JPS5424971B1 - - Google Patents
Info
- Publication number
- JPS5424971B1 JPS5424971B1 JP11006470A JP11006470A JPS5424971B1 JP S5424971 B1 JPS5424971 B1 JP S5424971B1 JP 11006470 A JP11006470 A JP 11006470A JP 11006470 A JP11006470 A JP 11006470A JP S5424971 B1 JPS5424971 B1 JP S5424971B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11006470A JPS5424971B1 (en) | 1970-12-10 | 1970-12-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11006470A JPS5424971B1 (en) | 1970-12-10 | 1970-12-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5424971B1 true JPS5424971B1 (en) | 1979-08-24 |
Family
ID=14526140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11006470A Pending JPS5424971B1 (en) | 1970-12-10 | 1970-12-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5424971B1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107119293A (en) * | 2017-03-10 | 2017-09-01 | 董晓坤 | A kind of method of nickel cobalt (alloy) copper coin coating |
| JP2020525654A (en) * | 2017-07-05 | 2020-08-27 | マクダーミッド エンソン インコーポレイテッド | Interconnect Cobalt Fill |
| JP2021503560A (en) * | 2017-11-20 | 2021-02-12 | ビーエイエスエフ・ソシエタス・エウロパエアＢａｓｆ Ｓｅ | Cobalt electroplating composition containing a leveling agent |
-
1970
- 1970-12-10 JP JP11006470A patent/JPS5424971B1/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107119293A (en) * | 2017-03-10 | 2017-09-01 | 董晓坤 | A kind of method of nickel cobalt (alloy) copper coin coating |
| JP2020525654A (en) * | 2017-07-05 | 2020-08-27 | マクダーミッド エンソン インコーポレイテッド | Interconnect Cobalt Fill |
| US11401618B2 (en) | 2017-07-05 | 2022-08-02 | Macdermid Enthone Inc. | Cobalt filling of interconnects |
| JP2021503560A (en) * | 2017-11-20 | 2021-02-12 | ビーエイエスエフ・ソシエタス・エウロパエアＢａｓｆ Ｓｅ | Cobalt electroplating composition containing a leveling agent |