CN107107261A - Method and workpiece for processing workpiece surface - Google Patents

Method and workpiece for processing workpiece surface Download PDF

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Publication number
CN107107261A
CN107107261A CN201580068386.2A CN201580068386A CN107107261A CN 107107261 A CN107107261 A CN 107107261A CN 201580068386 A CN201580068386 A CN 201580068386A CN 107107261 A CN107107261 A CN 107107261A
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CN
China
Prior art keywords
grade
surface topography
workpiece
processing
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201580068386.2A
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Chinese (zh)
Inventor
萨沙·尧曼
马蒂亚斯·德林克曼
沃尔夫冈·伦普
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mauser Werke Oberndorf Maschinenbau GmbH
Original Assignee
Mauser Werke Oberndorf Maschinenbau GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mauser Werke Oberndorf Maschinenbau GmbH filed Critical Mauser Werke Oberndorf Maschinenbau GmbH
Publication of CN107107261A publication Critical patent/CN107107261A/en
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0093Working by laser beam, e.g. welding, cutting or boring combined with mechanical machining or metal-working covered by other subclasses than B23K
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/354Working by laser beam, e.g. welding, cutting or boring for surface treatment by melting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/3568Modifying rugosity
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/3568Modifying rugosity
    • B23K26/3584Increasing rugosity, e.g. roughening
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/0025Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22BPRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B9/00General processes of refining or remelting of metals; Apparatus for electroslag or arc remelting of metals
    • C22B9/16Remelting metals
    • C22B9/22Remelting metals with heating by wave energy or particle radiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/34Coated articles, e.g. plated or painted; Surface treated articles
    • B23K2101/35Surface treated articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/08Non-ferrous metals or alloys
    • B23K2103/10Aluminium or alloys thereof
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/356Working by laser beam, e.g. welding, cutting or boring for surface treatment by shock processing
    • CCHEMISTRY; METALLURGY
    • C21METALLURGY OF IRON
    • C21DMODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D10/00Modifying the physical properties by methods other than heat treatment or deformation
    • C21D10/005Modifying the physical properties by methods other than heat treatment or deformation by laser shock processing
    • CCHEMISTRY; METALLURGY
    • C21METALLURGY OF IRON
    • C21DMODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D2261/00Machining or cutting being involved

Abstract

The invention discloses a kind of method for processing workpiece surface, wherein, the 1st grade of surface topography (1) is constructed by the first manufacture method, such as machining.Then the 2nd and/or 3 grade of surface topography formed herein is changed by laser machining, wherein, the 1st grade of surface topography (1) is kept essentially constant.1st grade of surface topography (1) can in this way substantially independently constructed with 3rd level surface topography and/or the 2nd grade of surface topography (2), and therefore have adjusted reflectivity.

Description

Method and workpiece for processing workpiece surface
Technical field
The present invention relates to preamble according to claim 1 for processing the method for workpiece surface and according to this side The workpiece of method manufacture.
Background technology
On the surface of workpiece, for tribology, mechanics, it is optical or other the reason for its different level table The requirement limited is often proposed in terms of facial contour.
1st grade of surface topography is related to the shape of workpiece, or workpiece area shape, to ensure function.
2nd grade of surface topography is related to the macro geometry on surface, especially percent ripple.The percent ripple is typically manufacturing process Kinematic reflection, such as kinematic roughness.For example, being used as cutter rotating speed and the function of feed speed in milling Ground, the shape of each cutting blade is periodically cut in workpiece.The mutual distance of these otch is then defined as per tooth The amount of feeding.
Therefore, every kind of cutting process, which all remains with it, has representational surface texture, and the surface texture is used as workpiece Structure is typically undesirable.Following target is often there are, by cutter radius and should by reducing feed engagement Structure leveling is slided, so that the structure only has the depth of subordinate.
Specific process (finished machined) make use of the whole smooth effect that the convexity with big radius by cutting blade is produced.
It can be made in the case of cutting blade seamed edge being especially for example made up in application of the diamond of monocrystalline, very smooth Extremely smooth surface is produced, the surface can be better than the result on the surface being polished.
Here, the fine structure of each otch is the 3rd level surface topography of workpiece surface.It can be by structuring or cutting blade rib The smoothness influence on side.
Similar to processed using geometrically specific cutting blade ground, feelings of the relation even in geometrically unspecific cutting blade It is also applicable under condition.There, realize that the leveling to surface is slided by the fineness of grain of cutting blade material.
Therefore there are different feasible programs, to influence workpiece surface in terms of the 2nd and 3 grade of surface topography.This is suitable It is improved in surface, because for the reason for tribology, mechanics or optics, smoother surface is to expect , wherein, often make every effort to reach while following the surface topography of the first order with high precision.
But for tribology, mechanics, optical or other reasonses, can also make every effort to reach coarse surface.For this And have the cutting process as with relatively thicker particle brushing or grinding.Also using other removing methods, for example, lose Quarter, the elimination of chemical or electrochemistry.Nonreflective surface can also be produced by applying cloth method as japanning or coating.
However, cutting process generally preserves machining locus, it is correspondingly oriented machine direction.This is often undesirable 's.
The shortcoming of all these methods is that the 1st grade of surface topography is impacted in the following way, i.e. these methods or The different forming parts of many or few consumingly influence surface configuration.These methods often more strongly rise in the region of workpiece seamed edge Effect.Therefore, etching and paint for example always causes to carry out certain undesirable seamed edge rounding.
As described by beginning, the 1st can be targetedly influenceed by machining, 2 and 3 grades of surface topographies. Here, can for example reduce feed engagement, to be flattened to the 2nd grade of surface topography (percent ripple, kinematic roughness) It is sliding.3rd level surface topography (roughness) can flatten cunning by improving cutting blade seamed edge breach degree (Schartigkeit).At this In two kinds of measures, the accuracy of shape (the 1st grade of surface topography) also becomes higher in the following way, i.e. occur indirectly smaller Cutting pressure, its smaller deformation due to part during processing causes smaller deviation.
If to influence surface in terms of less reflectivity, then the surface must targetedly obtain higher thick Rugosity.
Cause the raising to kinematic roughness (the 2nd grade of surface topography) unfavorable by more acute cutting blade geometry Ground have impact on the accuracy of shape (the 1st grade of surface topography).
Therefore, it is particularly possible to 3rd level surface topography is influenceed by cutting blade breach degree, so as to improve roughness, and make Less light is for example reflected on surface.
However, in order to improve the influence to each otch on summary table facial contour, it is necessary to improve feed engagement.Therefore shape Into such as lower surface, it has the percent ripple (the 2nd grade of surface topography) increased again.
Therefore in the absence of following possibility, i.e. for example by cut manufacture method targetedly reduce reflectivity or its His geometric jacquard patterning unit surface characteristic, and the other characteristic on surface can not adversely be influenceed herein.It is nonreflective that cutting ground is manufactured Surface especially has the limited accuracy of shape (the 1st grade of surface topography) and high percent ripple (the 2nd grade of surface topography).This is It is undesirable.
A kind of spotlight structure type is described in the A of US 4,914,747, wherein, the division to spotlight region is led to Shading piece is crossed to realize.The seamed edge of shading piece generates the projection figure limited by being projected caused by corresponding optics Picture.Shading piece can cover the light in specific region herein.In order to improve the quality of projects images, shading piece is targetedly Equipped with nonreflective surface.This is realized by special, lacklustre enamelled coating.Nonreflective surface is used to avoid projection There is aberration in image.High expense in this embodiment disadvantageously when applying special enamelled coating and improving light work( The heat sensitivity of the paint during lifting of rate and associated heat release.Especially in the case of the special moulding of shading piece, It is very high cost to cover the surface being not coated with.
Known a kind of embodiment of spotlight in the T2 of DE 60 2,004 002 043, wherein, use two not Same light source.Here, a light source produces dipped beam, dipped beam produces the light and shade border of legal provisions.Secondary light source can illuminate Region above light and shade border.Distance light is formed in the combination of two illuminations.Illuminated in the case of distance light on light and shade border Side and the region of lower section.Occur the special requirement to the accuracy of shape (the 1st grade of surface topography) of shading piece herein, this be because There should not be not illuminated region (dark portion) for two projects images of mixing.Projects images should be with high accuracy bright It is overlapping in the region of dark border, so that light and shade border is no longer visible.
A kind of additional cost is described in the A2 of WO 00 2,014 165 884, to improve projects images in light and shade Quality in the region on border.There is provided additional light path, it can illuminate dark portion above-mentioned.Shading piece must match somebody with somebody herein Have at least one nonreflective region.Reflectivity preferably must be held in the tolerance of restriction.
The A1 of DE 10 2,010 054 858 disclose a kind of side for being used to manufacture the painting part for reducing reflection in substrate Method, wherein, the painting part passes through laser radiation.
The content of the invention
Therefore, task of the invention is to provide a kind of method and the workpiece manufactured according to this method, wherein, with very little Method and technology on cost influence the 3rd level surface topography to influence geometric jacquard patterning unit surface characteristic, such as reflectivity is feasible.
The task passes through the method for the feature with Patent right requirement 1 or the workpiece solution by being manufactured according to this method Certainly.
This method is advantageously improved the theme that scheme is dependent claims.
It is used according to the invention by machining and the Combination of Methods that constitutes of Laser Processing, so as to by geometric jacquard patterning unit surface characteristic, Especially reflectivity is adjusted to necessary value.
According to the present invention, in the method for processing workpiece surface, by the function of workpiece come default 1st grade of surface Profile is made up of the manufacturing process of shaping.2nd grade of surface topography is caused by machined parameters, and the 2nd grade of surface topography is related to The macro geometry on surface.2nd grade of surface topography is configured with the 3rd level surface topography that form is fine structure again.According to this hair Bright, the 1st grade of surface topography is by the first manufacture method, and the preferably processing of chip formula is set up.Then, the formed herein the 2nd or 3 Level surface topography is changed by Laser Processing, to adjust predetermined geometric jacquard patterning unit surface characteristic, such as reflectivity.With such as Under type carries out the change, i.e. be kept essentially constant the 1st grade of surface topography.
Utilization can avoid the shortcoming that beginning is illustrated by this method.
In an embodiment of the present invention, the function by workpiece is targetedly influenceed by machining come default 1st grade of surface topography.Subsequent Laser Processing is at most as influenceing that of the 2nd and 3 grade of surface topography by the Laser Processing The 1st grade of surface topography is influenceed under the degree of sample.In this manner, the dimensional accuracy of workpiece can be obtained relative to conventional solution To improvement.
Machining may, for example, be turnery processing or Milling Process.
In finished machined, at least one convex spherical secondary cutting blade is used in order to process the 1st grade of surface topography.
When the cutting blade used in machining is made up of diamond, dimensional accuracy can further be changed Enter.
Laser Processing is designed as follows in an embodiment of the present invention, i.e. realize the 2nd and/or 3 grade of surface topography Change in shape.
This Laser Processing can be carried out with cancelling, wherein it is possible to implement one or more depressed parts.
In an embodiment of the present invention, promote to chemically react on workpiece surface by Laser Processing, thus, on surface Upper formation retains oxide or other reaction products.
In other flexible program, Laser Processing is controlled as follows, i.e. make melt workpiece material, and Fusing particle is deposited on the surface of the workpiece again.
Control in Laser Processing can be carried out by location equipment, via location equipment so that laser beam can be with Relative to workpiece motion s, so as to be laser machined on the different regions of workpiece.
Manipulation to laser beam can be carried out as follows, i.e. form pattern or structure on the surface of the workpiece.The figure Case can be pit pattern or line pattern or other pattern.
Here it is preferred, in particular, that pattern is associated with the 2nd and/or 3 grade of surface topography.
Can be by changing the placement angle of laser by the shape and depth that laser machine the structure/depressed part constituted Change.
Brief description of the drawings
Below a preferred embodiment of the present invention is elaborated by schematic diagram.Wherein:
Fig. 1 shows the 1st of workpiece the, the schematic diagram of 2 and 3 grades of surface topographies;
Fig. 2 shows to be configured with the 2nd or 3 grade of surface topography of pit structure;
Fig. 3 shows the flexible program of the embodiment according to Fig. 2 with overlapping pit;
Fig. 4 shows the schematic diagram of method, wherein, laser beam is obliquely coupled into relative to workpiece surface;
Fig. 5 shows the schematic diagram of the spotlight for dipped beam;And
Fig. 6 shows the schematic diagram for the workpiece surface processed according to the method according to the invention.
Embodiment
Fig. 1 a show the schematical part of the functional surfaces 4 of workpiece 6.The functional surfaces 4 are implemented with ripple struction, and it is being opened It is the 1st grade of surface topography 1 in the meaning for the restriction that head is illustrated.Ripple struction (the 1st grade of surface topography) is pre- by the function of workpiece 6 If.It is apparent that the geometry of the 1st grade of surface topography is not limited to ripple struction, but it can also such as include flat Face, other structures etc..
Fig. 1 b are shown along the section of the line A-A in Fig. 1 a.In the figure it can be seen that constituting the ripple of the 1st grade of surface topography Line structure 1.The structure is implemented with the 2nd grade of surface topography 2 in itself, and the 2nd grade of surface topography is for example constituted in percent ripple or kinematics Roughness, the percent ripple or kinematic the roughness manufacture method used in are with representational surface knot Structure.This structure is typically undesirable.
As being shown in figure 1 c in details B, there should be representational surface texture (the 2nd grade of surface topography 2) Fine structure is implemented with again, and it constitutes 3rd level surface topography 3.The 3rd level surface topography can for example pass through structuring or cutting blade The smoothness of seamed edge influences.
According to the present invention, the 2nd and/or 3 grade of surface topography 2,3 is targetedly manufactured by laser machining, wherein, it is as follows Approach application is carried out in this wise, i.e. be kept essentially constant the 1st grade of surface topography 1.
As example indicating in fig. 2, the 2nd grade of surface topography 2 or 3rd level surface topography 3 can pass through pit figure Case is constructed.Here, constructing the depressed part 8 of many pit shapes by laser beam.These depressed parts for example can be by fiber Laser is introduced, and its laser beam is directed at region to be processed by scanning means.This laser is used for example as marking laser, and In the case of being also employed in structuring and introducing rupture breach.As figure 2 illustrates as, the depressed part 8 of pit shape can be with Arranged with predetermined pattern, wherein, level interval is default with x, and vertical spacing is default with y.The diameter of each pit is in Fig. 2 It is middle to be represented with d.The area A and table that is remaining, being not provided with pit of pit can be for example calculated by diameter d and spacing x, y Face part A '.By constructing pit structure, for example, reflectivity ρ can be formed, so as to according to the method according to the invention, such as may be used To optimize the reflector of spotlight in terms of reflectivity.Surface portion A ' and A area ratio can be calculated according to below equation:
That is, must correspondingly select surface area ratio A ' to adjust out specific reflectivity:A.It is apparent that other Parameter also intervene determination to reflectivity.However, as having been carried out, the present invention is but not limited to by suitably Construct the 2nd and 3 grade of surface topography to adjust the reflectivity of workpiece, but can also be influenceed by the method according to the invention mode Other surfaces characteristic.
Figure 3 illustrates following examples, wherein, the depressed part 8 of pit shape is not spaced from each other, but range selector The overlapped arrangement in ground, so as to construct the linear pit structure with many lines 10,12.These lines for example can be mutual Arranged with parallel spacing.In principle, these lines can also be constructed corrugatedly.The intersection of line 10,12 or different placement angles It is also imaginabale.
Fig. 4 shows the schematic diagram of the construction of the depressed part 8 for illustrating pit shape.As illustrating, the depressed part It may be constructed the 2nd or 3 grade of surface topography 2,3.As illustrate as, this is realized by laser beam 10, laser beam for example through It is coupled into by the scanning means with the mirror that can be adjusted in multiple axis or via mobile laser head.In shown reality Apply in example, laser beam 10 is obliquely coupled into relative to the vertical curve V of guide surface 4.Correspondingly, the medial axis M of depressed part 8 Obliquely dispose.By the laser beam 10 (as shown in Figure 4) in geometry strictly from the point of view of do not constitute it is recessed Shape of spot, but constitute attenuating downwards, tapered in farthest meaning or in funnel shaped structure.
Fig. 5 shows specific solution, according to the solution, and the method according to the invention is used for manufacture and is directed to The reflector spotlight of dipped beam.This spotlight has light source 12, such as H7 lamps, its towards reflector 14 direction radiant light, instead Embodiment of the reflecting surface of emitter before constitutes functional surfaces 4.Accordingly, the functional surfaces 4 with the 1st, 2 and 3 grades of surface topographies Implement.1st grade of surface topography constitutes the bending section of reflector 14 herein.The default parameter of reflectivity herein according to Fig. 2 is real Apply.The light radiated by light source 12 on reflector 14 or reflecting surface 4 towards projecting lens 16 direction deflecting, then projecting lens spoke Penetrate substantially parallel dipped beam.Spotlight is additionally implemented with shading piece 18 in the region of front seamed edge, via shading piece, anti- The share A1 for the light penetrated is absorbed.The unabsorbed share of light path is marked in the diagram according to Fig. 5 with reference A2.Light It can also be influenceed on road A1, A2 Distribution Principles by the appropriate design of the 2nd and 3 grade of surface topography.
Fig. 6 shows workpiece, the flexible program of the functional surfaces 4 of such as reflector 14.The workpiece has by chip formula Cause the 1st grade of surface topography 1 of processing, it can for example have somewhat corrugated structure again.As illustrating in figure 6 Property show as, may then pass through subsequent Laser Processing and constitute the 2nd or 3 grade of appropriate surface texture 2,3, in laser In processing, the dimensional accuracy of the 1st grade of surface topography 1 is no or only slightly impacted.In the diagram according to Fig. 6, these structures It is arranged side by side.It is apparent that fine structure (3rd level surface topography) can be constituted in the identical region of function surface 4 and grand See profile (the 2nd grade of surface topography).
As mentioned by, it is clear that the different depressed part of the depressed part of pit shape from describing before can also be constituted.Its structure is several Arbitrarily it can be changed according to the respective requirement to functional surfaces.
, can also be in the region of the Inner Constitution of functional surfaces 4 differently structuring as illustrated.
Below, the method according to the invention carries out popularization elaboration again.
By especially with specific cutting blade carry out cutting process, especially by be with finishing cutting blade carry out Milling, very smooth surface is obtained with high economy and very high reproducibility.Herein correspondingly, outside the 1st grade of surface Shape obtains the very high accuracy of shape on surface, makes by favourable parameter selection and by cutting blade radius in kinematics Roughness (the 2nd grade of surface topography) be minimized by, and roughness (the 3rd level table caused due to cutting blade breach degree Facial contour) equally it is minimized by by very smooth cutting blade (especially diamond).
First procedure of processing provides the very reproducible surface for subsequent Laser Processing.Surface is that characteristic is put down Weighing apparatus, and the reflectivity of maximum possible in material unit can be set up.
In the procedure of processing, surface hot-working is performed by shooting surface by laser beam, especially eliminates and adds Work.The place of material forms depressed part in laser fusion, and melt is removed as necessary by additional medium.
These depressed parts change the 2nd grade of surface topography on surface, wherein, the accuracy of shape (the 1st grade of surface topography) can To keep constant completely.
Reflectivity can especially be affected, because the surface (3rd level surface topography) in each depressed part has Certain roughness as surface be melted and solidification result.
Can also be by solidifying molten on surface not by laser effect to surface, the especially influence to reflectivity Compound particle is realized.
Due to introducing reaction enthalpy by laser and inputting oxygen by air blowing medium, so can also be by forming oxygen Compound is realized to surface, the especially influence to reflectivity.Air blowing medium can also change, so that can via different materials To form the coloured reaction product of different tools.Accordingly it is also possible to targetedly influence the coloring on surface.
Generally, run to laser pulsed.Pass through each pulse shaping each pit with relatively high energy density. It can deepen these pits by multiple pulses, can also be via pulse duration and the size and depth of energy affect pit Degree.
By machine axis or by scanning element, laser beam can be square on the surface of the workpiece with mono-axial or multi-axial cord Motion.Linear structure can be produced by the arrangement of each pit.
Line targetedly can reflect or cover according to aspect effect according to the orientation of the light path partly loaded.Can be with Obtain the polarization of light.
Placement angle by laser beam relative to workpiece surface, the surface topography of pit can change.Therefore, Reflection characteristic targetedly changes in which may rely on direction.
Reflectivity can be adjusted targetedly as follows, i.e. area fraction A ' passes through area fraction A precentagewises Instead of.A ' is the surface share for not being lasered influence of workpiece surface herein, and A is that having with it for pit is representational Reflectivity area fraction.In ideal conditions, between area fraction ratio and the total reflectivity of the integration on surface is into just Than.
Using
In order to reduce friction or in order to improve friction, laser structure is applied on workpiece surface processed before.
By targetedly orienting each part of laser structure relative to the surface manufactured with cutting before The positioning of surface topography can be to the characteristic optimization on surface.
Laser structure can significantly improve the friction valve on surface in the following way with respect to the 2nd grade attaching troops to a unit for surface topography, That is, the protuberance for the material being thermally melted for example just is produced on roughness kurtosis.Thus, when friction mating member and the surface are embedding (formschl ü ssig) engagement of strong shape sealed is formed when connecing.
Very many surfaces for example for commodity have the requirement in optical and tactile.Surface for example should be subjectively Seem very rare, and touch up very rare.Uniform glossiness surface and lacklustre surface can be frequently seen, this It is because being respectively present manufacture method for this.
However, manufacture as lower surface be it is very difficult, these surfaces be in its 3rd level surface topography it is glossiness, And be coarse in its 2nd grade of surface topography, or in its 2nd grade of surface topography be smooth, and on its 3rd level surface It is coarse in profile.
Technically for example it can only manufacture extremely difficultly " the general gloss of silk ".It is simultaneously thick in the 2nd grade of surface topography The sign of gloss with 3rd level surface topography in the case of rough.
The root for the Combination of Methods being made up of the machining and Laser Processing that are caused especially by diamond finished machined According to it is an advantage of the current invention that targetedly influence the 2nd or 3 grade of surface topography, and other levels are not influenceed respectively.Therefore example Characteristic on the gloss as can produce silk, and reflectivity and other geometry, optical and tactile passes through laser figure The arrangement and shape of case and targetedly controlled by the other parameter of superficial density, depth and laser pattern.
For example, in optical instrument, there is following requirement in the inside of telescope tube, reflected seldom light, thus, Coarse, nonreflective surface is useful.
On the common workpiece with optical requirement, surface is in terms of its optical characteristic often targetedly by shadow Ring.Make every effort to reach uniform glossiness also lacklustre surface.
In the utensil of transmitting light should also using targetedly reflected light and the table for this with high reflectance Face, and also using should not targetedly reflect and should have for this surface of corresponding low reflectivity.Therefore, gather Optical part in light lamp can targetedly assemble light, wherein, the scattered light formed in the light path is absorbed, and because The light and shade border of the restriction in the region that this formation is illuminated.This be for dipped beam particularly with automatic condensing lamp it is important will Ask.Street should be illuminated, and on-coming traffic should not be dazzling, and this is real by the reflector or shading piece of special shaping It is existing.
Application artificially oneself is remained, and intrinsic claim is concentrated on into these using upper.
The method for processing workpiece surface is disclosed, wherein, the 1st grade of surface topography is by the first manufacture method, for example Machining is constituted.Then the 2nd and/or 3 grade of surface topography formed herein is changed via Laser Processing, wherein, the 1st grade of surface Profile is kept essentially constant.In this way can be substantially with 3rd level surface topography and/or the 2nd grade of surface topography independently The 1st grade of surface topography is constructed, and therefore adjusts reflectivity.

Claims (17)

1. one kind is used for the method for processing workpiece surface (4), the 1st grade of surface topography (1) of the workpiece surface passes through workpiece (6) Functional condition, and by shaping manufacturing process construct, wherein, the 2nd grade of surface topography (2) by manufacturing process processing join Number causes and is related to the macro geometry on surface, and it also has the 3rd level surface topography (3) that form is fine structure, its feature It is, the 1st grade of surface topography (1) is by the first manufacture method, and the preferably processing of cutting type is formed herein to set up The 2nd grade (2) or 3rd level (3) surface topography changed by laser machining, it is special to adjust out predetermined geometric jacquard patterning unit surface Property, such as such as reflectivity, wherein, the 1st grade of surface topography (1) is kept essentially constant.
2. according to the method described in claim 1, wherein, the 1st grade of surface topography (1) by machining targetedly It is impacted, and by subsequent Laser Processing at most as influenceing the 2nd and 3 grade of surface topography (2,3) by laser machining It is impacted under degree as itself.
3. according to any method of the preceding claims, wherein, the machining is turnery processing.
4. method according to claim 1 or 2, wherein, the machining is Milling Process.
5. according to any method of the preceding claims, wherein, the processing is finished machined, wherein, cutter structure A convex spherical secondary cutting blade is made, or is configured with multiple convex spherical secondary cutting blades.
6. according to any method of the preceding claims, wherein, the cutting blade of machining is made up of diamond.
7. according to any method of the preceding claims, wherein, the Laser Processing leaves the 2nd grade of surface topography (2) and/or 3rd level surface topography (3) change in shape.
8. according to any method of the preceding claims, wherein, the Laser Processing is cancelling and left One or more depressed parts.
9. according to any method of the preceding claims, wherein, it is described Laser Processing in workpiece material causing Reaction is learned, and oxide or other reaction products are remained on the surface.
10. according to any method of the preceding claims, wherein, it is described Laser Processing fusing workpiece material, and Molten particle deposition is on the surface.
11. according to any method of the preceding claims, wherein, laser beam is by location equipment above workpiece Motion, and therefore, it is possible to be acted on different positions.
12. method according to claim 11, wherein, the laser beam is in the way of location-controlled in different positions On work as follows, i.e. form pattern on the surface.
13. method according to claim 12, wherein, the pattern is pit pattern or line pattern.
14. the method according to claim 12 or 13, wherein, the pattern be associated with the 2nd grade of surface topography and/or 3rd level surface topography.
15. according to any method of the preceding claims, it is characterised in that by angled placement laser beam come Influence the shape of depressed part.
16. a kind of workpiece to manufacture according to any method of the preceding claims.
17. workpiece according to claim 16, wherein, the workpiece is reflector (14).
CN201580068386.2A 2014-12-15 2015-12-14 Method and workpiece for processing workpiece surface Pending CN107107261A (en)

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DE102014118686.9 2014-12-15
DE102015113141.2A DE102015113141A1 (en) 2014-12-15 2015-08-10 Method for machining a workpiece surface and workpiece
DE102015113141.2 2015-08-10
PCT/EP2015/079627 WO2016096748A1 (en) 2014-12-15 2015-12-14 Method for processing a workpiece surface and workpiece

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