星光电半导体显示技术有限公司 | Flexible substrate stripping device and method |
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CN103208418A (en) * | 2012-01-11 | 2013-07-17 | 元太科技工业股份有限公司 | Substrate Stripping Process |
CN203910868U (en) * | 2014-06-25 | 2014-10-29 | 京东方科技集团股份有限公司 | Laser lift-off device |
CN106098965A (en) * | 2016-06-15 | 2016-11-09 | 昆山国显光电有限公司 | Flexible base board stripping off device and flexible base board stripping means |
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US20100154992A1 (en) * | 2008-12-22 | 2010-06-24 | Feinstein Casey J | Layer-Specific Energy Distribution Delamination |
CN103208418A (en) * | 2012-01-11 | 2013-07-17 | 元太科技工业股份有限公司 | Substrate Stripping Process |
CN203910868U (en) * | 2014-06-25 | 2014-10-29 | 京东方科技集团股份有限公司 | Laser lift-off device |
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CN114447257A (en) * | 2022-01-17 | 2022-05-06 | 深圳市华星光电半导体显示技术有限公司 | Flexible substrate stripping device and method |
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