CN107077914B - 导电糊剂及连接结构体 - Google Patents

导电糊剂及连接结构体 Download PDF

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Publication number
CN107077914B
CN107077914B CN201680003218.XA CN201680003218A CN107077914B CN 107077914 B CN107077914 B CN 107077914B CN 201680003218 A CN201680003218 A CN 201680003218A CN 107077914 B CN107077914 B CN 107077914B
Authority
CN
China
Prior art keywords
scolding tin
mentioned
electrode
particle
conductive paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201680003218.XA
Other languages
English (en)
Chinese (zh)
Other versions
CN107077914A (zh
Inventor
增井良平
石泽英亮
上野山伸也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of CN107077914A publication Critical patent/CN107077914A/zh
Application granted granted Critical
Publication of CN107077914B publication Critical patent/CN107077914B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/115—Manufacturing methods by chemical or physical modification of a pre-existing or pre-deposited material
    • H01L2224/1152—Self-assembly, e.g. self-agglomeration of the bump material in a fluid

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
CN201680003218.XA 2015-02-19 2016-02-17 导电糊剂及连接结构体 Expired - Fee Related CN107077914B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015-031012 2015-02-19
JP2015031012 2015-02-19
PCT/JP2016/054565 WO2016133113A1 (ja) 2015-02-19 2016-02-17 導電ペースト及び接続構造体

Publications (2)

Publication Number Publication Date
CN107077914A CN107077914A (zh) 2017-08-18
CN107077914B true CN107077914B (zh) 2019-05-31

Family

ID=56688991

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680003218.XA Expired - Fee Related CN107077914B (zh) 2015-02-19 2016-02-17 导电糊剂及连接结构体

Country Status (4)

Country Link
JP (1) JP6082843B2 (ja)
CN (1) CN107077914B (ja)
TW (1) TW201635310A (ja)
WO (1) WO2016133113A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018046004A (ja) * 2016-09-07 2018-03-22 積水化学工業株式会社 導電材料及び接続構造体
US20210229222A1 (en) * 2018-06-26 2021-07-29 Showa Denko Materials Co., Ltd. Solder particles and method for producing solder particles

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1706008A (zh) * 2003-07-04 2005-12-07 奈得可股份有限公司 敷料导电性粒子、导电性材料、各向异性导电粘合剂及各向异性导电接合结构
CN102144432A (zh) * 2008-09-05 2011-08-03 住友电木株式会社 导电连接材料、使用该导电连接材料的端子之间的连接方法以及连接端子的制造方法
CN103443869A (zh) * 2012-02-21 2013-12-11 积水化学工业株式会社 导电性粒子、导电性粒子的制造方法、导电材料及连接结构体
WO2014112541A1 (ja) * 2013-01-17 2014-07-24 積水化学工業株式会社 電子部品用硬化性組成物、接続構造体及び接続構造体の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5099284B2 (ja) * 2005-02-24 2012-12-19 ソニーケミカル＆インフォメーションデバイス株式会社 異方性接続シート材料
CN101523513B (zh) * 2006-10-17 2012-01-11 日立化成工业株式会社 被覆粒子及其制造方法、以及所形成的组合物和粘接剂膜
US20120152343A1 (en) * 2010-12-16 2012-06-21 E. I. Du Pont De Nemours And Company Aluminum paste compositions comprising siloxanes and their use in manufacturing solar cells
EP2753442B1 (en) * 2011-09-06 2019-10-30 Henkel IP & Holding GmbH Di-or poly-functional electron deficient olefins coated metal powders for solder pastes

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1706008A (zh) * 2003-07-04 2005-12-07 奈得可股份有限公司 敷料导电性粒子、导电性材料、各向异性导电粘合剂及各向异性导电接合结构
CN102144432A (zh) * 2008-09-05 2011-08-03 住友电木株式会社 导电连接材料、使用该导电连接材料的端子之间的连接方法以及连接端子的制造方法
CN103443869A (zh) * 2012-02-21 2013-12-11 积水化学工业株式会社 导电性粒子、导电性粒子的制造方法、导电材料及连接结构体
WO2014112541A1 (ja) * 2013-01-17 2014-07-24 積水化学工業株式会社 電子部品用硬化性組成物、接続構造体及び接続構造体の製造方法

Also Published As

Publication number Publication date
WO2016133113A1 (ja) 2016-08-25
CN107077914A (zh) 2017-08-18
JP6082843B2 (ja) 2017-02-15
JPWO2016133113A1 (ja) 2017-04-27
TW201635310A (zh) 2016-10-01

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Granted publication date: 20190531

Termination date: 20210217