CN107086356B - Antenna Module and Terminal - Google Patents
Antenna Module and Terminal Download PDFInfo
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- CN107086356B CN107086356B CN201710353157.6A CN201710353157A CN107086356B CN 107086356 B CN107086356 B CN 107086356B CN 201710353157 A CN201710353157 A CN 201710353157A CN 107086356 B CN107086356 B CN 107086356B
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- 238000006243 chemical reaction Methods 0.000 claims abstract description 29
- 239000003990 capacitor Substances 0.000 claims description 124
- 239000013078 crystal Substances 0.000 claims description 8
- 238000012545 processing Methods 0.000 claims description 8
- 238000003466 welding Methods 0.000 claims description 5
- 230000009977 dual effect Effects 0.000 claims description 4
- 238000004891 communication Methods 0.000 abstract description 13
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 230000009286 beneficial effect Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- 230000005540 biological transmission Effects 0.000 description 4
- BQENMISTWGTJIJ-UHFFFAOYSA-N 2,3,3',4,5-pentachlorobiphenyl Chemical compound ClC1=CC=CC(C=2C(=C(Cl)C(Cl)=C(Cl)C=2)Cl)=C1 BQENMISTWGTJIJ-UHFFFAOYSA-N 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
- H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
Abstract
The disclosure relates to an antenna module and a terminal. The antenna module comprises a first antenna, an impedance matching module, a signal conversion module and a dual-mode chip; the first antenna is connected with the first end of the impedance matching module, the second end of the impedance matching module is connected with the first end of the signal conversion module, and the second end of the signal conversion module is connected with the first end of the dual-mode chip; the impedance matching module is used for balancing the impedance of the first end of the impedance matching module and the impedance of the second end of the impedance matching module; the signal conversion module is used for converting the differential signal output by the first end of the dual-mode chip into a single-ended signal. In the technical scheme, the dual-mode chip can support Wi-Fi and Bluetooth signals at the same time, so that Wi-Fi and Bluetooth communication can be realized at the same time through the cooperation of the dual-mode chip and the antenna, the structure of the antenna module is simplified, and the manufacturing cost of the antenna module is reduced.
Description
Technical Field
The disclosure relates to the field of communication technologies, and in particular, to an antenna module and a terminal.
Background
Along with the continuous improvement of the living standard of people, the mobile phone becomes a necessary product in the life of people, and the use frequency is also higher and higher. The user not only needs normal communication of the mobile phone and can connect Wi-Fi (Wireless-Fidelity) or Bluetooth to carry out data transmission, but also needs small space occupied by the antenna so as to realize the light and thin of the mobile phone, so that the design requirement on the mobile phone antenna is higher and higher.
Disclosure of Invention
In order to overcome the problems in the related art, embodiments of the present disclosure provide an antenna module and a terminal. The technical scheme is as follows:
according to a first aspect of embodiments of the present disclosure, an antenna module is provided, including a first antenna, an impedance matching module, a signal conversion module, and a dual-mode chip;
the first antenna is connected with the first end of the impedance matching module, the second end of the impedance matching module is connected with the first end of the signal conversion module, and the second end of the signal conversion module is connected with the first end of the dual-mode chip;
the impedance matching module is used for balancing the impedance of the first end of the impedance matching module and the impedance of the second end of the impedance matching module;
the signal conversion module is used for converting the differential signal output by the first end of the dual-mode chip into a single-ended signal.
The technical scheme provided by the embodiment of the disclosure can comprise the following beneficial effects: because the dual-mode chip can support Wi-Fi and Bluetooth signals simultaneously, wi-Fi and Bluetooth communication can be realized simultaneously through the cooperation of the dual-mode chip and the antenna, the structure of the antenna module is simplified, and the manufacturing cost of the antenna module is reduced.
In one embodiment, the antenna module further comprises a connection module;
the connecting module is connected with the third end of the impedance matching module;
the connecting module is used for externally connecting a second antenna;
the impedance matching module is further configured to balance an impedance of a third end of the impedance matching module and a second end of the impedance matching module.
The technical scheme provided by the embodiment of the disclosure can comprise the following beneficial effects: when the working state of the first antenna is poor, the antenna module can be externally connected with the second antenna through the connecting module, so that the flexibility and the practicability of the antenna module are improved.
In one embodiment, the antenna module is disposed on a printed circuit board PCB;
the PCB further comprises a plurality of leads and a plurality of output ends, wherein the plurality of output ends are arranged at the edge of the PCB;
the plurality of leads are for connecting a plurality of output pins of the dual mode chip to the plurality of output terminals.
The technical scheme provided by the embodiment of the disclosure can comprise the following beneficial effects: the plurality of leads are used for connecting a plurality of output pins of the dual-mode chip to a plurality of output ends at the edge of the PCB, so that convenience of using the dual-mode chip by a user is improved, and user experience is further improved.
In one embodiment, the PCB further comprises a soldering region of an impedance matching module; the welding area of the impedance matching module comprises a first capacitance pad, a second capacitance pad, a third capacitance pad, a fourth capacitance pad and a fifth capacitance pad;
a first end of the first capacitor pad is connected with the first antenna, and a second end of the first capacitor pad is connected with a grounding end;
the first end of the second capacitor pad is connected with the first end of the first capacitor pad, and the second end of the second capacitor pad is connected with the first end of the third capacitor pad;
the second end of the third capacitor pad is connected with the grounding end;
the first end of the fourth capacitor pad is connected with the first end of the third capacitor pad, and the second end of the fourth capacitor pad is connected with the first end of the fifth capacitor pad;
the first end of the fifth capacitor pad is connected with the connection module; the second end of the fifth capacitor pad is connected with the grounding end.
The technical scheme provided by the embodiment of the disclosure can comprise the following beneficial effects: the welding area of the PCB impedance matching module is provided with a plurality of different capacitor pads, and the capacitors can be inserted into the different capacitor pads under different conditions, so that the application diversity of the antenna module is improved, and the practicability of the antenna module is further improved.
In one embodiment, the impedance matching module further comprises a first capacitance, a second capacitance, and a third capacitance;
the first capacitor is inserted into the first capacitor bonding pad, the second capacitor is inserted into the second capacitor bonding pad, and the third capacitor is inserted into the third capacitor bonding pad.
The technical scheme provided by the embodiment of the disclosure can comprise the following beneficial effects: through peg graft first electric capacity respectively at first electric capacity pad, second electric capacity pad and third electric capacity pad for antenna module can realize Wi-Fi and bluetooth's communication through first antenna, simplified antenna module's structure, reduced antenna module's cost of manufacture.
In one embodiment, the impedance matching module further comprises a fourth capacitance, a fifth capacitance, and a sixth capacitance;
the fourth capacitor is inserted into the third capacitor bonding pad, the fifth capacitor is inserted into the fourth capacitor bonding pad, and the sixth capacitor is inserted into the fifth capacitor bonding pad.
The technical scheme provided by the embodiment of the disclosure can comprise the following beneficial effects: through peg graft fourth electric capacity respectively at third electric capacity pad, fourth electric capacity pad and fifth electric capacity pad, fifth electric capacity and sixth electric capacity for antenna module can realize Wi-Fi and bluetooth's communication through the second antenna, simplified antenna module's structure, reduced antenna module's cost of manufacture.
In one embodiment, there is a region of overlap of the second and fourth capacitive pads.
The technical scheme provided by the embodiment of the disclosure can comprise the following beneficial effects: through setting up the coincidence region at second electric capacity pad and fourth electric capacity pad, avoided through the lead connection between second electric capacity pad and the fourth electric capacity pad, and then avoided the mutual influence between first antenna working line and the second antenna working line.
In one embodiment, the antenna module further comprises a HomeKit chip;
the HomeKit chip is connected with the second end of the dual-mode chip.
The technical scheme provided by the embodiment of the disclosure can comprise the following beneficial effects: by arranging the HomeKit chip on the antenna module, the antenna module can be applied to the equipment of the ios system, and the applicability of the antenna module is improved.
In one embodiment, the signal conversion module includes a balun filter.
The technical scheme provided by the embodiment of the disclosure can comprise the following beneficial effects: and the balun filter is used for realizing signal conversion, so that the efficiency of signal conversion is improved.
In one embodiment, the antenna module further comprises a flash memory module and a crystal oscillator module;
the flash memory module is connected with a third end of the dual-mode chip;
and the crystal oscillator module is connected with the fourth end of the dual-mode chip.
The technical scheme provided by the embodiment of the disclosure can comprise the following beneficial effects: by arranging the flash memory module and the crystal oscillator module on the antenna module, the signal processing speed and the signal processing precision of the dual-mode chip are improved, and the performance of the antenna module is further improved.
According to a second aspect of embodiments of the present disclosure, a terminal is provided, including any one of the antenna modules described above.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure.
Fig. 1 is a schematic diagram illustrating a structure of an antenna module according to an exemplary embodiment.
Fig. 2 is a schematic diagram illustrating a structure of an antenna module according to an exemplary embodiment.
Fig. 3 is a schematic diagram illustrating a structure of an antenna module according to an exemplary embodiment.
FIG. 4 is a functional diagram of a dual-mode chip shown according to an exemplary embodiment.
Fig. 5 is a circuit diagram illustrating an impedance matching module according to an exemplary embodiment.
Fig. 6 is a block diagram of an impedance matching module pad according to an exemplary embodiment.
Fig. 7 is a schematic diagram illustrating a structure of an antenna module according to an exemplary embodiment.
Fig. 8 is a schematic diagram illustrating a structure of an antenna module according to an exemplary embodiment.
Detailed Description
Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples are not representative of all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with some aspects of the present disclosure as detailed in the accompanying claims.
The technical scheme provided by the embodiment of the disclosure relates to an antenna module, which can be applied to mobile phones, tablet computers, smart watches and other devices capable of Wi-Fi or Bluetooth communication, and the embodiment of the disclosure is not limited to this. In the related art, in order to support signal receiving or transmitting of Wi-Fi and bluetooth at the same time, two chips are usually required to be arranged on the antenna module, wherein one chip is used for supporting processing of Wi-Fi signals, and the other chip is used for supporting processing of bluetooth signals, so that the antenna module is complex in structure and high in hardware cost, and meanwhile, the requirements of miniaturization development of terminals are not met. The technical scheme provided by the embodiment of the disclosure can set the dual-mode chip in the antenna module, and the dual-mode chip can simultaneously support Wi-Fi and Bluetooth signal processing, so that Wi-Fi and Bluetooth communication can be simultaneously realized through the cooperation of the dual-mode chip and the antenna, the structure of the antenna module is simplified, and the manufacturing cost of the antenna module is reduced.
The disclosed embodiment shows an antenna module 10 according to an exemplary embodiment, and as shown in fig. 1, the antenna module 10 includes a first antenna 101, an impedance matching module 102, a signal conversion module 103, and a dual-mode chip 104.
The first antenna 101 is connected to a first end of the impedance matching module 102, a second end of the impedance matching module 102 is connected to a first end of the signal conversion module 103, and a second end of the signal conversion module 103 is connected to a first end of the dual-mode chip 104. The impedance matching module 102 is configured to balance the impedance of the first end of the impedance matching module 102 and the second end of the impedance matching module 102; the signal conversion module 103 is configured to convert a differential signal output from the first end of the dual-mode chip 104 into a single-ended signal.
For example, if the impedance of the first antenna 101 is not matched with the impedance of the dual-mode chip 104, the signal output by the dual-mode chip 104 is not matched with the first antenna 101, so that the transmission efficiency of the first antenna 101 is low, the sensitivity is poor, and the like, so that the impedance of the first antenna 101 and the impedance of the dual-mode chip 104 can be balanced through the impedance matching module 102, so that the impedance of the first antenna 101 and the impedance of the dual-mode chip are approximately the same, and the transmission efficiency and the sensitivity of the first antenna 101 are ensured. Meanwhile, since the first antenna 101 can only transmit a single-ended signal and the dual-mode chip 104 outputs a differential signal, the signal conversion module 103 can convert the differential signal output by the dual-mode chip 104 into a single-ended signal, and the signal conversion module 103 can also convert the single-ended signal received by the first antenna 101 into a differential signal.
In the technical scheme provided by the embodiment of the disclosure, because the dual-mode chip 104 can support Wi-Fi and Bluetooth signals at the same time, wi-Fi and Bluetooth communication can be realized at the same time through the cooperation of the dual-mode chip 104 and the antenna, the structure of the antenna module 10 is simplified, and the manufacturing cost of the antenna module 10 is reduced.
In one embodiment, as shown in fig. 2, the antenna module 10 further includes a connection module 105. Wherein the connection module 105 is connected to the third terminal of the impedance matching module 102; the connection module 105 is used for externally connecting the second antenna 20; the impedance matching module 102 is further configured to balance the impedance of the third end of the impedance matching module 102 and the second end of the impedance matching module 102.
In practical application, because the transmitting power of the first antenna 101 is limited, effective signals may not be received or signals carrying information may be transmitted in some unstable signal areas, so the antenna module 10 may be provided with the connection module 105, when the first antenna 101 cannot meet the communication requirement, the second antenna 20 may be externally connected through the connection module 105, the transmitting power of the second antenna 20 is greater than that of the first antenna 101, and when the signals are unstable, the signals may be received or transmitted with greater power, thereby improving the practicality of the antenna module 20.
For example, the second antenna 20 may be plugged onto the connection module 105 through a cable, and the user may set the second antenna 20 at an arbitrary position according to the need.
In the technical solution provided in the embodiments of the present disclosure, when the working state of the first antenna 101 is poor, the antenna module 10 may be externally connected with the second antenna 20 through the connection module 105, so as to improve flexibility and practicality of the antenna module 10.
In one embodiment, as shown in fig. 3, the antenna module 10 is disposed on a PCB (Printed Circuit Board ) 106. The PCB106 further includes a plurality of leads 1061 and a plurality of outputs 1062, the plurality of outputs 1062 being disposed at an edge of the PCB 106; a plurality of leads 1061 are used to connect a plurality of output pins of dual mode chip 104 to a plurality of output terminals 1062.
For example, fig. 4 is a functional diagram of the dual-mode chip 104, and as shown in fig. 4, the dual-mode chip 104 has more functions, so that the output pins 1041 are more, and when the dual-mode chip 104 is disposed on the PCB106, in order to facilitate the user to use the dual-mode chip 104, the output pins 1041 may be connected with the output terminals 1062 disposed on the edge of the PCB106 through the leads 1061, so that the user may use the dual-mode chip 104 by plugging the output terminals 1062, thereby improving the convenience of operation of the user.
In the technical solution provided in the embodiments of the present disclosure, the plurality of leads 1061 are used to connect the plurality of output pins of the dual-mode chip 104 to the plurality of output ends 1062 at the edge of the PCB106, so that convenience in using the dual-mode chip 104 by a user is improved, and further user experience is improved.
In one embodiment, the PCB106 further includes a solder area of the impedance matching module 102. The bonding area of the impedance matching module 102 includes a first capacitance pad 106a, a second capacitance pad 106b, a third capacitance pad 106c, a fourth capacitance pad 106d, and a fifth capacitance pad 106e.
As shown in fig. 5, a first end of the first capacitor pad 106a is connected to the first antenna 101, and a second end of the first capacitor pad 106a is connected to the ground terminal 106 z; a first end of the second capacitor pad 106b is connected to a first end of the first capacitor pad 106a, and a second end of the second capacitor pad 106b is connected to a first end of the third capacitor pad 106 c; a second terminal of the third capacitor pad 106c is connected to the ground terminal 106 z; a first end of the fourth capacitance pad 106d is connected to a first end of the third capacitance pad 106c, and a second end of the fourth capacitance pad 106d is connected to a first end of the fifth capacitance pad 106 e; a first end of the fifth capacitor pad 106e is connected to the connection module 105; a second terminal of the fifth capacitor pad 106e is connected to the ground terminal 106 z.
For example, pads for individual electronic components may be provided on the PCB 106. In practical application, if a certain electronic component is needed to be used, the electronic component can be spliced on a corresponding bonding pad for testing or use; if the electronic components are not needed, the electronic components can be detached, so that the mutual influence among the electronic components is avoided.
In the technical scheme provided by the embodiment of the disclosure, a plurality of different capacitor pads are arranged in the welding area of the impedance matching module 102 of the PCB106, and the capacitors can be inserted into the different capacitor pads under different conditions, so that the application diversity of the antenna module 10 is improved, and the practicability of the antenna module 10 is further improved.
In one embodiment, the impedance matching module 102 further includes a first capacitance, a second capacitance, and a third capacitance.
The first capacitor is plugged onto the first capacitor pad 106a, the second capacitor is plugged onto the second capacitor pad 106b, and the third capacitor is plugged onto the third capacitor pad 106 c.
For example, when the antenna module 10 needs to use the first antenna 101, the first capacitor may be plugged onto the first capacitor pad 106a, the second capacitor may be plugged onto the second capacitor pad 106b, and the third capacitor may be plugged onto the third capacitor pad 106c, where the line of the first antenna 101 is turned on, and the antenna module 10 may receive or transmit signals through the first antenna 101.
In the technical scheme provided by the embodiment of the disclosure, the first capacitor, the second capacitor and the third capacitor are respectively inserted into the first capacitor pad 106a, the second capacitor pad 106b and the third capacitor pad 106c, so that the antenna module 10 can realize Wi-Fi and Bluetooth communication through the first antenna 101, the structure of the antenna module 10 is simplified, and the manufacturing cost of the antenna module 10 is reduced.
In one embodiment, the impedance matching module 102 further includes a fourth capacitance, a fifth capacitance, and a sixth capacitance.
The fourth capacitor is plugged onto the third capacitor pad 106c, the fifth capacitor is plugged onto the fourth capacitor pad 106d, and the sixth capacitor is plugged onto the fifth capacitor pad 106e.
For example, when the antenna module 10 needs to use the first antenna 20, the fourth capacitor may be plugged onto the third capacitor pad 106c, the fifth capacitor is plugged onto the fourth capacitor pad 106d, and the sixth capacitor is plugged onto the fifth capacitor pad 106e, and at this time, the line of the second antenna 20 is turned on, and the antenna module 10 may receive or transmit signals through the second antenna 20.
In the technical scheme provided by the embodiment of the disclosure, the fourth capacitor, the fifth capacitor and the sixth capacitor are respectively inserted into the third capacitor pad 106c, the fourth capacitor pad 106d and the fifth capacitor pad 106e, so that the antenna module 10 can realize Wi-Fi and Bluetooth communication through the second antenna 20, the structure of the antenna module 10 is simplified, and the manufacturing cost of the antenna module 10 is reduced.
In one embodiment, as shown in fig. 6, there is a region of overlap 60a between the second capacitor pad 106b and the fourth capacitor pad 106 d.
For example, the various pads are typically connected to the PCB106 by leads, which typically affect the reception or transmission of the antenna due to the radiation of signals, and thus affect the performance of the antenna. When the antenna module 10 provided in the embodiment of the present disclosure uses the second antenna 20, although the second capacitor is not required to be plugged into the second capacitor pad 106b, if a lead exists between the second capacitor pad 106b and the fourth capacitor pad 106d, the lead will still affect the performance of the second antenna 20. Therefore, the second capacitor pad 106b and the fourth capacitor pad 106d on the PVB106 may be connected through the overlapping area 60a, and no connection lead is between the second capacitor pad 106b and the fourth capacitor pad 106d, so that when the antenna module 10 uses the second antenna 20, the performance of the second antenna 20 is relatively stable and is not affected by the second capacitor pad 106 b.
In the technical solution provided in the embodiments of the present disclosure, by setting the overlapping area between the second capacitor pad 106b and the fourth capacitor pad 106d, the second capacitor pad 106b and the fourth capacitor pad 106d are prevented from being connected by a lead, and thus, the mutual influence between the working line of the first antenna 101 and the working line of the second antenna 20 is prevented.
In one embodiment, as shown in fig. 7, the antenna module 10 further includes a HomeKit chip 107. The HomeKit chip 107 is connected to a second terminal of the dual mode chip 104.
In the technical scheme provided by the embodiment of the disclosure, the HomeKit chip 107 is arranged on the antenna module 10, so that the antenna module 10 can be applied to the ios system equipment, and the applicability of the antenna module 10 is improved.
In one embodiment, the signal conversion module 103 includes a balun filter. And the balun filter is used for realizing signal conversion, so that the efficiency of signal conversion is improved.
In one embodiment, as shown in fig. 8, the antenna module 10 further includes a flash memory module 108 and a crystal oscillator module 109.
Wherein the flash memory module 108 is connected to the third terminal of the dual-mode chip 104; the crystal oscillator module 109 is connected to the fourth terminal of the dual-mode chip 104.
In the technical solution provided in the embodiments of the present disclosure, by setting the flash memory module 108 and the crystal oscillator module 109 on the antenna module 10, the signal processing speed and the signal processing precision of the dual-mode chip 104 are improved, and thus the performance of the antenna module 10 is improved.
The disclosed embodiment provides a terminal, which includes the antenna module 10 described in any one of the above embodiments.
The antenna module 10 at least includes a first antenna 101, an impedance matching module 102, a signal conversion module 103 and a dual-mode chip 104.
The first antenna 101 is connected to a first end of the impedance matching module 102, a second end of the impedance matching module 102 is connected to a first end of the signal conversion module 103, and a second end of the signal conversion module 103 is connected to a first end of the dual-mode chip 104. The impedance matching module 102 is configured to balance the impedance of the first end of the impedance matching module 102 and the second end of the impedance matching module 102; the signal conversion module 103 is configured to convert a differential signal output from the first end of the dual-mode chip 104 into a single-ended signal.
According to the terminal provided by the embodiment of the disclosure, the antenna module of the terminal is provided with the dual-mode chip, and the dual-mode chip can support Wi-Fi and Bluetooth signals simultaneously, so that Wi-Fi and Bluetooth communication can be realized simultaneously through the cooperation of the dual-mode chip and the antenna, the structure of the antenna module is simplified, the structure of the terminal is further simplified, and the manufacturing cost of the terminal is reduced.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any adaptations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It is to be understood that the present disclosure is not limited to the precise arrangements and instrumentalities shown in the drawings, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
Claims (10)
1. The antenna module is characterized by comprising a first antenna, an impedance matching module, a signal conversion module and a dual-mode chip; wherein, the dual-mode chip supports the processing of Wi-Fi signals and Bluetooth signals at the same time;
the first antenna is connected with the first end of the impedance matching module, the second end of the impedance matching module is connected with the first end of the signal conversion module, and the second end of the signal conversion module is connected with the first end of the dual-mode chip;
the impedance matching module is used for balancing the impedance of the first end of the impedance matching module and the impedance of the second end of the impedance matching module;
the signal conversion module is used for converting the differential signal output by the first end of the dual-mode chip into a single-ended signal;
the antenna module further comprises a connecting module; the connecting module is used for externally connecting a second antenna; the connecting module is connected with the third end of the impedance matching module; the impedance matching module is further used for balancing the impedance of the third end of the impedance matching module and the impedance of the second end of the impedance matching module;
the antenna module is arranged on the Printed Circuit Board (PCB); the PCB further comprises a welding area of the impedance matching module; the welding area of the impedance matching module comprises a plurality of capacitor pads, and the circuit conduction of the first antenna or the second antenna is realized by using different capacitor pads.
2. The antenna module of claim 1, wherein the PCB further comprises a plurality of leads and a plurality of outputs, the plurality of outputs being disposed at an edge of the PCB;
the plurality of leads are for connecting a plurality of output pins of the dual mode chip to the plurality of output terminals.
3. The antenna module of claim 1, wherein the bonding region of the impedance matching module comprises a first capacitive pad, a second capacitive pad, a third capacitive pad, a fourth capacitive pad, and a fifth capacitive pad;
a first end of the first capacitor pad is connected with the first antenna, and a second end of the first capacitor pad is connected with a grounding end;
the first end of the second capacitor pad is connected with the first end of the first capacitor pad, and the second end of the second capacitor pad is connected with the first end of the third capacitor pad;
the second end of the third capacitor pad is connected with the grounding end;
the first end of the fourth capacitor pad is connected with the first end of the third capacitor pad, and the second end of the fourth capacitor pad is connected with the first end of the fifth capacitor pad;
the first end of the fifth capacitor pad is connected with the connection module; the second end of the fifth capacitor pad is connected with the grounding end.
4. The antenna module of claim 3, wherein the impedance matching module further comprises a first capacitor, a second capacitor, and a third capacitor;
the first capacitor is inserted into the first capacitor bonding pad, the second capacitor is inserted into the second capacitor bonding pad, and the third capacitor is inserted into the third capacitor bonding pad.
5. The antenna module of claim 3, wherein the impedance matching module further comprises a fourth capacitor, a fifth capacitor, and a sixth capacitor;
the fourth capacitor is inserted into the third capacitor bonding pad, the fifth capacitor is inserted into the fourth capacitor bonding pad, and the sixth capacitor is inserted into the fifth capacitor bonding pad.
6. The antenna module of claim 3, wherein there is a region of overlap of the second capacitive pad and the fourth capacitive pad.
7. The antenna module of any one of claims 1 to 6, further comprising a HomeKit chip;
the HomeKit chip is connected with the second end of the dual-mode chip.
8. The antenna module of any one of claims 1 to 6, wherein the signal conversion module comprises a balun filter.
9. The antenna module of any one of claims 1 to 6, further comprising a flash memory module and a crystal oscillator module;
the flash memory module is connected with a third end of the dual-mode chip;
and the crystal oscillator module is connected with the fourth end of the dual-mode chip.
10. A terminal comprising an antenna module as claimed in any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710353157.6A CN107086356B (en) | 2017-05-18 | 2017-05-18 | Antenna Module and Terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710353157.6A CN107086356B (en) | 2017-05-18 | 2017-05-18 | Antenna Module and Terminal |
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| CN109088137B (en) * | 2018-08-31 | 2022-03-01 | 易力声科技(深圳)有限公司 | Lumped circuit balance converter applied to double-sided parallel lines |
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| CN103515720A (en) * | 2012-06-28 | 2014-01-15 | 比亚迪股份有限公司 | Dual-mode antenna structure and calibration method thereof |
| CN104733855A (en) * | 2015-03-27 | 2015-06-24 | 惠州Tcl移动通信有限公司 | Capacitive combined antenna and mobile terminal |
| CN204597962U (en) * | 2015-03-18 | 2015-08-26 | 广东机电职业技术学院 | Industrial blue-tooth module |
| CN206099965U (en) * | 2016-10-27 | 2017-04-12 | 北京智芯微电子科技有限公司 | Single -chip wi fi module |
| WO2017078878A1 (en) * | 2015-11-06 | 2017-05-11 | Qualcomm Incorporated | Notch filter utilized for near field communication and wireless power transfer dual mode antennas |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TW201019620A (en) * | 2008-11-04 | 2010-05-16 | Ra Link Technology Corp | Front-end architecture of RF transceiver and transceiver chip thereof |
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| CN103515720A (en) * | 2012-06-28 | 2014-01-15 | 比亚迪股份有限公司 | Dual-mode antenna structure and calibration method thereof |
| CN204597962U (en) * | 2015-03-18 | 2015-08-26 | 广东机电职业技术学院 | Industrial blue-tooth module |
| CN104733855A (en) * | 2015-03-27 | 2015-06-24 | 惠州Tcl移动通信有限公司 | Capacitive combined antenna and mobile terminal |
| WO2017078878A1 (en) * | 2015-11-06 | 2017-05-11 | Qualcomm Incorporated | Notch filter utilized for near field communication and wireless power transfer dual mode antennas |
| CN206099965U (en) * | 2016-10-27 | 2017-04-12 | 北京智芯微电子科技有限公司 | Single -chip wi fi module |
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Address after: 100085 Huarun Qingcai Street 68, Haidian District, Beijing, two stage, 9 floor, 01 rooms. Patentee after: BEIJING XIAOMI MOBILE SOFTWARE Co.,Ltd. Patentee after: Qingdao Yilai Intelligent Technology Co.,Ltd. Address before: 100085 Huarun Qingcai Street 68, Haidian District, Beijing, two stage, 9 floor, 01 rooms. Patentee before: BEIJING XIAOMI MOBILE SOFTWARE Co.,Ltd. Patentee before: QINGDAO YEELINK INFORMATION TECHNOLOGY Co.,Ltd. |