CN107105571A - Flexible PCB and its manufacture method and the electronic installation with the flexible PCB - Google Patents
Flexible PCB and its manufacture method and the electronic installation with the flexible PCB Download PDFInfo
- Publication number
- CN107105571A CN107105571A CN201610097836.7A CN201610097836A CN107105571A CN 107105571 A CN107105571 A CN 107105571A CN 201610097836 A CN201610097836 A CN 201610097836A CN 107105571 A CN107105571 A CN 107105571A
- Authority
- CN
- China
- Prior art keywords
- flexible
- base board
- flexible base
- film
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10356—Cables
Abstract
The present invention provides a kind of flexible PCB, including flexible base board, and the flexible PCB also includes film, and the film is arranged on the flexible base board, and the flexible base board is provided with some cells, and the conductive yam sequentially passes through the cell and constitutes circuit with film.The present invention also provides a kind of flexible circuit board fabrication method, including：One flexible base board is provided；Film is set on the flexible base board；Conductive yam is sequentially passed through to the cell and film on the flexible base board, film and flexible base board are fixed, circuit is formed；Injection molding in mold is carried out to the conductive yam on flexible base board, to form the line construction of flexible base board.The present invention also provides a kind of electronic installation, including above-mentioned flexible PCB.The present invention can be electrically connected by making the functional module on line construction, the electronic installation using conductive yam on the flexible base board of flexible PCB by the line construction, effectively reduce the size of the flexible PCB.
Description
Technical field
The present invention relates to a kind of flexible PCB, flexible circuit board fabrication method and the electronic installation with the flexible PCB.
Background technology
At present, with the development of science and technology electronic technology field obtains development at full speed, client improves constantly to the demand of electronic installation, and particularly the structural requirement of electronic installation is more light small.Multiple functional modules are usually provided with current electronic installation, the plurality of functional module is typically attached by outer lead, so easily increases the inner space burden of the electronic installation, is unfavorable for electronic installation towards short and small frivolous trend development.
The content of the invention
In view of this, it is necessary to which a kind of flexible PCB for saving inner space is provided.
A kind of manufacture method of above-mentioned flexible PCB is provided in addition, there is a need to.
In addition, there is a need to a kind of electronic installation with the flexible PCB of proposition.
A kind of flexible PCB, including flexible base board, the flexible PCB also include film, and the film is arranged on the flexible base board, and the flexible base board is provided with some cells, and the conductive yam sequentially passes through the cell and constitutes circuit with film.
A kind of flexible circuit board fabrication method, including：One flexible base board is provided；Film is set on the flexible base board；Conductive yam is sequentially passed through into the cell on the thin film flexible substrate, thin film flexible substrate is fixed, circuit is formed；Injection molding in mold is carried out to conductive yam, to form the line construction of flexible base board.
A kind of electronic installation, including above-mentioned flexible PCB.
Flexible PCB and its manufacture method that the present invention is provided and the electronic installation with the flexible PCB, by making line construction using conductive yam on the flexible base board of flexible PCB, functional module on the electronic installation can be electrically connected by the line construction, the size of the flexible PCB is effectively reduced, product space is saved while the functional requirement of electronic installation is met.
Brief description of the drawings
Fig. 1 is the structural representation of the electronic installation shown in present pre-ferred embodiments.
Fig. 2 is the structural representation of the flexible PCB shown in present pre-ferred embodiments.
Fig. 3 is the flow chart of flexible circuit board fabrication method shown in Fig. 2.
Fig. 4 is the functional block diagram that flexible PCB shown in Fig. 2 is applied to electronic installation.
Main element symbol description
| Electronic installation | 100 |
| Flexible PCB | 10 |
| Functional module | 20 |
| Flexible base board | 11 |
| Line construction | 12 |
| Cell | 13 |
| Ambient light adjustment module | 21 |
| Voice module | 22 |
| Memory module | 23 |
| Display module | 24 |
| Scan module | 25 |
| Translation module | 26 |
| Map file modular converter | 27 |
| Processor | 28 |
| OPTICAL SENSORS | 211 |
| Light source | 212 |
| Voice recorder | 221 |
| Speech player | 222 |
| Display screen | 241 |
| Projecting cell | 242 |
Following embodiment will further illustrate the present invention with reference to above-mentioned accompanying drawing.
Embodiment
Fig. 1 and Fig. 2 are referred to, present pre-ferred embodiments disclose a kind of electronic installation 100.In this preferred embodiment, the electronic installation 100 is a smart pen, and the electronic installation 100 includes flexible PCB 10 and functional module 20.The functional module 20 is arranged on the flexible PCB 10, and is electrically connected by the line construction 12 being made up of conductive yam, and then effectively saves the inner space of electronic installation 100.
Referring to Fig. 2, the flexible PCB 10 includes flexible base board 11 and the line construction 12 being arranged on the flexible base board 11.The flexible base board 11 is made up of insulation high-temperature-resistant material.Functional module 20 is provided with the flexible base board 11, the functional module 20 includes the module to realize each function, such as display module.The line construction 12 is made by conductive yam, to the functional module 20 being connected on flexible PCB 10.Multiple cells 13 are provided with the flexible base board 11, the consecutive intervals of cell 13 are set, on the panel for being distributed in whole flexible base board 11.The conductive yam may pass through in each continuous cell 13 on the flexible base board 11, and then be woven into the line construction 12.
Referring to Fig. 3, present pre-ferred embodiments disclose a kind of manufacture method of flexible PCB 10.The manufacture method of flexible PCB 10 comprises the following steps：
S1：One flexible base board 11 is provided, multiple cells 13 are opened up on the flexible base board 11, film 30 is set on flexible base board 11.In the present embodiment, the film is PET film.
S2：Conductive yam is provided, conductive yam is sequentially passed through to the cell 13 and film 30 on the flexible base board 11, so as to fix film 30 with flexible base board 11 using conductive yam, so as to form circuit on flexible base board 11.The film 30 is to prevent conductive yam to be broken in hot pressing and injection moulding.
S3：Hot-pressing processing is carried out to conductive yam, to cause the conductive yam on flexible base board 11 to be mutually flush.
S4：Flexible base board 11 is positioned in injection molding, to being provided with progress injection molding in mold at conductive yam on flexible base board 11, to coat one layer of plastic cement to the conductive yam on flexible base board 11, so as to form the line construction 12 of flexible base board 11.In the present embodiment, the injection plastic cement is thermoplastic vulcanizates silica gel.
S5：Electric conductivity detection is carried out to the flexible PCB 10 after injection molding in mold, S6 is performed if energy is conductive.
S6：Secondary injection molding in mold is carried out to flexible base board 11, to form preferably appearance member.In the present embodiment, the injection material of the appearance member can be thermoplastic vulcanizates silica gel.
S7：Radium-shine processing is carried out to flexible PCB 10, to cut off the conductive yam outwards overflowed from film 30 on flexible PCB 10 after secondary injection molding in mold.
S8：Electric conductivity detection is carried out to flexible PCB 10, the manufacture of flexible PCB 10 is completed if energy is conductive.
It is appreciated that above-mentioned flexible PCB 10 can be applied to electronic installation 100.The electronic installation 100 can be mobile phone or smart pen etc..In the present embodiment, it is illustrated so that the electronic installation 100 is a smart pen as an example.
Referring to Fig. 4, the functional module 20 at least includes ambient light adjustment module 21, voice module 22, memory module 23, display module 24, scan module 25, translation module 26, map file modular converter 27 and processor 28.The ambient light adjustment module 21, voice module 22, memory module 23, display module 24, scan module 25, translation module 26, map file modular converter 27 are electrically connected with the processor 28.
The ambient light adjustment module 21 is used for the intensity for adjusting the light of user's local environment.In the present embodiment, the ambient light adjustment module 21 includes OPTICAL SENSORS 211 and light source 212.When the intensity that OPTICAL SENSORS 211 senses light is less than a certain preset value, the OPTICAL SENSORS 211 sends a signal to the processor 28.The processor 28 sends a control signal to the light source 212, to control the light source 212 outwards transmitting light, and the gradually intensity of increase transmitting light, until the intensity for the light that OPTICAL SENSORS 211 is sensed reaches preset value.Now the light source 212 stops the intensity of increase transmitting light, to be maintained at the intensity level of current light.The ambient light adjustment module 21 may be such that user when using electronic installation 100, is under suitable luminous intensity environment, be beneficial to the eyes for protecting user.
The voice module 22 includes voice recorder 221 and speech player 222.The voice recorder 221 is used to record voice, and by the voice transfer of record to the processor 28.The processor 28 is by phonetic storage in memory module 23, and the speech player 222 is used for the voice for playing the memory storage of memory module 23.The voice module 22 is to cause user when using smart pen, to can record and play voice.
The display module 24 is used to be presented information, including display screen 241 and projecting cell 242, and the projecting cell 242 includes 2D projecting apparatus and 3D projecting apparatus.The electronic information that the display screen 241 is used in display electronics assemblies 100, is checked for user.The signal that the projecting apparatus is used to send processor 28 carries out projective amplification so that user only please unify modification by electronic installation 100 can carry out 2D or 3D amplification to picture, to watch.
The scan module 25 is used for scanning information, and the information of scanning is sent to processor 28.The scan module 25 can be infrared scanner or other scanners.In the present embodiment, the scan module 25 is infrared scanner.
The translation module 26 is used to realize the translation between Chinese and other language.When needing to be translated, scan module 25 is first scanned to information, and the information of scanning is sent to the processor 28.The processor 28 sends the information that scan module 25 is scanned to the translation module 26.The information of 26 pairs of scannings of the translation module is translated, and translation result is sent into processor 28.The processor 28 sends a command to the display module 24, and translation result is presented to user and checked by the display module 24.The translation module 26 causes user when using electronic installation 100, it is only necessary to the word for needing to translate is scanned, relatively simple convenience.
The map file modular converter 27 is used for the conversion of three-view diagram and stereogram.When needing to be changed, scan module 25 is first scanned to drawing, and the information of scanning is sent to processor 28.The processor 28 sends the information that scan module 25 is scanned to the map file modular converter 27.The information of 27 pairs of scanning of the map file modular converter carries out the conversion of three-view diagram and stereogram, and the result of conversion is sent into the processor 28.The processor 28 sends a command to the display module 24, and the display module 24 starts projecting apparatus and projected, and is presented to user.If specifically, plane three-view diagram is converted into stereogram, then projecting apparatus is 3D projecting apparatus.If stereogram is converted into plane three-view diagram, then projecting apparatus is 2D projecting apparatus.The map file modular converter 27 effectively solves the transfer problem between 2D figures and 3D figures, and only needs user to be scanned using the smart pen.The flexible PCB 10 that the present invention is provided using conductive yam on flexible base board 11 by making line construction 12, so that the functional module 20 on the electronic installation 100 can be electrically connected by the line construction 12, the space of the flexible PCB 10 is effectively saved.
In summary, although having been disclosed for the preferred embodiments of the present invention for the purpose of illustration, however, the present invention is not limited solely to embodiment as described above, in the category without departing from basic fundamental thought of the present invention, the technical staff of relevant industries can carry out various deformation and application to it.
Claims (10)
1. a kind of flexible PCB, including flexible base board, it is characterised in that:The flexible PCB also includes film, and the film is arranged on the flexible base board, and the flexible base board is provided with some cells, and the conductive yam sequentially passes through the cell and constitutes circuit with film.
2. flexible PCB as claimed in claim 1, it is characterised in that：Functional module is provided with the flexible PCB, the functional module includes the module for realizing each function, and the module is electrically connected by the circuit.
3. a kind of flexible circuit board fabrication method, including：
One flexible base board is provided；
Film is set on the flexible base board；
Conductive yam is sequentially passed through to the cell and film on the flexible base board, film and flexible base board are fixed, circuit is formed；
Injection molding in mold is carried out to the conductive yam on flexible base board, to form the line construction of flexible base board.
4. flexible circuit board fabrication method as claimed in claim 3, it is characterised in that：The step of flexible circuit board fabrication method is additionally included on flexible base board between the step of setting film and conductive yam is sequentially passed through to cell and the film on the flexible base board to conductive yam progress hot-pressing processing.
5. flexible circuit board fabrication method as claimed in claim 3, it is characterised in that：The flexible circuit board fabrication method is additionally included in the step of to the conductive yam on flexible base board detect the electric conductivity of flexible PCB after injection molding in mold step.
6. flexible circuit board fabrication method as claimed in claim 5, it is characterised in that：If the electric conductivity detection is qualified, secondary injection molding in mold is carried out to the flexible base board.
7. flexible circuit board fabrication method as claimed in claim 6, it is characterised in that：The flexible circuit board fabrication method is additionally included in after the secondary injection molding in mold step the step of carrying out radium-shine processing to the flexible base board and conductive yam and carry out electric conductivity detection.
8. a kind of electronic installation, including the flexible PCB as described in claim 1-7.
9. electronic installation as claimed in claim 8, it is characterised in that：The electronic installation is one in smart pen, intelligent object wearing device or personal digital assistant.
10. electronic installation as claimed in claim 9, it is characterised in that：The functional module at least includes one in ambient light adjustment module, voice module, memory module, display module, scan module, translation module, map file modular converter and processor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610097836.7A CN107105571B (en) | 2016-02-23 | 2016-02-23 | Flexible circuit board, manufacturing method thereof and electronic device with flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610097836.7A CN107105571B (en) | 2016-02-23 | 2016-02-23 | Flexible circuit board, manufacturing method thereof and electronic device with flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107105571A true CN107105571A (en) | 2017-08-29 |
| CN107105571B CN107105571B (en) | 2020-08-18 |
Family
ID=59658803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610097836.7A Active CN107105571B (en) | 2016-02-23 | 2016-02-23 | Flexible circuit board, manufacturing method thereof and electronic device with flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107105571B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102511203A (en) * | 2009-09-24 | 2012-06-20 | 皇家飞利浦电子股份有限公司 | Electronic textile with local energy supply devices |
| CN103109009A (en) * | 2010-09-22 | 2013-05-15 | 皇家飞利浦电子股份有限公司 | Knitted textile substrate with different stitch patterns and electronic textile |
| CN103109586A (en) * | 2010-09-21 | 2013-05-15 | 皇家飞利浦电子股份有限公司 | Electronic textile and method of manufacturing an electronic textile |
| CN105405365A (en) * | 2015-12-02 | 2016-03-16 | 龙川耀宇科技有限公司 | Flexible display screen |
-
2016
- 2016-02-23 CN CN201610097836.7A patent/CN107105571B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102511203A (en) * | 2009-09-24 | 2012-06-20 | 皇家飞利浦电子股份有限公司 | Electronic textile with local energy supply devices |
| CN103109586A (en) * | 2010-09-21 | 2013-05-15 | 皇家飞利浦电子股份有限公司 | Electronic textile and method of manufacturing an electronic textile |
| CN103109009A (en) * | 2010-09-22 | 2013-05-15 | 皇家飞利浦电子股份有限公司 | Knitted textile substrate with different stitch patterns and electronic textile |
| CN105405365A (en) * | 2015-12-02 | 2016-03-16 | 龙川耀宇科技有限公司 | Flexible display screen |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107105571B (en) | 2020-08-18 |
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| TR01 | Transfer of patent right |
Effective date of registration: 20230619 Address after: 065000 No. 369 Jianshe South Road, anci District, Langfang City, Hebei Province Patentee after: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO.,LTD. Address before: 518109 A building, F3 District, Foxconn science and Technology Industrial Park, Longhua Town, Shenzhen, Guangdong, Baoan District Patentee before: Shenzhen Futaihong Precision Industry Co.,Ltd. |
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| TR01 | Transfer of patent right |