CN107105571B

CN107105571B - Flexible circuit board, manufacturing method thereof and electronic device with flexible circuit board

Info

Publication number: CN107105571B
Application number: CN201610097836.7A
Authority: CN
Inventors: 王有财; 董毕玲
Original assignee: Shenzhen Futaihong Precision Industry Co Ltd
Current assignee: Shenzhen Futaihong Precision Industry Co Ltd
Priority date: 2016-02-23
Filing date: 2016-02-23
Publication date: 2020-08-18
Anticipated expiration: 2036-02-23
Also published as: CN107105571A

Abstract

The invention provides a flexible circuit board which comprises a flexible substrate and a film, wherein the film is arranged on the flexible substrate, a plurality of holes are formed in the flexible substrate, and conductive yarns sequentially penetrate through the holes and the film to form a circuit. The invention also provides a manufacturing method of the flexible circuit board, which comprises the following steps: providing a flexible substrate; disposing a thin film on the flexible substrate; sequentially penetrating the conductive yarns through the holes and the thin film on the flexible substrate to fix the thin film and the flexible substrate to form a circuit; and performing in-mold injection molding on the conductive yarn on the flexible substrate to form a circuit structure of the flexible substrate. The invention also provides an electronic device comprising the flexible circuit board. According to the invention, the circuit structure is manufactured on the flexible substrate of the flexible circuit board by using the conductive yarn, and the functional modules on the electronic device can be electrically connected through the circuit structure, so that the size of the flexible circuit board is effectively reduced.

Description

Flexible circuit board, manufacturing method thereof and electronic device with flexible circuit board

Technical Field

The invention relates to a flexible circuit board, a manufacturing method of the flexible circuit board and an electronic device with the flexible circuit board.

Background

At present, with the development of science and technology, the electronic technology field is rapidly developed, and the demand of customers for electronic devices is continuously increased, especially the structural requirements of electronic devices are smaller. At present, a plurality of functional modules are usually disposed in an electronic device, and the functional modules are generally connected through external wires, so that the burden of an internal space of the electronic device is easily increased, and the development of the electronic device towards short, small, light and thin is not facilitated.

Disclosure of Invention

Accordingly, there is a need for a flexible circuit board that can save internal space.

In addition, it is also necessary to provide a method for manufacturing the flexible circuit board.

In addition, it is necessary to provide an electronic device having the flexible circuit board.

The flexible circuit board comprises a flexible substrate and a film, wherein the film is arranged on the flexible substrate, a plurality of holes are formed in the flexible substrate, and conductive yarns sequentially penetrate through the holes and the film to form a circuit.

A flexible circuit board manufacturing method comprising: providing a flexible substrate; disposing a thin film on the flexible substrate; sequentially penetrating conductive yarns through the holes on the thin film flexible substrate to fix the thin film flexible substrate to form a circuit; and performing in-mold injection molding on the conductive yarn to form a circuit structure of the flexible substrate.

An electronic device comprises the flexible circuit board.

According to the flexible circuit board, the manufacturing method thereof and the electronic device with the flexible circuit board, the circuit structure is manufactured on the flexible substrate of the flexible circuit board by using the conductive yarn, and the functional modules on the electronic device can be electrically connected through the circuit structure, so that the size of the flexible circuit board is effectively reduced, the functional requirements of the electronic device are met, and meanwhile, the product space is saved.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device according to a preferred embodiment of the invention.

Fig. 2 is a schematic structural diagram of a flexible circuit board according to a preferred embodiment of the invention.

Fig. 3 is a flowchart of a method of manufacturing the flexible circuit board shown in fig. 2.

Fig. 4 is a functional block diagram of the flexible circuit board shown in fig. 2 applied to an electronic device.

Description of the main elements

Electronic device	100
		Flexible circuit board	10
Functional module	20
		Flexible substrate	11
Circuit structure	12
		Hole lattice	13
Ambient light adjusting module	21
		Voice module	22
Memory module	23
		Display module	24
Scanning module	25
		Translation module	26
Drawing and file conversion module	27
		Processor with a memory having a plurality of memory cells	28
Light sensor	211
		Light source	212
Voice recorder	221
		Voice player	222
Display screen	241
		Projection unit	242

The following detailed description will further illustrate the invention in conjunction with the above-described figures.

Detailed Description

Referring to fig. 1 and fig. 2, a preferred embodiment of the invention discloses an electronic device 100. In the preferred embodiment, the electronic device 100 is a smart pen, and the electronic device 100 includes a flexible circuit board 10 and a functional module 20. The functional module 20 is disposed on the flexible circuit board 10 and electrically connected through the circuit structure 12 made of conductive yarn, so as to effectively save the internal space of the electronic device 100.

Referring to fig. 2, the flexible circuit board 10 includes a flexible substrate 11 and a circuit structure 12 disposed on the flexible substrate 11. The flexible substrate 11 is made of an insulating high-temperature resistant material. The flexible substrate 11 is provided with a functional module 20, and the functional module 20 includes a module for realizing each function, such as a display module. The circuit structure 12 is made of conductive yarn and is used for connecting the functional module 20 disposed on the flexible circuit board 10. The flexible substrate 11 is provided with a plurality of cells 13, and the cells 13 are continuously arranged at intervals and distributed on the whole panel of the flexible substrate 11. The conductive yarn may be threaded through each of the successive cells 13 of the flexible substrate 11 to weave the circuit structure 12.

Referring to fig. 3, a method for manufacturing a flexible printed circuit 10 is disclosed in the preferred embodiment of the present invention. The manufacturing method of the flexible circuit board 10 includes the steps of:

s1: a flexible substrate 11 is provided, a plurality of holes 13 are arranged on the flexible substrate 11, and a film 30 is arranged on the flexible substrate 11. In this embodiment, the film is a PET film.

S2: the conductive yarn is provided and sequentially passed through the cells 13 and the film 30 on the flexible substrate 11, so that the film 30 and the flexible substrate 11 are fixed by the conductive yarn, thereby forming a circuit on the flexible substrate 11. The film 30 serves to prevent the conductive yarn from being broken during the hot press and injection molding.

S3: the conductive yarns are subjected to a heat press process so that the conductive yarns on the flexible substrate 11 are flush with each other.

S4: the flexible substrate 11 is placed in an injection mold, and the position, where the conductive yarn is arranged, on the flexible substrate 11 is subjected to in-mold injection molding, so that the conductive yarn on the flexible substrate 11 is coated with a layer of plastic, and the circuit structure 12 of the flexible substrate 11 is formed. In this embodiment, the injection plastic is thermoplastic silicone sulfide.

S5: the conductive performance of the flexible circuit board 10 after the injection molding is performed, and if the conductive performance is enabled, S6 is performed.

S6: the flexible substrate 11 is subjected to a secondary in-mold injection molding to form a better appearance piece. In this embodiment, the injection material of the outer member may be thermoplastic silicone sulfide.

S7: and performing laser processing on the flexible circuit board 10 to cut off the conductive yarns which overflow from the film 30 on the flexible circuit board 10 after the secondary in-mold injection molding.

S8: and (5) conducting performance detection is carried out on the flexible circuit board 10, and if the flexible circuit board 10 can conduct electricity, the flexible circuit board 10 is manufactured.

It is understood that the flexible circuit board 10 described above may be applied to the electronic device 100. The electronic device 100 may be a mobile phone or a smart pen. In the present embodiment, the electronic device 100 is taken as an example of a smart pen.

Referring to fig. 4, the functional modules 20 at least include an ambient light adjusting module 21, a voice module 22, a storage module 23, a display module 24, a scanning module 25, a translation module 26, a drawing conversion module 27, and a processor 28. The ambient light adjusting module 21, the voice module 22, the storage module 23, the display module 24, the scanning module 25, the translation module 26, and the drawing conversion module 27 are electrically connected to the processor 28.

The ambient light adjusting module 21 is used for adjusting the intensity of the light of the environment in which the user is located. In the present embodiment, the ambient light adjusting module 21 includes a light sensor 211 and a light source 212. When the light sensor 211 senses that the intensity of the light is lower than a predetermined value, the light sensor 211 sends a signal to the processor 28. The processor 28 sends a control signal to the light source 212 to control the light source 212 to emit light outwards, and gradually increase the intensity of the emitted light until the intensity of the light sensed by the light sensor 211 reaches a predetermined value. At this time, the light source 212 stops increasing the intensity of the emitted light to maintain the current light intensity. The ambient light adjusting module 21 may be beneficial to protect the eyes of the user when the user uses the electronic device 100 in a suitable light intensity environment.

The voice module 22 includes a voice recorder 221 and a voice player 222. The voice recorder 221 is configured to record voice and transmit the recorded voice to the processor 28. The processor 28 stores the voice in the storage module 23, and the voice player 222 is used for playing the voice stored in the storage module 23. The voice module 22 is used to allow the user to record and play voice while using the smart pen.

The display module 24 is used for presenting information, and includes a display screen 241 and a projection unit 242, and the projection unit 242 includes a 2D projector and a 3D projector. The display screen 241 is used for displaying electronic information in the electronic device 100 for a user to view. The projector is used for projecting and amplifying the signal sent by the processor 28, so that a user can perform 2D or 3D amplification on a picture for viewing only by requesting to modify the electronic device 100 uniformly.

The scanning module 25 is used for scanning information and sending the scanned information to the processor 28. The scanning module 25 may be an infrared scanner or other scanner. In this embodiment, the scanning module 25 is an infrared scanner.

The translation module 26 is used to implement translations between Chinese and other languages. When translation is required, the scanning module 25 scans the information and sends the scanned information to the processor 28. The processor 28 sends the information scanned by the scanning module 25 to the translation module 26. The translation module 26 translates the scanned information and communicates the translation results to the processor 28. The processor 28 sends instructions to the display module 24, and the display module 24 presents the translation results to the user for viewing. The translation module 26 enables a user to use the electronic device 100 by only scanning the text to be translated, which is simple and convenient.

The drawing conversion module 27 is used for converting three-view and three-dimensional views. When a conversion is required, the scanning module 25 scans the drawing and sends the scanned information to the processor 28. The processor 28 sends the information scanned by the scanning module 25 to the drawing conversion module 27. The drawing conversion module 27 converts the scanned information into a three-view and a three-dimensional view, and transmits the conversion result to the processor 28. The processor 28 sends instructions to the display module 24 which the display module 24 activates the projector to project to the user. Specifically, if the planar three-view is converted into a perspective view, the projector is a 3D projector. If the stereo image is converted into a planar three-view image, the projector is a 2D projector. The drawing file conversion module 27 effectively solves the problem of conversion between the 2D drawing and the 3D drawing, and only a user needs to use the intelligent pen for scanning. According to the flexible circuit board 10 provided by the invention, the circuit structure 12 is made of the conductive yarn on the flexible substrate 11, so that the functional modules 20 on the electronic device 100 can be electrically connected through the circuit structure 12, and the space of the flexible circuit board 10 is effectively saved.

In view of the above, although the preferred embodiments of the present invention have been disclosed for illustrative purposes, the present invention is not limited to the above-described embodiments, and those skilled in the relevant art can make various modifications and applications without departing from the scope of the basic technical idea of the present invention.

Claims

1. A flexible circuit board comprises a flexible substrate and a circuit structure arranged on the flexible substrate, wherein the circuit structure is made of conductive yarns, and the flexible circuit board is characterized by further comprising a film and a plastic layer, the film is arranged on the flexible substrate, the flexible substrate is provided with a plurality of holes, the conductive yarns sequentially penetrate through the holes and the film to form the circuit structure, and the plastic layer wraps the circuit structure.

2. The flexible circuit board of claim 1, wherein: the flexible circuit board is provided with a functional module, and the functional module is electrically connected with the flexible circuit board through the circuit structure.

3. A flexible circuit board manufacturing method comprising:

providing a flexible substrate, wherein a plurality of holes are formed in the flexible substrate;

disposing a thin film on the flexible substrate;

providing conductive yarns, and sequentially penetrating the conductive yarns through the holes and the film on the flexible substrate to fix the film and the flexible substrate to form a circuit structure;

and performing in-mold injection molding on the conductive yarn on the flexible substrate to form a plastic layer on the surface of the circuit structure so as to coat the circuit structure of the flexible substrate.

4. A method of manufacturing a flexible circuit board according to claim 3, wherein: the method also comprises the step of carrying out hot pressing treatment on the conductive yarn after the circuit structure is formed and before the conductive yarn on the flexible substrate is subjected to in-mold injection molding.

5. A method of manufacturing a flexible circuit board according to claim 3, wherein: the method comprises the step of detecting the conductivity of the flexible circuit board after the step of performing in-mold injection molding on the conductive yarn on the flexible substrate.

6. The method of manufacturing a flexible circuit board according to claim 5, wherein: and if the conductivity is detected to be qualified, performing secondary in-mold injection molding on the flexible substrate.

7. The method of manufacturing a flexible circuit board according to claim 6, wherein: and after the step of secondary in-mold injection molding, the method also comprises the step of carrying out laser processing on the flexible substrate and the conductive yarn and carrying out conductive property detection.

8. An electronic device comprises a flexible circuit board and a functional module arranged on the flexible circuit board, wherein the flexible circuit board comprises a flexible substrate and a circuit structure arranged on the flexible substrate, the functional module is electrically connected with the flexible circuit board through the circuit structure, and the circuit structure is made of conductive yarns.

9. The electronic device of claim 8, wherein: the electronic device is one of a smart pen, a smart wearable device, or a personal digital assistant.

10. The electronic device of claim 9, wherein: the functional module at least comprises one of an ambient light adjusting module, a voice module, a storage module, a display module, a scanning module, a translation module, a drawing conversion module and a processor.