CN107121899A - Anticorrosive additive stripping liquid controlling composition - Google Patents
Anticorrosive additive stripping liquid controlling composition Download PDFInfo
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- CN107121899A CN107121899A CN201610798919.9A CN201610798919A CN107121899A CN 107121899 A CN107121899 A CN 107121899A CN 201610798919 A CN201610798919 A CN 201610798919A CN 107121899 A CN107121899 A CN 107121899A
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- stripping liquid
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/426—Stripping or agents therefor using liquids only containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides
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Abstract
The present invention relates to anticorrosive additive stripping liquid controlling composition, more specifically, it is related to following anticorrosive additive stripping liquid controlling composition：By imidazolidine based compound and polar organic solvent comprising following chemical formula 1, so that resist peeling force is significantly excellent, it can make to minimize for the corrosivity comprising copper and the metal film quality of aluminium.In above-mentioned chemical formula 1, R1And R2It is each independently the alkylidene of carbon number 1~3.
Description
Technical field
The present invention relates to it is a kind of make that the resist for being attached to substrate is easily peeled off in photoresist stripping process it is anti-
Lose agent remover composition.
Background technology
Photoresist (Photoresist) is to utilize that photomask will be drawn in advance by the photochemical reaction of light
(Photomask) fine pattern can develop the chemical envelope onto required substrate, be that exposure is applied to together with photomask
The high polymer material of technology, it is considered to be directly being brought on the integrated level of element influences and determine the master of final resolution limit
Want the factor.According to also known as Moore's Law (Moore's law；The theory of integrated level 2 times of the increase in every 2 years of semiconductor), in order to incite somebody to action
The integrated level of annual increased circuit is put into the semiconductor of size restriction, it is necessary to which the circuit of design to be carried out to smaller patterning
(patterning), thus semiconductor integration densities the exploitation of photoresist that will necessarily constantly be looked for novelty of increase.
In order to manufacture high-resolution flat-panel monitor, general use forms micro- using this photoresist on substrate
Photoetching (photolithography) process of thin distribution, this is the thermal characteristics, mechanical property, chemistry using photoresist
Characteristic, on substrate after painting photoresist, makes it expose (exposure) in the light of certain wavelength, carries out dry-etching
Or the method for Wet-type etching.
In it make use of the fine pattern technology of photoresist, new photoresist is together taken seriously with exploitation
Field be anticorrosive additive stripping liquid controlling.Photoresist needs to remove using anticorrosive additive stripping liquid controlling after process terminates, because
Unnecessary photoresist layer and by etching and the metal residue that remains on substrate of washing process after the etching process
Or rotten photoresist residue can cause semiconductor manufacturing yield to decline etc. and initiation problem.
It is therefore desirable to the removing power for etch residue and the excellent stripping for rotten photoresist residue
Ability, specifically, for the removing power of etch residue occurred after dry-etching process and the corrosion for metal wiring
Restraint etc. requires quite high-caliber peel property.Particularly, the corrosion restraint for aluminium, and requirement pair are not required nothing more than
In the corrosion restraint of copper, and in order to ensure price competitiveness, also require to improve peeling rate, increase the processing number of substrate
Such economy.
Associated with this, Ebrean Registered Patent the 1008373rd discloses following anticorrosive additive stripping liquid controlling composition：By comprising
The imidazolidine based compound of specified chemical formula, it is possible to increase resist stripping ability, increases for the photoresist comprising molybdenum
The corrosion protection power of lower film.But, when using above-mentioned anticorrosive additive stripping liquid controlling composition, it may occur however that the gold for including copper and aluminium
The problem of corrosion protection power of category film quality declines.
In addition, Ebrean Registered Patent the 1213735th discloses following anticorrosive additive stripping liquid controlling composition：By including ring-type
Amine, stripping accelerator, anticorrosive etc., so as to improve resist stripping ability, increase the corrosion protection power for metal wiring.But
Be, the anticorrosive additive stripping liquid controlling composition it can also happen that resist stripping ability is insufficient, for metal film quality corrosion protection power not
Sufficient the problem of.
Prior art literature
Patent document
Patent document 1：Ebrean Registered Patent the 1008373rd (2011.01.07, LG Chemical Ltd)
Patent document 2：Ebrean Registered Patent the 1213735th (2012.12.12, Co., Ltd. Dong Jin Shi-Mei Ken)
The content of the invention
Problem to be solved
It is an object of the invention to provide one kind, resist peeling effect is excellent in resist stripping process, can make bag
The anticorrosive additive stripping liquid controlling composition that the corrosion of the metal film quality of cupric and aluminium is minimized.
The method for solving problem
For realizing that the anticorrosive additive stripping liquid controlling composition according to the present invention of above-mentioned purpose is characterised by having comprising polarity
The imidazolidine based compound of machine solvent and following chemical formula 1.
[chemical formula 1]
(in above-mentioned chemical formula 1,
R1And R2It is each independently the alkylidene of carbon number 1~3.)
Invention effect
According to the anticorrosive additive stripping liquid controlling composition of the present invention by the imidazolidine based compound comprising specified chemical formula, so that
With the resist for being attached to substrate is easily peeled off in resist stripping process, the metal for including copper and aluminium can be made
The effect that the corrosion of film quality is minimized.
Embodiment
In the present invention, when certain part "comprising" inscape, as long as no especially opposite record, then this means
Comprising other inscapes rather than other inscapes further can be excluded.
Hereinafter, the present invention is described in detail preferred embodiment.
Imidazolidine based compound
Anticorrosive additive stripping liquid controlling composition in the present invention includes the imidazolidine based compound of following chemical formula 1：
[chemical formula 1]
(in above-mentioned chemical formula 1,
R1And R2It is each independently the alkylidene of carbon number 1~3.)
The imidazolidine based compound of above-mentioned chemical formula 1 is played in dry type or Wet-type etching, ashing (ashing) or ion note
Enter and rotten or crosslinking resist is strongly impregnated under the various process conditions such as process (ion implant processing)
Macromolecule matrix and destroy the effect for being present in intramolecular or intermolecular combination, by the resist of substrate is residued in
Fragile part forms space in structure, resist is become the state of unbodied high-molecular gel (gel) block, so that attached
The resist in substrate top can easily to remove.Thus, i.e., it is rotten or crosslinking anti-using can also rapidly remove on a small quantity
Lose agent.
In addition, the imidazolidine based compound of above-mentioned chemical formula 1 can make for the corrosion comprising copper and the metal film quality of aluminium
Property minimize.
As the preference of the imidazolidine based compound of above-mentioned chemical formula 1, imidazolidine ethoxy ethanol, imidazoles can be enumerated
Alkane methoxyl group methanol, imidazolidine propoxy propanol, imidazolidine methyl cellosolve, but it is not limited to this.
On the imidazolidine based compound of above-mentioned chemical formula 1, in the range of it can play its all effect, its content does not have
It is particularly limited to, for example, 100 weight % total relative to anticorrosive additive stripping liquid controlling composition, can include 0.1~30 weight %, tool
Body can include 0.2~25 weight %, can more specifically include 0.3~20 weight %.In the imidazoles methane series of above-mentioned chemical formula 1
In the case that the content of compound is less than above range, the content of above-mentioned imidazolidine based compound is insufficient and ascending effect in peeling force
Little, in the case larger than the above-mentioned range, peeling force that content increase is brought, which rises, to have little effect and uneconomical, and due to
The content of other compositions is possible to composition with respect to reduction and the dissolving power of resist is declined.
Polar organic solvent
Anticorrosive additive stripping liquid controlling composition in the present invention includes polar organic solvent.
Polar organic solvent can dissolve the resist macromolecule of gelation, in deionization after resist stripping process
In water matting, stripper can be made easily to remove, and make adsorbing and adhering to again most again for stripper and the resist of dissolving
Smallization.
As above-mentioned polar organic solvent, proton polar solvent and aprotic polar solvent can be enumerated, they can be single
Solely use or be use mixing two or more.
As the preference of above-mentioned proton polar solvent, glycol monoethyl ether, ethylene glycol monoethyl ether, ethylene glycol can be enumerated
Single isopropyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol list isopropyl ether, diethylene glycol
Monobutyl ether, triethylene glycol monomethyl ether, Triethylene glycol ethyl ether, triethylene glycol list isopropyl ether, triethylene glycol butyl ether, poly- second two
Alcohol, polypropylene glycol, poly glycol monomethyl ether, polyethylene glycol monobutyl ether, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, 3 the third two
The alkylene glycol monoalkyl ethers such as alcohol monomethyl ether, propylene glycol methyl ether acetate and tetrahydrofurfuryl alcohol etc., they can be used alone
Or be use mixing two or more.
The boiling point of above-mentioned polar organic solvent is not particularly limited, but in order to obtain appropriate peeling force, preferably uses boiling
Point is 150~300 DEG C of polar organic solvent, can further adjust boiling point according to the performance of supplementary demand in stripping process.
On above-mentioned polar organic solvent, in the range of it can play its all effect, its content is not particularly limited,
For example, 100 weight % total relative to anticorrosive additive stripping liquid controlling composition, can include 70~99.9 weight %, can specifically include
80~99.9 weight %, can more specifically include 90~99.9 weight %.If content is less than 70 weight %, it is likely that confrontation
The dissolving power for losing agent declines, when more than 99.9 weight %, and the content of the imidazolidine based compound of above-mentioned chemical formula 1 is reduced and had
The peeling force of resist may be declined.
As the preference of above-mentioned aprotic polar solvent, 1-METHYLPYRROLIDONE (NMP), N- N-ethyl pyrrole Ns can be enumerated
The pyrrolidone-2 compounds such as alkanone；The imidazoline assimilations such as 1,3- dimethyl-2-imidazolinones, 1,3- dipropyl -2- imidazolones
Compound；The lactone compounds such as gamma-butyrolacton；The sulfoxide compounds such as dimethyl sulfoxide (DMSO), sulfolane；Triethyl phosphate, phosphoric acid
The phosphate compounds such as tributyl；The carbonate products such as dimethyl carbonate, ethylene carbonate；Formamide, N-METHYLFORMAMIDE,
N- ethyl-formamides, N,N-dimethylformamide, N, N- diethylformamides, acetamide, N- methylacetamides, N, N- dimethyl
Acetamide, N- (2- ethoxys) acetamide, N, N- dimethylpropionamides, 3- methoxyl groups-N, N- dimethylpropionamide, 3- (2- second
Base hexyl epoxide)-N, the amide compound such as N- dimethylpropionamides, 3- butoxy-N, N- dimethylpropionamide, they can be single
Solely use or be use mixing two or more.
Alkali compounds
Anticorrosive additive stripping liquid controlling composition in the present invention can further include alkali compounds.
Alkali compounds plays strength and is impregnated into the macromolecule matrix of rotten or crosslinking resist and destroys and be present in point
The effect of sub interior or intermolecular combination, and sky is formed by fragile part in the structure in residuing in the resist of substrate
Between, resist is become the state of unbodied Macromolecule blob of viscose, so that being attached to the resist on substrate top can hold
Easily remove.Thus, if be used together with the imidazolidine based compound of chemical formula 1, can further it improve to resist
Peeling force.
As long as there is alkali compounds excellent peeling force to be just not particularly limited to resist, can for example enumerate KOH,
NaOH, TMAH (TMAH), tetraethyl ammonium hydroxide (TEAH), ammonia, carbonate compound, phosphate compounds,
Amines etc., preferably can be amines.They can be used alone or are use mixing two or more.
As the concrete example of above-mentioned carbonate compound, can enumerate sodium carbonate, sodium acid carbonate, potassium carbonate, saleratus,
Lithium carbonate, calcium carbonate, magnesium carbonate, sodium acid carbonate, calcium bicarbonate etc..
As the concrete example of above-mentioned phosphate compounds, ammonium phosphate ((NH can be enumerated4)3PO4), diammonium hydrogen phosphate
((NH4)2HPO4), ammonium dihydrogen phosphate (NH4H2PO4), potassium phosphate (K3PO4), dipotassium hydrogen phosphate (K2HPO4), potassium dihydrogen phosphate
(KH2PO4), sodium phosphate (Na3PO4), disodium hydrogen phosphate (Na2HPO4), sodium dihydrogen phosphate (NaH2PO4) etc..
As the concrete example of amines, can enumerate methylamine, ethamine, Mono Isopropylamine, n-butylamine, sec-butylamine, isobutyl amine,
The primary amine such as tert-butylamine, amylamine；Dimethylamine, diethylamine, di-n-propylamine, diisopropylamine, dibutyl amine, di-iso-butylmanice, methyl ethyl-amine, methyl
The secondary amine such as propylamine, methyl isopropylamine, methylbutylamine, methyl tert-butyl amine；Diethyl hydroxylamine, trimethylamine, triethylamine, tripropyl amine (TPA), three
The tertiary amines such as butylamine, triamylamine, dimethyl amine, methyl-diethyl-amine and methyl-di-n-propylamine；Choline, monoethanolamine, diethanol amine, three
Monoethanolamine, monopropylene glycol amine, 2- ethylaminoethanols, 2- (ethylamino) ethanol, 2- (methylamino) ethanol, N methyldiethanol amine,
N, N- dimethylethanolamine, N, N- DEAE diethylaminoethanols, 2- (2- aminoethylaminos) -1- ethanol, 1- amino -2- propyl alcohol,
2- amino -1- propyl alcohol, 3- amino -1- propyl alcohol, 4- amino-n-butyl alcohol, two butanolamines etc. preferably have the hydroxyl of carbon number 1~6
The alkanolamine of alkyl；(butoxymethyl) diethylamine, (methoxy) diethylamine, (methoxy) dimethylamine, (butoxy
Methyl) dimethylamine, (isobutoxymethyl) dimethylamine, (methoxy) diethanol amine, (hydroxyethyl oxygen methyl) diethylamine,
Methyl (methoxy) aminoethane, methyl (methoxy) ethylaminoethanol, methyl (butoxymethyl) ethylaminoethanol, 2-
The alkoxyamine of the preferably alkoxy with carbon number 1~6 such as (2- amino ethoxies) ethanol；Diethyl hydroxylamine, dipropyl
The azanols such as azanol, N- ethyl-N-methyl azanols；1- (2- ethoxys) piperazine, 1- (2- amino-ethyls) piperazine, 1- (2- ethoxys)
Methyl piperazine, N- (3- aminopropyls) morpholine, 2- methyl piperazines, 1- methyl piperazines, 1- amino -4- methyl piperazines, 1- benzyl piperazines
Piperazine, 1-php, N-methylmorpholine, 4- ethyl morpholines, N- N-formyl morpholine Ns, N- (2- ethoxys) morpholine, N- (3- hydroxypropyls)
The preferably cyclic amine of ring with carbon number 3~6 etc. such as morpholine.
On alkali compounds, in the range of it can play its effect, its content is not particularly limited, for example, relatively
In the total 100 weight % of anticorrosive additive stripping liquid controlling composition, 0.1~20 weight % can be included, 0.3~18 weight can be specifically included
% is measured, 0.5~15 weight % can be more specifically included.If the content of alkali compounds is less than 0.1 weight %, it is likely that anti-
Agent peeling force improvement is lost little, if it exceeds 20 weight %, it is likely that trigger for by aluminum or aluminum alloy and copper or copper
The corrosion rate of the metal wiring of alloy formation steeply rises.
Anticorrosive
Anticorrosive additive stripping liquid controlling composition in the present invention can further include anticorrosive.
Above-mentioned anticorrosive is used together by the imidazolidine based compound with above-mentioned chemical formula 1, can further be improved
Corrosion protection power.
The species of above-mentioned anticorrosive is not particularly limited, and can use anticorrosive as known in the art, and they can
To be used alone or be use mixing two or more.
As the concrete example of above-mentioned anticorrosive, the monocarboxylic acids such as formic acid, acetic acid, propionic acid can be enumerated；Oxalic acid, malonic acid,
The dicarboxylic acids such as butanedioic acid, glutaric acid, adipic acid, pimelic acid, maleic acid, fumaric acid, glutaconate；Trimellitic acid, tricarballylic acid
Deng tricarboxylic acids；The organic acids such as hydroxyacetic acid, lactic acid, salicylic acid, malic acid, tartaric acid, citric acid, gluconic acid and hydroxycarboxylic acid
Class；Succinamide ester, malic acid carboxylic acid amide esters, maleic acid ester, amides ester, oxalic acid amide esters, malonic acid acid amides
Ester, glutaramide ester, amide ester, lactamide ester, citric mide ester, tartaric acid carboxylic acid amide esters, gluconic acid carboxylic acid amide esters,
The organic acid amide esters such as benzoic acid amides ester and uric acid carboxylic acid amide esters；BTA, tolyl-triazole, methyl toluene base triazole, 2,
2 '-[[[BTA] methyl] imino group] di-methylcarbinols, 2,2 '-[[[methyl isophthalic acid H- BTA -1- bases] methyl] imino group]
Double methanol, 2,2 '-[[[ethyl -1H- BTA -1- bases] methyl] imino group] di-methylcarbinols, 2,2 '-[[[methyl isophthalic acid H- benzos
Triazol-1-yl] methyl] imino group] di-methylcarbinol, 2,2 '-[[[methyl isophthalic acid H- BTA -1- bases] methyl] imino group] double carboxylics
Acid, 2,2 '-[[[methyl isophthalic acid H- BTA -1- bases] methyl] imino group] double methylamines, 2,2 '-[[[amine -1H- BTAs -1-
Base] methyl] imino group] di-methylcarbinol, 4- methyl isophthalic acid H- BTAs, 6- methyl -4,5,6,7- tetrahydrochysene -1H- benzos [1,2,3] three
Azoles, 4- methyl -4,5,6,7- tetrahydrochysene -1H- benzos [1,2,3] triazole, 5- methyl -4,5,6,7- tetrahydrochysene -1H- benzos [1,2,3]
Triazole, 5,6- dimethyl -4,5,6,7- tetrahydrochysene -1H- benzos [1,2,3] triazole, 4,6- dimethyl -4,5,6,7- tetrahydrochysene -1H- benzene
And the azole compounds such as [1,2,3] triazole and 5- methyl isophthalic acid H- BTAs；2,6- xylenols, 2,4,6- trimethylbenzenes
Phenol, 2,6- diethyl phenols, 2,6- diethyl -4- methylphenols, 2,6- dipropyl phenol, 2,6- dipropyl -4- methylphenols,
The symmetric form phenol systems such as 2,6 di t butyl phenol, 2,4,6- tri-butyl-phenols and 2,6 di tert butyl 4 methyl phenol
Compound；Deng.
The content of above-mentioned anticorrosive is not particularly limited, for example, 100 weight total relative to anticorrosive additive stripping liquid controlling composition
Measure %, 0.001~5 weight % can be included, can specifically include 0.005~4.5 weight %, more specifically can comprising 0.01~
4 weight %.If the content of above-mentioned anticorrosive is less than 0.001 weight %, it is likely that corrosion protection power improvement is little, if
More than 5 weight %, then it can not obtain content and increase brought corrosion protection power improving effect and uneconomical, and due to other compositions
Content resist peeling force and dissolving power be possible to respect to reduction decline.
Hereinafter, in order to help to understand the present invention, preferred embodiment is disclosed, but these embodiments only illustrate this hair
It is bright, scope of the appended claims is not intended to limit, in the range of scope of the invention and technological thought, embodiment can be carried out
Various changes and amendment, this is it will become apparent to those skilled in the art that certainly such deformation and amendment also belong to
In scope of the appended claims.In addition, as long as no particularly pointing out, then representing content in following embodiment and comparative example
" % " and " part " is weight basis.
Embodiment and comparative example
Manufacture with the composition and the anticorrosive additive stripping liquid controlling composition of content described in table 1 below.
[table 1]
The resist peeling force of experimental example 1. is evaluated
On the glass substrate with 1.7 μm of painting photoresists (DWG-520, east friend's fine chemistry industry), then in 170 DEG C of realities
Apply hard baking (hard bake) 10 minutes.
In the anticorrosive additive stripping liquid controlling composition that aforesaid substrate was impregnated in 50 DEG C of embodiment and comparative example with 30 seconds intervals,
And have rated peeling force.In order to remove the stripper of residual, implement to wash for 1 minute with pure water, and base is remained in order to remove
Pure water on plate, substrate is completely dried using nitrogen.
With the naked eye confirm aforesaid substrate, determine the time that resist is completely removed, the results are shown in table 2 below.
It is believed that splitting time is shorter, peeling effect is more excellent.
The metal wiring corrosion protection power of experimental example 2. is evaluated
Using thin film sputtering method, Mo/Al, Cu/Ti layers are formed on the glass substrate, then form photoresist (DWG-
520, east friend's fine chemistry industry) pattern, metal film is etched respectively using Wet-type etching and dry-etching mode, so as to prepare
Substrate.
In the anticorrosive additive stripping liquid controlling composition of 50 DEG C of embodiments and comparative example, taken after aforesaid substrate is impregnated 30 minutes
Go out, with pure water 1 minute, and in order to remove the pure water remained on substrate, substrate is completely dried using nitrogen.
Corrosion protection power is observed by SEM (SEM, Hitachi S-4700), and is carried out according to following benchmark
Evaluate.It the results are shown in table 2 below.
<Metewand>
◎：Very good (not observing corrosion in the surface and interface of metal wiring)
○：Well (slight erosion is observed at the interface of metal wiring, but is had no problem when being used as distribution)
△：Typically (it observed slight erosion in the surface and interface of metal wiring)
×：Bad (serious corrosion is observed in the surface and interface of metal wiring)
[table 2]
With reference to above-mentioned table 2 it has been confirmed that using the imidazolidine based compound represented by the chemical formula 1 comprising the present invention
In the case of the embodiment 1~6 of anticorrosive additive stripping liquid controlling composition, with having used not comprising the imidazoles represented by above-mentioned chemical formula 1
The situation of the comparative example 1~6 of the anticorrosive additive stripping liquid controlling composition of methane series compound is compared, and peeling rate is significantly excellent.In addition, right
The corrosion protection power of copper and aluminum wiring is also very excellent.
Specifically, confirm using the against corrosion of the imidazolidine based compound represented by the chemical formula 1 comprising the present invention
In the case of agent remover composition (embodiment 1~6), the anticorrosive additive stripping liquid controlling of imidazolidine based compound is not included with having used
The situation of composition (comparative example 1~4) is compared, and peeling rate and corrosion protection power are excellent, and confirm not comprising imidazoles methane series
In the case of compound, even the anticorrosive additive stripping liquid controlling (comparative example 2~4) comprising alkali compounds such as amines, peeling rate
Also decline with corrosion protection power.
In addition confirm, in the anticorrosive additive stripping liquid controlling of the imidazolidine based compound represented by the chemical formula 1 using the present invention
In the case of composition (embodiment 1~6), from using comprising with the structure different with the structure of the chemical formula 1 of the present invention
The situation of the anticorrosive additive stripping liquid controlling composition (comparative example 5 and comparative example 6) of imidazolidine based compound is compared, peeling rate or corrosion protection
Power is excellent.
Claims (6)
1. a kind of anticorrosive additive stripping liquid controlling composition, it is characterised in that the imidazolidine comprising polar organic solvent and following chemical formula 1
Based compound：
Chemical formula 1
In the chemical formula 1,
R1And R2It is each independently the alkylidene of carbon number 1~3.
2. anticorrosive additive stripping liquid controlling composition according to claim 1, it is characterised in that the imidazolidine based compound is relative
0.1~30 weight % is included in the total 100 weight % of anticorrosive additive stripping liquid controlling composition.
3. anticorrosive additive stripping liquid controlling composition according to claim 1, it is characterised in that the polar organic solvent relative to
The total 100 weight % of anticorrosive additive stripping liquid controlling composition includes 70~99.9 weight %.
4. anticorrosive additive stripping liquid controlling composition according to claim 1, it is characterised in that the anticorrosive additive stripping liquid controlling composition
Further include selected from one or more of the group being made up of alkali compounds and anticorrosive additive.
5. anticorrosive additive stripping liquid controlling composition according to claim 4, it is characterised in that the alkali compounds is relative to anti-
Lose the total 100 weight % of agent remover composition and include 0.1~20 weight %.
6. anticorrosive additive stripping liquid controlling composition according to claim 4, it is characterised in that the anticorrosive is relative to against corrosion
The total 100 weight % of agent remover composition includes 0.001~5 weight %.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2016-0021669 | 2016-02-24 | ||
| KR1020160021669A KR20170099525A (en) | 2016-02-24 | 2016-02-24 | Resist stripper composition |
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| Publication Number | Publication Date |
|---|---|
| CN107121899A true CN107121899A (en) | 2017-09-01 |
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ID=59717161
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115066104A (en) * | 2022-07-09 | 2022-09-16 | 南通群安电子材料有限公司 | Stripping liquid for thick photoresist |
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| US20130034812A1 (en) * | 2010-01-27 | 2013-02-07 | Fujifilm Corporation | Polymerizable composition for solder resist, and solder resist pattern formation method |
| CN103383530A (en) * | 2012-07-18 | 2013-11-06 | 张峰 | Positive photoresist-cleaning agent composition |
| CN103804980A (en) * | 2012-11-07 | 2014-05-21 | 东友精细化工有限公司 | Cleaning solution composition for offset-printing gravure and cleaning method using the same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115066104A (en) * | 2022-07-09 | 2022-09-16 | 南通群安电子材料有限公司 | Stripping liquid for thick photoresist |
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| KR20170099525A (en) | 2017-09-01 |
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