CN107135639A - A kind of comprehensive copper foil superconducts foam and preparation method thereof - Google Patents
A kind of comprehensive copper foil superconducts foam and preparation method thereof Download PDFInfo
- Publication number
- CN107135639A CN107135639A CN201710443071.2A CN201710443071A CN107135639A CN 107135639 A CN107135639 A CN 107135639A CN 201710443071 A CN201710443071 A CN 201710443071A CN 107135639 A CN107135639 A CN 107135639A
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- Prior art keywords
- copper foil
- foam
- comprehensive
- superconducts
- adhesive layer
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0015—Gaskets or seals
- H05K9/0016—Gaskets or seals having a spring contact
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
- Y02E40/60—Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment
Abstract
Superconduct foam and preparation method thereof the invention discloses a kind of comprehensive copper foil, including：Copper foil body, the upper surface of copper foil body is coated with conductive adhesive layer, and the upper surface interval of upper conductive adhesive layer is bonded with multiple all-directional conductive foam bars；The lower surface of copper foil body is coated with lower conductive adhesive layer.The comprehensive copper foil superconducts the problem of foam solves in the prior art that conducting foam adhesive force is not strong, easily come off, with preferable comprehensive effectiveness and high conductivity.Machining accuracy height, the production efficiency height of the product prepared by the preparation method of foam are superconducted using the comprehensive copper foil.
Description
Technical field
Superconduct foam and its preparation side the present invention relates to electromangnetic spectrum field, more particularly to a kind of comprehensive copper foil
Method.
Background technology
Electromagnetic interference (EMI) or Radio frequency interference (RFI) are being not required to of producing or radiate from electronics or electrical equipment
The electromagnet portion wanted, its normal operating to electronics or electrical equipment constitutes interference.In order to efficiently reduce electromagnetic interference (EMI)
Or Radio frequency interference (RFI), typically in electromagnetic interference source or source of radio-frequency interference and it can need to set conductive between area to be protected
Foam.This conducting foam both can be used for reduction electromagnetic energy and be emitted from electromagnetic interference source or source of radio-frequency interference, also may be used
Entered for reducing external electromagnetic energy in electromagnetic interference source or source of radio-frequency interference.
Conducting foam used in current industry, its structure is mainly by PU foams and the conductive fabric being coated on around the foam
Composition, after a series of processing, makes it have good electric conductivity, being then fixed on using adhesive tape is needed on shielding device,
Form the conducting foam with the elasticity of compression.
But often its adhesive force is not strong for existing conducting foam, easily comes off, comprehensive shield effectiveness and electric conductivity
It is poor.
The content of the invention
It is an object of the present invention to propose that a kind of comprehensive copper foil superconducts foam, solve conductive in the prior art
Foam adhesive force is not strong, the problem of easily come off, with preferable comprehensive effectiveness and high conductivity.
It is another object of the present invention to propose that a kind of comprehensive copper foil superconducts the preparation method of foam, Product processing
Precision is high, production efficiency is high.
For up to this purpose, the present invention uses following technical scheme：
A kind of comprehensive copper foil superconducts foam, including：Copper foil body, the upper surface of the copper foil body, which is coated with, leads
Electric glue-line, the upper surface interval of the upper conductive adhesive layer is bonded with multiple all-directional conductive foam bars；Under the copper foil body
Surface is coated with lower conductive adhesive layer.
As a further improvement on the present invention, the lower surface of the lower conductive adhesive layer is covered with one layer of mould release membrance.
As a further improvement on the present invention, the copper foil body is V-shaped；The thickness of the copper foil body is 0.05mm.
As a further improvement on the present invention, the all-directional conductive foam bar is elongated, and described comprehensive leads
The medial surface of electric foam bar aligns with the medial surface of the V-arrangement of the copper foil body, or the all-directional conductive foam bar is outer
Alignd with the lateral surface of the V-arrangement of the copper foil body side.
As a further improvement on the present invention, the thickness of the upper conductive adhesive layer is 0.02mm~0.03mm.
As a further improvement on the present invention, the thickness of the lower conductive adhesive layer is 0.02mm~0.03mm.
A kind of comprehensive copper foil superconducts the preparation method of foam, comprises the following steps：
Step A：Blanking, prepares copper foil body；
Step B：Applied in the upper surface of copper foil body and be covered with conductive adhesive layer；
Step C：All-directional conductive foam tablet is punched, all-directional conductive foam body, and all-directional conductive foam is formed
The punching end face of body is formed with the all-directional conductive foam bar of spaced multiple bar shapeds；
Step D：The all-directional conductive foam body obtained in the step C is bonded in the upper surface of copper foil body, it is right
All-directional conductive foam body and copper foil body are punched jointly, obtain being bonded in its upper surface by copper foil body and interval
The comprehensive copper foil of multiple all-directional conductive foam bar formation superconducts foam semi-finished product；
Step E：The lower surface for the copper foil body that the mould release membrance of lower conductive adhesive layer is covered in the step D is coated with,
Superconduct foam so as to obtain comprehensive copper foil.
Beneficial effects of the present invention are：The present invention proposes that a kind of comprehensive copper foil superconducts foam, in the upper of copper foil body
Surface is bonded with multiple all-directional conductive foam bars by upper conductive adhesive layer interval, is coated in the lower surface of copper foil body for inciting somebody to action
It is bonded in the lower conductive adhesive layer on electronic component, so that improving existing conducting foam is unable to all-directional conductive and full side
The problem of bit mask heat conduction, with preferable comprehensive effectiveness and high conductivity, it is bonded than stronger.The present invention is carried
A kind of comprehensive copper foil gone out superconducts the preparation method of foam, by die cutting device be punched into punching end surfaces be provided with it is many
The all-directional conductive foam body of the all-directional conductive foam bar of individual bar shaped, copper foil sheet is bonded in by all-directional conductive foam body
The upper surface of body, and be punched jointly by die cutting device, obtain being bonded in many of its upper surface by copper foil body and interval
The comprehensive copper foil of individual all-directional conductive foam bar formation superconducts foam semi-finished product, be finally coated with lower conductive adhesive layer from
Type film is covered in the lower surface of copper foil body, so that obtaining comprehensive copper foil superconducts foam, the product prepared using this method
Machining accuracy it is high, production efficiency is high.
Brief description of the drawings
Fig. 1 is the structural representation that a kind of comprehensive copper foil that the present invention is provided superconducts foam；
Fig. 2 is the partial sectional view that a kind of comprehensive copper foil that the present invention is provided superconducts foam；
Fig. 3 is the flow chart for the preparation method that a kind of comprehensive copper foil that the present invention is provided superconducts foam.
In figure：1- copper foil bodies；2- all-directional conductive foam bodies；21- all-directional conductive foam bars；The upper conducting resinls of 3-
Layer；Conductive adhesive layer under 4-；5- mould release membrances.
Embodiment
Further illustrate technical scheme below in conjunction with the accompanying drawings and by embodiment.
As shown in Figures 1 to 3, a kind of comprehensive copper foil superconducts foam, including：Copper foil body 1, the upper table of copper foil body 1
Face is coated with conductive adhesive layer 3, and the upper surface interval of upper conductive adhesive layer 3 is bonded with multiple all-directional conductive foam bars 21；Copper foil
The lower surface of body 1 is coated with lower conductive adhesive layer 4.
A kind of comprehensive copper foil proposed by the present invention superconducts foam, passes through multiple all-directional conductive foam bars 21 and V-arrangement
Copper foil body bonding mode, effectively improve that existing conducting foam is unable to all-directional conductive and comprehensive shielding heat conduction is asked
Topic, with preferable comprehensive effectiveness and high conductivity.Meanwhile, also have both the remarkable mechanism performance of PU foams
(restoration), can be used as the less pad of thickness of pad, LCD back cushions and various I/O interfaces.In use, comprehensive
Copper foil superconducts foam and is adhesively fixed on by lower conductive adhesive layer on electronic component.
Above-mentioned comprehensive copper foil is superconducted in foam, and the lower surface of lower conductive adhesive layer 4 is covered with one layer of mould release membrance 5.It is preferred that
Ground, mould release membrance 5 is PET film.In use, first the mould release membrance 5 is torn off.
Above-mentioned comprehensive copper foil is superconducted in foam, it is preferable that copper foil body 1 is V-shaped；The thickness of copper foil body 1 is
0.05mm。
Above-mentioned comprehensive copper foil is superconducted in foam, and all-directional conductive foam bar 21 is elongated, and all-directional conductive
The medial surface of foam bar 21 aligns with the medial surface of the V-arrangement of copper foil body 1, or all-directional conductive foam bar 21 lateral surface with
The lateral surface alignment of the V-arrangement of copper foil body 1.
Above-mentioned comprehensive copper foil is superconducted in foam, it is preferable that the thickness of upper conductive adhesive layer 3 is 0.02mm~0.03mm.
Above-mentioned comprehensive copper foil is superconducted in foam, it is preferable that the thickness of lower conductive adhesive layer 4 is 0.02mm~0.03mm.
Above-mentioned comprehensive copper foil is superconducted in foam, it is preferable that upper conductive adhesive layer and lower conductive adhesive layer are using each to same
Property conducting resinl, the base material of conducting resinl may be selected from the resin material of thermmohardening or thermoplasticity, several conducting particles contained in base material.
Above-mentioned comprehensive copper foil is superconducted in foam, and the base material of all-directional conductive foam bar is elastomeric with poly- for sheet
Ester, polyethers or PET are the foaming sponge of main component.
A kind of comprehensive copper foil superconducts the preparation method of foam, comprises the following steps：
Step A：Blanking, prepares copper foil body 1；
Step B：Applied in the upper surface of copper foil body 1 and be covered with conductive adhesive layer 3；
Step C：All-directional conductive foam tablet is punched, all-directional conductive foam body 2, and all-directional conductive foam is formed
The punching end face of body 2 is formed with the all-directional conductive foam bar 21 of spaced multiple bar shapeds；
Step D：The all-directional conductive foam body 2 obtained in step C is bonded in the upper surface of copper foil body 1, to complete
Orientation conducting foam body 2 and copper foil body 1 are punched jointly, by the part connected between all-directional conductive foam bar 21 and
The part of copper foil body 1 corresponding with above and below the part is cut simultaneously, obtains being bonded in its upper surface by copper foil body 1 and interval
Multiple all-directional conductive foam bars 21 formation comprehensive copper foil superconduct foam semi-finished product；
Step E：The mould release membrance 5 for being coated with conductive adhesive layer pastes the lower surface of copper foil body 1 in step D, so that
Obtain comprehensive copper foil and superconduct foam.
Further, copper foil body 1 is V-shaped, when being punched all-directional conductive foam tablet in step C, all-directional conductive
The punching end of foam body 2 has the v-shaped structure with the form fit of copper foil body 1, so that all-directional conductive foam body 2
One end with multiple all-directional conductive foam bars 21 can be bonded in the upper surface of copper foil body 1 completely.
A kind of comprehensive copper foil proposed by the present invention superconducts the preparation method of foam, and being punched into by die cutting device has
The lateral surface of V-arrangement or the all-directional conductive foam body 2 of medial surface, and the lateral surface of the V-arrangement of all-directional conductive foam body 2
Or medial surface is arranged at intervals with the all-directional conductive foam bar 21 of multiple bar shapeds, and all-directional conductive foam body 2 is bonded in into copper
The upper surface of paper tinsel body 1, and be punched jointly by die cutting device, obtain being bonded in its upper table by copper foil body 1 and interval
The comprehensive copper foil of multiple all-directional conductive foam bars 21 formation in face superconducts foam semi-finished product, is finally coated with lower conduction
The mould release membrance 5 of glue-line 4 is covered in the lower surface of copper foil body 1, so that obtaining comprehensive copper foil superconducts foam.Using this method
The machining accuracy of the product of preparation is high, is glued between all-directional conductive foam bar and copper foil body and between product and electronic component
Connect higher than stronger, production efficiency.
The technical principle of the present invention is described above in association with specific embodiment.These descriptions are intended merely to explain the present invention's
Principle, and limiting the scope of the invention can not be construed in any way.Based on explanation herein, the technology of this area
Personnel, which would not require any inventive effort, can associate other embodiments of the present invention, and these modes are fallen within
Within protection scope of the present invention.
Claims (7)
1. a kind of comprehensive copper foil superconducts foam, it is characterised in that including：Copper foil body (1), the copper foil body (1)
Upper surface is coated with conductive adhesive layer (3), and the upper surface interval of the upper conductive adhesive layer (3) is bonded with multiple all-directional conductive bubbles
Sliver (21)；The lower surface of the copper foil body (1) is coated with lower conductive adhesive layer (4).
2. a kind of comprehensive copper foil according to claim 1 superconducts foam, it is characterised in that the lower conductive adhesive layer
(4) lower surface is covered with one layer of mould release membrance (5).
3. a kind of comprehensive copper foil according to claim 1 superconducts foam, it is characterised in that the copper foil body (1)
It is V-shaped；The thickness of the copper foil body (1) is 0.05mm.
4. a kind of comprehensive copper foil according to claim 3 superconducts foam, it is characterised in that the all-directional conductive bubble
Sliver (21) is elongated, and the medial surface of the all-directional conductive foam bar (21) and the V-arrangement of the copper foil body (1)
Medial surface aligns, or the all-directional conductive foam bar (21) lateral surface and the copper foil body (1) V-arrangement lateral surface
Alignment.
5. a kind of comprehensive copper foil according to claim 1 superconducts foam, it is characterised in that the upper conductive adhesive layer
(3) thickness is 0.02mm~0.03mm.
6. a kind of comprehensive copper foil according to claim 1 superconducts foam, it is characterised in that the lower conductive adhesive layer
(4) thickness is 0.02mm~0.03mm.
7. a kind of comprehensive copper foil superconducts the preparation method of foam, it is characterised in that comprise the following steps：
Step A：Blanking, prepares copper foil body (1)；
Step B：Applied in the upper surface of copper foil body (1) and be covered with conductive adhesive layer (3)；
Step C：All-directional conductive foam tablet is punched, all-directional conductive foam body (2), and all-directional conductive foam sheet is formed
The punching end face of body (2) is formed with the all-directional conductive foam bar (21) of spaced multiple bar shapeds；
Step D：The all-directional conductive foam body (2) obtained in the step C is bonded in the upper surface of copper foil body (1),
All-directional conductive foam body (2) and copper foil body (1) are punched jointly, obtained by copper foil body (1) and interval bonding
The comprehensive copper foil that multiple all-directional conductive foam bars (21) in its upper surface are formed superconducts foam semi-finished product；
Step E：The lower surface for the copper foil body (1) that the mould release membrance of conductive adhesive layer (5) is covered in the step D is coated with,
Superconduct foam so as to obtain comprehensive copper foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710443071.2A CN107135639B (en) | 2017-06-13 | 2017-06-13 | All-dimensional copper foil superconducting foam and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710443071.2A CN107135639B (en) | 2017-06-13 | 2017-06-13 | All-dimensional copper foil superconducting foam and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107135639A true CN107135639A (en) | 2017-09-05 |
| CN107135639B CN107135639B (en) | 2023-08-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710443071.2A Active CN107135639B (en) | 2017-06-13 | 2017-06-13 | All-dimensional copper foil superconducting foam and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108189503A (en) * | 2018-01-31 | 2018-06-22 | 苏州维洛克电子科技有限公司 | A kind of multi-functional PET film |
| CN108546524A (en) * | 2018-07-26 | 2018-09-18 | 东莞捷邦实业有限公司 | The anti-tampering copper foil foam component of electronic circuit board static conductive |
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| CN206977920U (en) * | 2017-06-13 | 2018-02-06 | 昆山市飞荣达电子材料有限公司 | A kind of comprehensive copper foil superconducts foam |
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| CN103680683A (en) * | 2013-01-18 | 2014-03-26 | 隆扬电子（昆山）有限公司 | Conductive sponge |
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| CN108189503A (en) * | 2018-01-31 | 2018-06-22 | 苏州维洛克电子科技有限公司 | A kind of multi-functional PET film |
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| Publication number | Publication date |
|---|---|
| CN107135639B (en) | 2023-08-08 |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20230713 Address after: 213200 No.139 Huaye Road, Jintan District, Changzhou City, Jiangsu Province Applicant after: Feirongda Technology (Jiangsu) Co.,Ltd. Address before: No. 258, Dongping Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province, 215311 Applicant before: KUNSHAN FEIRONGDA ELECTRONIC MATERIAL Co.,Ltd. |
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