CN107124838B - Multi-layer flexible circuit board ends-opening method - Google Patents
Multi-layer flexible circuit board ends-opening method Download PDFInfo
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- CN107124838B CN107124838B CN201710456410.0A CN201710456410A CN107124838B CN 107124838 B CN107124838 B CN 107124838B CN 201710456410 A CN201710456410 A CN 201710456410A CN 107124838 B CN107124838 B CN 107124838B
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- Prior art keywords
- aperture
- area
- dry film
- copper
- single sided
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention relates to a kind of multi-layer flexible circuit board ends-opening methods, comprising the following steps: (1) layers of copper for etching single sided board forms the first aperture；(2) single sided board and assembly adhesive vacation are connect, and etch single sided board PI layer and assembly adhesive and form the second aperture, the aperture of the aperture of the second aperture less than the first aperture；(3) single sided board and assembly adhesive that vacation connects originally are connect with dual platen, the area so that the first aperture, the second aperture formation are uncapped；(4) copper plate in the bottom and side wall in the area that uncaps；(5) oral area that the second aperture is connected with the first aperture is covered in using dry film, the bottom in the hole wall of the second aperture and the area that uncaps is made to form the overlay area of dry film；(6) region that choosing plating is not covered by dry film；(7) dry film is removed；(8) layers of copper in the overlay area of dry film is etched.The present invention can improve multi-layer flexible circuit board uncap can not release problem, to improve wiring board product quality.
Description
Technical field
The method that the present invention relates to a kind of to open up the area that uncaps on multi-layer flexible circuit board.
Background technique
The design of certain multi-layer flexible circuit boards needs to open up the area that uncaps so that internal layer circuit on the single sided board for constituting it
It is exposed.In the prior art, for the multilayer circuit board after fitting, the area that uncaps is formed by the way of radium-shine single sided board.Using this
When mode, the area's area that there is a problem of uncapping is too small, copper foil can not be release, to influence product quality.
Summary of the invention
The object of the present invention is to provide one kind can improve multi-layer flexible circuit board uncap can not release problem multilayer it is soft
Property wiring board ends-opening method.
In order to achieve the above objectives, the technical solution adopted by the present invention is that:
A kind of multi-layer flexible circuit board ends-opening method, in the layer flexible line as made of single sided board and dual platen fitting
It realizes and uncaps on the plate of road, method includes the following steps:
(1) layers of copper for etching the single sided board forms the first aperture；
(2) single sided board and assembly adhesive vacation are connect, and etch the single sided board PI layer and the assembly adhesive and formed
Second aperture, the aperture of second aperture are less than the aperture of first aperture；
(3) the false single sided board connect and the assembly adhesive are originally connect with dual platen, so that first aperture, institute
It states the second aperture and forms the area that uncaps, the side copper face of the dual platen forms the bottom in the area that uncaps, first aperture
Hole wall, second aperture hole wall form the side wall in the area that uncaps；
(4) copper plate in the bottom and side wall in the area that uncaps；
(5) oral area that second aperture is connected with the first aperture is covered in using dry film, makes at least described second to open
The overlay area of the dry film is formed on the bottom in the hole wall in hole and the area that uncaps；
(6) region that choosing plating is not covered by the dry film；
(7) dry film is removed；
(8) layers of copper in the overlay area of the dry film is etched.
In step (4), the layers of copper is plated to using PTH and flash method.
In step (4), the layers of copper with a thickness of 1 μm.
Due to the above technical solutions, the present invention has the following advantages over the prior art: the side of uncapping of the invention
Method can improve multi-layer flexible circuit board uncap can not release problem, to improve wiring board product quality.
Detailed description of the invention
Attached drawing 1 is flow diagram of the invention.
In the figures above: 1, single sided board；2, assembly adhesive；3, dual platen；4, uncap area；5, layers of copper；6, dry film；7, choosing plating
Layer.
Specific embodiment
The invention will be further described for embodiment shown in reference to the accompanying drawing.
Embodiment one: multi-layer flexible circuit board is bonded by single sided board 1 and dual platen 3 by assembly adhesive 2, wherein single side
Plate 1 has one layer of layers of copper 5 and one layer of PI layers of composition, and dual platen 3 is made of the two sides layers of copper 5 of one layer PI layers and its two sides.
Referring to figure 1, a kind of for the multi-layer flexible circuit board made of being bonded as single sided board 1 and dual platen 3
Realize the multi-layer flexible circuit board ends-opening method uncapped, comprising the following steps:
(1) layers of copper 5 for etching single sided board 1 forms the first aperture；
(2) single sided board 1 and 2 vacation of assembly adhesive are connect, and etch single sided board 1 PI layer and assembly adhesive 2 and formed the second aperture,
Aperture of the aperture of second aperture less than the first aperture；
(3) single sided board 1 and assembly adhesive 2 that vacation connects are connect with dual platen 3, so that the first aperture, the second aperture shape
At the area 4 that uncaps, the side copper face of dual platen 3 forms the bottom in the area 4 that uncaps, the hole wall of the first aperture, the second aperture hole wall shape
At the side wall in the area 4 that uncaps；
(4) use PTH and flash the method copper plate 5 in the bottom and side wall in the area 4 that uncaps, layers of copper 5 with a thickness of 1 μm；
(5) oral area that the second aperture is connected with the first aperture is covered in using dry film 6, makes the hole wall of at least the second aperture
And the overlay area of dry film 6 is formed on the bottom in the area 4 that uncaps；
(6) choosing plating is not formed by the region that dry film 6 covers and selects coating 7；
(7) dry film 6 is removed；
(8) layers of copper 5 in the overlay area of dry film 6 is etched.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art
Scholar cans understand the content of the present invention and implement it accordingly, and it is not intended to limit the scope of the present invention.It is all according to the present invention
Equivalent change or modification made by Spirit Essence, should be covered by the protection scope of the present invention.
Claims (3)
1. a kind of multi-layer flexible circuit board ends-opening method, in the layer flexible route as made of single sided board and dual platen fitting
It realizes and uncaps on plate, it is characterised in that: method includes the following steps:
(1) layers of copper for etching the single sided board forms the first aperture；
(2) single sided board and assembly adhesive vacation are connect, and etch the single sided board PI layer and the assembly adhesive and form second
Aperture, the aperture of second aperture are less than the aperture of first aperture；
(3) single sided board that connects of vacation and the assembly adhesive are originally connect with dual platen, so that first aperture, described the
Two apertures formation is uncapped area, and the side copper face of the dual platen forms the bottom in the area that uncaps, the hole wall of first aperture,
The hole wall of second aperture forms the side wall in the area that uncaps；
(4) copper plate in the bottom and side wall in the area that uncaps；
(5) oral area that second aperture is connected with the first aperture is covered in using dry film, makes at least described second aperture
The overlay area of the dry film is formed on the bottom in hole wall and the area that uncaps；
(6) region that choosing plating is not covered by the dry film；
(7) dry film is removed；
(8) layers of copper in the overlay area of the dry film is etched.
2. multi-layer flexible circuit board ends-opening method according to claim 1, it is characterised in that: in step (4), using PTH
The layers of copper is plated to flash method.
3. multi-layer flexible circuit board ends-opening method according to claim 1, it is characterised in that: in step (4), the layers of copper
With a thickness of 1 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710456410.0A CN107124838B (en) | 2017-06-16 | 2017-06-16 | Multi-layer flexible circuit board ends-opening method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710456410.0A CN107124838B (en) | 2017-06-16 | 2017-06-16 | Multi-layer flexible circuit board ends-opening method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107124838A CN107124838A (en) | 2017-09-01 |
| CN107124838B true CN107124838B (en) | 2019-05-14 |
Family
ID=59719252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710456410.0A Active CN107124838B (en) | 2017-06-16 | 2017-06-16 | Multi-layer flexible circuit board ends-opening method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107124838B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102244973A (en) * | 2011-05-09 | 2011-11-16 | 厦门市英诺尔电子科技有限公司 | Printed circuit board with blind hole structure and manufacturing method thereof |
| CN103269564A (en) * | 2013-03-28 | 2013-08-28 | 淳华科技(昆山)有限公司 | Multilayer board local single-layer area inner layer cutting process |
-
2017
- 2017-06-16 CN CN201710456410.0A patent/CN107124838B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102244973A (en) * | 2011-05-09 | 2011-11-16 | 厦门市英诺尔电子科技有限公司 | Printed circuit board with blind hole structure and manufacturing method thereof |
| CN103269564A (en) * | 2013-03-28 | 2013-08-28 | 淳华科技(昆山)有限公司 | Multilayer board local single-layer area inner layer cutting process |
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| Publication number | Publication date |
|---|---|
| CN107124838A (en) | 2017-09-01 |
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