CN107119298A - Pcb surface processing method - Google Patents
Pcb surface processing method Download PDFInfo
- Publication number
- CN107119298A CN107119298A CN201610104383.6A CN201610104383A CN107119298A CN 107119298 A CN107119298 A CN 107119298A CN 201610104383 A CN201610104383 A CN 201610104383A CN 107119298 A CN107119298 A CN 107119298A
- Authority
- CN
- China
- Prior art keywords
- pcb
- cobalt
- plating
- processing method
- surface processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The PCB surface processing method of the present invention, including：PCB is soaked with the scheduled time with acid solution；And form cobalt-based metal level on the surface of the PCB.The forming step of the cobalt-based metal level includes：The PCB carries out pre- cobalt plating in preplating cobalt liquor；And the PCB carries out pulse cobalt plating in plating cobalt liquor, average pulse current density is 1~2A/dm2.The present invention can improve the reliability of lead-free solder solder joints of the PCB in welding assembly and reduce production cost.
Description
Technical field
The present invention relates to field of semiconductor fabrication, more particularly to a kind of PCB (Printed Circuit Board,
Printed circuit board (PCB)) surface treatment method.
Background technology
In semiconductor applications, PCB pad, terminal part, the hole of insertion element and printing contact chip
Wait in addition to as welding part, in addition it is also necessary to which connection and connector between element electrically conduct.Therefore
In order to ensure the weldability on PCB between the copper of these parts and lead-free solder solder joint, often PCB's
Surface is handled to ensure connection reliability and the reliability that electrically conducts.Nowadays, PCB surface is improved
The properity of metal level simultaneously reduces production cost, as urgent problem to be solved.
The content of the invention
It is an object of the invention to provide a kind of PCB surface processing method, it can improve PCB in welding group
The reliability of lead-free solder solder joint during dress simultaneously reduces production cost.
To achieve the above object, PCB surface processing method of the invention, including：PCB is soaked with acid solution
With the scheduled time；And form cobalt-based metal level on the surface of the PCB.The formation of the cobalt-based metal level
Step includes：The PCB carries out pre- cobalt plating in preplating cobalt liquor；And the PCB is in plating cobalt liquor
Middle progress pulse cobalt plating, average pulse current density is 1~2A/dm2。
Compared with prior art, PCB surface processing method of the invention forms cobalt-based gold on PCB surface
Belong to layer, the cobalt-based metal level is strong to the wellability of lead-free solder in welding assembly, and with the brazing on substrate
Disk bond strength is high, while having the effect for preferably stopping elements diffusion to lead-free solder, so as to improve PCB
The reliability of upper lead-free solder solder joint.Moreover, the cobalt-based metal level is directly connected to lead-free solder and copper pad,
Change the composition of PCB surface process layer so that diffusion barrier effect increase, be not susceptible to Lead-Free Solder Joint
Fatigue and creep, improve the reliability of long service.In addition, the PCB surface processing side that the present invention is provided
Method need not form extra metal level, so as to reduce process procedure, reduce production cost.
It is preferred that the plating cobalt liquor includes：Sulfamic acid cobalt, sodium chloride, boric acid, brightener.
It is preferred that the preplating time of the pre- cobalt plating is 20~30 minutes.
It is preferred that the pulse cobalt plating is specifically included：The pH value of the control plating cobalt liquor is in 4~5, temperature
For 50~80 DEG C, the cobalt plating time is 40~60 minutes.
It is preferred that the pulse cobalt plating also includes：It is 1.1A/dm to control average pulse current density2, pulse
Power frequency is 700Hz~800Hz, and dutycycle is 90%~95%.
It is preferred that also including before soaking PCB with acid solution：PCB is entered with cleaning fluid and ultrasonic wave
Row cleaning.
It is preferred that also including before being cleaned with cleaning fluid and ultrasonic wave to PCB：To PCB surface
Ion etching is carried out, the depth of etching is 0.2~0.3 μm.
It is preferred that also including after cobalt-based metal level is formed：Anti- tarnishing Passivation Treatment is carried out to the PCB.
Specifically included it is preferred that carrying out Anti- tarnishing Passivation Treatment to the PCB：The PCB is in 1- phenyl -5
It is passivated in mercapto tetrazole, BTA and ethanol solution.
Embodiment
The PCB surface processing method of the present invention is described further with reference to embodiment, but therefore not limited
The system present invention.
In one embodiment of the PCB surface processing method of the present invention, this method includes carrying out PCB
Activation process, then forms cobalt-based metal level on PCB surface, and the metal level directly connects with lead-free solder
Touch, the reliability to lead-free solder solder joints of the PCB in welding assembly is improved effect, and reduction is produced into
This.Specifically, cobalt-based metal level is formed by pre- cobalt plating and pulse cobalt plating handling process.Following embodiments
It will be further described.
In a preferred embodiment, the PCB surface processing method comprises the following steps：
Step one, ion etching.First, ion etching is carried out to the surface of PCB copper pads, makes its surface
It is coarse.Specifically, the depth of etching is 0.2~0.3 μm.
Step 2, ultrasonic wave cleaning.Specifically, the PCB copper pads after over etching are dipped in cleaning fluid,
As carried out ultrasonic wave cleaning in IPA solution.It is preferred that supersonic frequency is 25kHz, ultrasonic power is
250W/cm2, current density range 3-5A/dm2, cleaning temperature is room temperature, and soak time is 10 minutes to be
Preferably.
Step 3, activation process.Specifically, PCB is soaked with the scheduled time with acid solution.For example, should
Acid solution is the sulfuric acid solution that mass fraction is 5%~10%, and soak time is 1~5 minute.At the activation
Manage is that follow-up pre- cobalt plating and cobalt plating processing are prepared.
Step 4, pre- cobalt plating.Specifically, the PCB carries out pre- cobalt plating in preplating cobalt liquor.The pre- cobalt plating
Solution is cobaltous sulfate and sulfuric acid.Cathode-current density is 4A/dm2, anode is the cobalt block that purity is 99.99%.
Agitating mode is continuous filtering, and the preplating time is 20~30 minutes.
Step 5, pulse cobalt plating.Specifically, the plating cobalt liquor that the step is used includes sulfamic acid cobalt, chlorine
Change sodium, boric acid, brightener.Wherein, pulse cobalt plating is specifically included：Control plates the pH value of cobalt liquor 4~5,
Temperature is 50~80 DEG C, and the cobalt plating time is 40~60 minutes.In the present embodiment, negative electrode is adopted in pulse cobalt plating
Average pulse current density is 1~2A/dm2, such as average pulse current density is 1.1A/dm2, arteries and veins
Power frequency is rushed for 700Hz~800Hz, dutycycle is 90%~95%.Anode uses purity for 99.99%
Cobalt block.After pre- cobalt plating and the processing of pulse cobalt plating, PCB surface one layer of cobalt-based metal level of formation, the cobalt-based
Metal level is directly contacted and connected with lead-free solder in PCB welding assemblies.
Step 6, Anti- tarnishing processing.PCB after plating is subjected to Anti- tarnishing processing, Anti- tarnishing treatment fluid bag
The mercapto tetrazole of 1- phenyl -5 and BTA are included, and using ethanol as solvent, at a temperature of 40 DEG C at passivation
Reason, the time is 1 minute or so.By this Passivation Treatment, fine and close protect is formed on the surface of cobalt-based metal level
Cuticula with prevent discoloration.Finally, copper pad is dried to obtain PCB finished products.
In summary, PCB surface processing method of the invention forms cobalt-based metal level on PCB surface,
Wellability of the cobalt-based metal level in welding assembly to lead-free solder is strong, and is combined with the copper pad on substrate
Intensity is high, while having the effect for preferably stopping elements diffusion to lead-free solder, so as to improve nothing on PCB
The reliability of kupper solder solder joint.Moreover, the cobalt-based metal level is directly connected to lead-free solder and copper pad, change
The composition of PCB surface process layer so that diffusion barrier effect increase, makes Lead-Free Solder Joint be not susceptible to fatigue
And creep, improve the reliability of long service.In addition, the PCB surface processing method that the present invention is provided is not
Need to form extra metal level, so as to reduce process procedure, reduce production cost.
Above disclosed is only presently preferred embodiments of the present invention, can not limit the present invention with this certainly
Interest field, therefore equivalent variations made according to scope of the present invention patent still belong to the present invention and are covered
Scope.
Claims (10)
1. a kind of PCB surface processing method, including：
PCB is soaked with the scheduled time with acid solution；And
Cobalt-based metal level is formed on the surface of the PCB；
Characterized in that, the forming step of the cobalt-based metal level includes：
The PCB carries out pre- cobalt plating in preplating cobalt liquor；And
The PCB carries out pulse cobalt plating in plating cobalt liquor, and average pulse current density is 1~2A/dm2。
2. PCB surface processing method as claimed in claim 1, it is characterised in that：The preplating cobalt liquor
Including cobaltous sulfate and sulfuric acid.
3. PCB surface processing method as claimed in claim 1, it is characterised in that：The plating cobalt liquor bag
Include：Sulfamic acid cobalt, sodium chloride, boric acid and brightener.
4. PCB surface processing method as claimed in claim 1, it is characterised in that：The pre- cobalt plating it is pre-
The plating time is 20~30 minutes.
5. PCB surface processing method as claimed in claim 1, it is characterised in that：The pulse cobalt plating tool
Body includes：The pH value of the control plating cobalt liquor is 4~5, and temperature is 50~80 DEG C, and the cobalt plating time is 40~60
Minute.
6. PCB surface processing method as claimed in claim 5, it is characterised in that：The pulse cobalt plating is also
Including：It is 1.1A/dm to control average pulse current density2, pulse current frequency is 700Hz~800Hz, is accounted for
Sky is than being 90%~95%.
7. PCB surface processing method as claimed in claim 1, it is characterised in that：Soaked with acid solution
Also include before PCB：PCB is cleaned with cleaning fluid and ultrasonic wave.
8. PCB surface processing method as claimed in claim 7, it is characterised in that：With cleaning fluid and ultrasound
Ripple also includes before being cleaned to PCB：Ion etching is carried out to PCB surface, the depth of etching is
0.2~0.3 μm.
9. PCB surface processing method as claimed in claim 1, it is characterised in that：Forming cobalt-based metal
Also include after layer：Anti- tarnishing Passivation Treatment is carried out to the PCB.
10. PCB surface processing method as claimed in claim 9, it is characterised in that：The PCB is entered
Row Anti- tarnishing Passivation Treatment is specifically included：The PCB the mercapto tetrazole of 1- phenyl -5, BTA and
It is passivated in ethanol solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610104383.6A CN107119298A (en) | 2016-02-25 | 2016-02-25 | Pcb surface processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610104383.6A CN107119298A (en) | 2016-02-25 | 2016-02-25 | Pcb surface processing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107119298A true CN107119298A (en) | 2017-09-01 |
Family
ID=59717807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610104383.6A Pending CN107119298A (en) | 2016-02-25 | 2016-02-25 | Pcb surface processing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107119298A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110708881A (en) * | 2019-11-13 | 2020-01-17 | 重庆秦嵩科技有限公司 | PCB surface treatment method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101445923A (en) * | 2008-12-30 | 2009-06-03 | 罗冲 | Passivation method for brass antitarnish |
| CN102248241A (en) * | 2011-05-18 | 2011-11-23 | 清华大学 | Method for connecting bump bottom metal layer containing Co-based film with lead-free welding spot |
| CN103384448A (en) * | 2013-06-27 | 2013-11-06 | 清华大学 | Printed circuit board and method for processing surface of printed circuit board |
| CN104342732A (en) * | 2013-07-23 | 2015-02-11 | 深圳中宇昭日科技有限公司 | Cobalt electroplating method for tungsten steel |
| CN104342726A (en) * | 2013-07-23 | 2015-02-11 | 深圳中宇昭日科技有限公司 | Cyanide-free silver plating method |
-
2016
- 2016-02-25 CN CN201610104383.6A patent/CN107119298A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101445923A (en) * | 2008-12-30 | 2009-06-03 | 罗冲 | Passivation method for brass antitarnish |
| CN102248241A (en) * | 2011-05-18 | 2011-11-23 | 清华大学 | Method for connecting bump bottom metal layer containing Co-based film with lead-free welding spot |
| CN103384448A (en) * | 2013-06-27 | 2013-11-06 | 清华大学 | Printed circuit board and method for processing surface of printed circuit board |
| CN104342732A (en) * | 2013-07-23 | 2015-02-11 | 深圳中宇昭日科技有限公司 | Cobalt electroplating method for tungsten steel |
| CN104342726A (en) * | 2013-07-23 | 2015-02-11 | 深圳中宇昭日科技有限公司 | Cyanide-free silver plating method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110708881A (en) * | 2019-11-13 | 2020-01-17 | 重庆秦嵩科技有限公司 | PCB surface treatment method |
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| PB01 | Publication | ||
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| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170901 |