CN111836452A

CN111836452A - Printed circuit board external member and wireless communication equipment

Info

Publication number: CN111836452A
Application number: CN201910315196.6A
Authority: CN
Inventors: 杨依珍; 李志杰
Original assignee: Beijing Xiaomi Mobile Software Co Ltd
Current assignee: Beijing Xiaomi Mobile Software Co Ltd
Priority date: 2019-04-18
Filing date: 2019-04-18
Publication date: 2020-10-27

Abstract

The disclosure relates to a printed circuit board kit, and belongs to the technical field of communication. The printed circuit board suite comprises a first printed circuit board and a second printed circuit board which are arranged in the same wireless communication device, wherein the first printed circuit board comprises a first radio frequency chip, and the second printed circuit board comprises a second radio frequency chip; and data between the first printed circuit board and the second printed circuit board is transmitted between the first radio frequency chip and the second radio frequency chip in a wireless mode. According to the wireless communication equipment, the data between the first printed circuit board and the second printed circuit board in the wireless communication equipment are wirelessly transmitted through the first radio frequency chip and the second radio frequency chip, circuit wiring for data transmission between the first printed circuit board and the second printed circuit board in the printed circuit board suite is reduced, and the space utilization rate of the wireless communication equipment is improved.

Description

Printed circuit board external member and wireless communication equipment

Technical Field

The present disclosure relates to the field of communications technologies, and in particular, to a printed circuit board kit and a wireless communication device.

Background

With the development of the communication technology field, the increasing miniaturization of the wireless communication device has become one of the mainstream directions of the development of the current wireless communication device.

In the related art, in order to adapt to miniaturized wireless communication equipment, in the hardware design (such as Circuit design) process inside wireless communication equipment, in order to improve the space utilization inside wireless communication equipment, can be through adopting the design that FPC (Flexible Printed Circuit, Flexible Circuit board) soft board is connected, for example, when wireless communication equipment is the cell-phone, can be connected through FPC soft board between mainboard in the cell-phone and each functional module (the module of making a video recording, light module etc.), thereby realize the data transmission between mainboard and each functional module.

Disclosure of Invention

The embodiment of the disclosure provides a printed circuit board kit and a wireless communication device, which can further improve the space utilization rate of the internal space of the wireless communication device. The technical scheme is as follows:

according to a first aspect of embodiments of the present disclosure, there is provided a printed circuit board kit comprising:

a first printed circuit board and a second printed circuit board provided in the same wireless communication apparatus;

the first printed circuit board comprises a first radio frequency chip; the second printed circuit board comprises a second radio frequency chip;

and data between the first printed circuit board and the second printed circuit board is transmitted between the first radio frequency chip and the second radio frequency chip in a wireless mode.

Optionally, a distance between the antenna of the first radio frequency chip and the antenna of the second radio frequency chip is smaller than a preset distance threshold.

Optionally, a deviation angle between the antenna direction of the first radio frequency chip and the antenna direction of the second radio frequency chip is smaller than a preset angle threshold.

Optionally, the first radio frequency chip and the second radio frequency chip support a designated radio frequency band, and the designated radio frequency band is not lower than a radio frequency V band.

Optionally, the data between the first printed circuit board and the second printed circuit board is transmitted between the first radio frequency chip and the second radio frequency chip according to a transmission rate corresponding to a data type of the data.

Optionally, the data between the first printed circuit board and the second printed circuit board is transmitted between the first radio frequency chip and the second radio frequency chip according to a transmission rate indicated by designated software installed in the wireless communication device.

Optionally, the first radio frequency chip is connected to the first printed circuit board through a Universal Serial Bus (USB) interface;

and/or the presence of a gas in the gas,

the second radio frequency chip is connected with the second printed circuit board through a USB interface.

Optionally, the first printed circuit board is a main board in the wireless communication device;

the second printed circuit board is a camera control module, a screen control module or an audio control module in the wireless communication equipment.

Optionally, the first printed circuit board is disposed in a first housing of the wireless communication device, the second printed circuit board is disposed in a second housing of the wireless communication device, and the first housing and the second housing are two housings whose relative positions are changeable.

Optionally, the data is transmitted between the first radio frequency chip and the second radio frequency chip in a half-duplex manner;

alternatively, the first and second electrodes may be,

and the first radio frequency chip and the second radio frequency chip transmit the data in a full duplex mode.

According to a second aspect of the embodiments of the present disclosure, there is provided a wireless communication device, which includes the printed circuit board assembly according to the first aspect and any optional implementation manner of the first aspect.

Optionally, the wireless communication device comprises a first housing and a second housing, and the first housing and the second housing are two housings with variable relative positions;

a first printed circuit board of the printed circuit board assembly is disposed in the first housing, and a second printed circuit board of the printed circuit board assembly is disposed in the second housing.

The technical scheme provided by the embodiment of the disclosure at least comprises the following beneficial effects:

the printed circuit board suite comprises a first printed circuit board and a second printed circuit board which are arranged in the same wireless communication device, wherein the first printed circuit board comprises a first radio frequency chip, and the second printed circuit board comprises a second radio frequency chip; and data between the first printed circuit board and the second printed circuit board is transmitted between the first radio frequency chip and the second radio frequency chip in a wireless mode. According to the wireless communication equipment, the data between the first printed circuit board and the second printed circuit board in the wireless communication equipment are wirelessly transmitted through the first radio frequency chip and the second radio frequency chip, circuit wiring for data transmission between the first printed circuit board and the second printed circuit board in the printed circuit board suite is reduced, and the space utilization rate of the wireless communication equipment is improved.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.

Fig. 1 is a schematic structural diagram of a printed circuit board assembly provided by the present disclosure according to an exemplary embodiment;

fig. 2 is a schematic structural diagram of a printed circuit board assembly provided in an embodiment of the present disclosure;

fig. 3 is a schematic structural diagram of a printed circuit board assembly provided in an embodiment of the present disclosure;

fig. 4 is a schematic structural diagram of a radio frequency chip according to an embodiment of the present disclosure;

fig. 5 is a schematic structural diagram of a printed circuit board according to an embodiment of the present disclosure;

fig. 6 is a schematic structural diagram of a folding screen mobile phone according to an embodiment of the present disclosure;

FIG. 7 is a schematic diagram of a folded screen handset according to the embodiment of the present disclosure;

FIG. 8 is a schematic diagram of a folded screen handset according to the embodiment of the present disclosure;

fig. 9 is a schematic structural diagram of a mobile phone in which a first housing and a second housing can slide relative to each other according to an embodiment of the present disclosure;

fig. 10 is a schematic structural diagram of a wireless communication device provided in an embodiment of the present disclosure;

fig. 11 is a schematic structural diagram of a smartphone according to an embodiment of the present disclosure.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.

The scheme provided by the disclosure can be used in a scene of terminal internal data transmission in daily life, and for convenience of understanding, some terms and application scenes related to the embodiments of the disclosure are first briefly described below.

Flexible circuit board FPC: a flexible printed circuit board is made of polyimide or polyester film as base material.

Radio Frequency (RF): radio frequency is a short for high frequency alternating current varying electromagnetic wave, and represents an electromagnetic frequency that can be radiated to space.

In the theory of electronics, current flows through a conductor, and a magnetic field is formed around the conductor; an alternating current passes through a conductor, around which an alternating electromagnetic field, called an electromagnetic wave, is formed.

The radio frequency (300 KHz-300 GHz) is the higher of the high frequency (greater than 10KHz) bands, while the microwave band (300 MHz-300 GHz) is the higher of the radio frequency.

The wireless communication device communicates wireless data with other wireless communication devices through the radio frequency circuit. Among them, in the radio frequency circuit, a chip for controlling reception and transmission of a radio frequency signal is called a radio frequency chip.

Fig. 1 is a schematic structural diagram of a printed circuit board assembly provided by the present disclosure according to an exemplary embodiment. As shown in fig. 1, the printed circuit board assembly 100 includes a first printed circuit board 101, a second printed circuit board 102, and an FPC board 103. The printed circuit board assembly 100 may be disposed in a wireless communication device, and the first printed circuit board 101 and the second printed circuit board 102 may perform data transmission in response to an execution instruction inside the wireless communication device. When the wireless communication device needs to transmit data between the first printed circuit board 101 and the second printed circuit board 102, the first printed circuit board 101 and the second printed circuit board 102 may transmit data through the conductive lines on the FPC board 103.

Optionally, the wireless communication device may be a terminal, for example, the terminal may be a smart phone, a tablet computer, an e-book reader, smart glasses, a smart watch, an MP3 player (Moving Picture Experts Group audio Layer III, motion Picture Experts Group audio Layer 3), an MP4 player (Moving Picture Experts Group audio Layer IV, motion Picture Experts Group audio Layer 4), a notebook computer, a laptop computer, a desktop computer, and the like.

Optionally, the wireless communication device may also be an internet of things device, such as a sensor device, a mobile phone (or "cellular" phone), and a computer with an internet of things terminal, such as a stationary, portable, pocket, hand-held, computer-included, or vehicle-mounted device. For example, a Station (STA), a subscriber unit (subscriber unit), a subscriber Station (subscriber Station), a mobile Station (mobile), a remote Station (remote), an access point, a remote terminal (remote), an access terminal (access terminal), a user equipment (user terminal), a user agent (user agent), and a user equipment (user device). Alternatively, the wireless communication device may be a device of an unmanned aerial vehicle. Alternatively, the wireless communication device may also be a vehicle-mounted device, for example, a vehicle computer with a wireless communication function, or a wireless communication device externally connected to the vehicle computer. Alternatively, the wireless communication device may be a roadside device, for example, a street lamp, a signal lamp or other roadside device with a wireless communication function.

With the development of modern technologies, the miniaturization of wireless communication devices makes higher requirements on the internal design of wireless communication devices, and in related technologies, most of the FPC circuits shown in fig. 1 used for data transmission have to set corresponding circuit cables inside the wireless communication devices, which occupy more internal space positions of the wireless communication devices and reduce the utilization rate of the internal space of the wireless communication devices to a certain extent.

In order to solve the above existing problems and improve the utilization rate of the internal space of the wireless communication device, the present disclosure provides a printed circuit board assembly, which can be applied to the wireless communication device, please refer to fig. 2, which shows a schematic structural diagram of a printed circuit board assembly provided by an embodiment of the present disclosure. As shown in fig. 2, a printed circuit board assembly 201 is included in the wireless communication device 200, the printed circuit board assembly 201 including:

a first printed circuit board 202 and a second printed circuit board 203 provided in the same wireless communication apparatus;

the first printed circuit board 202 includes a first rf chip 202 a; the second printed circuit board 203 comprises a second radio frequency chip 203 a;

data between the first printed circuit board 202 and the second printed circuit board 203 is transmitted between the first radio frequency chip 202a and the second radio frequency chip 203a in a wireless mode.

Optionally, a distance between the antenna of the first rf chip 202a and the antenna of the second rf chip 203a is smaller than a preset distance threshold.

Optionally, a deviation angle between the antenna direction of the first rf chip 202a and the antenna direction of the second rf chip 203a is smaller than a preset angle threshold.

Optionally, the first rf chip 202a and the second rf chip 203a support a specific rf frequency band, and the specific rf frequency band is not lower than the rf V band.

Optionally, the data between the first printed circuit board 202 and the second printed circuit board 203 is transmitted between the first rf chip 202a and the second rf chip 203a according to a transmission rate corresponding to a data type of the data.

Optionally, the data between the first printed circuit board 202 and the second printed circuit board 203 is transmitted between the first rf chip 202a and the second rf chip 203a according to a transmission rate indicated by a designated software installed in the wireless communication device.

Optionally, the first rf chip 202a is connected to the first printed circuit board 202 through a USB interface;

and/or the presence of a gas in the gas,

the second rf chip 203a is connected to the second pcb 203 through a USB interface.

Optionally, the first printed circuit board 202 is a main board in the wireless communication device;

the second printed circuit board 203 is a camera control module, a screen control module or an audio control module in the wireless communication device.

Alternatively, the first printed circuit board 202 is disposed in a first housing of the wireless communication device, and the second printed circuit board 203 is disposed in a second housing of the wireless communication device, and the first housing and the second housing are two housings whose relative positions are changeable.

Optionally, data is transmitted between the first rf chip 202a and the second rf chip 203a in a half-duplex manner;

alternatively, the first and second electrodes may be,

the first rf chip 202a and the second rf chip 203a transmit data in a full duplex manner.

To sum up, this disclosure carries out wireless transmission through first radio frequency chip and second radio frequency chip with the data between first printed circuit board and the second printed circuit board in the wireless communication equipment, has reduced the circuit winding displacement of carrying out data transmission between first printed circuit board and the second printed circuit board in this printed circuit board external member, has improved wireless communication equipment's space utilization.

In a possible implementation manner, the printed circuit board assembly may be connected to a power supply of the wireless communication device, and the power supply of the wireless communication device supplies power to the printed circuit board assembly, and the first printed circuit board and the second printed circuit board that are disposed inside the wireless communication device may include a first control chip and a second control chip, where the first control chip may receive a first transmission signal inside the wireless communication device according to the first printed circuit board, so as to control the first printed circuit board to transmit data to the second printed circuit board, and similarly, the second control chip may receive a second transmission signal inside the wireless communication device according to the second printed circuit board, so as to control the second printed circuit board to transmit data to the first printed circuit board. Referring to fig. 3, a schematic structural diagram of a printed circuit board assembly according to an embodiment of the disclosure is shown. As shown in fig. 3, a wireless communication device 300 includes a printed circuit board assembly 301 and a power supply 304, the printed circuit board assembly 301 comprising: a first printed circuit board 302 and a second printed circuit board 303.

The first printed circuit board 302 comprises a first radio frequency chip 302a and a first control chip 302 b; the second printed circuit board comprises a second radio frequency chip 303a and a second control chip 303 b;

both the first printed circuit board 302 and the second printed circuit board 303 may be connected to a power supply 304, and the power supply 304 supplies power to the first printed circuit board 302 and the second printed circuit board 303. The first control chip 302b may control the first printed circuit board 302 to wirelessly transmit data to the second printed circuit board 303 through the first rf chip 302a according to a first transmission signal received from the inside of the wireless communication device, and accordingly, the second printed circuit board 303 may receive the data transmitted by the first rf chip 302a through the second rf chip 303 a.

Optionally, when receiving a second transmission signal sent from inside of the wireless communication device, the second control chip 303b may also control the second printed circuit board 303 to transmit data to the first printed circuit board 302 in a wireless manner through the second radio frequency chip 303a, and accordingly, the first printed circuit board 302 may receive the data sent by the second radio frequency chip 303a through the first radio frequency chip 302 a.

Optionally, the first rf chip 302a and the first pcb 302 may be connected through a USB interface.

That is, inside the first printed circuit board 302, data received by the first rf chip 302a may be transmitted through the USB interface, or data or signals to be transmitted may be transmitted to the first rf chip 302a through the USB interface. Further, the second rf chip 303a and the second printed circuit board 303 may also be connected through a USB interface, and in the second printed circuit board 303, data received by the second rf chip 303a may also be transmitted through the USB interface, or data or signals to be sent may be transmitted to the second rf chip 303a through the USB interface.

The first rf chip 302a is connected to the first pcb 302 through a USB3.0 interface. The USB3.0 interface may support transmission between the first rf chip 302a and the first pcb 302 at a transmission rate of 5 Gbit/s.

Alternatively, the first rf chip 302a and the first pcb 302 may be connected via a USB interface with a higher standard than USB 3.0. For example, when the first rf chip 302a and the first printed circuit board 302 have a transmission rate requirement higher than 5Gbit/s, the first rf chip 302a and the first printed circuit board 302 may be connected through a USB interface of USB3.1 or a USB interface higher than USB3.1 standard, so as to support transmission between the first rf chip 302a and the first printed circuit board 302 at a transmission rate of 10Gbit/s or higher.

Alternatively, the first rf chip 302a and the first pcb 302 may be connected through a USB interface with a lower standard than USB 3.0. For example, when the speed requirement between the first rf chip 302a and the first pcb 302 is low, the first rf chip 302a and the first pcb 302 may be connected via a USB interface of USB2.0 standard, so as to support the transmission between the first rf chip 302a and the first pcb 302 at a transmission rate of 60 Mbit/s. Similarly, the USB interface used between the first rf chip 302a and the first printed circuit board 302 may also be used between the second rf chip 303a and the second printed circuit board 303, and details thereof are not repeated herein.

Optionally, the data between the first printed circuit board 302 and the second printed circuit board 303 is wirelessly transmitted between the first rf chip 302a and the second rf chip 303a, and may be transmitted through antennas included in the first rf chip 302a and the second rf chip 303a, respectively. Optionally, the antenna of the first rf chip 302a may be an internal antenna or an external antenna, and further, the antenna of the first rf chip 302a may be a PCB (Printed circuit Board) antenna. Similarly, the antenna of the second rf chip 303a may be an internal antenna or an external antenna.

Optionally, taking the first rf chip 302a as an example, when the first rf chip 302a has an internal antenna, a developer may directly apply the internal antenna of the first rf chip 302a as an antenna used by the first rf chip 302a to transmit data or receive data when designing the printed circuit board assembly 301.

Alternatively, when the first rf chip 302a does not have its own antenna, that is, when there is no internal antenna, a developer may design one or more antennas for the first rf chip 302a in advance when designing the printed circuit board assembly 301, so as to use the set antennas as antennas used when the first rf chip 302a transmits data or receives data. Optionally, the antenna designed by the developer may be a PCB antenna designed inside the first rf chip 302a, or may also be a PCB antenna designed on the first printed circuit board 302.

Alternatively, the antenna of the first rf chip 302a may be another type of antenna (external antenna described above) designed by the developer on the surface of the first rf chip 302a or the surface of the first printed circuit board 302, different from the PCB antenna.

Optionally, the antenna design of the second rf chip 303a may refer to the antenna design of the first rf chip 302a, which is not described herein again. However, it should be noted that, during design, the antenna of the second rf chip 303a needs to have a one-to-one correspondence relationship with the antenna of the first rf chip 302a, so as to facilitate the correctness of data transmission between the second rf chip 303a and the first rf chip 302 a.

Optionally, different antenna designs may have some influence on the data transmission rate between the second rf chip 303a and the first rf chip 302a, such as: the present disclosure is not limited to which antenna is used to receive or transmit data, and the present disclosure is not limited to the specific antenna used to receive or transmit data, and the transmission rate of the rf chip may be in one transmission range when the rf chip has an internal antenna, and the transmission rate of the rf chip may be in another transmission range when the PCB antenna designed by a developer is used.

Optionally, there is a one-to-one correspondence between antennas included in the first radio frequency chip 302a and the second radio frequency chip 303a, that is, the antenna of the first radio frequency chip 302a corresponds to the antenna of the second radio frequency chip 303a, and when the first radio frequency chip 302a needs to send data to the second radio frequency chip 303a, the first radio frequency chip 302a may identify, through matching identification, the second radio frequency chip 303a and a target antenna in the second radio frequency chip 303a, so as to send data to the second radio frequency chip 303 a. The target antenna is an antenna corresponding to an antenna used when the first rf chip 302a transmits data. For example, the first rf chip 302a may verify the identity of the second rf chip 303a through a handshake protocol, and when the second rf chip 303a passes the identity verification, the first rf chip 302a performs data transmission with the second rf chip 303 a. Similarly, when the second rf chip 303a transmits data to the first rf chip 302a, the first rf chip 303a and the antenna corresponding to the antenna used by the second rf chip 303a to transmit data in the first rf chip 302a may be identified through matching identification, so as to transmit data to the second rf chip 303 a.

Please refer to fig. 4, which illustrates a schematic structural diagram of a radio frequency chip according to an embodiment of the present disclosure. As shown in fig. 4, the first rf chip 40 includes a first antenna 401 and a second antenna 402, and the second rf chip 41 includes a third antenna 403 and a fourth antenna 404. The first antenna 401 corresponds to the third antenna 403, the second antenna 402 corresponds to the fourth antenna 404, and when the first rf chip 40 sends data to the second rf chip 41 through the first antenna 401, the second rf chip 41 may receive the data sent by the first rf chip 40 through the third antenna 403. Optionally, the second rf chip 41 may also send data to the first rf chip 40 through the third antenna 403, and the first rf chip 40 may receive the data sent by the second rf chip 41 by using the first antenna 401. Optionally, data transmission may also be performed between the first radio frequency chip 40 and the second radio frequency chip 41 through the respective second antenna 402 and the fourth antenna 404, and optionally, when the first radio frequency chip 40 sends data to the second radio frequency chip 41, the first antenna 401 and the second antenna 402 may be used to send data at the same time, and the corresponding second radio frequency chip 41 may also be used to receive data at the same time through the third antenna 403 and the fourth antenna 404. Optionally, when the first rf chip 40 simultaneously uses the first antenna 401 and the second antenna 402 to transmit data to the second rf chip 41, the data transmitted by the first antenna 401 and the data transmitted by the second antenna 402 may be the same or different. Optionally, in the first rf chip 40, the first antenna 401 and the second antenna 402 may be different antennas in the above antenna design, or may be the same antenna. For example, the first antenna 401 is a built-in antenna built in the first rf chip 40, and the second antenna 402 is a built-in PBC antenna designed by a developer on the first rf chip 40; alternatively, the first antenna 401 and the second antenna 402 are built-in antennas of the first rf chip 40.

Optionally, the first rf chip 302a and the second rf chip 303a support a designated rf frequency band, where the designated rf frequency band may be a radio frequency band preset by a developer. Wherein the assigned radio frequency band is not lower than the radio frequency V band. That is, when data is transmitted between the first rf chip 302a and the second rf chip 303a, the first rf chip can operate in a designated rf frequency band. For example, when the developer sets the rf frequency bands of the first rf chip 302a and the second rf chip 303a to be rf V-band or higher frequency band, the first rf chip 302a and the second rf chip 303a may transmit data using rf V-band or higher frequency band.

Optionally, a distance between the antenna of the first rf chip 302a and the antenna of the second rf chip 303a is smaller than a preset distance threshold. That is, the distance between the antenna of the first rf chip 302a and the antenna of the second rf chip 303a corresponding to the antenna of the first rf chip 302a is smaller than the preset distance threshold. Optionally, the preset distance threshold may be determined by a frequency band used when data is transmitted between the first rf chip 302a and the second rf chip 303a, for example, when data is transmitted between the first rf chip 302a and the second rf chip 303a by using a radio frequency V-band, and a developer designs an antenna of the first rf chip 302a and an antenna of the second rf chip 303a, a distance between the antenna of the first rf chip 302a and the antenna of the second rf chip 303a may be designed within 15mm, so as to ensure that data can be correctly transmitted.

Optionally, a deviation angle between the antenna direction of the first rf chip 302a and the antenna direction of the second rf chip 303a is smaller than a preset angle threshold. That is, the deviation angle between the antenna of the first rf chip 302a and the antenna of the second rf chip 303a corresponding to the antenna of the first rf chip 302a is smaller than the preset angle threshold. Optionally, the preset angle threshold may be determined by a frequency band used when data is transmitted between the first rf chip 302a and the second rf chip 303a, for example, taking the rf V-band data transmission between the first rf chip 302a and the second rf chip 303a as an example, when a developer designs an antenna of the first rf chip 302a and an antenna of the second rf chip 303a, a deviation angle between the antenna of the first rf chip 302a and the antenna of the second rf chip 303a may be designed within 45 degrees, so as to ensure that data can be transmitted correctly.

In a possible implementation manner, when data is transmitted between the first radio frequency chip 302a and the second radio frequency chip 303a, the first radio frequency chip 302a and the second radio frequency chip 303a may further transmit data between the first printed circuit board 302 and the second printed circuit board 303 according to a transmission rate corresponding to a data type of the data. For example, when the first rf chip 302a sends data to the second rf chip 303a, the first rf chip 302 may determine the type of data that needs to be sent this time according to the data sending signal received by the first control chip 302 b. In a possible implementation manner, different data types may correspond to different transmission rates, for example, on the first printed circuit board 302, an integrated memory chip may be further included, and a corresponding relationship table of transmission rates corresponding to different data types may be stored in the memory chip, please refer to table 1, which shows a corresponding relationship table between a data type and a transmission rate related to an embodiment of the present disclosure, as shown in table 1, which includes a corresponding relationship between a data type and a transmission rate.

Data type	Transmission rate
		Type one	Rate one
Type two	Rate two
		Type III	Rate three
……	……

TABLE 1

For example, when the first printed circuit board 302 determines that the data type required to be sent at this time is type two, the first control chip 302b of the first printed circuit board 302 may learn that the transmission rate corresponding to the data type is rate two by querying the table 1 stored in the memory chip, and the first control chip 302b of the first printed circuit board 302 may execute the actions of determining and controlling the transmission rate, so as to control the first rf chip 302a of the first printed circuit board 302 to send data at the rate two. Optionally, the obtaining of the transmission rate when the second rf chip 303a sends data may also be performed by referring to the obtaining manner of the transmission rate when the first rf chip 302a sends data, and details are not described here.

In one possible implementation, the rate of data transmission between the first rf chip 302a and the second rf chip 303a may be at a transmission rate dictated by specific software installed in the wireless communication device. That is, data between the first printed circuit board 302 and the second printed circuit board 303 is transmitted between the first rf chip 302a and the second rf chip 303a at a transmission rate indicated by the designated software installed in the wireless communication device.

It should be noted that, in practical applications, the rate of data transmission between the first rf chip 302a and the second rf chip 303a may also be limited by the frequency band used in transmission, for example, when a radio frequency V-band is used in data transmission between the first rf chip 302a and the second rf chip 303a, the range of the transmission rate supported by the band may be: 1Mbit/s to 6 Gbit/s. I.e. the rate at which data is transmitted using the rf V-band is within the transmission rate range.

Optionally, the first rf chip 302a and the second rf chip 303a transmit data in a half-duplex manner; or, the first rf chip 302a and the second rf chip 303a transmit data in a full duplex manner. Optionally, when data is transmitted between the first rf chip 302a and the second rf chip 303a, whether half-duplex operation or full-duplex operation is adopted may be determined according to an actual transmission rate. For example, the developer sets a rate transmission threshold in each of the first rf chip 302a and the second rf chip 303a in advance, and when the rate of data transmission between the first rf chip 302a and the second rf chip 303a does not exceed the rate transmission threshold, the developer performs full-duplex operation, and when the rate of data transmission between the first rf chip 302a and the second rf chip 303a exceeds the rate transmission threshold, the developer performs half-duplex operation.

Optionally, the first printed circuit board 302 may be a main board in the wireless communication device; the second printed circuit board 303 may be a camera control module, a screen control module, or an audio control module in the wireless communication apparatus. For example, when the first printed circuit board 302 is a motherboard in a wireless communication device; when the second printed circuit board 303 is a camera control module in the wireless communication device, the first printed circuit board 302 may send data for controlling the camera module to the second printed circuit board 303, and the second printed circuit board 303 may send feedback data or request data to the first printed circuit board 302. Optionally, the second printed circuit board 303 may also be a combination of any two or more than two of a camera control module, a screen control module, or an audio control module in the wireless communication device.

For example, the first printed circuit board 302 is used as a main board in the wireless communication device; the second printed circuit board 303 is, for example, a camera control module in the wireless communication device, and when the mainboard needs to call the camera control module, may send related call data to a radio frequency chip installed in the camera control module through a radio frequency chip of the mainboard itself, and when the corresponding radio frequency chip in the camera control module receives the call data, may execute a corresponding call action. In a possible implementation manner, when the screen control module serves as another second printed circuit board, and when the main board needs to call the screen control module, related call data can be sent to a corresponding radio frequency chip installed in the screen control module through a radio frequency chip of the main board itself, and when the corresponding radio frequency chip in the screen control module receives the call data, a corresponding call action can be executed.

In a mode that can realize, when camera control module group and screen control module group are as setting up on same second printed circuit board, when the mainboard need call the screen control module group, can send relevant calling data to the radio frequency chip of installing the screen control module group that the control corresponds in the second printed circuit board through the radio frequency chip of mainboard self, when corresponding radio frequency chip received this calling data, can carry out corresponding calling action.

Correspondingly, when the camera control module needs to send data to the mainboard, relevant data can be sent to the corresponding radio frequency chip installed in the mainboard through the radio frequency chip of the camera control module, and when the corresponding radio frequency chip in the mainboard receives the data, corresponding calling action can be executed.

In a possible implementation manner, the two second printed circuit boards can also pass through the same first printed circuit board, so that the calling between the two second printed circuit boards is realized. For example, when the camera control module needs to call the screen control module, the radio frequency chip of the camera control module itself can send related call data to the radio frequency chip installed in the motherboard for controlling the corresponding screen control module, and then the motherboard forwards the call data to the corresponding radio frequency chip in the screen control module through the corresponding radio frequency chip, and when the corresponding radio frequency chip in the screen control module receives the call data, the corresponding call action can be executed.

In one possible implementation, the first printed circuit board 302 and the second printed circuit board may each include a plurality of rf chips thereon. Please refer to fig. 5, which illustrates a schematic structural diagram of a printed circuit board according to an embodiment of the present disclosure. As shown in fig. 5, the printed circuit board 500 includes a first rf chip 501, a second rf chip 502 and a third rf chip 503, wherein the first rf chip 501, the second rf chip 502 and the third rf chip 503 can respectively respond to the control of the printed circuit board 500 to transmit data or receive data, and optionally, the data transmitted or received by the first rf chip 501, the second rf chip 502 and the third rf chip 503 may be the same or different. Optionally, each of the first rf chip 501, the second rf chip 502 and the third rf chip 503 may also include a plurality of antennas, and data is transmitted with other printed circuit boards through the antennas.

For example, the first printed circuit board 302 is used as a main board in the wireless communication device; the second printed circuit board 303 is, for example, a camera control module in the wireless communication device, and the main board of the wireless communication device can send data to the camera control module through a plurality of radio frequency chips on the control main board, and correspondingly, the camera control module of the wireless communication device can also receive data through a plurality of radio frequency chips. Optionally, the main board of the wireless communication device may send data to the camera control module through a part of radio frequency chips on the control main board, and at the same time, another part of radio frequency chips on the control main board sends data to the screen control module, and at this time, the screen control module may serve as another second printed circuit board.

Alternatively, the first printed circuit board 302 is disposed in a first housing of the wireless communication device, and the second printed circuit board 303 is disposed in a second housing of the wireless communication device, and the first housing and the second housing are two housings whose relative positions are changeable.

In a possible implementation manner, in practical applications, the wireless communication device may further include the first printed circuit board 302 and the second printed circuit board 303 disposed in different housings, as shown in the schematic structural diagram of the wireless communication device in fig. 3, which further includes a first housing 305 and a second housing 306.

In a possible implementation manner, when the first housing and the second housing are two housings with variable relative positions, please refer to fig. 6, which shows a schematic structural diagram of a folding screen mobile phone according to an embodiment of the present disclosure, as shown in fig. 6, in the folding screen mobile phone 60, a first housing 601, a second housing 602, a first rf chip 603, and a second rf chip 604 are included. The first rf chip 603 further includes a first antenna 603a, a second antenna 603b, the second rf chip 604 further includes a third antenna 604a, and a fourth antenna 604b, when the first antenna 603a corresponds to the third antenna 604a, and the second antenna 603b corresponds to the fourth antenna 604b, when the screen of the folding screen mobile phone is not unfolded, the folding screen mobile phone may use the first antenna 603a and the third antenna 604a to transmit data, and the second antenna 603b and the fourth antenna 604b to transmit data. Referring to fig. 7, which illustrates a schematic structural diagram of a foldable mobile phone related to fig. 6 according to an embodiment of the present disclosure, as shown in fig. 7, when a screen of the foldable mobile phone is unfolded, data transmission may not be completed due to a distance between the second antenna 603b and the fourth antenna 604b, and at this time, the foldable mobile phone may use the first antenna 603a and the third antenna 604a to transmit data.

In a possible implementation manner, the antennas can also be utilized by changing the position and arrangement of the antennas. Referring to fig. 8, a schematic structural diagram of a folding screen mobile phone related to fig. 6 according to an embodiment of the present disclosure is shown. As shown in fig. 8, by respectively setting the first antenna 603a and the second antenna 603b included in the first rf chip 603 and the third antenna 604a and the fourth antenna 604b included in the second rf chip 604 at the positions shown in fig. 8, when the screen of the folding-screen mobile phone is unfolded, the folding-screen mobile phone may continue to transmit data by using the first antenna 603a and the third antenna 604a, and transmit data by using the second antenna 603b and the fourth antenna 604 b.

In a possible implementation manner, please refer to fig. 9, which illustrates a schematic structural diagram of a mobile phone in which a first housing and a second housing can slide relative to each other according to an embodiment of the present disclosure. As shown in fig. 9, the cellular phone 90 includes a first housing 901, a second housing 902, a first rf chip 903, and a second rf chip 904. The first rf chip 903 further includes a first antenna 903a, a second antenna 903b, and a third antenna 903c, and the second rf chip 904 further includes a fourth antenna 904a and a fifth antenna 904b, where when the first antenna 903a corresponds to the fourth antenna 904a, the second antenna 903b corresponds to the fifth antenna 904b, and the third antenna 903a corresponds to the fourth antenna 904 a. Before the first housing and the second housing slide, the mobile phone 90 may use the first antenna 903a and the fourth antenna 904a to transmit data, and the second antenna 903b and the fifth antenna 904b to transmit data, where a distance designed by the third antenna 903c cannot support data transmission with the fourth antenna 904 a; after the first housing and the second housing slide, the distance between the third antenna 903c and the fourth antenna 904a may satisfy the distance for data transmission, and the mobile phone 90 may use the third antenna 903c and the fourth antenna 904a to transmit data, similarly, data transmission may not be performed between the first antenna 903a and the fourth antenna 904a, and data transmission may not be performed between the second antenna 903b and the fifth antenna 904b due to the distance.

For example, when the first housing 901 in fig. 9 includes a main board of the mobile phone 90, the second housing 902 includes a camera control module of the mobile phone 90. The camera control module in the cell-phone can take place to slide, before the camera control module does not take place to slide, can pass through first group radio frequency chip transmission data (such as first antenna 903a and fourth antenna 904a in above-mentioned figure 9, second antenna 903b and fifth antenna 904b) with the mainboard, after taking place to slide, can use second group radio frequency chip and mainboard to carry out data transmission (such as third antenna 903c and fourth antenna 904a in above-mentioned figure 9), thereby make the printed circuit board external member that this disclosed embodiment provided use in a flexible way.

In addition, the inside of the wireless communication equipment adopts the micron wave communication, the data transmission between the modules is realized, the anti-interference capability is strong, the problem that signals of the FPC are easily interfered can be solved, and the reliability of the data transmission is improved to a certain extent.

Referring to fig. 10, a schematic structural diagram of a wireless communication device according to an embodiment of the present disclosure is shown. As shown in fig. 10, the wireless communication device 1000 includes a printed circuit board assembly 1001, and the wireless communication device 1000 further includes a first housing 1002 and a second housing 1003, where the first housing 1002 and the second housing 1003 are two housings whose relative positions can be changed. A first printed circuit board in the printed circuit board assembly 1001 is disposed in the first housing 1002, and a second printed circuit board in the printed circuit board assembly 1001 is disposed in the second housing 1003.

In a possible implementation manner, when the wireless communication device may be a smartphone, please refer to fig. 11, which shows a schematic structural diagram of a smartphone according to an embodiment of the present disclosure, as shown in fig. 11, in a smartphone 1100, a printed circuit board kit 1101 is included, the smartphone 1100 further includes a first housing 1102 and a second housing 1103, and the first housing 1102 and the second housing 1103 are two housings whose relative positions are changeable. A first printed circuit board in the printed circuit board assembly 1101 is disposed in the first housing 1102, and a second printed circuit board in the printed circuit board assembly 1101 is disposed in the second housing 1103.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A printed circuit board assembly, comprising:

2. The printed circuit board assembly of claim 1, wherein a distance between the antenna of the first RF chip and the antenna of the second RF chip is less than a preset distance threshold.

3. The printed circuit board assembly of claim 1, wherein a deviation angle between the antenna direction of the first RF chip and the antenna direction of the second RF chip is less than a predetermined angle threshold.

4. The printed circuit board assembly of claim 1, wherein the first RF chip and the second RF chip support a designated RF band, the designated RF band not being lower than the RF V-band.

5. The printed circuit board assembly of claim 1,

and the data between the first printed circuit board and the second printed circuit board is transmitted between the first radio frequency chip and the second radio frequency chip according to the transmission rate corresponding to the data type of the data.

6. The printed circuit board assembly of claim 1,

and the data between the first printed circuit board and the second printed circuit board is transmitted between the first radio frequency chip and the second radio frequency chip according to the transmission rate indicated by the specified software installed in the wireless communication equipment.

7. The printed circuit board assembly of claim 1,

the first radio frequency chip is connected with the first printed circuit board through a Universal Serial Bus (USB) interface;

and/or the presence of a gas in the gas,

8. The printed circuit board assembly of claim 1,

the first printed circuit board is a main board in the wireless communication equipment;

9. The printed circuit board assembly of claim 1,

the first printed circuit board is disposed in a first housing of the wireless communication device, the second printed circuit board is disposed in a second housing of the wireless communication device, and the first housing and the second housing are two housings whose relative positions are changeable.

10. The printed circuit board assembly of claim 1,

the first radio frequency chip and the second radio frequency chip transmit the data in a half-duplex mode;

alternatively, the first and second electrodes may be,

11. A wireless communication device comprising a printed circuit board assembly as claimed in any one of claims 1 to 10.

12. The wireless communication device of claim 11, wherein the wireless communication device comprises a first housing and a second housing, wherein the first housing and the second housing are two housings with variable relative positions;