CN107086356A - Antenna modules and terminal - Google Patents
Antenna modules and terminal Download PDFInfo
- Publication number
- CN107086356A CN107086356A CN201710353157.6A CN201710353157A CN107086356A CN 107086356 A CN107086356 A CN 107086356A CN 201710353157 A CN201710353157 A CN 201710353157A CN 107086356 A CN107086356 A CN 107086356A
- Authority
- CN
- China
- Prior art keywords
- electric capacity
- pad
- antenna
- antenna modules
- impedance matching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000006243 chemical reaction Methods 0.000 claims abstract description 30
- 238000003466 welding Methods 0.000 claims description 15
- 239000013078 crystal Substances 0.000 claims description 7
- 238000007639 printing Methods 0.000 claims description 2
- 238000004891 communication Methods 0.000 abstract description 12
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000005540 biological transmission Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
- H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
Abstract
The disclosure is directed to a kind of antenna modules and terminal.The antenna modules include first antenna, impedance matching module, signal conversion module and dual-mode chip；The first antenna is connected with the first end of the impedance matching module, and the second end of the impedance matching module is connected with the first end of the signal conversion module, and the second end of the signal conversion module is connected with the first end of the dual-mode chip；The impedance matching module is used for first end and the impedance at the second end of the impedance matching module for balancing the impedance matching module；The signal conversion module is used to the differential signal that the first end of the dual-mode chip is exported being converted to single-ended signal.In the technical scheme, because dual-mode chip can support Wi Fi and the signal of bluetooth simultaneously, therefore pass through the cooperation of dual-mode chip and antenna, you can while realizing the communication of Wi Fi and bluetooth, simplify the structure of antenna modules, reduce the cost of manufacture of antenna modules.
Description
Technical field
This disclosure relates to communication technical field, more particularly to a kind of antenna modules and terminal.
Background technology
With the continuous improvement of people's living standard, mobile phone has become the necessary article in people's life, uses
Frequency also more and more higher.User not only needs mobile phone normally to communicate, and can connect Wi-Fi (Wireless-
Fidelity, Wireless Fidelity) or bluetooth carry out data transmission, in addition it is also necessary to antenna can take less space, in order to reality
Now mobile phone is lightening, therefore to the design requirement more and more higher of antenna for mobile phone.
The content of the invention
To overcome problem present in correlation technique, the embodiment of the present disclosure provides a kind of antenna modules and terminal.The skill
Art scheme is as follows：
According to the first aspect of the embodiment of the present disclosure, there is provided a kind of antenna modules, including first antenna, impedance matching mould
Block, signal conversion module and dual-mode chip；
The first antenna is connected with the first end of the impedance matching module, the second end of the impedance matching module with
The first end connection of the signal conversion module, the second end of the signal conversion module connects with the first end of the dual-mode chip
Connect；
The impedance matching module is used for the first end and the impedance matching module for balancing the impedance matching module
The impedance at the second end；
The signal conversion module is used to the differential signal that the first end of the dual-mode chip is exported being converted to single-ended letter
Number.
The technical scheme provided by this disclosed embodiment can include the following benefits：Because dual-mode chip can be simultaneously
The signal of Wi-Fi and bluetooth is supported, therefore passes through the cooperation of dual-mode chip and antenna, you can while realizing Wi-Fi and bluetooth
Communication, simplifies the structure of antenna modules, reduces the cost of manufacture of antenna modules.
In one embodiment, the antenna modules also include link block；
The three-terminal link of the link block and the impedance matching module；
The link block is used for external second antenna；
The impedance matching module is additionally operable to balance the 3rd end of the impedance matching module and the impedance matching module
The second end impedance.
The technical scheme provided by this disclosed embodiment can include the following benefits：When the working condition of first antenna
When not good, antenna modules can improve the flexibility and practicality of antenna modules by link block with external second antenna
Property.
In one embodiment, the antenna modules are arranged on printing board PCB；
The PCB also includes multiple leads and multiple output ends, and the multiple output end is arranged on the edge of the PCB；
The multiple lead is used to multiple output pins of the dual-mode chip being connected to the multiple output end.
The technical scheme provided by this disclosed embodiment can include the following benefits：Being used for by multiple leads will be double
Multiple output pins of core rod piece are connected to multiple output ends of PCB edge, improve the convenience that user uses dual-mode chip,
And then improve Consumer's Experience.
In one embodiment, the PCB also includes the welding region of impedance matching module；The impedance matching module
Welding region includes the first electric capacity pad, the second electric capacity pad, the 3rd electric capacity pad, the 4th electric capacity pad and the 5th condenser welding
Disk；
The first end of the first electric capacity pad is connected with the first antenna, the second end of the first electric capacity pad with
Earth terminal is connected；
The first end of the second electric capacity pad is connected with the first end of the first electric capacity pad, second condenser welding
Second end of disk is connected with the first end of the 3rd electric capacity pad；
Second end of the 3rd electric capacity pad is connected with the earth terminal；
The first end of the 4th electric capacity pad is connected with the first end of the 3rd electric capacity pad, the 4th condenser welding
Second end of disk is connected with the first end of the 5th electric capacity pad；
The first end of the 5th electric capacity pad is connected with the link block；Second end of the 5th electric capacity pad with
The earth terminal connection.
The technical scheme provided by this disclosed embodiment can include the following benefits：In PCB impedance matching modules
Welding region can select, in different electric capacity pad grafting electric capacity, to carry in the case of setting multiple different electric capacity pads, difference
The high diversity of antenna modules applications, and then improve the practicality of antenna modules.
In one embodiment, the impedance matching module also includes the first electric capacity, the second electric capacity and the 3rd electric capacity；
First electric capacity is plugged on the first electric capacity pad, and second electric capacity is plugged on second condenser welding
On disk, the 3rd electric capacity is plugged on the 3rd electric capacity pad.
The technical scheme provided by this disclosed embodiment can include the following benefits：By in the first electric capacity pad,
Second electric capacity pad and the 3rd electric capacity pad difference electric capacity of grafting first, the second electric capacity and the 3rd electric capacity so that antenna modules are led to
The communication of Wi-Fi and bluetooth can be realized by crossing first antenna, simplify the structure of antenna modules, reduce the making of antenna modules
Cost.
In one embodiment, the impedance matching module also includes the 4th electric capacity, the 5th electric capacity and the 6th electric capacity；
4th electric capacity is plugged on the 3rd electric capacity pad, and the 5th electric capacity is plugged on the 4th condenser welding
On disk, the 6th electric capacity is plugged on the 5th electric capacity pad.
The technical scheme provided by this disclosed embodiment can include the following benefits：By in the 3rd electric capacity pad,
4th electric capacity pad and the 5th electric capacity pad difference electric capacity of grafting the 4th, the 5th electric capacity and the 6th electric capacity so that antenna modules are led to
The communication of Wi-Fi and bluetooth can be realized by crossing the second antenna, simplify the structure of antenna modules, reduce the making of antenna modules
Cost.
In one embodiment, the second electric capacity pad is taken inventory in overlapping region with the 4th condenser welding.
The technical scheme provided by this disclosed embodiment can include the following benefits：By in the second electric capacity pad and
4th electric capacity pad sets overlapping region, it is to avoid connected by lead between the second electric capacity pad and the 4th electric capacity pad, enters
And avoid influencing each other between first antenna working line and the second Antenna Operation circuit.
In one embodiment, the antenna modules also include HomeKit chips；
The HomeKit chips are connected with the second end of the dual-mode chip.
The technical scheme provided by this disclosed embodiment can include the following benefits：By being set in antenna modules
HomeKit chips so that the equipment that the antenna modules can be applied to ios systems, improve the applicability of antenna modules.
In one embodiment, the signal conversion module includes balun wave filter.
The technical scheme provided by this disclosed embodiment can include the following benefits：Realized and believed by balun wave filter
Number conversion, improve signal conversion efficiency.
In one embodiment, the antenna modules also include flash memory module and crystal oscillator module；
The flash memory module and the three-terminal link of the dual-mode chip；
The crystal oscillator module is connected with the 4th end of the dual-mode chip.
The technical scheme provided by this disclosed embodiment can include the following benefits：By being set in antenna modules
Flash memory module and crystal oscillator module, improve the conversion speed and signal transacting precision of dual-mode chip, and then improve antenna
The performance of module.
According to the second aspect of the embodiment of the present disclosure, there is provided a kind of terminal, including any one above-mentioned antenna modules.
It should be appreciated that the general description of the above and detailed description hereinafter are only exemplary and explanatory, not
The disclosure can be limited.
Brief description of the drawings
Accompanying drawing herein is merged in specification and constitutes the part of this specification, shows the implementation for meeting the disclosure
Example, and be used to together with specification to explain the principle of the disclosure.
Fig. 1 is a kind of structural representation of antenna modules according to an exemplary embodiment.
Fig. 2 is a kind of structural representation of antenna modules according to an exemplary embodiment.
Fig. 3 is a kind of structural representation of antenna modules according to an exemplary embodiment.
Fig. 4 is a kind of functional diagram of dual-mode chip according to an exemplary embodiment.
Fig. 5 is a kind of circuit diagram of impedance matching module according to an exemplary embodiment.
Fig. 6 is a kind of impedance matching module pad structure figure according to an exemplary embodiment.
Fig. 7 is a kind of structural representation of antenna modules according to an exemplary embodiment.
Fig. 8 is a kind of structural representation of antenna modules according to an exemplary embodiment.
Embodiment
Here exemplary embodiment will be illustrated in detail, its example is illustrated in the accompanying drawings.Following description is related to
During accompanying drawing, unless otherwise indicated, the same numbers in different accompanying drawings represent same or analogous key element.Following exemplary embodiment
Described in embodiment do not represent all embodiments consistent with the disclosure.On the contrary, they be only with it is such as appended
The example of the consistent apparatus and method of some aspects be described in detail in claims, the disclosure.
The technical scheme that the embodiment of the present disclosure is provided is related to antenna modules, and the antenna modules go for mobile phone, flat board
Computer, intelligent watch and other equipment that can carry out Wi-Fi or Bluetooth communication, the embodiment of the present disclosure are not construed as limiting to this.
In correlation technique, antenna modules are in order to while support Wi-Fi and the signal of bluetooth to receive or launch, it usually needs set two cores
Piece, one of chip is used for the processing for supporting Wi-Fi signal, and another chip is used for the processing for supporting Bluetooth signal, therefore
Cause antenna modules complicated, hardware cost is higher, while also not meeting the requirement of terminal miniaturization development.The reality of the disclosure
Dual-mode chip can be set in antenna modules by applying the technical scheme of example offer, and dual-mode chip can support simultaneously Wi-Fi and
The signal transacting of bluetooth, therefore by the cooperation of dual-mode chip and antenna, the communication of Wi-Fi and bluetooth can be realized simultaneously, letter
Change the structure of antenna modules, reduce the cost of manufacture of antenna modules.
The embodiment of the present disclosure shows a kind of antenna modules 10 according to an exemplary embodiment, as shown in figure 1, the antenna modules
10 include first antenna 101, impedance matching module 102, signal conversion module 103 and dual-mode chip 104.
Wherein, first antenna 101 is connected with the first end of impedance matching module 102, the second end of impedance matching module 102
It is connected with the first end of signal conversion module 103, the second end of signal conversion module 103 connects with the first end of dual-mode chip 104
Connect.First end and second end of impedance matching module 102 of the impedance matching module 102 for balanced impedance matching module 102
Impedance；Signal conversion module 103 is used to the differential signal that the first end of dual-mode chip 104 is exported being converted to single-ended signal.
Example, if the impedance mismatch of first antenna 101 and dual-mode chip 104, can cause dual-mode chip 104 to export
Signal mismatched with first antenna 101, and then cause the emission effciency of first antenna 101 low, poor sensitivity etc., therefore can be with
The impedance of first antenna 101 and dual-mode chip 104 is balanced by impedance matching module 102 so that both impedances are roughly the same, protected
Emission effciency and the sensitivity of first antenna 101 are demonstrate,proved.Simultaneously as first antenna 101 is only capable of launching single-ended signal, and bimodulus
What chip 104 was exported is differential signal, therefore the difference that can be exported dual-mode chip 104 by signal conversion module 103 is believed
Single-ended signal number is converted into, the single-ended signal that signal conversion module 103 can also receive first antenna 101 is converted into difference letter
Number.
In the technical scheme provided by this disclosed embodiment, because dual-mode chip 104 can support Wi-Fi and bluetooth simultaneously
Signal, therefore pass through the cooperation of dual-mode chip 104 and antenna, you can while realizing the communication of Wi-Fi and bluetooth, simplify day
The structure of line module 10, reduces the cost of manufacture of antenna modules 10.
In one embodiment, as shown in Fig. 2 antenna modules 10 also include link block 105.Wherein, link block 105
With the three-terminal link of impedance matching module 102；Link block 105 is used for external second antenna 20；Impedance matching module 102 is also
Impedance for the 3rd end and the second end of impedance matching module 102 of balanced impedance matching module 102.
, may nothing in the region of some jitters because the transmission power of first antenna 101 is limited in practical application
Method receives useful signal or launches the signal for carrying information, therefore antenna modules 10 can set link block
105, can be by external second antenna 20 of link block 105 when first antenna 101 can not meet communication requirement, this second
The transmission power of antenna 20 is more than the transmission power of first antenna 101, in swinging of signal timing, can be received and believed with relatively high power
Number or transmission signal, improve the practicality of antenna modules 20.
For example, the second antenna 20 can be plugged in link block 105 by cable lines, and user can be according to need
Ask and set the second antenna 20 at an arbitrary position.
In the technical scheme provided by this disclosed embodiment, when the working condition of first antenna 101 is not good, antenna modules
10 can improve flexibility and the practicality of antenna modules 10 by link block 105 with external second antenna 20.
In one embodiment, as shown in figure 3, antenna modules 10 are arranged on PCB (Printed Circuit Board, print
Circuit board processed) on 106.PCB106 also includes multiple leads 1061 and multiple output ends 1062, and multiple output ends 1062 are arranged on
PCB106 edge；Multiple leads 1061 are used to multiple output pins of dual-mode chip 104 being connected to multiple output ends 1062.
Example, Fig. 4 is the functional diagram of dual-mode chip 104, and the function of dual-mode chip 104 is more as shown in Figure 4, therefore defeated
Go out pin 1041 also more, when dual-mode chip 104 is arranged on PCB106, the use for the ease of user to dual-mode chip 104,
Output pin 1041 can be connected with the output end 1062 that PCB106 edges are set by lead 1061, such user can lead to
Cross grafting output end 1062 to use dual-mode chip 104, improve the convenience of user's operation.
In the technical scheme provided by this disclosed embodiment, it is used for by multiple leads 1061 by many of dual-mode chip 104
Individual output pin is connected to multiple output ends 1062 at PCB106 edges, improves the convenience that user uses dual-mode chip 104,
And then improve Consumer's Experience.
In one embodiment, PCB106 also includes the welding region of impedance matching module 102.Impedance matching module 102
Welding region include the first electric capacity pad 106a, the second electric capacity pad 106b, the 3rd electric capacity pad 106c, the 4th electric capacity pad
106d and the 5th electric capacity pad 106e.
Wherein, as shown in figure 5, the first electric capacity pad 106a first end is connected with first antenna 101, the first electric capacity pad
106a the second end is connected with earth terminal 106z；Second electric capacity pad 106b first end and the first of the first electric capacity pad 106a
End connection, the second electric capacity pad 106b the second end is connected with the 3rd electric capacity pad 106c first end；3rd electric capacity pad
106c the second end is connected with earth terminal 106z；4th electric capacity pad 106d first end and the first of the 3rd electric capacity pad 106c
End connection, the 4th electric capacity pad 106d the second end is connected with the 5th electric capacity pad 106e first end；5th electric capacity pad
106e first end is connected with link block 105；5th electric capacity pad 106e the second end is connected with earth terminal 106z.
Example, the pad of each electronic component can be set on PCB106.In practical application, use if desired
The electronic component, can be plugged on corresponding pad, be tested or used by a certain electronic component；If need not make
The electronic component is used, the electronic component can be disassembled, it is to avoid influencing each other between electronic component.
In the technical scheme provided by this disclosed embodiment, set in the welding region of PCB106 impedance matching modules 102
It can select, in different electric capacity pad grafting electric capacity, to improve antenna modules in the case of multiple different electric capacity pads, difference
The diversity of 10 applications, and then improve the practicality of antenna modules 10.
In one embodiment, impedance matching module 102 also includes the first electric capacity, the second electric capacity and the 3rd electric capacity.
Wherein, the first electric capacity is plugged on the first electric capacity pad 106a, and the second electric capacity is plugged on the second electric capacity pad 106b
On, the 3rd electric capacity is plugged on the 3rd electric capacity pad 106c.
Example, when antenna modules 10 need to use first antenna 101, the first electric capacity can be plugged on the first electric capacity
On pad 106a, the second electric capacity is plugged on the second electric capacity pad 106b, and the 3rd electric capacity is plugged on the 3rd electric capacity pad 106c,
The now line conduction of first antenna 101, antenna modules 10 can be received or transmission signal by first antenna 101.
In the technical scheme provided by this disclosed embodiment, by the first electric capacity pad 106a, the second electric capacity pad
106b and the 3rd electric capacity pad 106c difference electric capacity of grafting first, the second electric capacity and the 3rd electric capacity so that antenna modules 10 pass through
First antenna 101 can realize the communication of Wi-Fi and bluetooth, simplify the structure of antenna modules 10, reduce antenna modules 10
Cost of manufacture.
In one embodiment, impedance matching module 102 also includes the 4th electric capacity, the 5th electric capacity and the 6th electric capacity.
Wherein, the 4th electric capacity is plugged on the 3rd electric capacity pad 106c, and the 5th electric capacity is plugged on the 4th electric capacity pad 106d
On, the 6th electric capacity is plugged on the 5th electric capacity pad 106e.
Example, need to use and during antenna 20 in antenna modules 10, the 4th electric capacity can be plugged on the 3rd electric capacity
On pad 106c, the 5th electric capacity is plugged on the 4th electric capacity pad 106d, and the 6th electric capacity is plugged on the 5th electric capacity pad 106e,
The now line conduction of the second antenna 20, antenna modules 10 can be received or transmission signal by the second antenna 20.
In the technical scheme provided by this disclosed embodiment, by the 3rd electric capacity pad 106c, the 4th electric capacity pad
106d and the 5th electric capacity pad 106e difference electric capacity of grafting the 4th, the 5th electric capacity and the 6th electric capacity so that antenna modules 10 pass through
Second antenna 20 can realize the communication of Wi-Fi and bluetooth, simplify the structure of antenna modules 10, reduce antenna modules 10
Cost of manufacture.
In one embodiment, as shown in fig. 6, the second electric capacity pad 106b exists with the 4th electric capacity pad 106d overlaps area
Domain 60a.
Example, PCB106 is upper generally to connect different pads by lead, due to the radiation of signal, drawing on PCB106
Line would generally produce influence to the reception or transmitting of antenna, and then influence the performance of antenna.The antenna that the embodiment of the present disclosure is provided
Module 10 using the second antenna 20 when, although need not on the second electric capacity pad 106b the electric capacity of grafting second, but if
If there is lead between second electric capacity pad 106b and the 4th electric capacity pad 106d, this section of lead still can be to the second antenna 20
Performance produce influence.Therefore, the second electric capacity pad 106b can be by overlapping with the 4th electric capacity pad 106d on PVB106
Region 60a is attached, and does not have connecting lead wire between the second electric capacity pad 106b and the 4th electric capacity pad 106d now, therefore work as
When antenna modules 10 are using the second antenna 20, the performance of the second antenna 20 is relatively stablized, will not be by the second electric capacity pad 106b's
Influence.
In the technical scheme provided by this disclosed embodiment, by the second electric capacity pad 106b and the 4th electric capacity pad
106d sets overlapping region, it is to avoid connected by lead between the second electric capacity pad 106b and the 4th electric capacity pad 106d, enters
And avoid influencing each other between the working line of first antenna 101 and the working line of the second antenna 20.
In one embodiment, as shown in fig. 7, antenna modules 10 also include HomeKit chips 107.HomeKit chips
107 are connected with the second end of dual-mode chip 104.
In the technical scheme provided by this disclosed embodiment, by setting HomeKit chips 107 in antenna modules 10,
The equipment for enabling the antenna modules 10 to be applied to ios systems, improves the applicability of antenna modules 10.
In one embodiment, signal conversion module 103 includes balun wave filter.Realize that signal turns by balun wave filter
Change, improve the efficiency of signal conversion.
In one embodiment, as shown in figure 8, antenna modules 10 also include flash memory module 108 and crystal oscillator module 109.
Wherein, flash memory module 108 and the three-terminal link of dual-mode chip 104；Crystal oscillator module 109 and dual-mode chip 104
4th end is connected.
In the technical scheme provided by this disclosed embodiment, by setting flash memory module 108 and crystalline substance in antenna modules 10
Module of shaking 109, improves the conversion speed and signal transacting precision of dual-mode chip 104, and then improves antenna modules 10
Performance.
The embodiment of the present disclosure provides a kind of terminal, and the terminal includes the antenna modules described in any one above-mentioned embodiment
10。
The antenna modules 10 at least include first antenna 101, impedance matching module 102, signal conversion module 103 and bimodulus
Chip 104.
Wherein, first antenna 101 is connected with the first end of impedance matching module 102, the second end of impedance matching module 102
It is connected with the first end of signal conversion module 103, the second end of signal conversion module 103 connects with the first end of dual-mode chip 104
Connect.First end and second end of impedance matching module 102 of the impedance matching module 102 for balanced impedance matching module 102
Impedance；Signal conversion module 103 is used to the differential signal that the first end of dual-mode chip 104 is exported being converted to single-ended signal.
A kind of terminal that embodiment of the disclosure is provided, the antenna modules of the terminal are provided with dual-mode chip, due to bimodulus
Chip can support Wi-Fi and the signal of bluetooth simultaneously, therefore pass through the cooperation of dual-mode chip and antenna, you can realize simultaneously
Wi-Fi and bluetooth communication, simplify the structure of antenna modules, and then simplify the structure of terminal, reduce the making of terminal
Cost.
Those skilled in the art will readily occur to its of the disclosure after considering specification and putting into practice disclosure disclosed herein
Its embodiment.The application is intended to any modification, purposes or the adaptations of the disclosure, these modifications, purposes or
Person's adaptations follow the general principle of the disclosure and including the undocumented common knowledge in the art of the disclosure
Or conventional techniques.Description and embodiments are considered only as exemplary, and the true scope of the disclosure and spirit are by following
Claim is pointed out.
It should be appreciated that the precision architecture that the disclosure is not limited to be described above and is shown in the drawings, and
And various modifications and changes can be being carried out without departing from the scope.The scope of the present disclosure is only limited by appended claim.
Claims (11)
1. a kind of antenna modules, it is characterised in that including first antenna, impedance matching module, signal conversion module and bimodulus core
Piece；
The first antenna is connected with the first end of the impedance matching module, the second end of the impedance matching module with it is described
The first end connection of signal conversion module, the second end of the signal conversion module is connected with the first end of the dual-mode chip；
The impedance matching module is used for the first end and the second of the impedance matching module for balancing the impedance matching module
The impedance at end；
The signal conversion module is used to the differential signal that the first end of the dual-mode chip is exported being converted to single-ended signal.
2. antenna modules according to claim 1, it is characterised in that the antenna modules also include link block；
The three-terminal link of the link block and the impedance matching module；
The link block is used for external second antenna；
The impedance matching module is additionally operable to balance the of the 3rd end of the impedance matching module and the impedance matching module
The impedance at two ends.
3. antenna modules according to claim 2, it is characterised in that the antenna modules are arranged on printing board PCB
On；
The PCB also includes multiple leads and multiple output ends, and the multiple output end is arranged on the edge of the PCB；
The multiple lead is used to multiple output pins of the dual-mode chip being connected to the multiple output end.
4. antenna modules according to claim 3, it is characterised in that the PCB also includes the welding of impedance matching module
Region；The welding region of the impedance matching module includes the first electric capacity pad, the second electric capacity pad, the 3rd electric capacity pad, the
Four electric capacity pads and the 5th electric capacity pad；
The first end of the first electric capacity pad is connected with the first antenna, the second end and the ground connection of the first electric capacity pad
End connection；
The first end of the second electric capacity pad is connected with the first end of the first electric capacity pad, the second electric capacity pad
Second end is connected with the first end of the 3rd electric capacity pad；
Second end of the 3rd electric capacity pad is connected with the earth terminal；
The first end of the 4th electric capacity pad is connected with the first end of the 3rd electric capacity pad, the 4th electric capacity pad
Second end is connected with the first end of the 5th electric capacity pad；
The first end of the 5th electric capacity pad is connected with the link block；Second end of the 5th electric capacity pad with it is described
Earth terminal is connected.
5. antenna modules according to claim 4, it is characterised in that the impedance matching module also includes the first electric capacity,
Second electric capacity and the 3rd electric capacity；
First electric capacity is plugged on the first electric capacity pad, and second electric capacity is plugged on the second electric capacity pad
On, the 3rd electric capacity is plugged on the 3rd electric capacity pad.
6. antenna modules according to claim 4, it is characterised in that the impedance matching module also includes the 4th electric capacity,
5th electric capacity and the 6th electric capacity；
4th electric capacity is plugged on the 3rd electric capacity pad, and the 5th electric capacity is plugged on the 4th electric capacity pad
On, the 6th electric capacity is plugged on the 5th electric capacity pad.
7. antenna modules according to claim 4, it is characterised in that the second electric capacity pad and the 4th condenser welding
Take inventory in overlapping region.
8. the antenna modules according to claim 1 to 7 any one claim, it is characterised in that the antenna modules
Also include HomeKit chips；
The HomeKit chips are connected with the second end of the dual-mode chip.
9. the antenna modules according to claim 1 to 7 any one claim, it is characterised in that the signal conversion
Module includes balun wave filter.
10. the antenna modules according to claim 1 to 7 any one claim, it is characterised in that the antenna modules
Also include flash memory module and crystal oscillator module；
The flash memory module and the three-terminal link of the dual-mode chip；
The crystal oscillator module is connected with the 4th end of the dual-mode chip.
11. a kind of terminal, it is characterised in that including the antenna modules described in claim 1 to 10 any one claim.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710353157.6A CN107086356B (en) | 2017-05-18 | 2017-05-18 | Antenna Module and Terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710353157.6A CN107086356B (en) | 2017-05-18 | 2017-05-18 | Antenna Module and Terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107086356A true CN107086356A (en) | 2017-08-22 |
| CN107086356B CN107086356B (en) | 2023-08-29 |
Family
ID=59608812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710353157.6A Active CN107086356B (en) | 2017-05-18 | 2017-05-18 | Antenna Module and Terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107086356B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109088137A (en) * | 2018-08-31 | 2018-12-25 | 易力声科技(深圳)有限公司 | A kind of lumped-circuit balanced to unbalanced transformer applied to two-sided parallel lines |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100109798A1 (en) * | 2008-11-04 | 2010-05-06 | Ralink Technology Corporation | Front-end architecture of rf transceiver and transceiver chip thereof |
| CN103515720A (en) * | 2012-06-28 | 2014-01-15 | 比亚迪股份有限公司 | Dual-mode antenna structure and calibration method thereof |
| CN104733855A (en) * | 2015-03-27 | 2015-06-24 | 惠州Tcl移动通信有限公司 | Capacitive combined antenna and mobile terminal |
| CN204597962U (en) * | 2015-03-18 | 2015-08-26 | 广东机电职业技术学院 | Industrial blue-tooth module |
| CN206099965U (en) * | 2016-10-27 | 2017-04-12 | 北京智芯微电子科技有限公司 | Single -chip wi fi module |
| WO2017078878A1 (en) * | 2015-11-06 | 2017-05-11 | Qualcomm Incorporated | Notch filter utilized for near field communication and wireless power transfer dual mode antennas |
-
2017
- 2017-05-18 CN CN201710353157.6A patent/CN107086356B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100109798A1 (en) * | 2008-11-04 | 2010-05-06 | Ralink Technology Corporation | Front-end architecture of rf transceiver and transceiver chip thereof |
| CN103515720A (en) * | 2012-06-28 | 2014-01-15 | 比亚迪股份有限公司 | Dual-mode antenna structure and calibration method thereof |
| CN204597962U (en) * | 2015-03-18 | 2015-08-26 | 广东机电职业技术学院 | Industrial blue-tooth module |
| CN104733855A (en) * | 2015-03-27 | 2015-06-24 | 惠州Tcl移动通信有限公司 | Capacitive combined antenna and mobile terminal |
| WO2017078878A1 (en) * | 2015-11-06 | 2017-05-11 | Qualcomm Incorporated | Notch filter utilized for near field communication and wireless power transfer dual mode antennas |
| CN206099965U (en) * | 2016-10-27 | 2017-04-12 | 北京智芯微电子科技有限公司 | Single -chip wi fi module |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109088137A (en) * | 2018-08-31 | 2018-12-25 | 易力声科技(深圳)有限公司 | A kind of lumped-circuit balanced to unbalanced transformer applied to two-sided parallel lines |
| CN109088137B (en) * | 2018-08-31 | 2022-03-01 | 易力声科技(深圳)有限公司 | Lumped circuit balance converter applied to double-sided parallel lines |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107086356B (en) | 2023-08-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9431698B2 (en) | Wireless communication device | |
| CN109274788A (en) | Radio frequency system and Related product | |
| US20040033817A1 (en) | Intelligent interface for controlling an adaptive antenna array | |
| CN209419611U (en) | Amplifying circuit, near field communication controller and near-field communication transceiver circuit | |
| WO2017177495A1 (en) | Circularly polarized antenna and wireless communication device thereof | |
| CN108021020B (en) | Intelligent watch | |
| WO2019204988A1 (en) | Near field communication antenna system and terminal device | |
| US20100295569A1 (en) | Rf performance test structure with electronic switch function | |
| CN105742782A (en) | Hybrid-type NFC antenna and the electronic device thereof | |
| CN105655695A (en) | Low-profile circular polarized antenna array | |
| CN111277289A (en) | Electronic device | |
| CN105742263A (en) | High frequency integrated circuit and packaging for same | |
| US9135940B2 (en) | Radio frequency circuit | |
| CN112332077A (en) | Antenna module and electronic device using the same | |
| JPS59136829A (en) | Circuit module | |
| KR20130098361A (en) | Antenna device and communication device | |
| CN107086356A (en) | Antenna modules and terminal | |
| CN206727212U (en) | Antenna modules and terminal | |
| CN105896085A (en) | Antenna device and mobile terminal | |
| CN104751089B (en) | A kind of radio-frequency antenna plate and card reading circuit | |
| CN207764571U (en) | Smartwatch | |
| WO2015076009A1 (en) | High-frequency device and method for controlling same | |
| CN211125997U (en) | Test machine balun circuit module | |
| CN110169005A (en) | Oval directional filter for condensating synthesizering circuit | |
| CN207835444U (en) | Data transmit-receive circuit and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 100085 Huarun Qingcai Street 68, Haidian District, Beijing, two stage, 9 floor, 01 rooms. Patentee after: BEIJING XIAOMI MOBILE SOFTWARE Co.,Ltd. Patentee after: Qingdao Yilai Intelligent Technology Co.,Ltd. Address before: 100085 Huarun Qingcai Street 68, Haidian District, Beijing, two stage, 9 floor, 01 rooms. Patentee before: BEIJING XIAOMI MOBILE SOFTWARE Co.,Ltd. Patentee before: QINGDAO YEELINK INFORMATION TECHNOLOGY Co.,Ltd. |