CN107119293A - A kind of method of nickel cobalt (alloy) copper coin coating - Google Patents
A kind of method of nickel cobalt (alloy) copper coin coating Download PDFInfo
- Publication number
- CN107119293A CN107119293A CN201710140637.4A CN201710140637A CN107119293A CN 107119293 A CN107119293 A CN 107119293A CN 201710140637 A CN201710140637 A CN 201710140637A CN 107119293 A CN107119293 A CN 107119293A
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- CN
- China
- Prior art keywords
- cobalt
- nickel
- alloy
- copper coin
- plating
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
- B22D11/04—Continuous casting of metals, i.e. casting in indefinite lengths into open-ended moulds
- B22D11/057—Manufacturing or calibrating the moulds
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Proposed by the present invention is a kind of method of nickel cobalt (alloy) copper coin coating.Anode thick stick and copper coin negative electrode are provided with plating station, is connected respectively with dc source outside plating station by wire, dc source is connected by wire with switch board.Hanging Basket is provided with the anode thick stick, in Hanging Basket built with nickel metallic particles and cobalt metallic particles.The dc source is connected with anode thick stick and copper coin negative electrode respectively, constitutes electrolysis loop.The switch board balances concentration of cobalt ions in plating station by controlling dc source output current come the dissolution velocity of stable metal cobalt.Sulfamic acid cobalt is substituted in copper plate of crystallizer nickel-cobalt alloy plating layer using metallic cobalt, making the production cost of acquisition nickel cobalt (alloy) layer substantially reduces, and improves the utilization rate of metallic cobalt in copper plate of crystallizer electroplating process.Suitably as the method application of copper plate of crystallizer plating nickel-cobalt alloy plating.
Description
Technical field
Proposed by the present invention is metal processing sectors nickel-cobalt alloy plating plating method, is mainly used in conticaster crystallizer
Copper plate electroplating technique, specifically a kind of method of nickel cobalt (alloy) copper coin coating.
Background technology
At present, in the Critical Spare Part copper plate of crystallizer electroplating technology of conticaster, the plating nickel-cobalt alloy plating on copper coin, its
Middle use nickel metal provides nickel ion and sulfamic acid cobalt provides cobalt ions.Due to sulfamic acid cobalt, there are ammonia nitrogen and sulfonic acid
In the presence of so in the case of being cleaned to coating, pollutant can be produced, environment is polluted.There is provided simultaneously with sulfamic acid cobalt
Cobalt ions production cost is higher.
The content of the invention
In order to overcome in the prior art, production cost is higher, alloying element utilization rate is low and easily pollutes lacking for environment
Point, the present invention proposes a kind of method of nickel cobalt (alloy) copper coin coating.This method by using nickel and cobalt as metal electrode, in electricity
Under stream effect, the plating nickel cobalt (alloy) layer on copper coin solves the skill using metallic cobalt plating nickel cobalt (alloy) on copper plate of crystallizer
Art problem.
The present invention solves the scheme that is used of technical problem：
Anode thick stick and copper coin negative electrode are provided with plating station, is connected respectively with dc source outside plating station by wire, directly
Stream power supply is connected by wire with switch board；
Hanging Basket is provided with the anode thick stick, in Hanging Basket built with nickel metallic particles and cobalt metallic particles；
The dc source is connected with anode thick stick and copper coin negative electrode respectively, constitutes electrolysis loop；
The switch board by controlling dc source output current come the dissolution velocity of stable metal cobalt, in balance plating station cobalt from
Sub- concentration.
Good effect, due to the present invention using metallic cobalt replacement sulfamic acid cobalt in copper plate of crystallizer nickel-cobalt alloy plating
Layer, making the production cost of acquisition nickel cobalt (alloy) layer substantially reduces, and improves the utilization rate of metallic cobalt in copper plate of crystallizer electroplating process.
Suitably as the method application of copper plate of crystallizer plating nickel-cobalt alloy plating.
Brief description of the drawings
Fig. 1 is schematic diagram of the present invention.
In figure, 1. plating stations, 2. anode thick sticks, 3. copper coin negative electrodes, 4. dc sources, 5. switch boards.
Embodiment
According to the figure, anode thick stick 2 and copper coin negative electrode 3 are provided with plating station 1, by wire respectively with it is straight outside plating station
Stream power supply 4 is connected, and dc source is connected by wire with switch board 5.
Hanging Basket is provided with the anode thick stick, in Hanging Basket built with nickel metallic particles and cobalt metallic particles.
The dc source is connected with anode thick stick and copper coin negative electrode respectively, constitutes electrolysis loop.
The switch board is balanced in plating station by controlling dc source output current come the dissolution velocity of stable metal cobalt
Concentration of cobalt ions.
Technical principle：
Metallic cobalt is purer than sulfamic acid cobalt, and metallic nickel and metallic cobalt anode are directly translated into ionic state under electric field action, sinks
Product forms nickel-cobalt alloy plating on copper coin negative electrode.
Using metallic cobalt compared with using sulfamic acid cobalt, process is simple, and cost is low, and the coating formed complies fully with knot
The coating technology requirement of brilliant device copper coin.
Sulfamic acid cobalt has pollution, mainly there is ammonia nitrogen and sulfonic acid, and discharge is harmful to environment.
Embodiments of the invention：
By taking two pieces of crystallizer wide plate 2300mmX900mm as an example, the coating average thickness 5.0mm after plating, amount containing cobalt 30%.Then electroplate
Layer weight is 0.18423T.
Result of calculation：2.3X0.9X0.005X8.9X2=0.18423T
Wherein：Nickel Bing $100,000.00/T, density 8900Kg/m3；
Cobalt Kuai $400,000.00/T, density 8900Kg/m3；
Sulfamic acid Gu $160,000.00/T, density 1.45Kg/L, 150g/L containing metallic cobalt.
Electroplate two boards billet crystallizer wide plate（2300mmX900mm）Comprehensive production cost：
1st, it is $38,256.70 that cobalt metal plating, which integrates two pieces of wide plate costs of production,；
0.18423TX（$100,000.00/TX70%+$400,000.00/TX30%）+ $3,000.00+$253.00（The electricity charge
And auxiliary material）=$38,256.70.
2nd, the use of electroplating integrated two pieces of wide plate costs of production of sulfamic acid cobalt is $101,816.05；
0.18423TX ($100,000.00/TX70%+$1,550,000.00X30%)+$3,000.00+$253.00（Electricity
Take and auxiliary material）=$101,816.05.
3rd, the cost for substituting sulfamic acid cobalt two pieces of wide plates of electroplating integrated production with metallic cobalt will save 62.4%.
$101,816.05-$38,256.70 ÷ 101,816.05X100%=62.4%
Enterprise is repaired with one medium-sized plating to calculate：Annual electrodepositable repairs 150 sets of wide plate, then annual to save production cost nearly thousand
Wan Yuan：
$101,816.05-$38,256.70) X150=s $9,534,000.00, remarkable in economical benefits.
Claims (4)
1. a kind of method of nickel cobalt (alloy) copper coin coating, it is characterized in that：In plating station（1）Inside it is provided with anode thick stick（2）And copper coin
Negative electrode（3）, by wire respectively with dc source outside plating station（4）It is connected, dc source passes through wire and switch board（5）Phase
Even.
2. a kind of method of nickel cobalt (alloy) copper coin coating according to claim 1, it is characterized in that：Extension is provided with anode thick stick
Basket, in Hanging Basket built with nickel metallic particles and cobalt metallic particles.
3. a kind of method of nickel cobalt (alloy) copper coin coating according to claim 1, it is characterized in that：Dc source respectively with sun
Pole thick stick and the connection of copper coin negative electrode, constitute electrolysis loop.
4. a kind of method of nickel cobalt (alloy) copper coin coating according to claim 1, it is characterized in that：Switch board is straight by control
Stream electric power outputting current carrys out concentration of cobalt ions in the dissolution velocity of stable metal cobalt, balance plating station.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710140637.4A CN107119293A (en) | 2017-03-10 | 2017-03-10 | A kind of method of nickel cobalt (alloy) copper coin coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710140637.4A CN107119293A (en) | 2017-03-10 | 2017-03-10 | A kind of method of nickel cobalt (alloy) copper coin coating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107119293A true CN107119293A (en) | 2017-09-01 |
Family
ID=59717992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710140637.4A Pending CN107119293A (en) | 2017-03-10 | 2017-03-10 | A kind of method of nickel cobalt (alloy) copper coin coating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107119293A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5424971B1 (en) * | 1970-12-10 | 1979-08-24 | ||
| CN1384226A (en) * | 2001-08-02 | 2002-12-11 | 西峡龙成冶材集团有限公司 | Ni-Co alloy electroplating process for copper plate working surface of continuously casting crystallizer |
| CN1455026A (en) * | 2003-05-21 | 2003-11-12 | 鞍钢附属企业公司一炼钢冶金修造厂 | Combined-box alloy plating process of continuous casting crystallizer copper plate |
| CN103233251A (en) * | 2013-04-24 | 2013-08-07 | 秦皇岛首钢长白结晶器有限责任公司 | Method for electroforming Co-Ni alloy coating on copper plate for continuous casting crystallizer |
-
2017
- 2017-03-10 CN CN201710140637.4A patent/CN107119293A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5424971B1 (en) * | 1970-12-10 | 1979-08-24 | ||
| CN1384226A (en) * | 2001-08-02 | 2002-12-11 | 西峡龙成冶材集团有限公司 | Ni-Co alloy electroplating process for copper plate working surface of continuously casting crystallizer |
| CN1455026A (en) * | 2003-05-21 | 2003-11-12 | 鞍钢附属企业公司一炼钢冶金修造厂 | Combined-box alloy plating process of continuous casting crystallizer copper plate |
| CN103233251A (en) * | 2013-04-24 | 2013-08-07 | 秦皇岛首钢长白结晶器有限责任公司 | Method for electroforming Co-Ni alloy coating on copper plate for continuous casting crystallizer |
Non-Patent Citations (2)
| Title |
|---|
| 曾华梁等编著: "《电镀工程手册》", 31 January 2010 * |
| 王蓓蓓: "用于结晶器内镀层的高钴低镍钴镍合金电铸工艺的研究", 《哈尔滨工业大学工学硕士学位论文》 * |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170901 |
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| RJ01 | Rejection of invention patent application after publication |