CN107121850B - Laser package method and laser package equipment - Google Patents
Laser package method and laser package equipment Download PDFInfo
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- CN107121850B CN107121850B CN201710389525.2A CN201710389525A CN107121850B CN 107121850 B CN107121850 B CN 107121850B CN 201710389525 A CN201710389525 A CN 201710389525A CN 107121850 B CN107121850 B CN 107121850B
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- Prior art keywords
- center line
- sealant
- process route
- laser
- encapsulation
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1341—Filling or closing of cells
Abstract
The invention discloses a kind of laser package method and laser package equipment.Laser package method, comprising: determine sealant along the position of the center line in encapsulation direction and as process route by center line determination unit；Emit laser by laser emission element and laser irradiation is made to form hot spot to packaging area；The center of control hot spot is moved along process route, so that sealant encapsulation is between the two glass, is eliminated the manual debugging process of the process route of hot spot and the printing route of sealant, is better assured the packaging efficiency of device to be packaged.
Description
Technical field
Present document relates to but be not limited to LCD technology, espespecially a kind of laser package method and a kind of laser package equipment.
Background technique
At present in the packaged type of liquid crystal display device (that is: device to be packaged), laser package is by laser beam to two
Envelope between glass substrate (sealant is arranged on a glass substrate, and another glass substrate and sealant are packaged by laser)
Frame glue carries out high temperature melt, to complete to encapsulate, which requires the process route of laser facula and the printing route of sealant
Unanimously (that is: laser facula is radiated at the frame of sealant and moves realization encapsulation in upper and along frame while in technical process), to guarantee
Irradiated area ratio > 90%, irradiated area ratio=(spot width/sealant frame hem width degree) * 100%.
In the prior art, device to be packaged needs manually to survey light spot process route when carrying out laser package technique
Amount and debugging, it is necessary first to which the relevant parameter that sealant is measured from device drawing to be packaged is entered into equipment computer
In to determine the process route (hot spot mobile route) of hot spot, then by actual test check hot spot process route whether with
The printing route of sealant is consistent (position on frame side is usually that there are manufacturing deviations relative to design position), if inconsistent
It needs the process route for repeatedly debugging laser facula manually to reach the printing route of itself and sealant unanimously, finally guarantees technique
Quality requirements, 1~3H of this process time-consuming.
On the other hand during the process route of laser facula is after debugging and is applied to mass production, due to envelope
Frame glue (each frame side position cannot ensure absolutely unified) in printing process has certain offset, needs people in the prior art
Work in real time checks the process route of laser facula by Supervision visual organ, if discovery have the process route of laser facula with
The inconsistent situation of printing route of sealant then need to carry out manually correct debugging, the process 1~2H of time-consuming, this period equipment
The product that upstream process completion can not be corresponded to, will cause the accumulation of semi-finished product, influences production capacity.
Summary of the invention
In order to solve the above-mentioned technical problem, disclosed herein is a kind of laser package method, the process route of hot spot is eliminated
With the manual debugging process of the printing route of sealant, the packaging efficiency of device to be packaged can be better assured.
In order to reach this paper purpose, the present invention provides a kind of laser package methods, comprising:
Determine sealant along the position of the center line in encapsulation direction and as process route by center line determination unit；
Emit laser by laser emission element and the laser irradiation is made to form hot spot to packaging area；
The center for controlling the hot spot is moved along the process route so that sealant be encapsulated in two glass substrates it
Between.
Optionally, position and the conduct that center line of the sealant along encapsulation direction is determined by center line determination unit
The step of process route includes: the light that sealant reflection is incuded by Photoinduction device, determines sealant by the light
Edge encapsulates the position of the center line in direction and as process route.
Optionally, described to determine sealant along the position for the center line for encapsulating direction and as technique road by the light
The step of line includes: the boundary coordinate that sealant is determined by the light, then by computing device according to the boundary coordinate
Determine sealant along the position of the center line in encapsulation direction and as process route.
Optionally, position and the conduct that center line of the sealant along encapsulation direction is determined by center line determination unit
The step of process route includes: to identify positioning grain of the sealant on the center line in encapsulation direction by position particles recognition unit
Son determines sealant along the position of the center line in encapsulation direction and as process route by the position particles.
Optionally, the position particles add the center line in sealant along encapsulation direction after sealant is completed for printing
On.
Optionally, it is described fixed to be provided at least two along any side of the center line in encapsulation direction at intervals for sealant
Position particle.Center line of the sealant along encapsulation direction surrounds rectangular frame structure.
Optionally, when being packaged to sealant or sealant encapsulation complete after, by apparatus for correcting detect into
Offset of the center line in the sealant edge encapsulation direction of row encapsulation relative to the process route, and be greater than in the offset and set
The process route is corrected according to the offset when definite value.
Optionally, position and the conduct that center line of the sealant along encapsulation direction is determined by center line determination unit
The step of process route includes: manufacturing deviation and control of the center line determination unit by sealant along the center line in encapsulation direction
Sealant in unit processed is integrated along the design position of the center line in encapsulation direction, determines the sealant along encapsulation side with this
To center line position (physical location) and as process line.
Optionally, the sealant is examined along the manufacturing deviation of the center line in encapsulation direction by sealant detection device
It surveys.
The present invention also provides a kind of laser package equipment, comprising: plummer, for carrying device to be packaged；Laser hair
Unit is penetrated, for emitting laser and laser irradiation being made to form hot spot on the packaging area of device to be packaged；Center line determines single
Member, for determining sealant along the position of center line in encapsulation direction；And control unit, with the laser emission element and it is described in
The electrical connection of heart line determination unit.
Optionally, the laser package equipment further include: computing device is electrically connected with the control unit, for calculating
The boundary parameter of sealant, the center line determination unit are Photoinduction device.
Optionally, the center line determination unit is position particles recognition unit.
Optionally, the laser package equipment further include: apparatus for correcting is electrically connected with the control unit, for detecting
Offset of the center line in current sealant edge encapsulation direction relative to process route, and when the offset is greater than the set value
The process route is corrected according to the offset.
Optionally, the laser package equipment further include: sealant detection device is electrically connected with the control unit, and is used
In the manufacturing deviation for the center line for detecting the sealant edge encapsulation direction.
Compared with prior art, laser package method provided by the invention automatically determines envelope by center line determination unit
The position of the center line in frame glue edge encapsulation direction simultaneously makes its process route as hot spot, the laser of laser transmitter projects
Spot center is moved along the process route automatically, is irradiated come the frame side to sealant, so that sealant is encapsulated in two glass
Between substrate, the manual debugging process of the process route of hot spot and the printing route of sealant is eliminated, is better assured wait seal
Fill the packaging efficiency of device.
The other feature and advantage of this paper will illustrate in the following description, also, partly become from specification
It is clear that by implementing to understand herein.The purpose of this paper and other advantages can be by specifications, claims
And specifically noted structure is achieved and obtained in attached drawing.
Detailed description of the invention
Attached drawing is used to provide to further understand this paper technical solution, and constitutes part of specification, with this Shen
Embodiment please is used to explain the technical solution of this paper together, does not constitute the limitation to this paper technical solution.
Fig. 1 is the structural schematic diagram of laser package equipment described in one embodiment of the invention.
Wherein, the corresponding relationship in Fig. 1 between appended drawing reference and component names are as follows:
1 plummer, 2 devices to be packaged, 21 glass substrates, 22 sealants, the center line in 23 sealing frames edge encapsulation directions, 3
Laser emission element.
Specific embodiment
For the purposes, technical schemes and advantages of this paper are more clearly understood, below in conjunction with attached drawing to the reality of this paper
Example is applied to be described in detail.It should be noted that in the absence of conflict, the spy in embodiment and embodiment in the application
Sign can mutual any combination.
Many details are explained in the following description in order to fully understand herein, still, can also be adopted herein
Implemented with other than the one described here mode, therefore, the protection scope of this paper is not by following public specific implementation
The limitation of example.
The laser package method and laser package equipment of some embodiments herein are described with reference to the accompanying drawing.
Laser package method provided by the invention, comprising:
Determine sealant along the position of the center line in encapsulation direction and as process route by center line determination unit；
Emit laser by laser emission element and the laser irradiation is made to form hot spot to packaging area；
The center for controlling the hot spot is moved along the process route so that sealant be encapsulated in two glass substrates it
Between.
Laser package method provided by the invention automatically determines sealant along encapsulation direction by center line determination unit
The position of center line simultaneously makes its process route as hot spot, and edge should automatically for the spot center of the laser of laser transmitter projects
Process route is mobile, is irradiated come the frame side to sealant, so that sealant encapsulation is between the two glass, eliminates light
The manual debugging process of the printing route of the process route and sealant of spot, better assures the packaging efficiency of device to be packaged.
It is described to determine sealant along encapsulation direction by center line determination unit in first specific embodiment of the invention
Center line position and as the step of process route include: by Photoinduction device incude sealant reflection light, lead to
Crossing the light determines sealant along the position of the center line in encapsulation direction and as process route.
Further, described to determine sealant along the position for the center line for encapsulating direction and as technique by the light
The step of route includes: the boundary coordinate that sealant is determined by the light, then is sat by computing device according to the boundary
It marks and determines sealant along the position of the center line in encapsulation direction and as process route.
Wherein, light is irradiated on the glass substrate on upper layer, the light of sealant reflection and the light of glass substrate reflection
Luminous intensity it is different, the luminous intensity of the light reflected by Photoinduction device automatic sensing sealant determines the boundary of sealant
Coordinate (such as: four boundary coordinates of corresponding detection on every frame side, frame side have setting width), then by computing device according to side
Boundary's coordinate automatically determines sealant along the position of the center line in encapsulation direction, in this, as the process route at the center of hot spot.
Further, it when being packaged to sealant or after sealant encapsulation is completed, is detected by apparatus for correcting
Offset of the center line in the sealant edge encapsulation direction being packaged relative to the process route, and be greater than in the offset
The process route is corrected according to the offset when setting value, to solve different sealants during continuous printing
Position offset problem, encapsulation is better achieved, eliminates the process manually adjusted.
It is described to determine sealant along encapsulation direction by center line determination unit in second specific embodiment of the invention
Center line position and include: to identify sealant along encapsulation side by position particles recognition unit as the step of process route
To center line on position particles, by the position particles determine sealant along encapsulation direction center line position and work
For process route.
Wherein, the position particles add the center line in sealant along encapsulation direction after sealant is completed for printing
On.Moreover, any frame of sealant is provided at least two institutes on the center line of (having setting width when frame) at intervals
Position particles are stated, determine that the center line on any frame side, the center line on four frame sides connect into rectangle frame (that is: sealant with this
Center line along encapsulation direction surrounds rectangular frame structure, as shown in Figure 1.).
Further, it when being packaged to sealant or after sealant encapsulation is completed, is detected by apparatus for correcting
Offset of the center line in the sealant edge encapsulation direction being packaged relative to the process route, and be greater than in the offset
The process route is corrected according to the offset when setting value, to solve different sealants during continuous printing
Position offset problem, encapsulation is better achieved, eliminates the process manually adjusted.
It is described to determine sealant along encapsulation direction by center line determination unit in third specific embodiment of the invention
Center line position and include: the center line determination unit by sealant along encapsulation direction as the step of process route
Sealant in the manufacturing deviation and control unit of center line is integrated along the design position of the center line in encapsulation direction, with this
To determine sealant along the physical location of the center line in encapsulation direction and as process line.
Wherein, the design drawing of device to be packaged is input in control unit in advance, sealant is come along encapsulation side with this
To center line design position.The sealant passes through sealant detection device along the manufacturing deviation of the center line in encapsulation direction
It is detected.
Sealant detection device can detect the offset of the width of sealant, height and center line.
Laser package equipment provided by the invention, as shown in Figure 1, comprising: plummer 1, for carrying device 2 to be packaged；
Laser emission element 3, positioned at the top of the plummer 1, for emitting laser and making laser irradiation in device 2 to be packaged
Hot spot is formed on packaging area (that is: the process route of sealant)；Center line determination unit, for determining sealant along encapsulation side
To position of center line；And control unit, it is electrically connected with the laser emission element 3 and the center line determination unit.Label
21 be glass substrate, and label 22 is sealant.
In first specific embodiment of the invention, the laser package equipment further include: computing device, with the control
Unit electrical connection, for calculating the boundary parameter of sealant, the center line determination unit is Photoinduction device, using first
The laser package method of specific embodiment encapsulates sealant.
Further, the laser package equipment further include: apparatus for correcting is electrically connected with the control unit, for examining
Current sealant is surveyed along the center line in encapsulation direction relative to process route (having determined in encapsulation process before)
Offset, and the process route is corrected according to the offset when the offset is greater than the set value, it is different to solve
Position offset problem of sealant during continuous printing, is better achieved encapsulation, eliminates the process manually adjusted.
In second specific embodiment of the invention, the center line determination unit is position particles recognition unit, is used
The laser package method of second specific embodiment encapsulates sealant.
Further, the laser package equipment further include: apparatus for correcting is electrically connected with the control unit, for examining
Offset of the center line in current sealant edge encapsulation direction relative to process route is surveyed, and is greater than the set value in the offset
When the process route is corrected according to the offset, it is inclined to solve position of different sealants during continuous printing
Encapsulation is better achieved in shifting problem, eliminates the process manually adjusted, can promote packaging efficiency, semi-finished product is avoided to accumulate.
In third specific embodiment of the invention, the laser package equipment further include: sealant detection device, with institute
Control unit electrical connection is stated, for detecting the sealant along the manufacturing deviation of the center line in encapsulation direction, is had using third
The laser package method of body embodiment encapsulates sealant.
In conclusion laser package method provided by the invention, automatically determines sealant edge by center line determination unit
It encapsulates the position of the center line in direction and makes its process route as hot spot, in the hot spot of the laser of laser transmitter projects
The heart is moved along the process route automatically, is irradiated come the frame side to sealant so that sealant be encapsulated in two glass substrates it
Between, the manual debugging process of the process route of hot spot and the printing route of sealant is eliminated, better assures device to be packaged
Packaging efficiency.
In description herein, term " installation ", " connected ", " connection ", " fixation " etc. be shall be understood in a broad sense, for example,
" connection " may be fixed connection or may be dismantle connection, or integral connection；It can be directly connected, can also lead to
Intermediary is crossed to be indirectly connected.For the ordinary skill in the art, above-mentioned term can be understood as the case may be
Concrete meaning herein.
In the description of this specification, the description of term " one embodiment ", " some embodiments ", " specific embodiment " etc.
Mean that particular features, structures, materials, or characteristics described in conjunction with this embodiment or example are contained at least one implementation of this paper
In example or example.In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or example.
Moreover, the particular features, structures, materials, or characteristics of description can be in any one or more of the embodiments or examples with suitable
Mode combine.
Although embodiment disclosed herein is as above, the content only implementation of use herein for ease of understanding
Mode is not limited to herein.Technical staff in any this paper fields, do not depart from spirit disclosed herein and
Under the premise of range, any modification and variation, but the patent protection model of this paper can be carried out in the form and details of implementation
It encloses, still should be subject to the scope of the claims as defined in the appended claims.
Claims (8)
1. a kind of laser package method characterized by comprising
Determine sealant along the position of the center line in encapsulation direction and as process route by center line determination unit；
Emit laser by laser emission element and the laser irradiation is made to form hot spot to packaging area；
The center for controlling the hot spot is moved along the process route, so that sealant encapsulation is between the two glass；
When being packaged to sealant or after sealant encapsulation is completed, the envelope frame being packaged is detected by apparatus for correcting
Offset of the center line in glue edge encapsulation direction relative to the process route, and when the offset is greater than the set value according to this
Offset is corrected the process route.
2. laser package method according to claim 1, which is characterized in that described determined by center line determination unit is sealed
Frame glue edge encapsulated the position of the center line in direction and as the step of process route
The light that sealant reflection is incuded by Photoinduction device determines sealant along the center in encapsulation direction by the light
The position of line and as process route.
3. laser package method according to claim 2, which is characterized in that described to determine sealant edge by the light
It encapsulates the position of the center line in direction and includes: as the step of process route
The boundary coordinate of sealant is determined by the light, then sealant is determined according to the boundary coordinate by computing device
Edge encapsulates the position of the center line in direction and as process route.
4. laser package method according to claim 1, which is characterized in that described determined by center line determination unit is sealed
Frame glue edge encapsulated the position of the center line in direction and as the step of process route
Position particles of the sealant on the center line in encapsulation direction are identified by position particles recognition unit, pass through the positioning
Particle determines sealant along the position of the center line in encapsulation direction and as process route.
5. laser package method according to claim 1, which is characterized in that described determined by center line determination unit is sealed
Frame glue edge encapsulated the position of the center line in direction and as the step of process route
Envelope frame of the center line determination unit by sealant in the manufacturing deviation and control unit of the center line in encapsulation direction
Glue is integrated along the design position of the center line in encapsulation direction, and the position of the center line in sealant edge encapsulation direction is determined with this
It sets and as process line.
6. a kind of laser package equipment characterized by comprising
Plummer, for carrying device to be packaged；
Laser emission element, for emitting laser and laser irradiation being made to form hot spot on the packaging area of device to be packaged；
Center line determination unit, for determining sealant along the position of center line in encapsulation direction；
Control unit is electrically connected with the laser emission element and the center line determination unit；With
Apparatus for correcting is electrically connected with the control unit, opposite for detecting center line of the current sealant along encapsulation direction
The process route is corrected according to the offset in the offset of process route, and when the offset is greater than the set value.
7. laser package equipment according to claim 6, which is characterized in that
The laser package equipment further include: computing device is electrically connected with the control unit, for calculating the boundary of sealant
Parameter, the center line determination unit are Photoinduction device；Or
The center line determination unit is position particles recognition unit.
8. laser package equipment according to claim 6, which is characterized in that further include:
Sealant detection device, is electrically connected with the control unit, for detecting the sealant along the center line of frame edge direction
Manufacturing deviation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710389525.2A CN107121850B (en) | 2017-05-27 | 2017-05-27 | Laser package method and laser package equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710389525.2A CN107121850B (en) | 2017-05-27 | 2017-05-27 | Laser package method and laser package equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107121850A CN107121850A (en) | 2017-09-01 |
| CN107121850B true CN107121850B (en) | 2019-10-18 |
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ID=59730254
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| CN201710389525.2A Active CN107121850B (en) | 2017-05-27 | 2017-05-27 | Laser package method and laser package equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1917160A (en) * | 2005-08-19 | 2007-02-21 | 力晶半导体股份有限公司 | Method and system for detecting bugs on wafer |
| CN101826601B (en) * | 2010-04-13 | 2012-12-12 | 友达光电股份有限公司 | Encapsulation of organic electroluminescent elements and manufacturing method thereof |
| CN103412445B (en) * | 2013-07-24 | 2015-09-30 | 京东方科技集团股份有限公司 | A kind of sealed plastic box solidification equipment |
| CN103490021B (en) * | 2013-09-30 | 2015-12-02 | 上海大学 | Packaging system |
| CN103531726B (en) * | 2013-10-25 | 2016-02-03 | 上海大学 | laser bonding method |
| US20150219442A1 (en) * | 2014-02-06 | 2015-08-06 | Ford Motor Company | Laser inspection station |
| CN205508888U (en) * | 2016-03-17 | 2016-08-24 | 京东方科技集团股份有限公司 | Encapsulation equipment, display panel and display device |
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