CN107070416B - Power amplifier module supporting hot plug - Google Patents
Power amplifier module supporting hot plug Download PDFInfo
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- CN107070416B CN107070416B CN201710211697.0A CN201710211697A CN107070416B CN 107070416 B CN107070416 B CN 107070416B CN 201710211697 A CN201710211697 A CN 201710211697A CN 107070416 B CN107070416 B CN 107070416B
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- 238000003199 nucleic acid amplification method Methods 0.000 claims description 19
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
- H03F1/52—Circuit arrangements for protecting such amplifiers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/02—Means for indicating or recording specially adapted for thermometers
- G01K1/024—Means for indicating or recording specially adapted for thermometers for remote indication
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
- G01R19/25—Arrangements for measuring currents or voltages or for indicating presence or sign thereof using digital measurement techniques
- G01R19/2513—Arrangements for monitoring electric power systems, e.g. power lines or loads; Logging
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R21/00—Arrangements for measuring electric power or power factor
- G01R21/133—Arrangements for measuring electric power or power factor by using digital technique
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/40—Bus structure
- G06F13/4063—Device-to-bus coupling
- G06F13/4068—Electrical coupling
- G06F13/4081—Live connection to bus, e.g. hot-plugging
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/189—High-frequency amplifiers, e.g. radio frequency amplifiers
- H03F3/19—High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
- H03F3/21—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
- H03F3/24—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2200/00—Indexing scheme relating to amplifiers
- H03F2200/451—Indexing scheme relating to amplifiers the amplifier being a radio frequency amplifier
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
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- Amplifiers (AREA)
Abstract
The invention discloses a power amplifier module supporting hot plug, and relates to the field of satellite and microwave communication. The power amplifier module consists of a power amplifier, a high-low frequency mixed connector assembly, a radiator and a power amplifier module support shell. The module adopts a planar power synthesis technology, and adopts two final power amplifier modules to carry out combination through a 3dB bridge coupler. The module is provided with complete detection and control functions, can detect the input and output power, working voltage, current and temperature of the power amplifier module in real time, can communicate with an upper computer through a 485 interface, and receives the control of the upper computer. The module designs a hot plug power supply management circuit, supports hot plug of equipment and increases redundancy of a system.
Description
Technical Field
The invention relates to the fields of satellite communication, microwave communication and scattering communication, in particular to a power amplifier module supporting hot plug, which can be widely applied to a power amplifier system based on space power synthesis.
Background
In recent years, with the rapid development of wireless communication technology, the requirements for bandwidth, efficiency, and output power of power amplifiers have increased. However, the solid-state power device is limited by the influence of the physical characteristics of the semiconductor, the problems of processing technology, heat dissipation, impedance matching and the like, the output power of the device is very limited, and the higher the working frequency is, the lower the single-chip output power level is. Therefore, a plurality of solid-state power devices are adopted for power synthesis, and the output power of the power amplifier system is effectively improved.
The traditional circuit synthesis technology adopts the power division/synthesis networks such as Wilkinson bridge, branch line bridge, land bridge and the like, has wide application, but the planar transmission line has large loss, and the synthesis efficiency is obviously reduced along with the increase of the synthesis network stage number, so that the number of amplifiers is limited, and the requirements of high efficiency and high power cannot be met. The spatial power synthesis technology proposed in recent years has the advantage of high synthesis efficiency, and is suitable for synthesizing a plurality of power amplifier modules to obtain high power.
In a high-power amplifier system, in order to ensure stable operation of the system, redundancy design is required to ensure normal operation of the system in case of damage to a certain power amplifier module. And the damaged module needs to be replaced under the condition that the system operation is not interrupted. It is therefore necessary to introduce a power amplifier module that supports hot plug.
Disclosure of Invention
The invention aims to provide a power amplifier module supporting hot plug, which solves the defects of low output power of a single power device, no support of hot plug of the module and poor system redundancy in the prior art. The amplifier has the characteristics of supporting hot plug, small volume, high efficiency and programmability.
In order to solve the technical problems, the invention is realized by the following technical scheme:
a power amplifier module supporting hot plug, comprising a power amplifier 1; the power amplifier 1 comprises a monitoring unit circuit 101, a radio frequency amplifying circuit 102, an output power detecting circuit 103, an input power detecting circuit 104, a state indicating circuit 105 and a temperature detecting circuit 106;
the monitoring unit circuit 101 is used for performing hot plug management on an input power supply and outputting a +28V power supply to the radio frequency amplifying circuit 102; the power supply is also used for converting +28V power supply into-5V power supply and outputting the-5V power supply to the radio frequency amplifying circuit 102; and is further configured to control the output power detection circuit 103, the input power detection circuit 104, and the temperature detection circuit 106, respectively, and receive the output and reflected power digital signal, the input power digital signal, and the temperature digital signal, respectively; the device is also used for detecting the voltage and the current in the working state and generating a voltage and current digital signal after analog-digital conversion; the system is also used for respectively reporting the output and reflected power digital signals, the input power digital signals, the temperature digital signals and the voltage and current digital signals to the upper computer under the control of the upper computer;
the rf amplifying circuit 102 is configured to perform power amplification on an externally input rf signal to generate a high-power rf signal, and output the high-power rf signal; the input power detection circuit 104 is further configured to sample an input radio frequency signal and output an input power sampling signal to the input power detection circuit; the output power detection circuit 103 is further used for sampling the output high-power radio frequency signal and outputting an output power and reflected power sampling signal to the output power detection circuit;
the output power detection circuit 103 is configured to detect the output power and the reflected power sampling signal, perform analog-to-digital conversion on an analog signal generated by the detection, generate an output and reflected power digital signal, and output the output and reflected power digital signal to the monitoring unit circuit 101 under the control of the monitoring unit circuit 101;
the input power detection circuit 104 is configured to detect an input power sampling signal, perform analog-to-digital conversion on an analog signal generated by the detection, generate an input power digital signal, and output the input power digital signal to the monitoring unit circuit 101 under the control of the monitoring unit circuit 101;
the state indicating circuit 105 is used for indicating the current operating state under the control of the monitoring unit circuit 101;
the temperature detection circuit 106 is configured to detect a temperature, perform analog-to-digital conversion on the temperature analog signal to generate a temperature digital signal, and output the temperature digital signal to the monitoring unit circuit 101 under the control of the monitoring unit circuit 101.
The monitoring unit circuit 101 comprises a central processing unit 111, a hot plug management circuit 112, an IIC interface circuit 113, a 485 interface circuit 114 and a power conversion circuit 115;
the hot plug management circuit 112 is configured to perform hot plug power management on the +28v power supply under the control of the central processor 111, and output the +28v power supply to the radio frequency amplifying circuit 102; the voltage and current output to the rf amplifying circuit 102 are detected, and analog-to-digital converted to generate voltage and current digital signals, and the voltage and current digital signals are output to the central processor 111 through the IIC interface circuit 113 under the control of the central processor 111; and is also used for controlling the on-off of the input +28V under the control of the central processing unit 111;
the power conversion circuit 115 is configured to convert the input 28V power into-5V and 3.3V, output the-5V power to the rf amplifying circuit 102, and output the 3.3V power to the central processor 111;
the central processing unit 111 is used for controlling the output power detection circuit 103, the input power detection circuit 104 and the temperature detection circuit 106 through the IIC interface circuit 113 respectively, and receiving the output and reflected power digital signal, the input power digital signal and the temperature digital signal through the IIC interface circuit 113 respectively; and also for controlling the status indication circuit 105 to indicate the current operating status; the system is also used for respectively reporting the output and reflected power digital signals, the input power digital signals, the temperature digital signals and the voltage and current digital signals to the upper computer under the control of the upper computer; the model number of the central processing unit 111 is C8051F502.
The radio frequency amplifying circuit 102 comprises a driving stage power amplifying module 121, a splitter 122, a first final stage power amplifying module 123, a second final stage power amplifying module 124, a combiner 125, an output end coupler 126 and an input end coupler 127; the rf driving stage power amplifier module 121 is configured to amplify an input rf signal, and output the amplified rf signal to the splitter 122; the splitter 122 is configured to split the amplified radio frequency signal into two signals with equal amplitude and 90 degrees phase difference, and output a relative 0 ° signal to the first final power amplification module 123 and a relative 90 ° signal to the second final power amplification module 124; the first final power amplification module 123 and the second final power amplification module 124 are respectively configured to amplify the respective input signals of 0 ° and 90 ° to output to the combiner 125; the combiner 125 is configured to combine the amplified relative 0 ° signal and the amplified relative 90 ° signal to form a high-power radio frequency signal and output the high-power radio frequency signal; the input end coupler 127 is used for sampling the input radio frequency signal and outputting an input power sampling signal to the input power detection circuit 104; the output coupler 126 is configured to sample the high-power rf signal output from the combiner 125, and output the output power and the reflected power sampled signal to the output power detection circuit 103.
The power amplifier module comprises a power amplifier module, a power amplifier module support shell 4, a high-low frequency mixed connector assembly 2 and a radiator 3; the power amplifier 1, the high-low frequency mixed connector assembly 2 and the radiator 3 are fixed on the power amplifier module support shell 4, and the power amplifier 1 is connected with the high-low frequency mixed connector assembly 2.
Wherein splitter 122 and combiner 125 act as a planar power splitting combining network through 3dB bridge couplers, respectively.
The beneficial effects generated by adopting the technical scheme are as follows:
(1) The invention comprises a hot plug power management circuit, can ensure the stable operation of the power amplifier under the condition of hot plug, and protects the power amplifier module from being damaged by impact current.
(2) The embedded monitoring circuit of the invention monitors the state of the power amplifier in real time and can communicate with an upper computer through an RS485 interface.
(3) The invention adopts a planar power synthesis technology, increases the output power of the power amplifier and increases the power synthesis efficiency; the reliability of the system is improved by adopting a hot plug management technology; the programmability of the power amplifier is improved by adopting an embedded CPU.
Drawings
Fig. 1 is a schematic perspective view of a power amplifier of the present invention;
fig. 2 is a block diagram of the power amplifier module of the present invention;
FIG. 3 is a block diagram of the components of the monitor cell circuit of the present invention;
fig. 4 is a block diagram of the components of the radio frequency amplifying circuit of the present invention.
Detailed Description
The invention will be described in further detail with reference to the drawings and the detailed description.
As shown in fig. 1, a power amplifier module supporting hot plug of the present invention includes a power amplifier 1, a high-low frequency hybrid connector assembly 2, a heat sink 3, and a power amplifier module housing 4. The power amplifier 1, the high-low frequency mixed connector assembly 2 and the radiator 3 are fixed on the power amplifier module support shell 4 by screws. The output, power supply and communication interface of the power amplifier module support shell 4 are on the same side, and the whole module can be positioned through the installation guide rail and the pin, so that the power amplifier module support shell is convenient to be connected with a combiner and a chassis motherboard. The heat sink 3 is directly connected to the power amplifier 1 for heat dissipation of the power amplifier 1.
Fig. 2 is a block diagram of a power amplifier module according to the present invention, where the power amplifier 1 includes a monitor unit circuit 101, a radio frequency amplifying circuit 102, an output power detecting circuit 103, an input power detecting circuit 104, a status indicating circuit 105, and a temperature detecting circuit 106;
the monitoring unit circuit 101 is used for performing hot plug management on an input power supply and outputting a +28V power supply to the radio frequency amplifying circuit 102; the power supply is also used for converting +28V power supply into-5V power supply and outputting the-5V power supply to the radio frequency amplifying circuit 102; and is further configured to control the output power detection circuit 103, the input power detection circuit 104, and the temperature detection circuit 106, respectively, and receive the output and reflected power digital signal, the input power digital signal, and the temperature digital signal, respectively; the voltage and current output to the radio frequency amplifying circuit 102 are detected and are subjected to analog-to-digital conversion to generate voltage and current digital signals; the system is also used for respectively reporting the output and reflected power digital signals, the input power digital signals, the temperature digital signals and the voltage and current digital signals to the upper computer under the control of the upper computer;
the rf amplifying circuit 102 is configured to perform power amplification on an externally input rf signal to generate a high-power rf signal, and output the high-power rf signal; the input power detection circuit 104 is further configured to sample an input radio frequency signal and output an input power sampling signal to the input power detection circuit; the output power detection circuit 103 is further used for sampling the output high-power radio frequency signal and outputting an output power and reflected power sampling signal to the output power detection circuit;
the output power detection circuit 103 is configured to detect the output power and the reflected power sampling signal, perform analog-to-digital conversion on an analog signal generated by the detection, generate an output and reflected power digital signal, and output the output and reflected power digital signal to the monitoring unit circuit 101 under the control of the monitoring unit circuit 101;
the input power detection circuit 104 is configured to detect an input power sampling signal, perform analog-to-digital conversion on an analog signal generated by the detection, generate an input power digital signal, and output the input power digital signal to the monitoring unit circuit 101 under the control of the monitoring unit circuit 101;
the state indicating circuit 105 is used for indicating the current operating state under the control of the monitoring unit circuit 101;
the temperature detection circuit 106 is configured to detect a temperature, perform analog-to-digital conversion on the temperature analog signal to generate a temperature digital signal, and output the temperature digital signal to the monitoring unit circuit 101 under the control of the monitoring unit circuit 101.
Fig. 3 is a block diagram of the components of the monitor cell circuit. The monitor cell circuit 101 includes a central processing circuit 111, a hot plug management circuit 112, an IIC interface circuit 113, a 485 interface circuit 114, and a power conversion circuit 115.
The hot plug management circuit 112 is configured to perform hot plug power management on the +28v power supply under the control of the central processor 111, and output the +28v power supply to the radio frequency amplifying circuit 102; the voltage and current detecting circuit is also used for detecting the voltage and current of the working state, generating voltage and current digital signals after analog-to-digital conversion, and outputting the voltage and current digital signals to the central processor 111 through the IIC interface circuit 113 under the control of the central processor 111; and is also used for controlling the on-off of the input +28V under the control of the central processing unit 111;
the power conversion circuit 115 is configured to convert the input 28V power into-5V and 3.3V, output the-5V power to the rf amplifying circuit 102, and output the 3.3V power to the central processor 111;
the central processing unit 111 is used for controlling the output power detection circuit 103, the input power detection circuit 104 and the temperature detection circuit 106 through the IIC interface circuit 113 respectively, and receiving the output and reflected power digital signal, the input power digital signal and the temperature digital signal through the IIC interface circuit 113 respectively; and also for controlling the status indication circuit 105 to indicate the current operating status; and the system is also used for respectively reporting the output and reflected power digital signals, the input power digital signals, the temperature digital signals and the voltage and current digital signals to the upper computer under the control of the upper computer.
The hot plug management circuit 112 controls the conduction depth of the external N-channel field effect transistor to limit the input current by detecting the current value on the precision sampling resistor, so that the stable operation of the power amplifier module and the system is ensured in the hot plug process, the damage of the impact current is avoided, the voltage and the current of the +28V power supply are detected, and the time sequence protection during the power-on is completed; the power conversion circuit 115 performs a power conversion from +28V to 3.3V, which is a voltage required by the CPU 111, and to-5V, which is a gate voltage required by the RF amplifier 102. The IIC interface circuit 113 is used as a communication bus inside the module to complete communication between the MCU and the hot plug management circuit 112, the input/output power detection circuits 104 and 103, the temperature detection circuit 106 and the status indication circuit 105, and the 485 interface circuit completes communication between the MCU and the upper computer.
Fig. 4 is a block diagram of a radio frequency amplification circuit, including a driver stage power amplifier module 121, a splitter 122, a first final stage power amplifier module 123, a second final stage power amplifier module 124, a combiner 125, an output coupler 126, and an input coupler 127; the rf driving stage power amplifier module 121 is configured to amplify an input rf signal, and output the amplified rf signal to the splitter 122; the splitter 122 is configured to split the amplified radio frequency signal into two signals with equal amplitude and 90 degrees phase difference, and output a relative 0 ° signal to the first final power amplification module 123 and a relative 90 ° signal to the second final power amplification module 124; the first final power amplification module 123 and the second final power amplification module 124 are respectively configured to amplify the respective input signals of 0 ° and 90 ° to output to the combiner 125; the combiner 125 is configured to combine the amplified relative 0 ° signal and the amplified relative 90 ° signal to form a high-power radio frequency signal and output the high-power radio frequency signal; the input end coupler 127 is used for sampling the input radio frequency signal and outputting an input power sampling signal to the input power detection circuit 104; the output coupler 126 is configured to sample the high-power rf signal output from the combiner 125, and output the output power and the reflected power sampled signal to the output power detection circuit 103. Wherein splitter 122 and combiner 125 act as a planar power splitting combining network through 3dB bridge couplers, respectively.
The invention briefly works on the principle:
the power amplifier adopts a planar power synthesis mode to finish the synthesis amplification of power, a hot plug control circuit is introduced to inhibit the impact current generated in the hot plug process, the power amplifier module is protected, the working state of the power amplifier is detected by adopting a mode of embedding a monitoring unit, and the power amplifier module is controlled by an upper computer to realize the programmability of the power amplifier module.
Claims (5)
1. A power amplifier module supporting hot plug, comprising a power amplifier (1); the power amplifier (1) is characterized by comprising a monitoring unit circuit (101), a radio frequency amplifying circuit (102), an output power detection circuit (103), an input power detection circuit (104), a state indication circuit (105) and a temperature detection circuit (106);
the monitoring unit circuit (101) is used for carrying out hot plug management on an input power supply and outputting a +28V power supply to the radio frequency amplifying circuit (102); the power supply is also used for converting +28V power supply into-5V power supply and outputting the-5V power supply to the radio frequency amplifying circuit (102); the device is also used for respectively controlling an output power detection circuit (103), an input power detection circuit (104) and a temperature detection circuit (106), and respectively receiving an output and reflected power digital signal, an input power digital signal and a temperature digital signal; the circuit is also used for detecting the voltage and the current output to the radio frequency amplifying circuit (102) and generating a voltage and current digital signal after analog-to-digital conversion; the system is also used for respectively reporting the output and reflected power digital signals, the input power digital signals, the temperature digital signals and the voltage and current digital signals to the upper computer under the control of the upper computer;
the radio frequency amplifying circuit (102) is used for carrying out power amplification on an externally input radio frequency signal to generate a high-power radio frequency signal and outputting the high-power radio frequency signal; the input power detection circuit is also used for sampling an input radio frequency signal and outputting an input power sampling signal to the input power detection circuit (104); the power control circuit is also used for sampling the output high-power radio frequency signals and outputting output power and reflected power sampling signals to an output power detection circuit (103);
the output power detection circuit (103) is used for detecting the output power and the reflected power sampling signals, performing analog-to-digital conversion on analog signals generated by the detection to generate output and reflected power digital signals, and outputting the output and reflected power digital signals to the monitoring unit circuit (101) under the control of the monitoring unit circuit (101);
the input power detection circuit (104) is used for detecting an input power sampling signal, performing analog-to-digital conversion on an analog signal generated by the detection to generate an input power digital signal, and outputting the input power digital signal to the monitoring unit circuit (101) under the control of the monitoring unit circuit (101);
the state indicating circuit (105) is used for indicating the current working state under the control of the monitoring unit circuit (101);
the temperature detection circuit (106) is used for detecting temperature, performing analog-to-digital conversion on the temperature analog signal to generate a temperature digital signal, and outputting the temperature digital signal to the monitoring unit circuit (101) under the control of the monitoring unit circuit (101).
2. The power amplifier module according to claim 1, wherein the monitor cell circuit (101) comprises a central processing unit (111), a hot plug management circuit (112), an IIC interface circuit (113), a 485 interface circuit (114), and a power conversion circuit (115);
the hot plug management circuit (112) is used for carrying out hot plug power management on the input +28V power supply under the control of the central processing unit (111) and outputting the +28V power supply to the radio frequency amplifying circuit (102); the voltage and current detecting circuit is also used for detecting the voltage and current of the working state, generating voltage and current digital signals after analog-to-digital conversion, and outputting the voltage and current digital signals to the central processing unit (111) through the IIC interface circuit (113) under the control of the central processing unit (111); the device is also used for carrying out on-off control on the input +28V under the control of the central processing unit (111);
the power supply conversion circuit (115) is used for converting the input 28V power supply into-5V and 3.3V, outputting the-5V power supply to the radio frequency amplifying circuit (102) and outputting the 3.3V power supply to the central processing unit (111);
the central processing unit (111) is used for controlling the output power detection circuit (103), the input power detection circuit (104) and the temperature detection circuit (106) through the IIC interface circuit (113) respectively, and receiving the output and reflected power digital signals, the input power digital signals and the temperature digital signals through the IIC interface circuit (113) respectively; and is also used for controlling the state indicating circuit (105) to indicate the current working state; and the system is also used for respectively reporting the output and reflected power digital signals, the input power digital signals, the temperature digital signals and the voltage and current digital signals to the upper computer under the control of the upper computer.
3. The power amplifier module of claim 1, wherein the radio frequency amplification circuit (102) comprises a driver stage power amplifier module (121), a splitter (122), a first final stage power amplifier module (123), a second final stage power amplifier module (124), a combiner (125), an output coupler (126), and an input coupler (127); the radio frequency driving stage power amplification module (121) is used for amplifying an input radio frequency signal and outputting the amplified radio frequency signal to the splitter (122); the splitter (122) is used for splitting the amplified radio frequency signal into two paths of signals with equal amplitude and 90-degree phase difference, outputting a relative 0-degree signal to the first final-stage power amplification module (123), and outputting a relative 90-degree signal to the second final-stage power amplification module (124); the first final power amplification module (123) and the second final power amplification module (124) are respectively used for amplifying the respectively input relative 0-degree signals and relative 90-degree signals in a one-to-one correspondence manner and outputting the amplified signals to the combiner (125); the combiner (125) is used for combining the amplified relative 0-degree signal and the amplified relative 90-degree signal to form a high-power radio frequency signal and outputting the high-power radio frequency signal; the input end coupler (127) is used for sampling an input radio frequency signal and outputting an input power sampling signal to the input power detection circuit (104); the output end coupler (126) is used for sampling the high-power radio frequency signal output by the combiner (125) and outputting the output power and the reflected power sampling signal to the output power detection circuit (103).
4. The power amplifier module supporting hot plug according to claim 1, further comprising a high-low frequency hybrid connector assembly (2), a heat sink (3) and a power amplifier module housing (4); the power amplifier (1), the high-low frequency mixed connector assembly (2) and the radiator (3) are fixed on the power amplifier module support shell (4), and the power amplifier (1) is connected with the high-low frequency mixed connector assembly (2).
5. A power amplifier module supporting hot plug according to claim 3, characterized in that the splitter (122) and combiner (125) are respectively connected as a planar power distribution combining network via a 3dB bridge coupler.
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CN201710211697.0A CN107070416B (en) | 2017-04-01 | 2017-04-01 | Power amplifier module supporting hot plug |
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CN201710211697.0A CN107070416B (en) | 2017-04-01 | 2017-04-01 | Power amplifier module supporting hot plug |
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CN107806945A (en) * | 2017-10-25 | 2018-03-16 | 成都西井科技有限公司 | power amplifier temperature detecting system |
CN113064368B (en) * | 2021-03-18 | 2022-03-08 | 科海技术股份有限公司 | High-power radio frequency power supply system |
CN114184851B (en) * | 2021-10-25 | 2024-03-15 | 西安空间无线电技术研究所 | Amplitude-phase unbalance detection system and method for multiport amplifier |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2001211038A (en) * | 2000-01-27 | 2001-08-03 | Hitachi Kokusai Electric Inc | Power amplifier |
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CN105634419A (en) * | 2015-12-25 | 2016-06-01 | 中国电子科技集团公司第五十四研究所 | C-waveband high-power solid-state power amplifier |
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2017
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JP2001211038A (en) * | 2000-01-27 | 2001-08-03 | Hitachi Kokusai Electric Inc | Power amplifier |
CN102355207A (en) * | 2011-09-29 | 2012-02-15 | 中国电子科技集团公司第五十四研究所 | Ka frequency-band solid-state power amplifier |
CN105634419A (en) * | 2015-12-25 | 2016-06-01 | 中国电子科技集团公司第五十四研究所 | C-waveband high-power solid-state power amplifier |
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