CN107105145A - It is a kind of to strengthen the camera of heat sinking function - Google Patents
It is a kind of to strengthen the camera of heat sinking function Download PDFInfo
- Publication number
- CN107105145A CN107105145A CN201710370199.0A CN201710370199A CN107105145A CN 107105145 A CN107105145 A CN 107105145A CN 201710370199 A CN201710370199 A CN 201710370199A CN 107105145 A CN107105145 A CN 107105145A
- Authority
- CN
- China
- Prior art keywords
- camera
- circuit substrate
- image sensor
- power supply
- sinking function
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 238000003384 imaging method Methods 0.000 claims abstract description 10
- 230000002708 enhancing effect Effects 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 3
- 239000011261 inert gas Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 2
- 230000017525 heat dissipation Effects 0.000 abstract description 5
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/51—Housings
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Cameras Adapted For Combination With Other Photographic Or Optical Apparatuses (AREA)
Abstract
Strengthen the camera of heat sinking function the invention discloses a kind of, be made up of camera lens, shell, image sensor circuit substrate, interface signal and power supply board, joint wire harness, imaging signal processing circuit substrate and transducer room；Camera lens, image sensor circuit substrate, interface signal and power supply board, joint wire harness, imaging signal processing circuit substrate are each attached on shell；Transducer room is provided between camera lens and image sensor circuit substrate；Image sensor circuit substrate, interface signal are connected with power supply board, imaging signal processing circuit substrate by soft arranging wire or substrate.The present invention solves the heat dissipation problem inside camera, improves the purpose of camera image q＆r.
Description
Technical field
The invention belongs to camera structure design field, it is related to a kind of camera, and in particular to one kind enhancing radiating
The camera of function.
Background technology
Camera is a kind of image input device, is all configured on the user terminal such as many computers, mobile phone for applying at present
There is camera.
See Fig. 1, the existing usual printed circuit board (PCB) of camera（PCB）Substrate（Image sensor IC, Yi Jitu
As processing, power supply and interface signal process circuit etc.）, camera lens, shell and joint wire harness etc. composition.With other electronic equipments one
Sample, PCB is included at many circuits, such as power supply regulation, the reduction of input and output noise, antinoise, circuit protection and image
Reason etc..
As more high pixel density and frame rate catch the trend of image, the capture of image and treating capacity increase, this causes
Imaging sensor and the circuit on PCB produce higher heat.The temperature upper limit of most of cameras and electronic product
About 50 ~ 60 degrees centigrades, when close to ceiling temperature, noise is begun to appear in the image captured, heat in camera
Accumulation turn into thorny problem, therefore, the heat dissipation problem inside camera in the urgent need to address, improve camera image quality and
Reliability.
The content of the invention
In order to solve the above-mentioned technical problem, the invention provides a kind of utilization space structure design and heat conduction and heat radiation design phase
With reference to, avoid heat accumulation, miniaturization enhancing heat sinking function camera.
The technical solution adopted in the present invention is：It is a kind of to strengthen the camera of heat sinking function, it is characterised in that：By camera lens,
Shell, image sensor circuit substrate, interface signal and power supply board, joint wire harness, imaging signal processing circuit substrate and biography
Sensor room is constituted；
The camera lens, image sensor circuit substrate, interface signal and power supply board, joint wire harness, imaging signal processing circuit
Substrate is each attached on the shell；
Transducer room is provided between the camera lens and image sensor circuit substrate；
Described image sensor circuit substrate, interface signal and power supply board, imaging signal processing circuit substrate pass through soft arranging wire
Or substrate is connected.
The structure for a kind of enhancing heat sinking function that the present invention is provided, each electronic functional module（Thermal source）Separation, and put
Put in relative existing structure space length structure farther out, and pass through the fin such as thermal conductive polymer, aluminium, aluminium alloy or knot
The mode of filling heat-conductive glue carries out enhanced radiating in structure cavity, and to reach the heat dissipation problem inside solution camera, raising is taken the photograph
As head picture quality and the purpose of reliability.
Brief description of the drawings
Fig. 1 is camera structure figure in the prior art of the invention；
Fig. 2 be the present invention be embodiment 1 structural representation；
Fig. 3 be the present invention be embodiment 2 structural representation；
Fig. 4 be the present invention be embodiment 3 structural representation.
Embodiment
Understand for the ease of those of ordinary skill in the art and implement the present invention, below in conjunction with the accompanying drawings and embodiment is to this hair
It is bright to be described in further detail, it will be appreciated that implementation example described herein is merely to illustrate and explain the present invention, not
For limiting the present invention.
Embodiment 1：
See the camera of Fig. 1, the present invention a kind of enhancing heat sinking function provided, by camera lens 1, shell 2, image sensor circuit
Substrate 3, interface signal and power supply board 4, joint wire harness 5, imaging signal processing circuit substrate 6 and transducer room 7 are constituted.
Image sensor circuit substrate 3 is fixed on shell 2 by screw or UV solidification glues（Upper part）On.
Interface（LVDS）Signal and power supply board 4 are fixed by screws in shell 2（Lower part）On, and polymerize by heat conduction
The cavity filling heat-conductive glue of the fin such as thing, aluminium, aluminium alloy or lower casing is radiated.
Picture signal processing（ISP）Circuit substrate 6 is fixed on shell 2 by neck（Lower part）On, and it is poly- by heat conduction
The fin such as compound, aluminium, aluminium alloy or picture signal processing（ISP）The cavity filling heat-conductive glue of circuit substrate 6 is radiated.
Joint wire harness 5 is arranged on shell 2 by injection（Lower part）On.
Camera lens 1 is fixed on shell 2 by screw thread or UV solidification glues（Upper part）On.
Image sensor circuit substrate 3, interface（LVDS）Signal and power supply board 4, picture signal processing（ISP）Circuit base
Plate 6 is connected by soft arranging wire or substrate.
Transducer room 7 is provided between camera lens 1 and image sensor circuit substrate 3；
The dry inert gas of injection in transducer room 7.
In the present embodiment, interface（LVDS）Signal and power supply board 4 are arranged on after image sensor circuit substrate 3, image
Signal transacting（ISP）Circuit substrate 6 is arranged on interface（LVDS）Signal and the bottom of power supply board 4.
In embodiment 2, interface（LVDS）Signal and power supply board 4, picture signal processing（ISP）Circuit substrate 6 is set respectively
Put in the top and the bottom of shell 2, joint wire harness 5 is arranged on the middle part of shell 2.
In embodiment 3, joint wire harness 5, interface（LVDS）Signal and power supply board 4, picture signal processing（ISP）Circuit base
Plate 6 is arranged on the upper, middle and lower portion of shell 2 with this.
This three embodiments, separate three pieces of circuit substrate complete spaces, and carrying out space structure layout makes each thermal source phase
Adjust the distance farther out, and radiated with reference to heat dissipation design, to reach the heat dissipation problem inside solution camera, improve camera figure
As the purpose of q＆r.
It should be appreciated that the part that this specification is not elaborated belongs to prior art.
It should be appreciated that the above-mentioned description for preferred embodiment is more detailed, therefore it can not be considered to this
The limitation of invention patent protection scope, one of ordinary skill in the art is not departing from power of the present invention under the enlightenment of the present invention
Profit is required under protected ambit, can also be made replacement or be deformed, each fall within protection scope of the present invention, this hair
It is bright scope is claimed to be determined by the appended claims.
Claims (6)
1. a kind of strengthen the camera of heat sinking function, it is characterised in that：By camera lens（1）, shell（2）, image sensor circuit base
Plate（3）, interface signal and power supply board（4）, joint wire harness（5）, imaging signal processing circuit substrate（6）And transducer room（7）
Composition；
The camera lens（1）, image sensor circuit substrate（3）, interface signal and power supply board（4）, joint wire harness（5）, image
Signal processing circuit substrate（6）It is each attached to the shell（2）On；
The camera lens（1）With image sensor circuit substrate（3）Between be provided with transducer room（7）；
Described image sensor circuit substrate（3）, interface signal and power supply board（4）, imaging signal processing circuit substrate（6）It is logical
Cross soft arranging wire or substrate is connected.
2. the camera of enhancing heat sinking function according to claim 1, it is characterised in that：Interface signal and the power supply base
Plate（4）It is configured with radiating tissue.
3. the camera of enhancing heat sinking function according to claim 2, it is characterised in that：The radiating tissue is gathered by heat conduction
Compound, metal fin or heat-conducting glue composition.
4. the camera of enhancing heat sinking function according to claim 1, it is characterised in that：Described image signal processing circuit
Substrate（6）It is configured with radiating tissue.
5. the camera of enhancing heat sinking function according to claim 4, it is characterised in that：The radiating tissue is gathered by heat conduction
Compound, metal fin or heat-conducting glue composition.
6. the camera of the enhancing heat sinking function according to claim 1-5 any one, it is characterised in that：The sensor
Room（7）Inside it is marked with dry inert gas.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710370199.0A CN107105145A (en) | 2017-05-23 | 2017-05-23 | It is a kind of to strengthen the camera of heat sinking function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710370199.0A CN107105145A (en) | 2017-05-23 | 2017-05-23 | It is a kind of to strengthen the camera of heat sinking function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107105145A true CN107105145A (en) | 2017-08-29 |
Family
ID=59669549
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710370199.0A Pending CN107105145A (en) | 2017-05-23 | 2017-05-23 | It is a kind of to strengthen the camera of heat sinking function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107105145A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108989643A (en) * | 2018-08-09 | 2018-12-11 | 上海保隆汽车科技股份有限公司 | A kind of vehicle-mounted camera |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006033031A (en) * | 2004-07-12 | 2006-02-02 | Casio Comput Co Ltd | Portable image photography system |
| US20060043555A1 (en) * | 2004-08-24 | 2006-03-02 | Liu Chung Y | Sensor package |
| US20140168507A1 (en) * | 2012-12-17 | 2014-06-19 | Integrated Micro-Electronics, Inc. | Camera Module With Enhanced Heat Dissipation |
| CN104994713A (en) * | 2015-07-14 | 2015-10-21 | 广东欧珀移动通信有限公司 | Mobile terminal and heat radiation structure thereof |
| CN105992501A (en) * | 2015-02-12 | 2016-10-05 | 广州世荣电子有限公司 | Camera |
| CN206807599U (en) * | 2017-05-23 | 2017-12-26 | 武汉雷微视达科技有限公司 | A kind of camera for strengthening heat sinking function |
-
2017
- 2017-05-23 CN CN201710370199.0A patent/CN107105145A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006033031A (en) * | 2004-07-12 | 2006-02-02 | Casio Comput Co Ltd | Portable image photography system |
| US20060043555A1 (en) * | 2004-08-24 | 2006-03-02 | Liu Chung Y | Sensor package |
| US20140168507A1 (en) * | 2012-12-17 | 2014-06-19 | Integrated Micro-Electronics, Inc. | Camera Module With Enhanced Heat Dissipation |
| CN105992501A (en) * | 2015-02-12 | 2016-10-05 | 广州世荣电子有限公司 | Camera |
| CN104994713A (en) * | 2015-07-14 | 2015-10-21 | 广东欧珀移动通信有限公司 | Mobile terminal and heat radiation structure thereof |
| CN206807599U (en) * | 2017-05-23 | 2017-12-26 | 武汉雷微视达科技有限公司 | A kind of camera for strengthening heat sinking function |
Non-Patent Citations (1)
| Title |
|---|
| 姜威: "《电子系统设计与学科竞赛培训教程 实用电子系统设计基础》", 北京理工大学出版社, pages: 84 - 95 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108989643A (en) * | 2018-08-09 | 2018-12-11 | 上海保隆汽车科技股份有限公司 | A kind of vehicle-mounted camera |
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