CN107077244A - The manufacture method of conductive board - Google Patents
The manufacture method of conductive board Download PDFInfo
- Publication number
- CN107077244A CN107077244A CN201580055410.9A CN201580055410A CN107077244A CN 107077244 A CN107077244 A CN 107077244A CN 201580055410 A CN201580055410 A CN 201580055410A CN 107077244 A CN107077244 A CN 107077244A
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- Prior art keywords
- metal level
- conductive board
- black coating
- resist layer
- layer
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
Abstract
The present invention provides a kind of manufacture method of conductive board, implements successively：Resist layer forming step, on the metal level of the base material of the metal level formed with transparent base and at least one face of the transparent base, forms the resist layer for possessing the opening portion corresponding with the Wiring pattern to be formed；Black coating forming step, black coating is formed in the opening portion of the resist layer；Resist layer removing step, removes the resist layer；And metal level removing step, remove the metal level exposed from the black coating.
Description
Technical field
The present invention relates to a kind of manufacture method of conductive board.
Background technology
Electrostatic capacity type touch screen is detected by the static capacity change caused by the object close to panel surface, is incited somebody to action
The positional information close to object on panel surface is transformed to electric signal.Due to the conductive board used in electrostatic capacity type touch screen
The surface of display is arranged on, so, the wiring material of the conductive board needs reflectivity relatively low, and is difficult to by depending on recognizing.
So, as the wiring material used in electrostatic capacity type touch screen, it can be used the reflectivity relatively low and be difficult to by depending on recognizing
Distribution is formed with material, and transparency carrier or transparent membrane.For example, being disclosed in patent document 1 a kind of thin in macromolecule
The touch screen transparent conducting film of ITO (tin indium oxide) film is formd on film as nesa coating.
In recent years, with the display for possessing touch screen large screen development, correspondingly, it is also desirable to touch screen use
The conductive boards such as transparent conducting film carry out large area.However, ITO resistance value is higher, easily occur the bad of signal
Change, so, it there is the problem of being unsuitable for larger panel.
Therefore, for example, as shown in patent document 2,3, having carried out using metal foils such as copper replacing the research of ito film.So
And, for example, in the case of having used the metal foils such as copper on the metal layer, because copper has metallic luster, so, it there is reflection
The flicker of light can make the problem of visibility of display is reduced.
So, in addition to also having carried out the metal level except being made up of metal foils such as copper, yet forms both can be to metal level table
The research of the conductive board for the blackening layer that the light reflection in face is suppressed.
Metal level and blackening layer are formed as one kind, and the conductive board of Wiring pattern has been carried out to metal level etc.
Manufacture method, for example, it is proposed that a kind of method based on following steps.
First, the lamination conductive board of metal level and blackening layer over the transparent substrate is manufactured.Next, black
Change and stick DFR (dry film resist) on layer, and put on DFR surface one and form Wiring pattern formation with covering
The mask of film figure, then carries out exposure and development, accordingly, and expected opening portion is formed on DFR.Next, to from DFR's
The blackening layer and metal level that opening portion is exposed are etched to form Wiring pattern, and DFR is peeled off.
Prior art text
Patent document
Patent document 1：Japanese Laid-Open 2003-151358 publications
Patent document 2：Japanese Laid-Open 2011-018194 publications
Patent document 3：Japanese Laid-Open 2013-069261 publications
The content of the invention
The invention problem to be solved
However, the adherence between DFR and blackening layer is poor, to form the fine fine rule of wiring width by etching,
Then there is the DFR formed on blackening layer can be peeling-off, the problem of causing to be difficult to form expected Wiring pattern.
In view of above-mentioned problem of the prior art, the purpose of an aspect of of the present present invention is to be formed including matching somebody with somebody there is provided one kind
The manufacture method of the conductive board of the Wiring pattern of the fine fine rule of line width.
Means for solving the problems
In order to solve above-mentioned problem, according to the embodiment of the present invention there is provided a kind of manufacture method of conductive board, according to
It is secondary to implement：
Resist layer (resist layer) forming step, with transparent base and at least one face of the transparent base
On the metal level of the base material of the metal level of upper formation, formation possesses the opening portion corresponding with the Wiring pattern to be formed
Resist layer；
Black coating forming step, black coating is formed in the opening portion of the resist layer；
Resist layer removing step, removes the resist layer；And
Metal level removing step, removes the metal level exposed from the black coating.
The effect of invention
According to the embodiment of the present invention, using the teaching of the invention it is possible to provide a kind of formed includes the wiring diagram of the fine fine rule of wiring width
The manufacture method of the conductive board of case.
Brief description of the drawings
The explanation figure (1) for the step of Figure 1A is the manufacture method of the conductive board of embodiments of the present invention.
The explanation figure (2) for the step of Figure 1B is the manufacture method of the conductive board of embodiments of the present invention.
The explanation figure (3) for the step of Fig. 1 C are the manufacture method of the conductive board of embodiments of the present invention.
The explanation figure (4) for the step of Fig. 1 D are the manufacture method of the conductive board of embodiments of the present invention.
Fig. 2A is the structure of the conductive board obtained by the manufacture method of the conductive board of embodiments of the present invention
Into the top view of example.
Fig. 2 B are the sectional view along Fig. 2A A-A ' lines.
Fig. 3 A are to have used the electric conductivity base that the manufacture method by the conductive board of embodiments of the present invention is obtained
Plate and possess netted distribution lamination conductive board configuration example top view.
Fig. 3 B are the sectional view along Fig. 3 A B-B ' lines.
Fig. 4 possesses leading for netted distribution for what is obtained by the manufacture method of the conductive board of embodiments of the present invention
The sectional view of electrical substrate.
Embodiment
The embodiment to the manufacture method of the conductive board of the present invention is illustrated below.
The manufacture method of the conductive board of present embodiment can be performed the following steps successively.
Resist layer forming step, in the metal formed with transparent base and at least one face of the transparent base
On the metal level of the base material of layer, the resist layer for possessing the opening portion corresponding with the Wiring pattern to be formed is formed.
Black coating forming step, black coating is formed in the opening portion of resist layer.
Resist layer removing step, removes resist layer.
Metal level removing step, removes the metal level exposed from black coating.
As noted previously, as blackening layer and relatively low as the adherence between the DFR of resist layer, so, carried according to existing
The manufacture method of the conductive board gone out, when being etched to metal level and/or blackening layer, it is peeling-off to there is DFR, leads
Cause can not form the situation of the Wiring pattern including fine fine rule.
So, manufacture method of the present inventor to the conductive board with the Wiring pattern including fine fine rule
Studied.It is found that, is formed on the metal layer after the black coating with expected pattern, reuse the black coating to gold
Category layer is patterned, accordingly, can manufacture the conductive board with the Wiring pattern for including fine fine rule, and complete this hair
It is bright.
Each step to the manufacture method of the property the led substrate of present embodiment is illustrated.
(resist layer forming step)
First, resist layer forming step is illustrated.
In resist layer forming step, what is formed with transparent base and at least one face of the transparent base
On the metal level of the base material of metal level, the resist layer for possessing the opening portion corresponding with the Wiring pattern to be formed can be formed.
Here, first to for having transparent base and at least one of the transparent base used in resist layer forming step
The base material of the metal level formed on face is illustrated.
As transparent base, there is no particular limitation on it, and preferably using the permeable resin substrate of visible light, (resin is thin
Film) or glass substrate etc..
As the material of the permeable resin substrate of visible light, such as polyamide (polyamide) class tree is preferably used
Fat, PET (polyethylene terephthalate) resinoid, PEN
(polyethylene naphthalate) resinoid, cycloolefin (cycloolefin) resinoid, polyimide
(polyimide) resin such as resinoid, makrolon (polycarbonate) resinoid.Particularly as visual light-transmissive
Resin substrate material, can be preferred polyamide, PET (PET), COP (cyclic olefin polymer),
PEN (PEN), polyimide, makrolon etc..
The thickness of transparent base is not particularly limited, can be according to required intensity when using for conductive board
And/or static capacity, light transmission rate etc. carry out any selection.As the thickness of transparent base, for example, can be more than 10 μm, 200 μ
Below m.Especially in the case where being used in the purposes of touch screen, the thickness of transparent base is preferably more than 20 μm, 120 μm with
Under, preferably more than 20 μm, less than 100 μm.In the case where being used in the purposes of touch screen, for example, especially needing to make to show
Show in the thinning purposes of device integral thickness, the thickness of transparent base is preferably more than 20 μm, less than 50 μm.
Overall light transmitance the higher person of transparent base be it is preferred, for example, overall light transmitance be preferably 30% with
On, preferably more than 60%.Within the above range, for example, it is being used in by by the overall light transmitance setting of transparent base
In the case of the purposes of touch screen, the visibility of display can be fully ensured.
It should be noted that can be passed through by the method for JIS K 7361-1 defineds to the overall light of transparent base
Rate is evaluated.
Next metal level is illustrated.
The constituent material of metal level is not particularly limited, the material with the electrical conductivity rate being consistent with its purposes may be selected
Expect, for example, it is preferable to the metal of at least one or more for Cu and selected in Ni, Mo, Ta, Ti, V, Cr, Fe, Mn, Co, W
Copper alloy or, copper-bearing materials.In addition, metal level can also be the layers of copper being made up of copper.
The method for forming metal level over the transparent substrate is not particularly limited, however, in order to not reduce light transmission rate, it is excellent
Elect as and adhesive agent is not configured between transparent base and metal level.That is, metal level is preferably be formed directly into transparent base upper
Surface.
In order to directly form metal level in the upper surface of transparent base, metal level is preferably to have metal film layer.Also, golden
Category layer can also have metal film layer and the coat of metal.
For example, over the transparent substrate, can be by universe formula plating method formation metal film layer, and it regard the metal film layer as gold
Belong to layer.Accordingly, metal level can not be directly formed via adhesive agent over the transparent substrate.It should be noted that being plated as universe formula
Method, preferably using such as vapour deposition method, sputtering method, ion plating method.Especially from the angle that easily can be controlled to thickness
From the point of view of, it is preferred to use sputtering method.
In addition, in the case where the thickness of metal level to be made is thickening, (being powered as to electric layer by metal film layer is used
Layer), the coat of metal is formed as a kind of galvanoplastic of wet type plating method, metal level can also have metal film layer and metal
Coating., now also can be over the transparent substrate not via adhesive agent by making metal level that there is metal film layer and the coat of metal
Directly form metal level.
Just using wet type plating method formed the coat of metal when condition, for example formed by galvanoplastic during the coat of metal
Condition for, there is no particular limitation on it, can use the various conditions based on usual method.For example, metal can will be formd
The base material of film layer is put into the coating bath for being built-in with metal plating liquid, and is entered by the conveyance speed to current density and/or base material
Row control, to form the coat of metal.
It should be noted that in the case where metal level has metal film layer and the coat of metal, metal film layer and gold
The material for belonging to coating can be difference, it is however preferred to be constituted using identical material.
In addition, in the conductive board of present embodiment, black coating and metal level described later relative to etching solution
Reactivity is preferably difference.For metal level, for example it is higher relative to the reactivity of general copper chloride solution used,
I.e., it is preferred to use copper chloride solution easily can be etched to it.Therefore, the metal level of the conductive board of present embodiment
The preferably such as layer including being made up of copper.Specifically, the metal level of the conductive board of present embodiment is preferably comprised
Such as copper film layer.In addition, the metal level of the conductive board of present embodiment may also comprise copper plate.
The thickness of metal level is not particularly limited, can be according to confession in the case where metal level is come into use as distribution
Any selection is carried out to size of current and/or wiring width to the distribution etc..
If however, metal level is thicker, when carrying out being used to be formed the etching of Wiring pattern, due to the time needed for etching
It is longer, lateral erosion is easily produced, so, it there is the problem of being difficult to form fine rule etc..Therefore, the thickness of metal level is preferably 5 μm
Hereinafter, preferably less than 3 μm.
In addition, especially from the resistance value of reduction conductive board with from the viewpoint of carrying out sufficient electric current supply, example
Such as, the thickness of metal level is preferably more than 50nm, preferably more than 60nm, preferably 150nm.
It should be noted that in the case where metal level has metal film layer and the coat of metal as described above, metal foil
The thickness of film layer and the total of the thickness of the coat of metal are preferably located in above range.
In the case where metal level is made up of metal film layer or, situation about being made up of metal film layer and the coat of metal
Under, the thickness of metal film layer is all not particularly limited, for example preferably more than 50nm, below 500nm.
For metal level, as described later, such as, by by its patterned expected Wiring pattern, it can be used as distribution
To use.Further, since the resistance value of metal level can be less than the ITO used as existing nesa coating resistance value,
So, by setting metal level, it is possible to decrease the resistance value of conductive board.
It should be noted that adhesive layer also can be set between transparent base and metal level.
As described above, metal level may be formed on transparent base, however, being formed directly into by metal level on transparent base
In the case of, then it there is the bad situation of adherence between transparent base and metal level.Therefore, in the upper table of transparent base
In the case that face directly forms metal level, in the fabrication process or in use, there is metal level can peel off from transparent base
Situation.
So, in the manufacture method of the conductive board of present embodiment, in order to improve transparent base and metal level it
Between adherence, adhesive layer can be also configured between transparent base and metal level.
By adhesive layer is configured between transparent base and metal level, the adherence of transparent base and metal level can be improved,
And then metal level can be suppressed from the stripping of transparent base.
In addition, can also make the function of adhesive layer performance blackening layer.Now, from metal level lower face side, i.e., transparent base
The light reflection of metal level caused by the incident light in side can be also suppressed.
The constituent material of adhesive layer is not particularly limited, can be according to the adhesion force and/or institute of transparent base and metal level
Need to the inhibition level of the light of layer on surface of metal reflection and relative to conductive board use environment (such as humidity, temperature)
Extent of stability etc. carries out any selection.
Adhesive layer preferably for example including selected from Ni, Zn, Mo, Ta, Ti, V, Cr, Fe, Co, W, Cu, Sn, Mn to
Few more than a kind metal.In addition, adhesive layer may also include more than a kind of the element selected from carbon, oxygen, hydrogen, nitrogen.
It should be noted that adhesive layer may include metal alloy, the metal alloy include from Ni, Zn, Mo, Ta, Ti, V,
At least two kinds of metals above selected in Cr, Fe, Co, W, Cu, Sn, Mn.In the case, adhesive layer also may also include from carbon,
More than a kind of the element selected in oxygen, hydrogen, nitrogen.Now, as including from Ni, Zn, Mo, Ta, Ti, V, Cr, Fe, Co, W, Cu,
The metal alloy of at least two kinds of metals above selected in Sn, Mn, preferably can be used such as Cu-Ti-Fe alloys, Cu-
Ni-Fe alloys, Ni-Cu alloys, Ni-Zn alloys, Ni-Ti alloys, Ni-W alloys, Ni-Cr alloy, Ni-Cu-Cr are closed
Gold.
It should be noted that make adhesive layer play blackening layer function in the case of, adhesive layer preferably for example including
Ni-Cu alloys.Now adhesive layer also may also include more than a kind of the element selected from carbon, oxygen, hydrogen, nitrogen.
In addition, as described later, after black coating is formed, the metal level exposed from black coating is removed, however,
In the case of foring adhesive layer, now adhesive layer is preferably also and carries out the patterning same with metal level.That is, be preferably pair
The part not covered by black coating in adhesive layer is removed.In the case, due to being using black coating to cover
Film is etched to metal level and adhesive layer, so, the material of adhesive layer is used as, is preferably the materials different from black coating
Material, preferably for etching solution reactivity than black coating also high material.
The film build method of adhesive layer is not particularly limited, it is however preferred to carry out film forming using universe formula plating method.It is used as the universe
Formula plating method, such as preferred usable vapour deposition method, sputtering method, ion plating method.Film forming is being carried out using universe formula method to adhesive layer
In the case of, due to that easily can be controlled to thickness, therefore, it is preferable to use sputtering method.It should be noted that in adhesive layer
More than a kind of the element selected from carbon, oxygen, hydrogen, nitrogen can be also added as described above, is splashed in this case, preferably using reactivity
Penetrate method.
In the case of including more than a kind of element being selected from carbon, oxygen, hydrogen, nitrogen in adhesive layer, by adherence
Addition includes the gas of more than a kind of the element selected from carbon, oxygen, hydrogen, nitrogen in environmental gas during layer film forming, can be added
Add in adhesive layer.For example, in the case of adding carbon in adhesive layer, can be in advance into environmental gas when implementing the plating of universe formula
Add CO gas and/or carbon dioxide；In the case of oxygen to be added, oxygen can be added in advance；To add
In the case of hydrogen, hydrogen and/or water can be added in advance；In the case of nitrogen to be added, nitrogen can be added in advance.
For the gas including more than a kind of the element selected from carbon, oxygen, hydrogen, nitrogen, it is preferably to be added to inertia
Gas, environmental gas during being plated as universe formula.As inert gas, there is no particular limitation on it, however, for example preferably making
Use argon gas.
Film forming is carried out by adhesive layer use universe formula plating method as described above, can be improved between transparent base and adhesive layer
Adherence.In addition, adhesive layer is for example due to may include metal as its principal component, so, the adherence between metal level
It is higher.Therefore, by adhesive layer is configured between transparent base and metal level, can suppress to the stripping of metal level.
The thickness of adhesive layer is not particularly limited, however, being for example preferably more than 3nm, below 50nm, preferably 3nm
Above, below 35nm, preferably more than 3nm, below 33nm.
In the case where making adhesive layer also play the function of blackening layer, i.e. the light reflection of metal level is being suppressed
In the case of, the thickness of adhesive layer is preferably more than 3nm as described above.
Higher limit to adhesive layer thickness is not particularly limited, if however, blocked up, time needed for film forming and/or
The time needed for etching during distribution formation can be elongated, so may result in into this upper Noboru.Therefore, the thickness of adhesive layer as above institute
State preferably below 50nm, preferably preferably below 35nm, below 33nm.
In addition, in resist layer forming step, can be on transparent base illustrated so far and the transparent base
Resist layer is formed on the base material of the metal level formed.
Cutting for conductive board when metal level 12 and resist layer 13 are formd on transparent base 11 is shown in Figure 1A
Face figure.Figure 1A shows the form that metal level 12 and resist layer 13 are formd on the 1st principal plane 11a of transparent base 11, so
And, the form is not limited to, for example, as described later, can also also form metal in the 2nd principal plane 11b sides of transparent base 11
Layer and resist layer.
For resist layer 13, as long as plating resist layer (plating resist) can be played in black coating forming step
Function, is not particularly limited to material of resist layer 13 etc..As resist layer 13, for example, preferably use film-form DFR
(dry film resist)。
The thickness of resist layer 13 also and is particularly limited to, any choosing can be carried out according to thickness for the black coating to be formed etc.
Select.Resist layer 13 is preferably that such as its thickness is more than 10 μm, less than 15 μm.
Forming method of the resist layer 13 on metal level 12 is not particularly limited, can be according to the constituent material of resist layer 13
Species etc. carry out any selection.For example, as described above, in resist layer by the case that film-form DFR is formed, it is contemplated that film
Shrinkage factor, can first be heated to after 85 DEG C~105 DEG C again by lamination by its transcription on the metal layer.
Resist layer 13 formed in resist layer forming step can have corresponding with the Wiring pattern shape to be formed
Opening portion.
Specifically,, can shape by opening portion 14 is formed on the resist layer 13 shown in Figure 1A for example, as shown in Figure 1B
Into the resist layer 131 for possessing opening portion 14.
The forming method for possessing the resist layer 131 of the opening portion 14 is not particularly limited, however, for example can be by following step
It is rapid to be formed.
First, as described above, in the face of the formation resist layer 13 of metal level 12, i.e., the upper surface of metal level 12 integrally
Form resist layer 13.
Next, putting a mask for foring the pattern for forming opening portion 14 on resist layer 13, and carry out
Exposure and development.Accordingly, the resist layer 131 for possessing the opening portion 14 corresponding with Wiring pattern shape can be formed.
Condition during to exposure and development is not particularly limited, can according to the constituent material of used resist layer and/or
Thickness of resist layer etc. carries out any selection.For example, for exposure, according to the thickness of resist layer, cumulative exposure can be set
It is set to 50mJ/cm2Above, 80mJ/cm2Implement below.In addition, for development, for example, aqueous sodium carbonate can be used
Implement, now, the concentration to used aqueous sodium carbonate is also not particularly limited, for example, can be 5~7wt%.
(black coating forming step)
Next black coating forming step is illustrated.
In black coating forming step, with the opening portion corresponding with manufacturing shape in resist layer forming step
Black coating is formed at the opening portion 14 of resist layer.For example, as shown in Figure 1 C, can possess the opening portion 14 that Figure 1B is formed
Black coating 15 is formed in the opening portion 14 of resist layer 131.
For black coating 15, for instance, it may be preferable to be formed using metal level 12 as the galvanoplastic of electrode.
The constituent material of black coating 15 is not particularly limited, carried out as long as can reflect the light on the surface of metal level 12
The material of suppression.
Black coating preferably comprises what is for example selected from Ni, Zn, Mo, Ta, Ti, V, Cr, Fe, Co, W, Cu, Sn, Mn
The metal of at least one or more.In addition, black coating may also include more than a kind of the element selected from carbon, oxygen, hydrogen, nitrogen.
It should be noted that black coating may also comprise metal alloy, the metal alloy include from Ni, Zn, Mo, Ta, Ti,
At least two kinds of metals above selected in V, Cr, Fe, Co, W, Cu, Sn, Mn.Now, black coating also may also include from carbon,
More than a kind of the element selected in oxygen, hydrogen, nitrogen.
Now, as including selected from Ni, Zn, Mo, Ta, Ti, V, Cr, Fe, Co, W, Cu, Sn, Mn it is at least two kinds of with
On metal metal alloy, for example preferably using Cu-Ti-Fe alloys, Cu-Ni-Fe alloys, Ni-Cu alloys,
Ni-Zn alloys, Ni-Ti alloys, Ni-W alloys, Ni-Cr alloy, Ni-Cu-Cr alloys.
In the manufacture method of the conductive board of present embodiment, using metal level and black coating and etching solution
Reactive difference, and metal level is patterned using the pattern of black coating.So, metal level and black coating
The reactivity relative to etching solution be preferably difference.In addition, as described above, forming adherence between transparent base and metal level
In the case of layer, the answering property relative to etching solution of adhesive layer and black coating is preferably also difference.
In addition, being understood by the research of the present inventor, formed by tin class black plating solution and/or chromium class black plating solution
In the case of black coating, the black coating is compared with the metal level such as including copper, it is relative to conventionally used work
For etching solution copper chloride solution it is reactive relatively low.Selected therefore, black coating is preferably comprised from Sn (tin), Cr (chromium)
More than a kind.The containing ratio for being especially desirable Sn (tin) be more than 15wt%, and/or, Cr (chromium) containing ratio be 10wt% with
On.
It should be noted that the manufacture method as above-mentioned existing conductive board, forming melanism on the metal layer
After layer again by being etched metal level and blackening layer to form Wiring pattern in the case of, preferably metal level and melanism
Layer has the reactivity of same degree relative to plating solution.However, for the blackening layer containing tin and/or chromium, as described above, its
It is poor compared with reactive copper with being suitable for use in metal level of copper chloride solution etc., it is therefore difficult to be formed with expection
The conductive board of Wiring pattern.In contrast, in the manufacture method of the conductive board of present embodiment, due to can not be right
Black coating implements etching, so, in the case that black coating includes tin and/or chromium, it can also be formed and matched somebody with somebody with expection
The conductive board of line pattern.Therefore, for the situation that blackening layer (black coating) includes tin and/or chromium, being led with existing
The manufacture method of electrical substrate is compared, especially with can form the effect of preferable Wiring pattern.
Especially, black coating preferably comprises chromium.The reason is that by the chromium class black plating solution (chromium class containing chromium
Plating solution) reduction (suppression) of the black coating that is formed to the reflectivity of layer on surface of metal is particularly effective.
Constituent to plating solution is not particularly limited, however, used plating solution is except black during black coating formation
Beyond the constituent of coating, for example, it may also include acetic acid and barium acetate.
Condition when being formed to black coating is not particularly limited, can be according to used plating solution and/or black coating
Thickness, conveyance speed of base material etc. carry out any selection.For example, black coating can bath temperature be more than 30 DEG C, 45 DEG C with
Under, and supply to the voltage of metal level to be formed using electroplating method under conditions of more than 4V, below 10V.
(resist layer removing step)
Next resist layer removing step is illustrated.
In resist layer removing step, for example, the resist layer 131 with opening portion shown in Fig. 1 C can be removed.
Removing method to resist layer is not particularly limited, and can be removed according to the species of resist layer using any means
Go.For example, in the case where having used DFR as resist layer, can be peeled off by warmed-up organic amine stripper.This
When, the temperature to organic amine stripper is not particularly limited, however, being for example preferably to be heated to more than 40 DEG C, less than 45 DEG C.
(metal level removing step)
Next metal level removing step is illustrated.
By above-mentioned resist layer removing step is implemented, a part for the upper surface of metal level is covered by black coating 15
Lid, the other parts of the upper surface of metal level 12 are then changed into the state exposed from black coating 15.So, removed in metal level
In step, the metal level 12 exposed from black coating 15 can be removed.Accordingly, as shown in figure iD, one can be obtained saturating
The metal level 121 of the patterning corresponding with the shape of black coating 15 and leading for black coating 15 have been laminated on bright base material 11
Electrical substrate.
In metal level removing step, it is etched by using etching solution, metal level can be removed.As now used
Etching solution, there is no particular limitation on it, can carry out any selection, it is preferable, however, that using the reactivity relative to black coating 15
The relatively low and higher etching solution of reactivity relative to metal level 12.It should be noted that reactivity is relatively low, it is meant that be difficult to molten
Change, and reactivity is higher, then means to dissolve easily.
As etching solution, for example, preferably use stannous chloride (bronze medal of chlorination second) solution.To the tool of cuprous chloride solution
Body constituent is not particularly limited, however, for example preferably using stannous chloride amount be more than 20wt%, 35wt% with
Under, and chlorine amount is more than 1wt%, below 7wt% solution.
In metal level removing step, etching condition when being removed to metal level, for example, etching solution temperature and/or etching
Dip time in liquid etc. is not particularly limited, can be according to the thickness of the material of metal level and/or metal level, the species of etching solution
Deng the arbitrary condition of selection.For example, in the case where using cuprous chloride solution as etching solution, cuprous chloride solution can be to connect
More than 20 DEG C, less than 25 DEG C of temperature of near ambient temperature.In addition, the material of metal level and black coating will can be formd on transparent base
Material carries out such as more than 10 seconds, the dipping of less than 20 seconds in cuprous chloride solution.
It should be noted that as described above, in the case of foring adhesive layer between transparent base and metal level, in gold
Belong in layer removing step, be preferably that the patterning same with metal level is also carried out to adhesive layer.That is, for adhesive layer, preferably
In metal level removing step, to be removed to the part not covered by black coating.
As described above, in the case where being patterned to adhesive layer, it is possible to use etching solution during etching metal level, with
Metal level is removed together.In addition, after the etching of implementation metal level, it is possible to use different etching solutions is carried out to adhesive layer
Etching., can be by etching, to not covered by black coating and metal level in adhesive layer when carrying out the etching of adhesive layer
Part is removed.That is, it can implement using black coating and metal level as the etching of the adhesive layer of mask.
So far, it is illustrated with reference to Figure 1A~Fig. 1 D, in addition, being illustrated that in Figure 1A~Fig. 1 D, only transparent
The example of the metal level 121 patterned and black coating 15 is formd on 1st principal plane 11a of base material.However, not limiting
Due to the form, the metal level and black coating patterned similarly can be also formed on the 2nd principal plane 11b.Need explanation
, adhesive layer can be also set between transparent base and metal level in the case.
For forming the situation of the metal level that has patterned and black coating on the 2nd principal plane 11b, due to can with it is upper
Situation is stated similarly to be formed, so, the description thereof will be omitted here.
The light degree of reflection for the conductive board that manufacture method to the conductive board by present embodiment is obtained
It is not particularly limited.For example, wavelength is more than 400nm, the reflectivity (normal reflection rate) of below 800nm light is preferably less than
30%, preferably less than 20%, preferably less than 10%.Wavelength be more than 400nm, below 800nm light reflectivity be less than
In the case of 30%, for example, even in as touch screen conductive board in use, because display is substantially not in
The reduction of visibility, so, it is preferred.
The measure of reflectivity can be measured by light irradiation is carried out to black coating.
Specifically, for example, having stacked gradually pattern in the 1st principal plane 11a sides of transparent base 11 as shown in figure iD
In the case of the metal level 121 and black coating 15 changed, light irradiation is carried out from upper side to the surface 15a of black coating 15,
So that illumination is incident upon black coating 15, you can be measured.During measure, can by wavelength be more than 400nm, below 800nm light
Interval for example using wavelength as 1nm is irradiated to the black coating 15 of conductive board as described above, and will can be determined
Value average value as the conductive board reflectivity.
It should be noted that being formed on transparent base 11 in the adhesive layer for the function of playing blackening layer and having patterned
In the case of between metal level 121, light irradiation is carried out from the 2nd lateral adhesive layers of principal plane 11b of transparent base with similarity condition,
So that illumination is incident upon adhesive layer, the reflectivity that pair can be also provided with the face of the side of adhesive layer is measured.
In the conductive board obtained by the manufacture method of the conductive board of present embodiment, it is preferably,
The light reflectivity that black coating surface is determined is located in above range.In addition, foring the close of the function of performance blackening layer
In the case of layer, preferably, the light reflectivity on adherence layer surface and black coating surface all meets above range.
In addition, in the conductive board obtained by the manufacture method of the conductive board of present embodiment, as above
Metal level 121 that is described, having been patterned due to being provided with, so, the sheet resistance of conductive board can be reduced.Sheet resistance is excellent
Elect as less than 0.2 Ω/, preferably less than 0.15 Ω/.The assay method of sheet resistance is not particularly limited, however, example
Can be such as measured using 4 sonde methods, preferably make probe and conductive board surface, for example, the surface of black coating
Contacted, to be measured.
Next, the composition for the conductive board that the manufacture method to the conductive board by present embodiment is obtained
Example is illustrated.
As described above, possessing by the conductive board manufactured by the manufacture method of the conductive board of present embodiment
Bright base material, metal level and black coating, wherein, metal level and black coating can be stacked gradually on transparent base.In addition, according to
Need, adhesive layer is may also set up between transparent base and metal level.
In addition, the conductive board obtained by the manufacture method of the conductive board of present embodiment can be wiring base
Plate, wherein, metal level and black coating are patterned, in addition, as needed, adhesive layer can also be patterned.
In the case, as shown in figure iD, the metal level 121 and black coating 15 patterned can have roughly the same pattern.That is,
The cross sectional shape in the face parallel with the principal plane of transparent base 11 can be same shape.
In addition, in the case where being provided with adhesive layer, for adhesive layer, it is with the metal level 121 that has patterned and black
The cross sectional shape in color coating 15, parallel with the principal plane of transparent base face can be same shape.
In the conductive board obtained by the manufacture method of the conductive board of present embodiment, just pattern
Metal level and blackening layer and adhesive layer in the case of being provided with adhesive layer for, (line width is matched somebody with somebody to the pattern width of each layer
Degree) and/or shape be all not particularly limited, any selection can be carried out according to purposes.
As described above, the manufacture method of the conductive board by present embodiment, can be formed fine including wiring width
Fine rule Wiring pattern, however, such Wiring pattern before be difficult to be formed, i.e. form gold over the transparent substrate
Belong to after layer and blackening layer, be difficult to form such wiring diagram using the method for forming resist layer on blackening layer and being etched
Case.Therefore, in the conductive board obtained by the manufacture method of the conductive board of present embodiment, preferably comprising
The fine fine rule of wiring width.Specifically, the conduction obtained by the manufacture method of the conductive board of present embodiment
Property substrate preferably for example including wiring width be more than 3 μm, less than 10 μm of distribution, preferably including more than 3 μm, 5 μm with
Under distribution.It should be noted that the manufacture method of the conductive board of present embodiment is not limited to include fine fine rule
Conductive board, can also be applied to manufacture has a case that the conductive boards of various wiring widths.
In addition, for example, in the case where being used in the purposes of touch screen, by the manufacture of the conductive board of present embodiment
Conductive board that method is obtained or, it is excellent by the lamination conductive board for carrying out lamination to the conductive board and obtaining
Elect as and possess netted distribution.
Here, with 2 conductive board institute laminations and the lamination conductive board that possesses netted distribution formational situation
Exemplified by, based on Fig. 2A and Fig. 2 B to the metal level that is formed on the conductive board before lamination and the pattern form of black coating
Configuration example is illustrated.
Fig. 2A is an electric conductivity in 2 conductive boards of the lamination conductive board for possessing netted distribution to composition
Seen in direction of the conductive board 20 of substrate from upper surface side, i.e., vertical with the principal plane 21a (21b) of transparent base 21
Figure when examining.In addition, Fig. 2 B are the sectional views along Fig. 2A A-A ' lines.
As shown in Fig. 2A, Fig. 2 B, in conductive board 20, metal level 22 with regard to the patterning on transparent base 21 and
For black coating 23, the cross sectional shape in its face parallel with the principal plane 21a (21b) of transparent base 21 has roughly the same
Shape.For example, black coating 23 has multiple patterns (black coating pattern 23A~23G) of the rectilinear form shown in Fig. 2A,
The plurality of rectilinear form pattern is parallel with Y-axis in figure, also, X-direction is mutually isolated configuration along along figure.Now, such as Fig. 2A institutes
Show, in the case where transparent base 21 has quadrilateral shape, for example, can be in the mode parallel with one side of transparent base 21 to black
The pattern (black coating pattern 23A~23G) of color coating is configured.
It should be noted that the metal level 22 patterned also has the pattern same with black coating 23, i.e. with straight
Multiple patterns (metal layer pattern) of wire shaped, also, the plurality of pattern is also parallel to each other and isolation configuration.Therefore, pattern
Between can expose the 1st principal plane 21a of transparent base 21.
It should be noted that in the resist layer forming step of the manufacture method of the conductive board of present embodiment, by
It is same as the black coating 23 with rectilinear form pattern shown in the shape of opening portion and Fig. 2A that make to be formed on resist layer
Shape, you can produce the conductive board shown in Fig. 2A, Fig. 2 B.
In addition, by foring the metal level 22 and black coating 23 that have patterned on 2 above-mentioned transparent bases 21
Conductive board 20 carry out lamination, can also form lamination conductive board.
Lamination conductive board is illustrated based on Fig. 3 A, Fig. 3 B.
Fig. 3 A be to lamination conductive board 30 from upper surface side, i.e., along the upper table in the lamination direction of 2 conductive boards
Figure when surface side is observed, Fig. 3 B are the sectional views along Fig. 3 A B-B ' lines.
Lamination conductive board 30 as shown in Figure 3 B, is accumulated by conductive board 301 and conductive board 302
Layer and obtain.It should be noted that for conductive board 301,302, each in transparent base 311 (312) the 1st
The metal level 321 (322) and black coating 331 (332) that have patterned of lamination on principal plane 311a (312a).With regard to electric conductivity base
For the metal level 321 (322) and black coating 331 (332) of the patterning of plate 301,302, be all patterned into it is upper
Stating conductive board 20 similarly has multiple patterns of rectilinear form.
In addition, lamination is to be led with the 1st principal plane 311a of the transparent base 311 of a conductive board 301 with another
The lamination that mode relative 2nd principal plane 312b of the transparent base 312 of electrical substrate 302 is carried out.
It should be noted that can also make the turned upside down of a conductive board 301, and with a conductive board 301
Transparent base 311 the 2nd principal plane 311b and another conductive board 302 transparent base 312 the 2nd principal plane 312b
Relative mode carries out lamination.The situation has identical configuration with Fig. 4 described later.
When carrying out lamination to 2 conductive boards, as shown in Fig. 3 A, Fig. 3 B, one conductive board 301 of enforcement can be entered
The lamination that the category layer 322 of the metal level 321 that has patterned with the patterning of another conductive board 302 intersects.It is specific and
Speech, for example, in figure 3 a, the metal level 321 of the patterning of a conductive board 301 can be configured as, the length of its pattern
Spend that direction is parallel with X-direction in figure, in addition, the metal level 322 of the patterning of another conductive board 302 can be configured
For the length direction of its pattern is parallel with Y direction in figure.
It should be noted that Fig. 3 A are when being observed as described above along the lamination direction of lamination conductive board 30
Figure, so, it illustrated therein is black coating 331,332 of the configuration in the upper space of each conductive board 301,302.Due to figure
The metal level 321,322 of case also has identical pattern with black coating 331,332, so, the metal level patterned
321st, 322 also in the same manner as black coating 331,332 to be netted.
The adhering method of 2 conductive boards to lamination is not particularly limited, for example, adhesive agent etc. can be used to carry out
It is bonded and fixed.
As described above, carrying out lamination, such as Fig. 3 A by a conductive board 301 and another conductive board 302
It is shown, the lamination conductive board 30 for possessing netted distribution can be formed.
So, in the case where manufacturing lamination conductive board, can have to by the conduction for having above-mentioned present embodiment
Property substrate the conductive board that is obtained of manufacture method carry out the layering steps of lamination.In layering steps, as described above, by
By carrying out lamination and fixation to multiple conductive boards, lamination conductive board can be obtained.
So far, to form the lamination electric conductivity with netted distribution by laminations are carried out to 2 conductive boards
It is illustrated exemplified by substrate, however, the method for forming (lamination) conductive board with netted distribution is not limited to this
Form.
For example, by the metal for carrying out that there is predetermined pattern respectively on the 1st principal plane of transparent base and the 2nd principal plane
The lamination of layer and blackening layer, can also obtain netted conductive board.It is specifically described below.
In Figure 1A~Fig. 1 D, show and only form metal level and blackening layer on a principal plane of transparent base 11
Conductive board example, however, the electric conductivity base obtained by the manufacture method of the conductive board of present embodiment
Plate is not limited to the form.For example, as shown in figure 4, the masters of the 1st principal plane 41a and the 2nd that also may be formed at transparent base 41 are flat
Metal level 42A, the 42B and the conductive board 40 of black coating 43A, 43B lamination patterned on the 41b of face.
In the case, by the metal level 42A and the 2nd principal plane with the patterning that is formed on the 1st principal plane 41a
Mode that the metal level 42B of the patterning formed on 41b intersects is patterned, and can also obtain and possesses netted distribution
Conductive board.
Specifically, in the 1st principal plane 41a sides of transparent base 41, to be patterned as with Y direction, i.e., perpendicular to
The metal level 42A and black coating 43A of the parallel multiple rectilinear forms in the direction of paper carry out lamination.In addition, in transparent base
41 the 2nd principal plane 41b sides, to be patterned as with X-direction in Fig. 4, i.e., multiple linears that left and right directions is parallel in figure
The metal level 42B and black coating 43B of shape carry out lamination.
It should be noted that metal level 42A, 42B and black coating 43A, 43B for having patterned can be by above method shapes
Into.
Specifically, first, a 1st principal plane 41a and the 2nd principal plane 41b whole face in transparent base 41 is prepared
On all form the base material of metal level.
Afterwards, on the metal level of above-mentioned base material, formed respectively it is above-mentioned have be patterned metal level 42A,
The resist layer (resist layer forming step) of the opening portion of shape corresponding 42B.Now, the resist layer of the 1st principal plane 41a sides can
With for example with Y direction, i.e., perpendicular to the opening portion of the parallel multiple rectilinear forms in the direction of paper.In addition, the 2nd master is flat
The resist layer of face 41b sides can have for example with X-direction, i.e., in figure multiple rectilinear forms that left and right directions is parallel opening portion.
Next, forming black coating 43A, 43B (black coating forming step) at the opening portion of each resist layer.
Next, the resist layer formed respectively to the 1st principal plane 41a sides and the 2nd principal plane 41b sides removed it is (against corrosion
Layer removing step).
Next, by resist layer is removed, to implement to being removed from black coating 43A, 43B metal level exposed
Metal level removing step (metal level removing step).Accordingly, metal level 42A, the 42B patterned can be formed.
So far, in Fig. 3 A, Fig. 3 B, Fig. 4, the distribution by combination rectilinear form (is matched somebody with somebody with forming netted distribution
Line pattern) example illustrated, however, be not limited to the form, the distribution for constituting Wiring pattern is alternatively arbitrary shape
Shape.For example, in order to which the portrait not with display produces interference line (moire), can be by the distribution for constituting netted Wiring pattern
Shape be respectively designed to be serrated bending line ("the" shape straight line) etc. it is variously-shaped.Conductive board shown in Fig. 4
Situation is also same.
It should be noted that in Fig. 3 A, Fig. 3 B, Fig. 4, showing the metal for foring patterned over the transparent substrate
The example of layer and black coating, however, as described above, can also set adhesive layer between transparent base and metal level.
Formd in the manufacture method of the conductive board of present embodiment discussed above, on metal level against corrosion
Layer, and form black coating in the opening portion formed on the resist layer.In addition, metal level can be carried out using black coating
Etching.
Because black coating formation is in the opening portion of resist layer, so, also its pattern width can be made to attenuate.In addition, by
By implementing the etching using black coating as mask, can be formed includes the Wiring pattern of the fine fine rule of wiring width.Therefore, according to
The manufacture method of the conductive board of present embodiment, can be formed includes the Wiring pattern of the fine fine rule of wiring width.
In addition, the conductive board that is obtained according to the manufacture method of the conductive board by present embodiment or, make
Understood with the lamination conductive board of the conductive board, the surface configuration of the metal level patterned black coating.For
This, can suppress to the light reflection of the layer on surface of metal patterned.Further, since metal level is configured with, so, it can make to lead
Electrical substrate, the resistance value of lamination conductive board diminish.
The manufacture method of conductive board is illustrated by embodiment etc. above, however, the present invention is not limited
Due to above-mentioned embodiment etc..In the range of the idea of the invention recorded in claim, it can carry out various
Deformation and change.
The application advocates " Patent 2014-221381 " applied based on October 30th, 2014 to Japan's patent Room
Priority, and the full content of " Patent 2014-221381 " is incorporated in this international application.
Symbol description
20、301、302、40：Conductive board
11、21、311、312、41：Transparent base
12：Metal level
121、22、321、322、42A、42B：The metal level patterned
131：Possesses the resist layer of opening portion
14：(resist layer) opening portion
15、23、331、332、43A、43B：Black coating.
Claims (according to the 19th article of modification of treaty)
A kind of (1. after modification) manufacture method of conductive board, implements successively：
Resist layer forming step, in the metal level formed with transparent base and at least one face of the transparent base
Base material the metal level on, formed and possess the resist layer of the opening portion corresponding with the Wiring pattern to be formed；
Black coating forming step, black coating is formed in the opening portion of the resist layer；
Resist layer removing step, removes the resist layer；And
Metal level removing step, is etched using etching solution, thus removes the metal level exposed from the black coating,
Wherein, the metal level includes copper,
The metal level is higher than the black relative to the reactivity of the etching solution used in the metal level removing step
Reactivity of the coating relative to the etching solution used in the metal level removing step.
2. the manufacture method of conductive board according to claim 1, wherein, the metal level includes copper plate.
3. the manufacture method of conductive board according to claim 1 or 2, wherein, the black coating includes chromium.
Illustrate or state (according to the 19th article of modification of treaty)
1. the content of modification
(1) following composition has been added in claim 1：In metal level removing step, it is etched using etching solution,
Thus the metal level exposed from black coating is removed；Metal level includes copper；And metal level is relative in metal level removing step
The reactivity of used etching solution is higher than black coating relative to the etching solution used in the metal level removing step
Reactivity.
2. explanation
In document 1 (JP2010-45227A) and document 2 (JP2012-103761A), do not record there is no suggestion that such as yet
Lower feature：Metal level includes copper；And metal level is high relative to the reactivity of the etching solution used in metal level removing step
In reactivity of the black coating relative to the etching solution used in the metal level removing step.
Claims (3)
1. a kind of manufacture method of conductive board, implements successively：
Resist layer forming step, in the metal level formed with transparent base and at least one face of the transparent base
Base material the metal level on, formed and possess the resist layer of the opening portion corresponding with the Wiring pattern to be formed；
Black coating forming step, black coating is formed in the opening portion of the resist layer；
Resist layer removing step, removes the resist layer；And
Metal level removing step, removes the metal level exposed from the black coating.
2. the manufacture method of conductive board according to claim 1, wherein, the metal level includes copper plate.
3. the manufacture method of conductive board according to claim 1 or 2, wherein, the black coating includes chromium.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-221381 | 2014-10-30 | ||
| JP2014221381 | 2014-10-30 | ||
| PCT/JP2015/080294 WO2016068153A1 (en) | 2014-10-30 | 2015-10-27 | Conductive substrate production method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107077244A true CN107077244A (en) | 2017-08-18 |
Family
ID=55857488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580055410.9A Pending CN107077244A (en) | 2014-10-30 | 2015-10-27 | The manufacture method of conductive board |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2016068153A1 (en) |
| CN (1) | CN107077244A (en) |
| TW (1) | TW201624502A (en) |
| WO (1) | WO2016068153A1 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010045227A (en) * | 2008-08-13 | 2010-02-25 | Mitsubishi Paper Mills Ltd | Method of forming conductive pattern |
| CN102576693A (en) * | 2009-09-07 | 2012-07-11 | 日立化成工业株式会社 | Substrate for mounting semiconductor chip and method for producing same |
| TW201229853A (en) * | 2010-11-05 | 2012-07-16 | Fujifilm Corp | Touch panel and image display device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5138459B2 (en) * | 2008-05-15 | 2013-02-06 | 新光電気工業株式会社 | Wiring board manufacturing method |
-
2015
- 2015-10-27 CN CN201580055410.9A patent/CN107077244A/en active Pending
- 2015-10-27 WO PCT/JP2015/080294 patent/WO2016068153A1/en active Application Filing
- 2015-10-27 JP JP2016556587A patent/JPWO2016068153A1/en active Pending
- 2015-10-29 TW TW104135569A patent/TW201624502A/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010045227A (en) * | 2008-08-13 | 2010-02-25 | Mitsubishi Paper Mills Ltd | Method of forming conductive pattern |
| CN102576693A (en) * | 2009-09-07 | 2012-07-11 | 日立化成工业株式会社 | Substrate for mounting semiconductor chip and method for producing same |
| TW201229853A (en) * | 2010-11-05 | 2012-07-16 | Fujifilm Corp | Touch panel and image display device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2016068153A1 (en) | 2017-08-10 |
| TW201624502A (en) | 2016-07-01 |
| WO2016068153A1 (en) | 2016-05-06 |
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